CN204943749U - A kind of electronic cooling ceiling system and electronic cooling module thereof - Google Patents
A kind of electronic cooling ceiling system and electronic cooling module thereof Download PDFInfo
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- CN204943749U CN204943749U CN201520594079.5U CN201520594079U CN204943749U CN 204943749 U CN204943749 U CN 204943749U CN 201520594079 U CN201520594079 U CN 201520594079U CN 204943749 U CN204943749 U CN 204943749U
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- radiator
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- sealing cover
- electronic cooling
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Abstract
The utility model provides a kind of electronic cooling module, and a kind of electronic cooling ceiling system.Described electronic cooling module comprises semiconductor refrigerating element, radiator, conduction cooling plate, chilled air fan and heat-insulating and sealing cover, described semiconductor refrigerating element has hot junction and cold junction, described heat-insulating and sealing cover comprises cross wall and perpendicular wall, described cross wall and semiconductor refrigerating element are in same plane, and there is the breach of holding semiconductor cooling module, described radiator and conduction cooling plate are respectively from upper, downside clamps cross wall and semiconductor refrigerating element simultaneously, described hot junction and radiator are fitted, described cold junction and conduction cooling plate are fitted, described perpendicular wall is from the edge of cross wall to downward-extension, conduction cooling plate is trapped among in heat-insulating and sealing cover, described chilled air fan be positioned at heat-insulating and sealing cover and its air supply direction just to conduction cooling plate.One or more electronic cooling module is set in metal ceiling system and can meets refrigeration demand, install easy, disguised high.The utility model can be applied to interior decoration.
Description
Technical field
The utility model relates to apparatus of air conditioning field, the electronic cooling module that particularly a kind of electronic cooling ceiling system, and this system uses.
Background technology
By influenced by global warming, the annual highest temperature of China is broken a record always, and therefore air-conditioning has also become requisite household electrical appliances of living at home, common are split-type air conditioner and central air-conditioning two kinds.In the space that some areas are less, as lavatory, kitchen etc., and be not suitable for split-type air conditioner is installed, because its refrigerating capacity is far beyond room volume, cause energy waste; And using central air-conditioning, its pipe laying extremely bothers again, so in general family, all well do not avoid heat refrigeration plant in the space such as lavatory, kitchen.
Utility model content
For the deficiencies in the prior art, the utility model provides a kind of electronic cooling module, and it can combine with metal ceiling system easily, for indoor subrange freezes.
The technical scheme of the utility model technical solution problem is as follows:
A kind of electronic cooling module, comprise semiconductor refrigerating element, radiator, conduction cooling plate, chilled air fan and heat-insulating and sealing cover, described semiconductor refrigerating element has hot junction and cold junction, described heat-insulating and sealing cover comprises cross wall and perpendicular wall, described cross wall and semiconductor refrigerating element are in same plane, and there is the breach of holding semiconductor cooling module, described radiator and conduction cooling plate are respectively from upper, downside clamps cross wall and semiconductor refrigerating element simultaneously, described hot junction and radiator are fitted, described cold junction and conduction cooling plate are fitted, described perpendicular wall is from the edge of cross wall to downward-extension, conduction cooling plate is trapped among in heat-insulating and sealing cover, described chilled air fan be positioned at heat-insulating and sealing cover and its air supply direction just to conduction cooling plate.Described chilled air fan is positioned at immediately below conduction cooling plate central point.Also comprise heat radiation guide plate, described heat radiation guide plate is fixedly connected on the side of radiator and upwards extends.Also comprise radiator fan, described radiator fan is positioned at directly over radiator central point, and its air supply direction is just to radiator.
The invention also discloses a kind of electronic cooling ceiling system, comprise metal ceiling, and electronic cooling module as above, described heat-insulating and sealing cover is fixedly connected with metal ceiling and encloses and forms cold wind and to circulate cavity, the middle part of described metal ceiling is provided with the suction opeing suitable with chilled air fan, and described suction opeing periphery is provided with air outlet.
The beneficial effect that the utility model brings is:
Can according to room area, in metal ceiling system, arrange one or more electronic cooling module can meet refrigeration demand, installs easily, disguised high, to there will not be as split-type air conditioner refrigerating capacity far beyond the situation of room volume.The metal ceiling being provided with electronic cooling module has just had more suction opeing and air outlet compared with common metal ceiling, the not any change of its mounting means.The utility model can be applied to interior decoration.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, below the accompanying drawing used required in describing embodiment is briefly described.Obviously, described accompanying drawing is a part of embodiment of the present utility model, instead of whole embodiment, and those skilled in the art, under the prerequisite not paying creative work, can also obtain other designs and accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic front view of electronic cooling module;
Fig. 2 is that schematic diagram is looked on the right side that electronic cooling module combines with metal ceiling.
Detailed description of the invention
Be clearly and completely described below with reference to embodiment and the accompanying drawing technique effect to design of the present utility model, concrete structure and generation, to understand the purpose of this utility model, characteristic sum effect fully.Obviously; described embodiment is a part of embodiment of the present utility model, instead of whole embodiment, based on embodiment of the present utility model; other embodiments that those skilled in the art obtains under the prerequisite not paying creative work, all belong to the scope of the utility model protection.In addition, all connection/annexations mentioned in literary composition, not singly refer to that component directly connects, and refer to and according to concrete performance, can connect auxiliary by adding or reducing, and form more excellent draw bail.Each technical characteristic in the invention, can combination of interactions under the prerequisite of not conflicting conflict.
