CN204905294U - Luminous car headlight device based on ceramic plate COB uses face down chip - Google Patents
Luminous car headlight device based on ceramic plate COB uses face down chip Download PDFInfo
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- CN204905294U CN204905294U CN201520676245.6U CN201520676245U CN204905294U CN 204905294 U CN204905294 U CN 204905294U CN 201520676245 U CN201520676245 U CN 201520676245U CN 204905294 U CN204905294 U CN 204905294U
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- ceramic wafer
- flip
- chip
- led
- adhesive layer
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Abstract
The utility model provides a luminous car headlight device based on ceramic plate COB uses face down chip, including ceramic plate carrier and transparent adhesive layer, be equipped with printed wire conductor and LED chipset on the ceramic plate carrier, the LED chipset includes a plurality of LED flip chips, electric connection between each LED flip chip, the LED flip chip at LED chipset both ends respectively with the printed wire conductor at ceramic plate carrier both ends is connected, transparent adhesive layer cladding is in the ceramic plate carrier with the LED chipset is peripheral. The beneficial effects of the utility model are that: the radiating rate is fast, has high reliability and stability, and light scattering nature is good, high color development.
Description
Technical field
The utility model relates to lighting device, particularly relates to a kind of large lamp components of luminous automobile using flip-chip based on ceramic wafer COB in lighting device.
Background technology
Be born so far from automobile in 1886, automobile all there occurs earth-shaking change from entirety to various piece, it has developed into the comprehensive carrier of scientific and technological level from a kind of delivery vehicle, and as a part that automobile is the most eye-catching, car light has unusual status naturally.In predictable future, safer, the environmental protection that car light will develop, fashion, for automobile, they will be exactly revealing of oneself personality.
Along with the raising of the change of traffic environment and vehicle safety, the feature of environmental protection, incandescent lamp can not have been satisfied the demand, and first the brightness of incandescent lamp series is inadequate, because the speed of a motor vehicle is more and more faster, under night and blind environment, brightness not directly affects the safety of vehicle and pedestrian.Next is not environmentally, compares with the bulk life time of automobile, and the life-span of incandescent lamp series is still too short.
More mainly due to traditional forward LED headlight for vehicles because light-emitting area is narrow, large-scale integrated is on bearing substrate, form a larger light emitting source, amount of heat can be caused thus to accumulate, simultaneously the silica gel of the insulating cement that uses of fixed chip and the coating of carrying fluorescent material ring-type is the low-down material of conductive coefficient (lower than 1.0W/ (mK)), accumulation of heat is caused in chip perimeter and lamp colloid inside, temperature sharply to be raised, and the rising of temperature can make its luminous efficiency plummet, colloid chaps, bonding line disconnection etc., therefore LED formal dress headlight for vehicles integrity problem becomes increasingly conspicuous.
Summary of the invention
In order to solve the problems of the prior art, the utility model provides a kind of large lamp components of luminous automobile using flip-chip based on ceramic wafer COB of good heat dissipation effect.
The utility model provides a kind of large lamp components of luminous automobile using flip-chip based on ceramic wafer COB, comprise ceramic wafer carrier and transparent adhesive layer, described ceramic wafer carrier is provided with printed wire conductor and LED chip group, described LED chip group comprises multiple LED flip chip, be electrically connected between each LED flip chip, the LED flip chip at described LED chip group two ends is connected with the printed wire conductor at described ceramic wafer carrier two ends respectively, and described transparent adhesive layer is coated on described ceramic wafer carrier and described LED chip group is peripheral.
As further improvement of the utility model, described ceramic wafer carrier is aluminium oxide ceramic substrate.
As further improvement of the utility model, described LED flip chip adopts aluminium alloy to be fixed on described printed wire conductor.
As further improvement of the utility model, described transparent adhesive layer is rectangle.
As further improvement of the utility model, described ceramic wafer carrier is rectangle.
As further improvement of the utility model, the length of described transparent adhesive layer is 9.5mm, and wide is 6.5mm.
As further improvement of the utility model, the length of described ceramic wafer carrier is 22mm, and wide is 10mm
As further improvement of the utility model, described transparent adhesive layer is silica gel mixed fluorescent powder layer.
As further improvement of the utility model, described printed wire conductor is connected with both positive and negative polarity and derives circuit.
The beneficial effects of the utility model are: radiating rate is fast, and have high reliability and stability, light diffusing is good, high colour developing.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation using the large lamp components of luminous automobile of flip-chip based on ceramic wafer COB of the utility model.
Embodiment
To illustrate below in conjunction with accompanying drawing and embodiment further illustrates the utility model.
Drawing reference numeral in Fig. 1 is: ceramic wafer carrier 1; LED chip group 2; Transparent adhesive layer 3; Both positive and negative polarity derives circuit 4.
As shown in Figure 1, a kind of large lamp components of luminous automobile using flip-chip based on ceramic wafer COB, comprise ceramic wafer carrier 1 and transparent adhesive layer 3, described ceramic wafer carrier 1 is provided with printed wire conductor and LED chip group 2, described LED chip group 2 comprises multiple LED flip chip, be electrically connected between each LED flip chip, the LED flip chip at described LED chip group 2 two ends is connected with the printed wire conductor at described ceramic wafer carrier 1 two ends respectively, and described transparent adhesive layer 3 is coated on described ceramic wafer carrier 1 and described LED chip group 2 is peripheral.
