CN105091163A - Electronic refrigerating ceiling system and electronic refrigerating module thereof - Google Patents

Electronic refrigerating ceiling system and electronic refrigerating module thereof Download PDF

Info

Publication number
CN105091163A
CN105091163A CN201510483233.6A CN201510483233A CN105091163A CN 105091163 A CN105091163 A CN 105091163A CN 201510483233 A CN201510483233 A CN 201510483233A CN 105091163 A CN105091163 A CN 105091163A
Authority
CN
China
Prior art keywords
radiator
heat
sealing cover
cold
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510483233.6A
Other languages
Chinese (zh)
Inventor
梁洪斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FOSHAN NANHAI HUSILONG 0RNAMENTAL FITTINGS Co Ltd
Original Assignee
FOSHAN NANHAI HUSILONG 0RNAMENTAL FITTINGS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FOSHAN NANHAI HUSILONG 0RNAMENTAL FITTINGS Co Ltd filed Critical FOSHAN NANHAI HUSILONG 0RNAMENTAL FITTINGS Co Ltd
Priority to CN201510483233.6A priority Critical patent/CN105091163A/en
Publication of CN105091163A publication Critical patent/CN105091163A/en
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0042Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/30Arrangement or mounting of heat-exchangers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides an electronic refrigerating module and an electronic refrigerating ceiling system. The electronic refrigerating module comprises a semiconductor refrigerating element, a radiator, a cold guiding plate, a cold air fan and a heat isolation sealing cover. The semiconductor refrigerating element is provided with a heat end and a cold end. The heat isolation sealing cover comprises a transverse wall and a vertical wall. The transverse wall and the semiconductor refrigerating element are located on the same plane, and a notch containing the semiconductor refrigerating element is arranged. The radiator and the cold guiding plate clamp the transverse wall and the semiconductor refrigerating element from the upper side to the lower side respectively at the same time. The heat end is attached to the radiator. The cold end is attached to the cold guiding plate. The vertical wall extends downwards from the edge of the transverse wall. The cold guiding plate is surrounded in the heat isolation sealing cover. The cold air fan is located in the heat isolation sealing cover, and the air feeding direction of the cold air fan is right opposite to the cold guiding plate. The refrigerating requirement can be met by arranging one or more electronic refrigerating modules in the metal ceiling system, installing is easy, and the hiding performance is high. The electronic refrigerating module and the electronic refrigerating ceiling system can be applied to indoor decoration.