As shown in Figure 1, a kind of electronic cooling module, comprise semiconductor refrigerating element 1, radiator 2, conduction cooling plate 3, chilled air fan 4 and heat-insulating and sealing cover 5, described semiconductor refrigerating element 1 has hot junction and cold junction, described heat-insulating and sealing cover 5 comprises cross wall 51 and perpendicular wall 52, described cross wall 51 is in same plane with semiconductor refrigerating element 1, and there is the breach of holding semiconductor cooling module 1, described radiator 2 and conduction cooling plate 3 are respectively from upper, downside clamps cross wall 51 and semiconductor refrigerating element 1 simultaneously, described hot junction and radiator 2 are fitted, described cold junction and conduction cooling plate 3 are fitted, described perpendicular wall 52 is from the edge of cross wall 51 to downward-extension, conduction cooling plate 3 is trapped among in heat-insulating and sealing cover 5, described chilled air fan 4 be positioned at heat-insulating and sealing cover 5 and its air supply direction just to conduction cooling plate 3.After semiconductor refrigerating element 1 is energized startup, producing heat pump effect, cold-side cooling, heats up in hot junction.Room air, by chilled air fan 4 suction heat-insulating and sealing cover 5, flows back to indoor again after conduction cooling plate 3 heat exchange cooling, realizes refrigeration object.Hot junction liberated heat is dispersed upward by radiator, and the cold air of the hot-air of top and below can come absolutely by described heat-insulating and sealing cover 5.
Be further used as preferred embodiment, described chilled air fan 4 is positioned at immediately below conduction cooling plate 3 central point.
Be further used as preferred embodiment, also comprise heat radiation guide plate 6, described heat radiation guide plate 6 is fixedly connected on the side of radiator 2 and upwards extends.
Be further used as preferred embodiment, also comprise radiator fan 7, described radiator fan 7 is positioned at directly over radiator 2 central point, and its air supply direction is just to radiator 2.
A kind of electronic cooling ceiling system, comprise metal ceiling 8, and electronic cooling module as above, described heat-insulating and sealing cover 5 is fixedly connected with metal ceiling 8 and encloses and forms cold wind and to circulate cavity, the middle part of described metal ceiling 8 is provided with the suction opeing suitable with chilled air fan 4, and described suction opeing periphery is provided with air outlet.
Above better embodiment of the present utility model is illustrated, but the invention is not limited to described embodiment, those of ordinary skill in the art also can make all equivalent modifications or replacement under the prerequisite without prejudice to the utility model spirit, and these equivalent modification or replacement are all included in the application's claim limited range.
Claims (5)
1. an electronic cooling module, it is characterized in that: comprise semiconductor refrigerating element (1), radiator (2), conduction cooling plate (3), chilled air fan (4) and heat-insulating and sealing cover (5), described semiconductor refrigerating element (1) has hot junction and cold junction, described heat-insulating and sealing cover (5) comprises cross wall (51) and perpendicular wall (52), described cross wall (51) and semiconductor refrigerating element (1) are in same plane, and there is the breach of holding semiconductor cooling module (1), described radiator (2) and conduction cooling plate (3) are respectively from upper, downside clamps cross wall (51) and semiconductor refrigerating element (1) simultaneously, described hot junction and radiator (2) are fitted, described cold junction and conduction cooling plate (3) are fitted, described perpendicular wall (52) is from the edge of cross wall (51) to downward-extension, conduction cooling plate (3) is trapped among in heat-insulating and sealing cover (5), described chilled air fan (4) be positioned at heat-insulating and sealing cover (5) and its air supply direction just to conduction cooling plate (3).
2. electronic cooling module according to claim 1, is characterized in that: described chilled air fan (4) is positioned at immediately below conduction cooling plate (3) central point.
3. electronic cooling module according to claim 1, is characterized in that: also comprise heat radiation guide plate (6), described heat radiation guide plate (6) is fixedly connected on the side of radiator (2) and upwards extends.
4. electronic cooling module according to claim 1, is characterized in that: also comprise radiator fan (7), and described radiator fan (7) is positioned at directly over radiator (2) central point, and its air supply direction is just to radiator (2).
5. an electronic cooling ceiling system, comprise metal ceiling (8), it is characterized in that: also comprise as arbitrary in Claims 1 to 4 as described in electronic cooling module, described heat-insulating and sealing cover (5) is fixedly connected with metal ceiling (8) and encloses and forms cold wind and to circulate cavity, the middle part of described metal ceiling (8) is provided with the suction opeing suitable with chilled air fan (4), and described suction opeing periphery is provided with air outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520594079.5U CN204943749U (en) | 2015-08-03 | 2015-08-03 | A kind of electronic cooling ceiling system and electronic cooling module thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520594079.5U CN204943749U (en) | 2015-08-03 | 2015-08-03 | A kind of electronic cooling ceiling system and electronic cooling module thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204943749U true CN204943749U (en) | 2016-01-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520594079.5U Active CN204943749U (en) | 2015-08-03 | 2015-08-03 | A kind of electronic cooling ceiling system and electronic cooling module thereof |
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| Country | Link |
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| CN (1) | CN204943749U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105091163A (en) * | 2015-08-03 | 2015-11-25 | 佛山市南海华狮龙金属装饰制品有限公司 | Electronic refrigerating ceiling system and electronic refrigerating module thereof |
-
2015
- 2015-08-03 CN CN201520594079.5U patent/CN204943749U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105091163A (en) * | 2015-08-03 | 2015-11-25 | 佛山市南海华狮龙金属装饰制品有限公司 | Electronic refrigerating ceiling system and electronic refrigerating module thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |