CN204836575U - MEMS microphone subassembly, drive -by -wire earphone and mobile communication device - Google Patents
MEMS microphone subassembly, drive -by -wire earphone and mobile communication device Download PDFInfo
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- CN204836575U CN204836575U CN201520523770.4U CN201520523770U CN204836575U CN 204836575 U CN204836575 U CN 204836575U CN 201520523770 U CN201520523770 U CN 201520523770U CN 204836575 U CN204836575 U CN 204836575U
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Abstract
MEMS microphone subassembly, drive -by -wire earphone and mobile communication device is disclosed. MEMS microphone subassembly includes: printed circuit board, printed circuit board includes first surface and relative second surface, the shell of setting on the printed circuit board first surface, the shell with printed circuit board's first surface forms first cavity, first cavity is including being suitable for the sound hole that advances of receiving the acoustical signal, the setting is in MEMS sensor in the first cavity, and set up the outside peripheral device of first cavity. This MEMS microphone subassembly sets up MEM sensor and peripheral device on same printed circuit board, not only simplifying processing with subtract small -size, improved the microphone performance moreover.
Description
Technical field
The utility model relates to microphone techniques field, is specifically related to a kind of MEMS microphone assembly, a kind of line control earphone and a kind of mobile communications device.
Background technology
MEMS microphone is the microphone adopting MEMS (micro electro mechanical system) (MicroelectromechanicalSystems, MEMS) technique to make.Compared with conventional condenser microphone (ECM), there is better acoustical behavior, higher signal to noise ratio, better conforming susceptibility and lower power consumption.MEMS microphone has been widely used in the field such as smart mobile phone, notebook computer to provide higher voice quality.
As shown in Figure 1, the MEMS microphone assembly of prior art comprises: MEMS microphone 10, main printed circuit board (PrintedCircuitBoard, PCB) 100, peripheral components 600 and other resistance capacitance inductance, switch etc.Wherein, MEMS microphone 10 comprises self printed circuit board (PCB) 700, MEMS sensor 300, MEMS integrated circuit 400, sound inlet 500 and shell 200.
In the MEMS microphone assembly of prior art, the circuit of printed circuit board (PCB) 100 not only needs the pad pin of compatible MEMS microphone 10, and needs MEMS microphone 10 to be welded on main printed circuit board 100 by reflow soldering process.Printed circuit board (PCB) 700 and the main printed circuit board 100 of MEMS microphone 10 are superimposed.
For the microphone assembly of advance sound, welding procedure is relatively simple.But for the microphone assembly of zero elevation, due to the printed circuit board (PCB) of microphone self and superposing of main printed circuit board, need the sound inlet on two printing electroplax plates to aim at, cause welding procedure more complicated and difficulty.In addition, the MEMS microphone of line control earphone is two line microphones, usually adds peripheral components in inside to realize the function that three lines turn two lines.In the MEMS microphone assembly of prior art, be arranged at by peripheral components in the shell of microphone, result limits the small-sized of line control earphone plate.
Utility model content
In view of this, the utility model proposes a kind of MEMS microphone assembly, by MEMS sensor and integrated circuit thereof are arranged on same printed circuit board (PCB), reduce process complexity and reduce size.
According to first aspect of the present utility model, provide a kind of MEMS microphone assembly, it is characterized in that, comprising: printed circuit board (PCB), described printed circuit board (PCB) comprises first surface and relative second surface; Be arranged on the shell on printed circuit board (PCB) first surface, the first surface of described shell and described printed circuit board (PCB) forms the first cavity, and described first cavity comprises the sound inlet being suitable for receiving acoustical signal; Be arranged on the MEMS sensor in described first cavity; And be arranged on the peripheral components of described first containment portion.
Preferably, described MEMS sensor is arranged on described shell or on described printed circuit board (PCB).
Preferably, described sound inlet is opened on described shell or on printed circuit board (PCB).
Preferably, this MEMS microphone assembly also comprises setting integrated circuit on the printed circuit board, and described integrated circuit is connected with described MEMS sensor, and processes the sensing signal of described MEMS sensor.
Preferably, described integrated circuit is arranged in described first cavity.
Preferably, described integrated circuit is arranged on the housing.