As shown in Figure 1, the LED chip group 2 of the large lamp components of this luminous automobile uses the mode of printed wire to connect, improve stability and the fastness of connection, transparent adhesive layer 3 adopts high thixotropic effects and has the shaping circle of the silica gel of certain fluidity or ellipse, overall structure is evenly attractive in appearance, easy to make, this LED automobile headlamp intensity of illumination is strong, realizes 140 degree of luminescences.Can be used for the application on the automotive type light-emitting lamp of traditional incandescent light, HID lamp.
As shown in Figure 1, described ceramic wafer carrier 1 is aluminium oxide ceramic substrate.
As shown in Figure 1, described LED flip chip adopts aluminium alloy to be fixed on described printed wire conductor.
As shown in Figure 1, described transparent adhesive layer 3 is rectangle.
As shown in Figure 1, described ceramic wafer carrier 1 is rectangle.
As shown in Figure 1, the length of described transparent adhesive layer 3 is 9.5mm, and wide is 6.5mm.
As shown in Figure 1, the length of described ceramic wafer carrier 1 is 22mm, and wide is 10mm
As shown in Figure 1, described transparent adhesive layer 3 is silica gel mixed fluorescent powder layer.
As shown in Figure 1, described printed wire conductor is connected with both positive and negative polarity and derives circuit 4.
As shown in Figure 1, described ceramic wafer carrier 1 is employing 96% aluminium oxide ceramic substrate, and pottery is Al
2o
3, chips substrate is also Al
2o
3, similar thermal expansion coefficient, can not snap and cause light decay and dead lamp by crystal grain because of variations in temperature, it has good thermal conductivity, electrical insulation properties and machining property.Ceramic wafer is withstand voltage reaches 4500V, and conductive coefficient is greater than 2.0, in the industry based on ceramic wafer.Fixed L ED chipset 2 on the printed wire conductor that described ceramic wafer carrier 1 prints, described LED chip group 2 comprises multiple LED flip chip, on the printed wire conductor that each LED flip chip adopts high-accuracy aluminum alloy to be fixed on to print.Be electrically connected as to be connected by the printed wire conductor printed between each flip LED wafer, improve stability and the fastness of connection, avoid overheated and glue stress to cause product electrical property failure.Described transparent adhesive layer 3 one side is coated in above described ceramic wafer carrier 1 and described LED chip group 2 and periphery, described transparent adhesive layer 3 adopts high thixotropic effects and has the shaping circle of the silica gel of certain fluidity or ellipse, overall structure is evenly attractive in appearance, easy to make.LED flip chip, by the bright dipping of ceramic wafer front, arrives 140 ° of illumination effects, and employing simultaneously has certain fluidity colloid and improves product dazzle situation, goes out light consistency good.
A kind of large lamp components of luminous automobile using flip-chip based on ceramic wafer COB that the utility model provides, radiating rate is fast, and have high reliability and stability, light diffusing is good, high colour developing
Above content is in conjunction with concrete preferred implementation further detailed description of the utility model, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, without departing from the concept of the premise utility, some simple deduction or replace can also be made, all should be considered as belonging to protection range of the present utility model.
Claims (8)
1. one kind uses the large lamp components of luminous automobile of flip-chip based on ceramic wafer COB, it is characterized in that: comprise ceramic wafer carrier and transparent adhesive layer, described ceramic wafer carrier is provided with printed wire conductor and LED chip group, described LED chip group comprises multiple LED flip chip, be electrically connected between each LED flip chip, described LED flip chip adopts aluminium alloy to be fixed on described printed wire conductor, the LED flip chip at described LED chip group two ends is connected with the printed wire conductor at described ceramic wafer carrier two ends respectively, described transparent adhesive layer is coated on described ceramic wafer carrier and described LED chip group is peripheral.
2. the large lamp components of luminous automobile using flip-chip based on ceramic wafer COB according to claim 1, is characterized in that: described ceramic wafer carrier is aluminium oxide ceramic substrate.
3. the large lamp components of luminous automobile using flip-chip based on ceramic wafer COB according to claim 1, is characterized in that: described transparent adhesive layer is rectangle.
4. the large lamp components of luminous automobile using flip-chip based on ceramic wafer COB according to claim 1, is characterized in that: described ceramic wafer carrier is rectangle.
5. the large lamp components of luminous automobile using flip-chip based on ceramic wafer COB according to claim 1, it is characterized in that: the length of described transparent adhesive layer is 9.5mm, wide is 6.5mm.
6. the large lamp components of luminous automobile using flip-chip based on ceramic wafer COB according to claim 1, it is characterized in that: the length of described ceramic wafer carrier is 22mm, wide is 10mm.
7. the large lamp components of luminous automobile using flip-chip based on ceramic wafer COB according to claim 1, is characterized in that: described transparent adhesive layer is silica gel mixed fluorescent powder layer.
8. the large lamp components of luminous automobile using flip-chip based on ceramic wafer COB according to claim 1, is characterized in that: described printed wire conductor is connected with both positive and negative polarity and derives circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520676245.6U CN204905294U (en) | 2015-09-02 | 2015-09-02 | Luminous car headlight device based on ceramic plate COB uses face down chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520676245.6U CN204905294U (en) | 2015-09-02 | 2015-09-02 | Luminous car headlight device based on ceramic plate COB uses face down chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204905294U true CN204905294U (en) | 2015-12-23 |
Family
ID=54927451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520676245.6U Expired - Fee Related CN204905294U (en) | 2015-09-02 | 2015-09-02 | Luminous car headlight device based on ceramic plate COB uses face down chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204905294U (en) |
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2015
- 2015-09-02 CN CN201520676245.6U patent/CN204905294U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151223 Termination date: 20180902 |