CN204885504U - Used standard module in flash disk module - Google Patents

Abstract

The utility model provides an used standard module in flash disk module that low in manufacturing cost, standardization level are high, it is installed on the mother board of a specification to enable the used equal accessible of all kinds of main control chip of flash disk. It comprises daughter board and the mother board of mountable on the flash disk USB interface, is equipped with standard butt -joint structural on daughter board and mother board opposite face, this standard butt -joint structural for set up on the daughter board contact electrode subarray with set up the contact electrode mother array on the mother board, contact electrode one -to -one in contact electrode subarray and the female array of contact electrode is in electric connection status. Its packaging structure that can make mother board and flash chip becomes the PCB board of standardized structure. But its greatly reduced manpower and material cost improve its production efficiency for labor -intensive flash disk manufacturing changes towards the production structure of the modernization of standardization, intensification and scale.

Description

Standard module used in flash disk module

Technical field

The utility model relates to a kind of flash disk, particularly a kind of flash disk for dissimilar main control chip with standard connections.

Background technology

At present, known USB flash drive is made up of shell and PCBA, and PCBA is by one piece of pcb board (also known as motherboard), USB main control chip 1, is arranged on pcb board top view surface layer and forms with the flash chip 4 (i.e. flash chip) that the circuit (circuit be made up of Chip-R, electric capacity, inductance) of this main control chip 1 adaptation, USB interface, LED light and sealing label are looked on surface layer at the bottom of pcb board.

As shown in Figure 1, 2, 3, usually, described main control chip 1 brand of formation flash disk is many, type assorted, pin 5 layout disunity, and its flash chip 4 used is comparatively single (sometimes, even if the type of flash chip 4 is different, but its pin 5 layout is substantially the same), present the sector USB main control chip 1 brand used has Anguo, core nation, SMI, silicon lattice, build honor, step gram micro-, rich only, silver is bright etc.These main control chips 1 have respective packing forms (LQFP48, SOP28, die), and have chip pins 5 different separately to define.So, even if use the flash chip 4 of identical type, its PCBA used is also not quite similar, and that is to say, for dissimilar main control chip 1, need arrange different circuit on described PCB top view surface layer.Like this to the enterprise that flash chip 4 and pcb board are packaged together, for the main control chip 1 that it is used, just need prepare more and there is pcb board and the electronics material (i.e. other electronic components, as devices such as resistance, electric capacity, inductance) of different circuit.Main control chip 1 packing forms more, the PCB of preparation and electronics material are also more, more assorted.

In prior art, the structure of flash disk and manufacture method exist following not enough:

1) get the raw materials ready more, more assorted, both equipment investment can be increased, also business administration cost can be increased, as increased the sealed in unit matched with dissimilar main control chip 1, the stock's cost of floor space increase etc. increasing management material cost of human resources used, get the raw materials ready required in a large number.

2) if manage the waste product also very easily produced because mistake of preparing burden causes not in place, thus, product quality and production efficiency is greatly reduced.

3) each parts owing to forming USB flash drive lack normal structure, and therefore, no matter the batch size of the flash disk of main control chip used 1 correspondence, it is all unsuitable for the large production of modernization, intensive and scale.

Summary of the invention

Standard module used in the flash disk module that the technical problems to be solved in the utility model is to provide a kind of low cost of manufacture, high, that flash disk can the be made used all kinds of main control chips of standardization level are all arranged on a kind of motherboard of specification by it.

In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is:

Standard module used in flash disk module of the present utility model, it is made up of daughter board and the motherboard that can be arranged in flash disk USB interface, described daughter board and motherboard opposite face are provided with standard docking structure, this standard docking structure is the contact electrode subarray be arranged on daughter board and the female array of the contact electrode be arranged on motherboard, contact electrode one_to_one corresponding in the female array of described contact electrode subarray and contact electrode, when daughter board is arranged on motherboard, in the female array of the contact electrode in contact electrode subarray and contact electrode, corresponding contact electrode is electrically connected.

Described contact electrode is plane electrode.

Described contact electrode is for applying copper electrode.

Described contact electrode is metal coating electrode.

Contact electrode in described contact electrode subarray is needle electrode, and the contact electrode in the female array of described contact electrode is for can make described needle electrode insert and be friction tight cellular type electrode therebetween.

Shape laid by the geometrical pattern of described contact electrode subarray and the female array of contact electrode is rectangle, circle, ellipse or kidney-shaped.

Described daughter board installs flash disk main control chip used in the one side of described motherboard, the pin layout of this main control chip can be Anguo, core nation, SMI, silicon lattice, build honor, step gram micro-, rich only or pin layout corresponding to the main control chip of silver-colored bright brand; Described motherboard installs flash disk flash chip used in the one side of described daughter board, and this flash chip is NANDFLASH chip.

Described daughter board and motherboard made by hard double-sided wiring board.

Compared with prior art, the utility model arranges the standard module be made up of daughter board and motherboard with standard docking structure between the main control chip and flash chip of flash disk, at the end of daughter board depending on surface layer being arranged contact electrode subarray, the top view surface layer of motherboard is arranged and the layout of contact electrode subarray, contact electrode mother array that structure is all identical, make the encapsulating structure of motherboard and flash chip become the pcb board of standardized structural thus.At production link, enterprise only need prepare the electronics material of a kind of motherboard and fixed type, in enormous quantities, intensive and automatically can produce, sell the flash disk pcb board of standardized structural.The encapsulation of daughter board afterwards again by with described motherboard being standard docking structure, namely completes the making of standard module used in whole flash disk module.

For USB flash drive manufacturing; described standard docking structure in the utility model is a revolutionary improvement; it can reduce manpower in the sector production process and material cost greatly; improve its production efficiency, labor-intensive flash disk manufacturing industry is changed towards standardization, modern production structure that is intensive and scale.

Accompanying drawing explanation

Fig. 1 is one of standard module schematic diagram used in flash disk module of the prior art.

Fig. 2 is standard module schematic diagram two used in flash disk module of the prior art.

Fig. 3 is standard module schematic diagram three used in flash disk module of the prior art.

Fig. 4 is the flash disk module schematic diagram applying standard module of the present utility model.

Fig. 5 is one of motherboard and daughter board released state schematic diagram in Fig. 4.

Fig. 6 is A portion enlarged plan view in Fig. 5.

Fig. 7 be in Fig. 4 B to schematic diagram.

Fig. 8 is motherboard in Fig. 4 and daughter board released state schematic diagram two.

Fig. 9 is C portion enlarged plan view in Fig. 8.

Figure 10 is D portion enlarged diagram in Fig. 8.

Figure 11 is flash disk main control chip peripheral circuit, pin schematic diagram used.

Figure 12 is the contact electrode subarray pin circuitry form schematic diagram on daughter board of the present utility model.

Figure 13 is flash chip pin and contact electrode female array pin circuitry form schematic diagram.

Reference numeral is as follows:

Main control chip 1, daughter board 2, motherboard 3, flash chip 4, pin 5, contact electrode subarray 6, contact electrode female array 7, contact electrode 8, USB interface 9.

Embodiment

As shown in Fig. 4,7, standard module used in flash disk module of the present utility model arranges to have standard docking structure for a pair and the electrical connection module be made up of daughter board 2 and motherboard 3 between flash disk main control chip 1 used and flash chip 4.

Motherboard is wherein arranged in conventional general USB interface 9, the top view surface layer of daughter board encapsulates described main control chip, at the end of motherboard depending on surface layer encapsulating described flash chip, the flash disk module described in again daughter board just being formed together with motherboard soldering and sealing afterwards.

As Fig. 5, 6, 8, 9, 10, 11, 12, shown in 13, described standard docking structure is look contact electrode subarray 6 on the top view surface layer of surface layer and motherboard 3 and contact electrode female array 7 end being arranged at daughter board 2 respectively, contact electrode subarray 6 is all identical with female array 7 shape and structure of contact electrode, and contact electrode 8 one_to_one corresponding wherein, when daughter board 2 is welded together with motherboard 3, in the female array 7 of contact electrode 8 in contact electrode subarray 6 and contact electrode, corresponding contact electrode 8 is in and is electrically connected conducting state (in Figure 12, J3 is the circuit form schematic diagram of contact electrode subarray 6 pin, U3 in Figure 13 is the circuit form schematic diagram of flash chip 4 pin, and J2 is the circuit form schematic diagram of female array 7 pin of contact electrode, and J1 is USB interface 9 circuit diagram).

The face shaping that several contact electrode 8 in the female array 7 of contact electrode subarray 6 and contact electrode are formed can be approximated to be rectangle, circle, ellipse or kidney-shaped, concrete shape can according to the size of daughter board 2 physical dimension, flash chip 4 pin 5 number and be beneficial to brief, principle of standardization and determine.

Described contact electrode 8 is plane electrode (see Fig. 5,6), as the deposited copper electrode on printed wiring board or the metal coating electrode adopting electroplating technology making.When described contact electrode 8 is plane electrode, described daughter board 2 is encapsulated on motherboard 3 by soldering and sealing, and contact electrode 8 mutually corresponding is therebetween for being welded to connect state.This structure fabrication is simple, and after encapsulation, daughter board 2 is stablized with the connection status of motherboard 3.

Described contact electrode 8 also can be non-planar electrode (see Fig. 8,9,10), that is: the contact electrode 8 on daughter board 2 in described contact electrode subarray 6 is needle electrode, contact electrode 8 on motherboard 3 in the female array 7 of described contact electrode is cellular type electrode, described needle electrode can insert in cellular type electrode, is tight fit therebetween.This construction packages is simple, and recycling rate of waterused is high, the mode that daughter board 2 inserts in cellular type electrode corresponding on motherboard 3 with the needle electrode on it is arranged on motherboard 3 by daughter board 2 during encapsulation, then in the bonding agent sealing-in of daughter board 2 periphery.

Described main control chip 1 and be encapsulated on the top view surface layer of daughter board 2 with the peripheral circuit (circuit be made up of elements such as Chip-R, electric capacity, inductance) of its adaptation, this main control chip 1 can be all kinds and the main control chip 1 for flash disk with the definition of different pin 5, such as can for Anguo, core nation, SMI, silicon lattice, build honor, step gram micro-, rich only or the main control chip 1 of the brand such as silver is bright.

The top view surface layer of daughter board 2 arranges some guide line, the quantity of guide line is no less than pin 5 quantity of main control chip 1, namely a guide line is corresponding with the pin 5 of in main control chip 1, the pin 5 that one end of every bar guide line is corresponding with on described main control chip 1 connects, its other end be arranged on daughter board 2 end and be electrically connected depending on a contact electrode 8 in the contact electrode subarray 6 on surface layer.The number of the contact electrode 8 in contact electrode subarray 6 of the present utility model is preferably 36, wherein, there is individual contacts electrode 8 to arrange for repeating, its objective is to there is multiple identical function pin 5 and the contact electrode 8 reserved for better adapting to indivedual main control chip 1.For the contact electrode 8 with identical function pin 5 correspondence, the other end of the guide line of its correspondence can adopt and the mode that connects connects.

Described flash chip 4 and look on surface layer with the end that the peripheral circuit of its adaptation is encapsulated in motherboard 3, because current numerous flash chip 4 used are in the industry essentially the chip of unified pin 5 definition (mostly conventionally in the industry being: the NANDFLASH chip of Samsung, Toshiba, modern times, magnesium light or SanDisk manufacturers produce), so peripheral circuit and pin 5 layout of this flash chip 4 are essentially standardized structure.Each contact electrode 8 in the female array 7 of contact electrode in the utility model by standard, the circuit of fixed structure connects with the pin 5 of flash chip 4 respectively.

