CN204927330U - Power type LED support - Google Patents
Power type LED support Download PDFInfo
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- CN204927330U CN204927330U CN201520609557.5U CN201520609557U CN204927330U CN 204927330 U CN204927330 U CN 204927330U CN 201520609557 U CN201520609557 U CN 201520609557U CN 204927330 U CN204927330 U CN 204927330U
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Abstract
For overcoming LED support processing difficulty among the prior art, problem with high costs, the utility model provides a power type LED support which comprises the base plate of pottery material and the reflection cup of plastics material, the connecting hole has on the base plate, reflection bottom of cup portion is formed with connecting portion, connecting portion fill in in the connecting hole. The utility model provides a power type LED support preparation technology is simple, and is with low costs to the bonding strength on the base plate is high for the reflection cup.
Description
Technical field
The utility model relates to a kind of power-type LED support.
Background technology
Along with the develop rapidly of light-emitting diode industry, light-emitting diode industry has entered high-speed development period that is high-power, high brightness.Usually, power type light-emitting diode refers to that power is the light-emitting diode of more than 0.5W, and along with the development of industry, power type light-emitting diode application also gets more and more.
But due to LED product optically focused, calorifics, electricity, mechanics product, cause in use procedure also run into a lot of technical problem need solve, be exactly mainly wherein luminous efficiency, heat dissipation problem, current LED product technical staff has done a lot of improvement in its packaging technology, use ceramic substrate, increase the conductive coefficient of substrate, reduce thermal resistance, thus promote the heat-sinking capability of LED product.Current planar structure ceramic substrate, lacks light reflector, and product light extraction efficiency is very low, causes product luminous efficiency low; And adopting the bowl cup ceramic substrate of high temperature sintering, complex process, cost is high, and ceramic hardness high fragility is large, causes follow-up cutting action difficulty.
For overcoming the problems referred to above, in prior art, develop a kind of LED support, ceramic substrate has the ceramic reflecting cup with ceramic substrate one, but the complex manufacturing technology of this structure, and cost is high, and ceramic hardness high fragility is large, causes follow-up cutting action difficulty.
Utility model content
Technical problem to be solved in the utility model is for LED support processing difficulties of the prior art, problem that cost is high, provides a kind of power-type LED support.
It is as follows that the utility model solves the problems of the technologies described above adopted technical scheme:
There is provided a kind of power-type LED support, comprise the substrate of ceramic material and the reflector of plastic material, described reflector is the cup-shaped of indent, and reflector and upper surface of base plate form echo area jointly; Described substrate has connecting hole; Be formed with connecting portion bottom described reflector, described connecting portion is filled in described connecting hole.
The power-type LED support that the utility model provides is substrate with ceramic material, and substrate is fixed with the reflector of plastic material, and described substrate has connecting hole; Be formed with connecting portion bottom described reflector, described connecting portion is filled in described connecting hole.This power-type LED support can effectively optically focused, bright dipping, thus reaches specular removal performance.Utilize the high thermal conductivity of pottery simultaneously, high heat dispersion requirement can be reached, reduce product chips junction temperature, the improving product life-span.Further, because reflector material is plastics, its hardness is low, easily cuts, and effectively can improve the bad problem of cutting of follow-up cutting action, is beneficial to improve to produce yield, reduces production cost.In addition, reflector is fixed on substrate by the way, is beneficial to and ensures reflector fixedly securing on substrate, thus the reliability of improving product, the life-span.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the power-type LED support that the first execution mode of the utility model provides;
Fig. 2 is the cross-sectional view of the power-type LED support that the utility model the second execution mode provides;
Fig. 3 is in the preparation process of the power-type LED support that the first execution mode of the utility model provides, the cross-sectional view of the substrate obtained after perforate;
Fig. 4 is in the preparation process of the power-type LED support that the first execution mode of the utility model provides, and substrate is formed the cross-sectional view behind conducting wire;
Fig. 5 is in the preparation process of the power-type LED support that the first execution mode of the utility model provides, the cross-sectional view of the power-type LED support obtained after injection moulding reflector.
