CN203607433U - Solder strip capable of improving welding effect and photovoltaic assembly packaging power - Google Patents
Solder strip capable of improving welding effect and photovoltaic assembly packaging power Download PDFInfo
- Publication number
- CN203607433U CN203607433U CN201320701668.XU CN201320701668U CN203607433U CN 203607433 U CN203607433 U CN 203607433U CN 201320701668 U CN201320701668 U CN 201320701668U CN 203607433 U CN203607433 U CN 203607433U
- Authority
- CN
- China
- Prior art keywords
- ripple
- welding
- solder strip
- photovoltaic assembly
- cell sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003466 welding Methods 0.000 title claims abstract description 57
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 18
- 230000000694 effects Effects 0.000 title claims abstract description 15
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 5
- 230000009977 dual effect Effects 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 229910001128 Sn alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000002002 slurry Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
Abstract
The utility model discloses a solder strip capable of improving welding effect and photovoltaic assembly packaging power; the solder strip comprises a conductive baseband being a substrate; the solder strip is characterized in that a plurality of compact uniform ripple structures are arranged on a top surface of the conductive baseband; a top surface of the ripple structure is covered by a solder layer made of tin or tin alloy material; the ripple structure is in single standing-wave consistent single ripple shape; the ripple structure is perpendicular to the length direction of the conductive baseband or the ripple structures are in mutually intersecting and overlapping dual-ripple shape; a welding surface of the solder strip and a cell sheet electrode employs the ripple structure, so the contact area between the solder strip and the cell sheet electrode can be maximumly enlarged, thereby improving welding tension force of the cell sheet electrode, and effectively improving welding effect and tin coating rate; ohmic contact resistance between the solder strip and the cell sheet electrode can be reduced, so the conversion rate of the photovoltaic assembly can be obviously improved, thereby effectively improving photovoltaic assembly packaging power.
Description
Technical field
The utility model relates to solar photovoltaic assembly welding, especially relates to a kind of welding that can improve welding effect, improve photovoltaic component encapsulating power.
Background technology
Welding is the important raw and processed materials in welding photovoltaic component process, the quality of welding will have influence on the welding effect of photovoltaic module, and the quality of welding effect directly has influence on the collection efficiency of photovoltaic module electric current, therefore, welding is very large to the power influences of photovoltaic module.
At present, traditional Tu soldering band for solar photovoltaic assembly is all ganoid structure, its major defect is: in when welding because the contact-making surface of traditional tin-coated welding strip and cell piece electrode is smooth, and contact-making surface is less, easily cause not prison welding solid, make to weld pulling force less than normal, namely failure welding, this can have a strong impact on the ohmic contact of welding and cell piece electrode.And, the silver slurry that tradition Tu soldering band uses for cell piece electrode is selected to require very high, as adopt international certain famous silver slurry and partial domestic silver to starch, because the pulling force of cell piece electrode (silver electrode) is less, will produce and weld the low shortcoming of little, the upper tin rate of pulling force with traditional Tu soldering band, therefore the generally requirement that assembly is produced be can not meet, thereby their popularization, use limited.
Summary of the invention
The purpose of this utility model is to provide a kind ofly can expand with the contact area of cell piece electrode, effectively improve welding effect, improve photovoltaic component encapsulating power, handling ease, welding simple in structure.
A kind of welding that can improve welding effect, improve photovoltaic component encapsulating power, comprise the electric conducting base band as basic unit, feature is: be placed with several fine and close ripple structions uniformly at the upper surface of electric conducting base band, be coated with at the upper surface of ripple struction the solder layer that layer of material is tin or ashbury metal.
The degree of depth of ripple struction is 5～60um, and the spacing of adjacent two ripple structions is 30～80um.
The thickness of solder layer is 1～30um.
Ripple struction is single consistent single corrugated of staying, and ripple struction is perpendicular to the length direction of electric conducting base band;
Or ripple struction is mutual intersection, overlapping dual corrugated.
The utility model is that the upper surface of electric conducting base band is processed into several fine and close ripple structions uniformly, namely the solder side of welding and cell piece electrode adopts ripple struction, so just can expand substantially the contact area of welding and cell piece electrode, strengthen the welding pulling force of cell piece electrode, can effectively improve welding effect, tin rate in raising, the ohmic contact resistance of welding and cell piece electrode will decline, cause the conversion efficiency of photovoltaic module obviously to be promoted, thereby effectively improve photovoltaic component encapsulating power.
Therefore, the utlity model has following advantage:
1, the solder side of welding and cell piece electrode adopts ripple struction, thereby can expand substantially the contact area of welding and cell piece electrode, strengthen the welding pulling force of cell piece electrode, and the ripple struction of welding upper surface can effectively improve welding effect when with the combination of cell piece electrode, paving tin effect when welding is more even, upper tin rate can be brought up to more than 90%;
2, owing to having increased effective contact area of welding and cell piece electrode, therefore the requirement of cell piece electrode pair electrode silver plasm pulling force will reduce, thereby adapts to various positive poles on market, backplane silver slurry;
3, due to effective improvement of welding effect, the ohmic contact resistance of welding and cell piece electrode will decline, thereby improved the fill factor, curve factor of photovoltaic module, caused the conversion efficiency of photovoltaic module obviously to be promoted, photovoltaic component encapsulating power can improve 0.5-2 % effectively.