Identical with contact electrode subarray 6, be also provided with multiple contact electrode 8 for subsequent use with there is identical function pin 5 connecting in the female array 7 of contact electrode.

The advantage of said structure is:

1, the manufacture of flash disk can be converted into scale, intensive and standardized production structure by existing labor-intensive production structure.

That is: first adopt modern production model to be encapsulated in flash chip 4 to have on the motherboard 3 of the female array 7 of described contact electrode, then the mode of being docked with contact electrode mother array 7 with contact electrode subarray 6 by the daughter board 2 with contact electrode subarray 6 being packaged with main control chip 1 and motherboard 3 weld together.

2, can solve the repetition and waste problem of various resource in industry, it greatly can be enhanced productivity, reduce production cost.

For the special enterprise producing motherboard 3, production materials are simply single-minded and its motherboard 3 produced is the product of standard universal.So, both the every management in its production process can have been simplified, the operating efficiency (due to standardized material, standardized product structure and standardized production model, what technical management can be made to become is simpler) that it solves the technical problem occurred in production process can be improved again.

3, when using dissimilar main control chip 1, main control chip 1 that different pin 5 defines will can be had and its peripheral circuit is integrated on described daughter board 2 and then converts the pin 5 (the contact electrode subarray 6 namely) of unified definition to.I.e. no matter which kind of main control chip 1, all can make standard module, shares a kind of universal mother plate 3, reaches saving resource, enhances productivity and reduce the effect of production cost.

Claims (8)

1. standard module used in a flash disk module, it is characterized in that: it is made up of daughter board (2) and the motherboard (3) that can be arranged in flash disk USB interface (9), described daughter board (2) with motherboard (3) opposite face are provided with standard docking structure, this standard docking structure is the contact electrode subarray (6) be arranged on daughter board (2) and the female array (7) of the contact electrode be arranged on motherboard (3), described contact electrode subarray (6) and contact electrode (8) one_to_one corresponding in the female array (7) of contact electrode, when daughter board (2) is arranged on motherboard (3), contact electrode (8) in contact electrode subarray (6) is electrically connected with the middle corresponding contact electrode (8) of the female array (7) of contact electrode.

2. standard module used in flash disk module according to claim 1, is characterized in that: described contact electrode (8) is plane electrode.

3. standard module used in flash disk module according to claim 2, is characterized in that: described contact electrode (8) is for applying copper electrode.

4. standard module used in flash disk module according to claim 2, is characterized in that: described contact electrode (8) is metal coating electrode.

5. standard module used in flash disk module according to claim 1, it is characterized in that: the contact electrode (8) in described contact electrode subarray (6) is needle electrode, the contact electrode (8) in the female array (7) of described contact electrode is for can make described needle electrode insert and be friction tight cellular type electrode therebetween.

6. standard module used in the flash disk module according to any one of claim 1-5, is characterized in that: it is rectangle, circle, ellipse or kidney-shaped that described contact electrode subarray (6) lays shape with the geometrical pattern of the female array (7) of contact electrode.

7. standard module used in flash disk module according to claim 6, it is characterized in that: on described daughter board (2), in the one side of described motherboard (3), flash disk main control chip used (1) is installed, pin (5) layout of this main control chip (1) can be Anguo, core nation, SMI, silicon lattice, build honor, step gram micro-, rich only or pin (5) layout corresponding to the main control chip (1) of silver-colored bright brand; Described motherboard (3) installs flash disk flash chip used (4) in the one side of described daughter board (2), and this flash chip (4) is NANDFLASH chip (4).

8. standard module used in flash disk module according to claim 7, is characterized in that: described daughter board (2) and motherboard (3) made by hard double-sided wiring board.