Preferably, described shell is metal-back.
Preferably, described peripheral components comprises at least one be selected from resistance, inductance, electric capacity, switch, additional integrated circuit.
Preferably, on the described peripheral components first surface that is arranged on described printed circuit board (PCB) or second surface.
According to second aspect of the present utility model, a kind of line control earphone is provided, it is characterized in that, comprise above-mentioned MEMS microphone assembly.
According to the third aspect of the present utility model, a kind of mobile communications device is provided, it is characterized in that, comprise above-mentioned MEMS microphone assembly.
MEMS microphone assembly of the present utility model is by being arranged on same printed circuit board (PCB) by MEMS sensor and peripheral components, save material and a step welding procedure, reduce the complexity of technique, and reduce the thickness of assembly and improve microphone property.Line control earphone of the present utility model and mobile communications device improve speech quality.
Accompanying drawing explanation
By referring to the description of accompanying drawing to the utility model embodiment, above-mentioned and other objects, features and advantages of the present utility model will be more clear, in the accompanying drawings:
Fig. 1 is the schematic block diagram of the MEMS microphone assembly of prior art;
Fig. 2 is the schematic block diagram of the MEMS microphone assembly according to the utility model first embodiment;
Fig. 3 is the schematic block diagram of the MEMS microphone assembly according to the utility model second embodiment;
Fig. 4 is the schematic block diagram of the MEMS microphone assembly according to the utility model the 3rd embodiment;
Fig. 5 is the schematic block diagram of the MEMS microphone assembly according to the utility model the 4th embodiment; And
Fig. 6 is the schematic block diagram of the MEMS microphone assembly according to the utility model the 5th embodiment.
Embodiment
Based on embodiment, the utility model is described below, but the utility model is not restricted to these embodiments.In hereafter details of the present utility model being described, detailedly describe some specific detail sections.Do not have the description of these detail sections can understand the utility model completely for a person skilled in the art yet.In order to avoid obscuring essence of the present utility model, known method, process, flow process, element and circuit do not describe in detail.In addition, it should be understood by one skilled in the art that the accompanying drawing provided at this is all for illustrative purposes, and accompanying drawing is not necessarily drawn in proportion.
Meanwhile, should be appreciated that in the following description, " circuit " refers to the galvanic circle connected and composed by electrical connection or electromagnetism by least one element or electronic circuit.When " being connected to " another element when claiming element or circuit or claiming element/circuit " to be connected to " between two nodes, it can be directly couple or be connected to another element or can there is intermediary element, the connection between element can be physically, in logic or its combine.On the contrary, " be directly coupled to " when claiming element or " being directly connected to " another element time, mean that both do not exist intermediary element.Unless the context clearly requires otherwise, similar words such as " comprising ", " comprising " otherwise in whole specification and claims should be interpreted as the implication that comprises instead of exclusive or exhaustive implication; That is, be the implication of " including but not limited to ".
In description of the present utility model, it is to be appreciated that term " first ", " second " etc. are only for describing object, and instruction or hint relative importance can not be interpreted as.In addition, in description of the present utility model, except as otherwise noted, the implication of " multiple " is two or more.
First embodiment
As shown in Figure 2, the MEMS microphone assembly of the first embodiment comprises: printed circuit board (PCB) 100, shell 200, MEMS sensor 300, integrated circuit 400, sound inlet 500 and peripheral components 600.
Printed circuit board (PCB) 100 comprises first surface and relative second surface.
The first surface of shell 200 and printed circuit board (PCB) 100 is formed in the first cavity jointly for providing sealing.Such as shell 200 is metal-back.
MEMS sensor 300 is positioned at the first cavity, is arranged at the first surface of printed circuit board (PCB) 100.Integrated circuit 400 is positioned at the first cavity, is arranged at the first surface of printed circuit board (PCB) 100.Integrated circuit 400 is connected with described MEMS sensor 300, and processes the sensing signal of MEMS sensor 300.Sound inlet 500 is opened on printed circuit board (PCB) 100, for the passage providing acoustical signal to enter for MEMS sensor 300.