Reference numeral in Figure of description is as follows:
10, substrate; 11, connecting hole; 12, the first conductive hole; 13, the second conductive hole;
20, reflector; 21, connecting portion;
30, the first electrode;
40, the second electrode.
Embodiment
The technical problem solved to make the utility model, technical scheme and beneficial effect are clearly understood, below in conjunction with drawings and Examples, are further elaborated to the utility model.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
In description of the present utility model, it will be appreciated that, term " on ", D score, " vertically ", " level ", " top ", " end ", " interior ", the orientation of the instruction such as " outward " or position relationship be for based on the orientation shown in accompanying drawing 1 or position relationship, only the utility model and simplified characterization for convenience of description, instead of the device of instruction or hint indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as restriction of the present utility model.In description of the present utility model, except as otherwise noted, the implication of " multiple " is two or more.
The power-type LED support that the utility model provides comprises the substrate of ceramic material and the reflector of plastic material; Described substrate has connecting hole; Be formed with connecting portion bottom described reflector, described connecting portion is filled in described connecting hole.
Wherein, substrate can adopt conventional ceramic material substrate, such as, specifically can adopt aluminium oxide or aluminum nitride ceramic substrate.
Aforesaid substrate is also fixed with the reflector of plastic material.Concrete, the material of reflector can adopt in nontransparent polyphtalamide, poly terephthalic acid 1,4-CHDM ester, epoxy-plastic packaging material one or more.
In the utility model, be fixed on this structure on substrate for realizing reflector, concrete adopts following structure: described substrate offers connecting hole; Described connecting hole vertically runs through described substrate; Be formed with connecting portion bottom described reflector, described connecting portion is filled in described connecting hole, and connecting portion bottom is positioned at below base lower surface.Now, the connecting portion bottom reflector runs through substrate.
Or the concrete structure that reflector is fixed on substrate can be: described upper surface of base plate indent forms connecting hole, and described connecting hole is blind hole; Be formed with connecting portion bottom described reflector, described connecting portion is filled in described connecting hole.
General shape and the existing ceramic reflecting cup of above-mentioned reflector are similar, and such as, on substrate, the cup-shaped of reflector substantially in indent, reflector and upper surface of base plate form echo area jointly.LED chip is fixed on the substrate surface in this echo area.
As is known in the art, substrate is also provided with simultaneously the positive pole being electrically connected to LED chip and negative pole.In the utility model, concrete, described substrate is also provided with the first electrode and second electrode of mutually insulated; Described first electrode and the second electrode are arranged in the upper and lower surface of substrate all simultaneously.
Above-mentioned first electrode does not limit, and can be positive pole or negative pole, corresponding, above-mentioned second electrode can be negative pole or positive pole.
Above-mentioned " the first electrode and the second electrode are arranged in the upper and lower surface of substrate all simultaneously " this structure can adopt conventional various set-up modes, according to the utility model, concrete, described substrate also has the first conductive hole and the second conductive hole; Described first conductive hole and the second conductive hole all vertically run through described substrate; Described first electrode fills described first conductive hole, and extends to the upper and lower surface of described substrate from described first conductive hole; Described second electrode fills described second conductive hole, and extends to the upper and lower surface of described substrate from described second conductive hole.
Meanwhile, the utility model additionally provides the preparation method of above-mentioned power-type LED support, comprises the steps:
S1, provide the substrate of ceramic material, described substrate has connecting hole, described connecting hole extends to the inner or described connecting hole of described substrate from upper surface of base plate and runs through described substrate;
S2, the first electrode that mutually insulated is set on the substrate and the second electrode;
S3, on the substrate surface form the reflector of plastic material, and form connecting portion bottom reflector, and described connecting portion is filled in described connecting hole at least partly.
