CN204905228U - A tray for graphical sapphire substrate of dry etching LED - Google Patents

A tray for graphical sapphire substrate of dry etching LED Download PDF

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Publication number
CN204905228U
CN204905228U CN201520606291.9U CN201520606291U CN204905228U CN 204905228 U CN204905228 U CN 204905228U CN 201520606291 U CN201520606291 U CN 201520606291U CN 204905228 U CN204905228 U CN 204905228U
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China
Prior art keywords
tray
substrate
pallet
dry etching
sealing ring
Prior art date
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Active
Application number
CN201520606291.9U
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Chinese (zh)
Inventor
杨新鹏
刘建哲
彭艳亮
郑小琳
金良荣
李庆跃
吴宗泽
池旭明
王臻
潘安练
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HUANGSHAN BOLANTE SEMICONDUCTOR TECHNOLOGY CO.,LTD.
Original Assignee
ZHEJIANG DONGJING BOLANTE OPTOELECTRONICS Co Ltd
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Priority to CN201520606291.9U priority Critical patent/CN204905228U/en
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Abstract

The utility model relates to a LED substrate field of making specifically is a tray for graphical sapphire substrate of dry etching LED, including last tray, lower tray, its characterized in that: down the tray has substrate support element, and every unit is protruding relatively in the surface, and unit center and peripheral position have the air vent, go up the tray, be fixed in down tray support element with the substrate on, being supported by the sealing ring between lower tray support element and substrate, bottom the support element and between last tray and sealing up, form independent confined space, the air vent of support element center and peripheral position lets in inertia heat conducting gas, and is right two confined space, surface of the substrate and hanging walls dispel the heat. The utility model discloses under the condition that does not increase the whole area of tray greatly increased the substrate put the station number, improve production efficiency, improved the substrate radiating effect, reduce the edge effect influence to improve product uniformity and production yield.