Peripheral components 600 such as comprises at least one be selected from resistance, inductance, electric capacity, switch, additional integrated circuit.Peripheral components 600 is positioned at outside the first cavity, is arranged at the first surface of printed circuit board (PCB) 100.
Second embodiment
As shown in Figure 3, the MEMS microphone assembly of the second embodiment comprises: printed circuit board (PCB) 100, shell 200, MEMS sensor 300, integrated circuit 400, sound inlet 500 and peripheral components 600.
Printed circuit board (PCB) 100 comprises first surface and relative second surface, and first surface comprises Part I and Part II.
The first surface of shell 200 and printed circuit board (PCB) 100 is formed in the first cavity jointly for providing sealing.Such as shell 200 is metal-back.
MEMS sensor 300 is positioned at the first cavity, is arranged at the first surface of printed circuit board (PCB) 100.Integrated circuit 400 is positioned at the first cavity, is arranged at the first surface of printed circuit board (PCB) 100.Integrated circuit 400 is electrically connected MEMS sensor 300 and printed circuit board (PCB) 100 respectively by metal wire.Sound inlet 500 is opened on shell 200, for the passage providing acoustical signal to enter for MEMS sensor 300.
Peripheral components 600 such as comprises at least one be selected from resistance, inductance, electric capacity, switch, additional integrated circuit.Peripheral components 600 is positioned at outside the first cavity, is arranged at the first surface of printed circuit board (PCB) 100.
3rd embodiment
As shown in Figure 4, the MEMS microphone assembly of the 3rd embodiment comprises: printed circuit board (PCB) 100, shell 200, MEMS sensor 300, integrated circuit 400, sound inlet 500 and peripheral components 600.
Printed circuit board (PCB) 100 comprises first surface and relative second surface, and first surface comprises Part I and Part II.
The first surface of shell 200 and printed circuit board (PCB) 100 is formed in the first cavity jointly for providing sealing.Such as shell 200 is metal-back.
MEMS sensor 300 is positioned at the first cavity, is arranged at the first surface of printed circuit board (PCB) 100.Integrated circuit 400 is positioned at the first cavity, is arranged on shell 200.Integrated circuit 400 is electrically connected MEMS sensor 300 and printed circuit board (PCB) 100 respectively by metal wire.Sound inlet 500 is opened on printed circuit board (PCB) 100, for the passage providing acoustical signal to enter for MEMS sensor 300.
Peripheral components 600 such as comprises at least one be selected from resistance, inductance, electric capacity, switch, additional integrated circuit.Peripheral components 600 is positioned at outside the first cavity, is arranged at the first surface of printed circuit board (PCB) 100.
4th embodiment
As shown in Figure 5, the MEMS microphone assembly of the 4th embodiment comprises: printed circuit board (PCB) 100, shell 200, MEMS sensor 300, integrated circuit 400, sound inlet 500 and peripheral components 600.
Printed circuit board (PCB) 100 comprises first surface and relative second surface, and first surface comprises Part I and Part II.
The first surface of shell 200 and printed circuit board (PCB) 100 is formed in the first cavity jointly for providing sealing.Such as shell 200 is metal-back.
MEMS sensor 300 is positioned at the first cavity, is arranged on shell 200.Integrated circuit 400 is positioned at the first cavity, is arranged on shell 200.Integrated circuit 400 is electrically connected MEMS sensor 300 and printed circuit board (PCB) 100 respectively by metal wire.Sound inlet 500 is opened on shell 200, for the passage providing acoustical signal to enter for MEMS sensor 300.
Peripheral components 600 such as comprises at least one be selected from resistance, inductance, electric capacity, switch, additional integrated circuit.Peripheral components 600 is positioned at outside the first cavity, is arranged at the second surface of printed circuit board (PCB) 100.
5th embodiment
As shown in Figure 6, the MEMS microphone assembly of the 5th embodiment comprises: printed circuit board (PCB) 100, shell 200, MEMS sensor 300, integrated circuit 400, sound inlet 500 and peripheral components 600.
Printed circuit board (PCB) 100 comprises first surface and relative second surface, and first surface comprises Part I and Part II.
The first surface of shell 200 and printed circuit board (PCB) 100 is formed in the first cavity jointly for providing sealing.Such as shell 200 is metal-back.