According to the utility model, first, the substrate that has a ceramic material of connecting hole is provided.As previously mentioned, substrate material specifically can adopt aluminium oxide or aluminium nitride ceramics.
Wherein, described connecting hole extends to the inner or described connecting hole of described substrate from upper surface of base plate and runs through described substrate.
Aforesaid substrate forms connecting hole by the method for radium-shine punching or boring and obtains on ceramic bare board.
Above-mentioned connecting hole is for realizing being fixedly connected with of reflector and substrate.Concrete, above-mentioned connecting hole vertically runs through described substrate.
After acquisition aforesaid substrate, as existing, the first electrode and second electrode of mutually insulated need be set on substrate.The set-up mode of above-mentioned first electrode and the second electrode and structure can adopt conventional, usually, on the upper surface that the first electrode and the second electrode are arranged at substrate all simultaneously and lower surface.
In the utility model, under preferable case, the substrate in step S1 also have the first conductive hole and the second conductive hole; Described first conductive hole and the second conductive hole all run through described substrate, and such as described first conductive hole and the second conductive hole all vertically run through described substrate.
As previously mentioned, the mode by radium-shine punching or boring forms described first conductive hole and the second conductive hole on ceramic bare board.
Then, in described step S2, the first electrode and the second electrode are set, make described first electrode fill described first conductive hole, and extend to the upper and lower surface of described substrate from described first conductive hole; Described second electrode fills described second conductive hole, and extends to the upper and lower surface of described substrate from described second conductive hole.
Concrete, in described step S2, the mode by plated metal or sintering metal prepares described first electrode and the second electrode.
The concrete grammar that mode above by plated metal prepares the first electrode and the second electrode can be: first, forms one deck conductive metal film by the mode sputtering or spray on substrate; Then the above-mentioned substrate with conductive metal film is placed in electroplate liquid to electroplate, plated metal is formed in first conductive hole and the second conductive hole of substrate, control the design parameter of electroplate liquid and electroplating technology, the metal level that substrate surface is formed reaches desired thickness, and makes plated metal fill the first conductive hole and the second conductive hole.Again by dry film or wet film technique, make metallic circuit pattern, and etch-forming, obtain the first electrode and the second electrode.
The electroplate liquid adopted in above-mentioned electroplating process and concrete electroplating technology can adopt this area commonly use various, the utility model is not particularly limited.
The concrete grammar being prepared described first electrode and the second electrode by the mode of sintering metal can be: by the mode of printing, metal paste is printed on substrate, line chart pattern needed for formation, now, metal paste need fill completely described first conductive hole and the second conductive hole.Then by high temperature sintering heat treatment, by metal paste melting, by metallic circuit pattern forming, the first electrode and the second electrode is obtained.
According to the utility model, understandable, when forming above-mentioned first electrode and the second electrode, connecting hole need be avoided to be filled or shutoff.
As step S3, after substrate is formed the first electrode and the second electrode, then surface forms the reflector of plastic material on the substrate, and make to form connecting portion bottom reflector, described connecting portion is at least filled in described connecting hole.
According to the utility model, the method by mold pressing or injection moulding prepares described reflector.Mold pressing or injection molding manner can adopt this area the various methods commonly used, be not particularly limited in the utility model.The material adopted when mold pressing or injection moulding can be one or more in polyphtalamide, poly terephthalic acid 1,4-CHDM ester, epoxy-plastic packaging material.
Above-mentioned polyphtalamide, poly terephthalic acid 1,4-cyclohexanedimethanoester ester, epoxy-plastic packaging material are material known in the art, such as, the semiaromatic polyamide composition that polyphtalamide (being called for short PPA) resin is is raw material with terephthalic acid (TPA) or phthalic acid.Mineral filler level PPA is used for the purposes of reflecting surface and plating aspect, comprises automobile headlamp, decoration pipe fitting and hardware.