Description

A kind of electronic cooling ceiling system and electronic cooling module thereof
Technical field
The present invention relates to apparatus of air conditioning field, the electronic cooling module that particularly a kind of electronic cooling ceiling system, and this system uses.
Background technology
By influenced by global warming, the annual highest temperature of China is broken a record always, and therefore air-conditioning has also become requisite household electrical appliances of living at home, common are split-type air conditioner and central air-conditioning two kinds.In the space that some areas are less, as lavatory, kitchen etc., and be not suitable for split-type air conditioner is installed, because its refrigerating capacity is far beyond room volume, cause energy waste; And using central air-conditioning, its pipe laying extremely bothers again, so in general family, all well do not avoid heat refrigeration plant in the space such as lavatory, kitchen.
Summary of the invention
For the deficiencies in the prior art, the invention provides a kind of electronic cooling module, it can combine with metal ceiling system easily, for indoor subrange freezes.
The technical scheme of technical solution problem of the present invention is as follows:
A kind of electronic cooling module, comprise semiconductor refrigerating element, radiator, conduction cooling plate, chilled air fan and heat-insulating and sealing cover, described semiconductor refrigerating element has hot junction and cold junction, described heat-insulating and sealing cover comprises cross wall and perpendicular wall, described cross wall and semiconductor refrigerating element are in same plane, and there is the breach of holding semiconductor cooling module, described radiator and conduction cooling plate are respectively from upper, downside clamps cross wall and semiconductor refrigerating element simultaneously, described hot junction and radiator are fitted, described cold junction and conduction cooling plate are fitted, described perpendicular wall is from the edge of cross wall to downward-extension, conduction cooling plate is trapped among in heat-insulating and sealing cover, described chilled air fan be positioned at heat-insulating and sealing cover and its air supply direction just to conduction cooling plate.Described chilled air fan is positioned at immediately below conduction cooling plate central point.Also comprise heat radiation guide plate, described heat radiation guide plate is fixedly connected on the side of radiator and upwards extends.Also comprise radiator fan, described radiator fan is positioned at directly over radiator central point, and its air supply direction is just to radiator.
The invention also discloses a kind of electronic cooling ceiling system, comprise metal ceiling, and electronic cooling module as above, described heat-insulating and sealing cover is fixedly connected with metal ceiling and encloses and forms cold wind and to circulate cavity, the middle part of described metal ceiling is provided with the suction opeing suitable with chilled air fan, and described suction opeing periphery is provided with air outlet.
The beneficial effect that the present invention brings is:
Can according to room area, in metal ceiling system, arrange one or more electronic cooling module can meet refrigeration demand, installs easily, disguised high, to there will not be as split-type air conditioner refrigerating capacity far beyond the situation of room volume.The metal ceiling being provided with electronic cooling module has just had more suction opeing and air outlet compared with common metal ceiling, the not any change of its mounting means.The present invention can be applied to interior decoration.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described.Obviously, described accompanying drawing is a part of embodiment of the present invention, instead of whole embodiment, and those skilled in the art, under the prerequisite not paying creative work, can also obtain other designs and accompanying drawing according to these accompanying drawings.
Fig. 1 is the schematic front view of electronic cooling module;
Fig. 2 is that schematic diagram is looked on the right side that electronic cooling module combines with metal ceiling.
Detailed description of the invention
Be clearly and completely described below with reference to embodiment and the accompanying drawing technique effect to design of the present invention, concrete structure and generation, to understand object of the present invention, characteristic sum effect fully.Obviously; described embodiment is a part of embodiment of the present invention, instead of whole embodiment, based on embodiments of the invention; other embodiments that those skilled in the art obtains under the prerequisite not paying creative work, all belong to the scope of protection of the invention.In addition, all connection/annexations mentioned in literary composition, not singly refer to that component directly connects, and refer to and according to concrete performance, can connect auxiliary by adding or reducing, and form more excellent draw bail.Each technical characteristic in the invention, can combination of interactions under the prerequisite of not conflicting conflict.
As shown in Figure 1, a kind of electronic cooling module, comprise semiconductor refrigerating element 1, radiator 2, conduction cooling plate 3, chilled air fan 4 and heat-insulating and sealing cover 5, described semiconductor refrigerating element 1 has hot junction and cold junction, described heat-insulating and sealing cover 5 comprises cross wall 51 and perpendicular wall 52, described cross wall 51 is in same plane with semiconductor refrigerating element 1, and there is the breach of holding semiconductor cooling module 1, described radiator 2 and conduction cooling plate 3 are respectively from upper, downside clamps cross wall 51 and semiconductor refrigerating element 1 simultaneously, described hot junction and radiator 2 are fitted, described cold junction and conduction cooling plate 3 are fitted, described perpendicular wall 52 is from the edge of cross wall 51 to downward-extension, conduction cooling plate 3 is trapped among in heat-insulating and sealing cover 5, described chilled air fan 4 be positioned at heat-insulating and sealing cover 5 and its air supply direction just to conduction cooling plate 3.After semiconductor refrigerating element 1 is energized startup, producing heat pump effect, cold-side cooling, heats up in hot junction.Room air, by chilled air fan 4 suction heat-insulating and sealing cover 5, flows back to indoor again after conduction cooling plate 3 heat exchange cooling, realizes refrigeration object.Hot junction liberated heat is dispersed upward by radiator, and the cold air of the hot-air of top and below can come absolutely by described heat-insulating and sealing cover 5.
Be further used as preferred embodiment, described chilled air fan 4 is positioned at immediately below conduction cooling plate 3 central point.
Be further used as preferred embodiment, also comprise heat radiation guide plate 6, described heat radiation guide plate 6 is fixedly connected on the side of radiator 2 and upwards extends.
Be further used as preferred embodiment, also comprise radiator fan 7, described radiator fan 7 is positioned at directly over radiator 2 central point, and its air supply direction is just to radiator 2.
A kind of electronic cooling ceiling system, comprise metal ceiling 8, and electronic cooling module as above, described heat-insulating and sealing cover 5 is fixedly connected with metal ceiling 8 and encloses and forms cold wind and to circulate cavity, the middle part of described metal ceiling 8 is provided with the suction opeing suitable with chilled air fan 4, and described suction opeing periphery is provided with air outlet.
Above better embodiment of the present invention is illustrated, but the invention is not limited to described embodiment, those of ordinary skill in the art also can make all equivalent modifications or replacement under the prerequisite without prejudice to spirit of the present invention, and these equivalent modification or replacement are all included in the application's claim limited range.