MEMS sensor 300 is positioned at the first cavity, is arranged at the first surface of printed circuit board (PCB) 100.Integrated circuit 400 is positioned at outside the first cavity, is arranged at the first surface of printed circuit board (PCB) 100.Integrated circuit 400 is electrically connected MEMS sensor 300 and printed circuit board (PCB) 100 respectively by metal wire.Sound inlet 500 is opened on printed circuit board (PCB) 100, for the passage providing acoustical signal to enter for MEMS sensor 300.
Peripheral components 600 such as comprises at least one be selected from resistance, inductance, electric capacity, switch, additional integrated circuit.Peripheral components 600 is positioned at outside the first cavity, is arranged at the second surface of printed circuit board (PCB) 100.
Different from the MEMS microphone assembly of prior art, according to MEMS microphone assembly of the present utility model, wherein MEMS sensor is formed on same printed circuit board (PCB) together with peripheral components.This MEMS sensor is only a part for MEMS microphone, namely saves the printed circuit board (PCB) of MEMS microphone self, thus does not need when installing MEMS microphone, by superposed on one another for two printing electroplax plates.By being directly installed on main printed circuit board by MEMS sensor and integrated circuit, reducing Material Cost, decreasing one welding procedure, improve performance.
This MEMS microphone assembly also reduces technology difficulty and the manufacturing cost of zero elevation microphone.The sound inlet of zero elevation microphone is opened on printed circuit board (PCB), then to be welded with printed circuit board (PCB) by MEMS sensor and realizes acoustic seal, thus simplified structure and acoustic design.In fact, the signal to noise ratio of zero elevation microphone is than advance sound microphone 5 ~ 6dB.By MEMS sensor and integrated circuit are directly installed on main printed circuit board, only need to form sound inlet on main printed circuit board, thus can easily realize aiming between MEMS sensor with sound inlet.
In addition, peripheral components arranges and outside annular seal space, is conducive to the small-sized of microphone.In MEMS microphone assembly of the present utility model, the output signal of microphone is directly completed by the cabling on printed circuit board (PCB), more flexibly, reduces the restriction of pad, is conducive to small-sized.Owing to MEMS sensor being directly installed on the printed circuit board (PCB) identical with peripheral components, the assembly welding of motherboard is completed at place of microphone producer.
Further, the utility model additionally provides a kind of line control earphone, and this line control earphone comprises the MEMS microphone assembly in as above any embodiment.Further, the utility model additionally provides a kind of mobile communications device, and this mobile communications device comprises the MEMS microphone assembly in as above any embodiment.Described mobile communications device is such as mobile phone, panel computer and notebook computer etc., can be improved the speech quality of described mobile communications device by MEMS microphone assembly of the present utility model.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, to those skilled in the art, the utility model can have various change and change.All do within spirit of the present utility model and principle any amendment, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (11)
1. a MEMS microphone assembly, is characterized in that, comprising:
Printed circuit board (PCB), described printed circuit board (PCB) comprises first surface and relative second surface;
Be arranged on the shell on printed circuit board (PCB) first surface, the first surface of described shell and described printed circuit board (PCB) forms the first cavity; Described first cavity comprises the sound inlet being suitable for receiving acoustical signal;
Be arranged on the MEMS sensor in described first cavity; And
Be arranged on the peripheral components of described first containment portion.
2. MEMS microphone assembly according to claim 1, is characterized in that, described MEMS sensor is arranged on described shell or on described printed circuit board (PCB).
3. MEMS microphone assembly according to claim 1, is characterized in that, described sound inlet is opened on described shell or on printed circuit board (PCB).
4. MEMS microphone assembly according to claim 1, it is characterized in that, also comprise setting integrated circuit on the printed circuit board, described integrated circuit is connected with described MEMS sensor, and processes the sensing signal of described MEMS sensor.
5. MEMS microphone assembly according to claim 4, is characterized in that, described integrated circuit is arranged in described first cavity.
6. MEMS microphone assembly according to claim 5, is characterized in that, described integrated circuit is arranged on the housing.