Poly terephthalic acid 1,4-CHDM ester is called for short PCT, also claims cyclohexanedimethanol to support dimethylene ester resin.PCT resin is a kind of thermoplastics of high temperature resistant, semicrystalline, is the another new product of polyester family.
Epoxy-plastic packaging material (EpoxyMoldingCompound, be called for short EMC), be matrix resin by epoxy resin, be curing agent with High Performance Phenolic Resins, adding silicon powder etc. is filler, and adds the powdery moulding compound of multiple additive mixture.
By the mode of injection moulding or mold pressing, make filling plastic connecting hole, bottom reflector, form connecting portion, realize fixing on substrate of reflector.Understandable, as previously mentioned, when connecting hole runs through substrate, connecting portion is filled in described connecting hole, and connecting portion bottom is positioned at below base lower surface.When connecting hole is the blind hole from substrate surface indent, connecting portion is filled in described connecting hole.
Fig. 1 shows the concrete structure of the first execution mode of the power-type LED support that the utility model provides.
Concrete, the substrate 10 of ceramic material vertically offers connecting hole 11, and connecting hole 11 runs through substrate 10.Meanwhile, substrate 10 also vertically offers the first conductive hole 12 and the second conductive hole 13 running through substrate 10.
The reflector 20 of plastic material is arranged at substrate 10 upper surface, has the connecting portion 21 to downward-extension bottom reflector 20.Connecting portion 21 is filled in the connecting hole 11 on aforesaid substrate 10, and the bottom of connecting portion 21 extends to below the lower surface of substrate 10.Reflector 20 cross section is trapezoidal, and reflector 20 coordinates with substrate 10, and surface forms the cup-shaped echo area of indent on the substrate 10.
First electrode 30 is filled in the first conductive hole 12, and the upper surface extending to substrate 10 from the two ends up and down of the first conductive hole 12 and lower surface, extends along the upper surface of substrate 10 and lower surface simultaneously.Same, the second electrode 40 is filled in the second conductive hole 13, and the upper surface extending to substrate 10 from the two ends up and down of the second conductive hole 13 and lower surface, extends along the upper surface of substrate 10 and lower surface simultaneously.First electrode 30 and the second electrode 40 are separated from each other, the two insulation.
The part that first electrode 30 and the second electrode 40 are positioned at substrate 10 upper surface is and above-mentioned echo area.
Fig. 2 shows the concrete structure of the second execution mode of the power-type LED support that the utility model provides.
In this embodiment, the structure of power-type LED support is substantially identical with the structure shown in Fig. 1, and difference is that the connecting hole 11 on substrate 10 extends to substantially inner from substrate 10 upper surface, does not run through substrate 10.And the connecting portion 21 bottom reflector 20 is only filled in this connecting hole 11, does not extend to below substrate 10.
Fig. 3-Fig. 5 shows the preparation method of the power-type LED support shown in Fig. 1.
First, as shown in Figure 3, by radium-shine mode, vertically hole on ceramic bare board, form connecting hole 11, first conductive hole 12 and the second conductive hole 13, obtain substrate 10.Wherein, the first conductive hole 12 and the second conductive hole 13 are positioned at inside connecting hole 11.
See Fig. 4, prepare the first electrode 30 and the second electrode 40 on the substrate 10 by the mode of sintering metal on the substrate 10.Described first electrode 30 fills described first conductive hole 12, and extends to the upper and lower surface of described substrate 10 from described first conductive hole 12; Described second electrode 40 fills described second conductive hole 13, and extends to the upper and lower surface of described substrate 10 from described second conductive hole 13.Meanwhile, the first electrode 30 and the second electrode 40 are positioned at inside connecting hole 11.