Description

A kind of pallet for dry etching LED graphical sapphire substrate
Technical field
The utility model relates to LED substrate and manufactures field, specifically a kind of pallet for dry etching LED graphical sapphire substrate.
Background technology
Along with carrying forward vigorously of China's energy-saving and emission-reduction, light-emitting diode (LED) has unrivaled advantage in fields such as illumination, communications due to the feature of the high and low energy consumption of light efficiency.Current domestic and international market makes brightness blue light LED substrate and is mainly 2-4 cun of sapphire plain film or graphical sapphire substrate (PSS), and the rising angle of the LED chip that the Sapphire Substrate after graphical is delayed outside, light extraction efficiency and lattice match have had raising by a relatively large margin than traditional sapphire plain film substrate.
The manufacture method of PSS is mainly divided into dry etching and wet etching two kinds, wherein dry etching has good anisotropy and high etching selection ratio, faster etch rate, is easy to the advantages such as control and is widely used by PSS manufacturing enterprise, and it is primarily of main technological steps compositions such as wafer cleaning, even glue, exposure, development, dry etchings.Owing to having, anisotropy is high, etch rate is fast, uniformity is good and technology stability is high for ICP (inductively coupled plasma) etching machine, becomes the capital equipment of dry etching already.And it needs to use special pallet at work, to carry sapphire wafer.Usual pallet divides top tray and lower tray, by nut by upper and lower pallet and substrate coupling, the upper surface of substrate is appeared, forms relatively independent cooling, heat conduction space by black box.
The selection of material pallet is main based on quartzy, ceramic etc. at present.And for a long time, due to problems such as material pallet selection, design principle imperfections, occur that in processing procedure, card heat dispersion is poor, the problems such as Waffer edge effect, govern the development of patterned substrate industry always.23 ~ 26 stations mostly are on the market, single-deck station negligible amounts at present for the pallet of 2 inches of graphical sapphire substrate manufactures, and the patterned substrate near tray edge position, appearance and size is abnormal more.Be difficult to increase station number by station manufacture method before, even if accelerate, yield also cannot be guaranteed.
Summary of the invention
The purpose of this utility model is for the deficiencies in the prior art, provides a kind of pallet for dry etching LED graphical sapphire substrate, solves current dry etching LED graphical sapphire substrate production efficiency low, the deficiency of marginal position consistency difference.
To achieve these goals, the utility model provides technical scheme as follows:
A kind of pallet for dry etching LED graphical sapphire substrate, comprise top tray, lower tray, it is characterized in that: lower tray, there is substrate supporting unit, each support unit is raised in surface relatively, and support unit center and peripheral position are with air vent hole; Top tray, is fixed on lower tray support unit by substrate; Support between lower tray support unit top and substrate, bottom support unit and between top tray by sealing ring and seal, form independently seal cavity.
The utility model lower tray support unit top and bottom margin position all have sealing ring to place groove, and described sealing ring cross section is circular, and top seal ring placement groove shapes is consistent with substrate, and sealing ring diameter is slightly less than substrate dimension; Bottom margin position seals ring groove shape is circular, and size is slightly larger than support unit diameter.
Substrate is fixed on lower tray support unit by pawl pin by the utility model top tray.
The utility model pallet adopts almag material, by nut, described top tray and substrate and lower tray that sealing ring is housed are carried out coupling, the air vent hole of support unit center and peripheral position passes into inertia heat-conducting gas, dispels the heat to described two cooling spaces, substrate surface and upper dish.
The utility model employing cost is low, heat conduction good, the almag material pallet of easy processing, by the support unit supports substrate of lower tray, considerably increase substrate when not increasing pallet entire area and put station number, enhance productivity, the seal cavity formed by air vent hole and the sealing ring support of support unit improves substrate radiating effect, reduce edge effect impact, to improve homogeneity of product and to produce yield.
Accompanying drawing explanation
Fig. 1 is the utility model tray support substrate schematic diagram.
Fig. 2 is the A portion enlarged drawing of Fig. 1.
Fig. 3 is the utility model lower tray vertical view.
Fig. 4 (a), 4 (b) are respectively vertical view and the sectional view of lower tray substrate supporting unit.
Fig. 5 is the utility model top tray vertical view.
Fig. 6 (a), 6 (b) are respectively the utility model sealing ring vertical view and sectional view.
Embodiment
Below in conjunction with accompanying drawing, the utility model embodiment is described in detail.
As Figure 1-5, a kind of pallet for dry etching LED graphical sapphire substrate, comprise top tray 1, lower tray 3, it is characterized in that: lower tray 3 has substrate supporting unit, support unit is relatively protruding is used for support substrates 2, and each support unit is with center roof vent 6 and peripheral position air vent hole 7 thereof; Substrate 2 is fixed on lower tray 3 support unit by pawl pin 12 by top tray 1; Supported by the first sealing ring 4 between support unit top and substrate 2 and seal, bottom support unit and support sealing by the second sealing ring 5 between top tray 1, and between substrate 2 and lower tray support unit, between top tray 1 and lower tray 3, form the first seal cavity 8 and the second seal cavity 9 respectively.
The utility model lower tray 3 support unit top has top seal ring to place groove 15, bottom has sealed bottom ring to place groove 14, described first sealing ring 4, second sealing ring 5 (as Fig. 6 (a), shown in 6 (b)) is placed groove 15 and sealed bottom ring respectively and is placed groove 14 and match with top seal ring.Wherein support unit top seal ring placement groove 15 shape is consistent with substrate 2, and the first sealing ring 4 diameter is slightly less than substrate 2 size; It is circular that support unit sealed bottom ring places groove 14, and size is slightly larger than support unit diameter.
The utility model top tray 1 with lower tray 3 has corresponding nut bore 13, have rotation screw thread in hole, the lower tray 3 that the first sealing ring 4, second sealing ring 5 is housed carried out coupling with substrate 2 and top tray 1 nut 19.Inertia heat-conducting gas enters the first seal cavity 8 and the second seal cavity 9 respectively respectively by lower tray support unit center roof vent 6 and peripheral position air vent hole 7, therefore heat is passed to lower tray 3 from top to bottom from substrate 2 and top tray 1 fast, until cooling base 10, make substrate 2 and the cooling rapidly of top tray 1 surface, this cooling base 10 inside passes to cooling fluid usually, makes its surface be in comparatively low-temperature condition.Cooling base 10 falling heat-transfer gas same with between pallet, and seal with sealing device 11.
The utility model top tray there is top tray groove 17, adopt the convex tip 16 that upper and lower pallet is carried out coupling location, be easy to coupling operation; Top tray there is sealing ring place groove 18, match with sealing ring.
The utility model top tray 1 and lower tray 3 adopt almag material.