7. MEMS microphone assembly according to claim 1, is characterized in that, described shell is metal-back.
8. MEMS microphone assembly according to claim 1, is characterized in that, described peripheral components comprises at least one be selected from resistance, inductance, electric capacity, switch, additional integrated circuit.
9. MEMS microphone assembly according to claim 8, is characterized in that, on the first surface that described peripheral components is arranged on described printed circuit board (PCB) or second surface.
10. a line control earphone, is characterized in that, comprises the MEMS microphone assembly as described in any one of claim 1-9.
11. 1 kinds of mobile communications devices, is characterized in that, comprise the MEMS microphone assembly as described in any one of claim 1-9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520523770.4U CN204836575U (en) | 2015-07-17 | 2015-07-17 | MEMS microphone subassembly, drive -by -wire earphone and mobile communication device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520523770.4U CN204836575U (en) | 2015-07-17 | 2015-07-17 | MEMS microphone subassembly, drive -by -wire earphone and mobile communication device |
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| CN204836575U true CN204836575U (en) | 2015-12-02 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108370464A (en) * | 2016-03-29 | 2018-08-03 | 松下知识产权经营株式会社 | Microphone |
| CN110536211A (en) * | 2018-05-25 | 2019-12-03 | 哈曼贝克自动系统股份有限公司 | Sightless inside roof lining microphone |
| RU2761033C1 (en) * | 2018-04-26 | 2021-12-02 | Шэньчжэнь Вокстек Ко., Лтд. | Apparatus and method for removing vibration for headphones with two microphones |
| US11509994B2 (en) | 2018-04-26 | 2022-11-22 | Shenzhen Shokz Co., Ltd. | Vibration removal apparatus and method for dual-microphone earphones |
| US11540057B2 (en) | 2011-12-23 | 2022-12-27 | Shenzhen Shokz Co., Ltd. | Bone conduction speaker and compound vibration device thereof |
| US11950055B2 (en) | 2014-01-06 | 2024-04-02 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
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2015
- 2015-07-17 CN CN201520523770.4U patent/CN204836575U/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11540057B2 (en) | 2011-12-23 | 2022-12-27 | Shenzhen Shokz Co., Ltd. | Bone conduction speaker and compound vibration device thereof |
| US11950055B2 (en) | 2014-01-06 | 2024-04-02 | Shenzhen Shokz Co., Ltd. | Systems and methods for suppressing sound leakage |
| CN108370464A (en) * | 2016-03-29 | 2018-08-03 | 松下知识产权经营株式会社 | Microphone |
| CN108370464B (en) * | 2016-03-29 | 2020-04-07 | 松下知识产权经营株式会社 | Microphone (CN) |
| RU2761033C1 (en) * | 2018-04-26 | 2021-12-02 | Шэньчжэнь Вокстек Ко., Лтд. | Apparatus and method for removing vibration for headphones with two microphones |
| US11350205B2 (en) | 2018-04-26 | 2022-05-31 | Shenzhen Shokz Co., Ltd. | Vibration removal apparatus and method for dual-microphone earphones |
| US11356765B2 (en) | 2018-04-26 | 2022-06-07 | Shenzhen Shokz Co., Ltd. | Vibration removal apparatus and method for dual-microphone earphones |
| US11509994B2 (en) | 2018-04-26 | 2022-11-22 | Shenzhen Shokz Co., Ltd. | Vibration removal apparatus and method for dual-microphone earphones |
| US12069424B2 (en) | 2018-04-26 | 2024-08-20 | Shenzhen Shokz Co., Ltd. | Vibration removal apparatus and method for dual-microphone earphones |
| CN110536211A (en) * | 2018-05-25 | 2019-12-03 | 哈曼贝克自动系统股份有限公司 | Sightless inside roof lining microphone |
| CN110536211B (en) * | 2018-05-25 | 2023-12-29 | 哈曼贝克自动系统股份有限公司 | Invisible headliner microphone |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20180724 Address after: 261000 Fengshan Road, Fangzi District, Weifang, Shandong Province, No. 68 Patentee after: Shandong Gettop Acoustic Co.,Ltd. Address before: 100191 Beijing Haidian District Zhichun Road 23 quantum Ginza 1002 room Patentee before: Beijing Acuti Microsystems Co., Ltd. |