See Fig. 5, in connecting hole 11 position, on the substrate 10 with the first electrode 30 and the second electrode 40, reflector 20 is formed by injection molding manner, reflector 20 is positioned on connecting hole 11, in injection moulding process, the resin of melting enters connecting hole 11 and fills connecting hole 11, and extends to substrate 10 lower surface further.The reflector 20 be fixed on substrate 10 is formed after resin solidification.
The power-type LED support that the utility model provides take ceramic material as substrate 10, and is fixed with the reflector 20 of plastic material on the substrate 10, and this power-type LED support can effectively optically focused, bright dipping, thus reaches specular removal performance.Utilize the high thermal conductivity of pottery simultaneously, high heat dispersion requirement can be reached, reduce product chips junction temperature, the improving product life-span.Further, because reflector 20 material is plastics, its hardness is low, easily cuts, and effectively can improve the bad problem of cutting of follow-up cutting action, is beneficial to improve to produce yield, reduces production cost.In addition, reflector 20 is fixed on substrate 10, is beneficial to and ensures reflector 20 fixedly securing on the substrate 10, thus the reliability of improving product.The reliability of most improving product, life-span.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (6)
1. a power-type LED support, is characterized in that, comprises the substrate of ceramic material and the reflector of plastic material, and described reflector is the cup-shaped of indent, and reflector and upper surface of base plate form echo area jointly;
Described substrate has connecting hole; Be formed with connecting portion bottom described reflector, described connecting portion is filled in described connecting hole.
2. power-type LED support according to claim 1, is characterized in that, described connecting hole vertically runs through described substrate;
Described connecting portion is filled in described connecting hole, and connecting portion bottom is positioned at below base lower surface.
3. power-type LED support according to claim 1, is characterized in that, described connecting hole is blind hole.
4. according to the power-type LED support in claim 1-3 described in any one, it is characterized in that, described substrate is also provided with the first electrode and second electrode of mutually insulated; Described first electrode and the second electrode are arranged in the upper and lower surface of substrate all simultaneously.
5. power-type LED support according to claim 4, is characterized in that, described substrate also has the first conductive hole and the second conductive hole; Described first conductive hole and the second conductive hole all vertically run through described substrate;
Described first electrode fills described first conductive hole, and extends to the upper and lower surface of described substrate from described first conductive hole;
Described second electrode fills described second conductive hole, and extends to the upper and lower surface of described substrate from described second conductive hole.
6. according to the power-type LED support in claim 1-3,5 described in any one, it is characterized in that, described substrate is aluminium oxide or aluminium nitride; Described reflector is the one in polyphtalamide, poly terephthalic acid 1,4-CHDM ester, epoxy-plastic packaging material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520609557.5U CN204927330U (en) | 2015-08-13 | 2015-08-13 | Power type LED support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520609557.5U CN204927330U (en) | 2015-08-13 | 2015-08-13 | Power type LED support |
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| Publication Number | Publication Date |
|---|---|
| CN204927330U true CN204927330U (en) | 2015-12-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520609557.5U Active CN204927330U (en) | 2015-08-13 | 2015-08-13 | Power type LED support |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112968110A (en) * | 2021-02-03 | 2021-06-15 | 华引芯（武汉）科技有限公司 | All-inorganic packaging high-power LED device and manufacturing method thereof |
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2015
- 2015-08-13 CN CN201520609557.5U patent/CN204927330U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112968110A (en) * | 2021-02-03 | 2021-06-15 | 华引芯（武汉）科技有限公司 | All-inorganic packaging high-power LED device and manufacturing method thereof |
| CN112968110B (en) * | 2021-02-03 | 2022-02-11 | 华引芯（武汉）科技有限公司 | All-inorganic packaging high-power LED device and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191122 Address after: 518119 1 Yanan Road, Kwai Chung street, Dapeng New District, Shenzhen, Guangdong Patentee after: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address before: 516083 Guangdong city of Huizhou province Dayawan xiangshuihe Patentee before: HUIZHOU BYD INDUSTRIAL Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: BYD Semiconductor Co.,Ltd. |