Claims (8)

1. for a pallet for dry etching LED graphical sapphire substrate, comprise top tray, lower tray, it is characterized in that: lower tray, have substrate supporting unit, each unit is raised in surface relatively, and unit center and peripheral position are with air vent hole; Top tray, is fixed on lower tray support unit by substrate; Support between lower tray support unit and substrate, bottom support unit and between top tray by sealing ring and seal, form independently seal cavity.
2. the pallet for dry etching LED graphical sapphire substrate according to claim 1, it is characterized in that: lower tray support unit top and bottom margin position all have sealing ring to place groove, described sealing ring cross section is circular, top seal ring placement groove shapes is consistent with substrate, and sealing ring diameter is slightly less than substrate dimension; Bottom margin position seals ring groove shape is circular, and size is slightly larger than support unit diameter.
3. the pallet for dry etching LED graphical sapphire substrate according to claim 1 and 2, it is characterized in that: top tray with lower tray has corresponding nut bore, there is rotation screw thread in hole, being undertaken coupling by being equipped with the lower tray of sealing ring and substrate and top tray nut.
4. the pallet for dry etching LED graphical sapphire substrate according to claim 1 and 2, it is characterized in that: the air vent hole of support unit center and peripheral position thereof passes into inertia heat-conducting gas, described two seal cavities, substrate surface and top tray are dispelled the heat.
5. the pallet for dry etching LED graphical sapphire substrate according to claim 1 and 2, is characterized in that: have cooling base under lower tray, this cooling base inside passes to cooling fluid.
6. the pallet for dry etching LED graphical sapphire substrate according to claim 1 and 2, is characterized in that: substrate is fixed on lower tray support unit by pawl pin by top tray.
7. the pallet for dry etching LED graphical sapphire substrate according to claim 1 and 2, is characterized in that: top tray has top tray groove, adopts the convex tip that upper and lower pallet is carried out coupling location; Top tray there is sealing ring place groove, match with described sealing ring.
8. a kind of pallet for dry etching LED graphical sapphire substrate according to claim 1, is characterized in that: pallet adopts almag to make.
CN201520606291.9U 2015-08-13 2015-08-13 A tray for graphical sapphire substrate of dry etching LED Active CN204905228U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520606291.9U CN204905228U (en) 2015-08-13 2015-08-13 A tray for graphical sapphire substrate of dry etching LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520606291.9U CN204905228U (en) 2015-08-13 2015-08-13 A tray for graphical sapphire substrate of dry etching LED

Publications (1)

Publication Number Publication Date
CN204905228U true CN204905228U (en) 2015-12-23

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105185735A (en) * 2015-08-13 2015-12-23 浙江东晶博蓝特光电有限公司 Pallet for dry etching of LED patterned sapphire substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105185735A (en) * 2015-08-13 2015-12-23 浙江东晶博蓝特光电有限公司 Pallet for dry etching of LED patterned sapphire substrate

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C14 Grant of patent or utility model
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 321000 South Second Ring West Road, Jinhua, Zhejiang Province, No. 2688

Patentee after: Zhejiang bloomer semiconductor Polytron Technologies Inc

Address before: No. 555 Binghong Road, Jinhua, Zhejiang Province, Zhejiang

Patentee before: ZHEJIANG DONGJING BOLANTE OPTOELECTRONICS CO., LTD.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20220419

Address after: 245000 No. 66 Cuiwei North Road, Huangshan Jiulong Low Carbon Economic Park, Huangshan City, Anhui Province

Patentee after: HUANGSHAN BOLANTE SEMICONDUCTOR TECHNOLOGY CO.,LTD.

Address before: 321000 South Second Ring West Road, Jinhua, Zhejiang Province, No. 2688

Patentee before: ZHEJIANG BOLANTE SEMICONDUCTOR TECHNOLOGY Co.,Ltd.