Claims (5)

1. an electronic cooling module, it is characterized in that: comprise semiconductor refrigerating element (1), radiator (2), conduction cooling plate (3), chilled air fan (4) and heat-insulating and sealing cover (5), described semiconductor refrigerating element (1) has hot junction and cold junction, described heat-insulating and sealing cover (5) comprises cross wall (51) and perpendicular wall (52), described cross wall (51) and semiconductor refrigerating element (1) are in same plane, and there is the breach of holding semiconductor cooling module (1), described radiator (2) and conduction cooling plate (3) are respectively from upper, downside clamps cross wall (51) and semiconductor refrigerating element (1) simultaneously, described hot junction and radiator (2) are fitted, described cold junction and conduction cooling plate (3) are fitted, described perpendicular wall (52) is from the edge of cross wall (51) to downward-extension, conduction cooling plate (3) is trapped among in heat-insulating and sealing cover (5), described chilled air fan (4) be positioned at heat-insulating and sealing cover (5) and its air supply direction just to conduction cooling plate (3).
2. electronic cooling module according to claim 1, is characterized in that: described chilled air fan (4) is positioned at immediately below conduction cooling plate (3) central point.
3. electronic cooling module according to claim 1, is characterized in that: also comprise heat radiation guide plate (6), described heat radiation guide plate (6) is fixedly connected on the side of radiator (2) and upwards extends.
4. electronic cooling module according to claim 1, is characterized in that: also comprise radiator fan (7), and described radiator fan (7) is positioned at directly over radiator (2) central point, and its air supply direction is just to radiator (2).
5. an electronic cooling ceiling system, comprise metal ceiling (8), it is characterized in that: also comprise as arbitrary in Claims 1 to 4 as described in electronic cooling module, described heat-insulating and sealing cover (5) is fixedly connected with metal ceiling (8) and encloses and forms cold wind and to circulate cavity, the middle part of described metal ceiling (8) is provided with the suction opeing suitable with chilled air fan (4), and described suction opeing periphery is provided with air outlet.
CN201510483233.6A 2015-08-03 2015-08-03 Electronic refrigerating ceiling system and electronic refrigerating module thereof Pending CN105091163A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510483233.6A CN105091163A (en) 2015-08-03 2015-08-03 Electronic refrigerating ceiling system and electronic refrigerating module thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510483233.6A CN105091163A (en) 2015-08-03 2015-08-03 Electronic refrigerating ceiling system and electronic refrigerating module thereof

Publications (1)

Publication Number Publication Date
CN105091163A true CN105091163A (en) 2015-11-25

Family

ID=54572159

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510483233.6A Pending CN105091163A (en) 2015-08-03 2015-08-03 Electronic refrigerating ceiling system and electronic refrigerating module thereof

Country Status (1)