Accompanying drawing explanation
Fig. 1 is perspective view of the present utility model;
Fig. 2 is the cross sectional representation (length direction of wall scroll ripple and electric conducting base band becomes 90 degree) of embodiment 1;
Fig. 3 is the schematic top plan view (two ripple intersection 90 is spent, and wherein a ripple becomes miter angle compacting with the length direction of electric conducting base band, and two ripples become 90 degree) of embodiment 2;
Fig. 4 is the cross sectional representation of embodiment 2.
Embodiment
Below in conjunction with embodiment and contrast accompanying drawing the utility model is described in further detail.
Embodiment 1:
A kind of welding that can improve welding effect, improve photovoltaic component encapsulating power, comprise the electric conducting base band 1 as basic unit, be placed with several fine and close ripple structions 2 uniformly at the upper surface of electric conducting base band 1, be coated with at the upper surface of ripple struction 2 solder layer 3 that layer of material is tin or ashbury metal.
The degree of depth h of ripple struction 2 is 5～60um, and the spacing L of adjacent two ripple structions is 30-80um.
The thickness d of solder layer 3 is 1～30um.
The concrete manufacture method of embodiment is: in welding calendering formation process, make ripple struction 2 with upper surface, one side that single-side embossing technique is mainly copper at electric conducting base band 1, the degree of depth of ripple struction 2 is 30um, and the spacing of adjacent two ripple structions is 40um.Upper surface at the electric conducting base band 1 through plating or other technique is coated with the solder layer 3 that layer of material is tin, is prepared into welding.By electroplating technology, the solder layer 3 of electric conducting base band 1 upper surface is more even, finer and close, and thickness is 15um.
Adopt the 156*156 polycrystalline cell piece that 60, efficiency are 16.8%, use this welding to prepare one group of solar photovoltaic assembly, its component power is 240---242.3W, and photovoltaic module power prepared by common welding is 238-240W, has improved 0.9%.The upper tin rate of photovoltaic module prepared by common welding is 75%-85%, and using the upper tin rate of photovoltaic module prepared by the welding of this ripple struction 2 is 92%.The welding pulling force of photovoltaic module prepared by common welding is 1.5-2.0N, and using the welding pulling force of photovoltaic module prepared by the welding of this ripple struction is 3.5-5N.
Embodiment 2:
The structure of embodiment 2 is substantially the same manner as Example 1, and difference is:
Claims (5)
1. the welding that can improve welding effect, improve photovoltaic component encapsulating power, comprise the electric conducting base band as basic unit, it is characterized in that: be placed with several fine and close ripple structions uniformly at the upper surface of electric conducting base band, be coated with at the upper surface of ripple struction the solder layer that layer of material is tin or ashbury metal.
2. welding according to claim 1, is characterized in that: ripple struction is single consistent single corrugated of staying, and ripple struction is perpendicular to the length direction of electric conducting base band.
3. welding according to claim 1, is characterized in that: ripple struction is mutual intersection, overlapping dual corrugated.
4. according to the welding described in claim 2 or 3, it is characterized in that: the degree of depth of ripple struction is 5～60um, the spacing of adjacent two ripple structions is 30-80um.
5. according to the welding described in claim 2 or 3, it is characterized in that: the thickness of solder layer is 1～30um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320701668.XU CN203607433U (en) | 2013-11-08 | 2013-11-08 | Solder strip capable of improving welding effect and photovoltaic assembly packaging power |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320701668.XU CN203607433U (en) | 2013-11-08 | 2013-11-08 | Solder strip capable of improving welding effect and photovoltaic assembly packaging power |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203607433U true CN203607433U (en) | 2014-05-21 |
Family
ID=50720095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320701668.XU Expired - Lifetime CN203607433U (en) | 2013-11-08 | 2013-11-08 | Solder strip capable of improving welding effect and photovoltaic assembly packaging power |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203607433U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104128541A (en) * | 2014-07-24 | 2014-11-05 | 无锡尚德太阳能电力有限公司 | Method for embossing surface of photovoltaic welding strip |
| CN109473788A (en) * | 2018-12-25 | 2019-03-15 | 广州电缆厂有限公司 | A kind of multiple spot wiring reinforcing electric wire |
| CN110993715A (en) * | 2019-12-18 | 2020-04-10 | 盛利维尔（中国）新材料技术股份有限公司 | Photovoltaic solder strip and preparation method thereof |
-
2013
- 2013-11-08 CN CN201320701668.XU patent/CN203607433U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104128541A (en) * | 2014-07-24 | 2014-11-05 | 无锡尚德太阳能电力有限公司 | Method for embossing surface of photovoltaic welding strip |
| CN104128541B (en) * | 2014-07-24 | 2016-03-30 | 无锡尚德太阳能电力有限公司 | The method of embossing is made on photovoltaic welding belt surface |
| CN109473788A (en) * | 2018-12-25 | 2019-03-15 | 广州电缆厂有限公司 | A kind of multiple spot wiring reinforcing electric wire |
| CN110993715A (en) * | 2019-12-18 | 2020-04-10 | 盛利维尔（中国）新材料技术股份有限公司 | Photovoltaic solder strip and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140521 |
|
| CX01 | Expiry of patent term |