Country Link
CN (1) CN105091163A (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2447666Y (en) * 2000-09-29 2001-09-12 汤继青 Ceiling semiconductor air conditioner
CN2463728Y (en) * 2000-08-25 2001-12-05 上海钻嘉科技发展有限公司 Cabinet type single chamber semiconductor air-conditioning apparatus
CN2867185Y (en) * 2006-01-13 2007-02-07 珠海佳一电子技术有限公司 Semiconductor air-conditioner
CN201069222Y (en) * 2007-06-29 2008-06-04 李乃应 Mosquito net air conditioner
CN201580392U (en) * 2010-01-04 2010-09-15 陈献忠 Narrow orbit mining motor vehicle semi-conductor refrigerating air conditioner
RU2407954C1 (en) * 2009-04-09 2010-12-27 Общество с ограниченной ответственностью "Системы связи и технического контроля" (ООО "Системы СТК") Thermoelectric air cooler
KR20110102586A (en) * 2010-03-11 2011-09-19 노태호 Air cleaner with air-conditioning unit
CN204943749U (en) * 2015-08-03 2016-01-06 佛山市南海华狮龙金属装饰制品有限公司 A kind of electronic cooling ceiling system and electronic cooling module thereof

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2463728Y (en) * 2000-08-25 2001-12-05 上海钻嘉科技发展有限公司 Cabinet type single chamber semiconductor air-conditioning apparatus
CN2447666Y (en) * 2000-09-29 2001-09-12 汤继青 Ceiling semiconductor air conditioner
CN2867185Y (en) * 2006-01-13 2007-02-07 珠海佳一电子技术有限公司 Semiconductor air-conditioner
CN201069222Y (en) * 2007-06-29 2008-06-04 李乃应 Mosquito net air conditioner
RU2407954C1 (en) * 2009-04-09 2010-12-27 Общество с ограниченной ответственностью "Системы связи и технического контроля" (ООО "Системы СТК") Thermoelectric air cooler
CN201580392U (en) * 2010-01-04 2010-09-15 陈献忠 Narrow orbit mining motor vehicle semi-conductor refrigerating air conditioner
KR20110102586A (en) * 2010-03-11 2011-09-19 노태호 Air cleaner with air-conditioning unit
CN204943749U (en) * 2015-08-03 2016-01-06 佛山市南海华狮龙金属装饰制品有限公司 A kind of electronic cooling ceiling system and electronic cooling module thereof

Similar Documents

Publication Publication Date Title
CN204329197U (en) Electric-controlled box, air-conditioner outdoor unit and air-conditioning
RU2541434C2 (en) Internal air conditioner unit
CN103604169A (en) Heating and cooling air conditioner
KR20130091731A (en) Indoor unit of air conditioner
CN202166128U (en) Integrated air-conditioner
CN204612012U (en) Air-conditioner outdoor unit and air-conditioner
JP6100518B2 (en) Heat pump equipment outdoor unit
CN204943749U (en) A kind of electronic cooling ceiling system and electronic cooling module thereof
CN105066281A (en) Heat radiation structure of electronic control module and heat radiation method thereof, air conditioning outdoor unit and air conditioner
CN102705942A (en) Thermal resonance radiation air conditioning system with heat pipes
CN204693673U (en) Semiconductor refrigerating module and smoke exhaust ventilator
CN203907967U (en) Air conditioner and radiator of electrical controller thereof
CN105091163A (en) Electronic refrigerating ceiling system and electronic refrigerating module thereof
KR100846000B1 (en) The whole type air conditioning system which becomes module
RU152103U1 (en) EQUIPMENT THERMAL REGULATION
CN204613851U (en) A kind of computer cooling system
EP2956723B1 (en) Energy system for dwellings
CN204555253U (en) A kind of burglarproof air conditioner
CN204460539U (en) Semiconductor refrigerating module and smoke exhaust ventilator
CN203912438U (en) Outdoor communication equipment cabinet
CN205210793U (en) Computer radiating device
CN204407742U (en) Ultra-thin dehydrating unit
CN203687196U (en) Air conditioning unit
CN105805861B (en) Cold and hot air isolation structure of semiconductor refrigeration module
CN203120326U (en) Network cabinet

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20151125