CN204810676U - Screening cap - Google Patents
Screening cap Download PDFInfo
- Publication number
- CN204810676U CN204810676U CN201520500750.5U CN201520500750U CN204810676U CN 204810676 U CN204810676 U CN 204810676U CN 201520500750 U CN201520500750 U CN 201520500750U CN 204810676 U CN204810676 U CN 204810676U
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- CN
- China
- Prior art keywords
- radome
- pcb board
- fin
- pad
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to an integrated field of semiconductor especially relates to a screening cap. Through set up the fin on screening cap, increased the area of contact of screening cap with the PCB board, make screening cap more firm, should not squint. The design of no base formula screening cap, the space of having practiced thrift PCB can reduce at least 13 cost again. Secondly, because set up the fin to has increased the area of contact of screening cap and PCB board, has let screening cap become heat conductor, absorbed the temperature of PCB board, the thermal run -away to the air in. Play the shielded effect promptly, play radiating effect again. And screening cap's design flexibility is stronger, and the various shapes that correspond to reality the production demand can be made according to the actual demand to the appearance.
Description
Technical field
The utility model relates to semiconductor integration field, particularly relates to a kind of radome.
Background technology
Radome (shieldcover/case/bracket) is an alloying metal cover, is the isolation to carrying out metal between two area of space, to control electric field and electromagnetic wave by a region to the induction in another region and radiation.Specifically, be surrounded with the interference source of shield by component, circuit, sub-assembly, cable or whole system exactly, prevent interfere with electromagnetic field to outdiffusion; With shield, receiving circuit, equipment or system are surrounded, prevent them to be subject to the impact of external electromagnetic field.
The use of radome in electronic product widely, but most of radome only play be shielding effect, patent document announce radome be mostly made up of upper outlet body and lower cover, need to make radome and lower radome, cost is higher simultaneously.Although existing program proposes bottomless sitting posture radome, radome also only plays the effect of shielding.
So need a kind of multi-functional radome badly.
Utility model content
In view of the above problems, the utility model provides a kind of radome.
A kind of radome, is applied on pcb board, it is characterized in that, comprising:
Pad, is arranged on described pcb board;
Radome lid, is arranged on described pad, with shield electromagnetic;
Fin, is arranged at the export-oriented extended spot bottom described radome lid, fits on described pad.
Above-mentioned radome, wherein, described fin is formed by a plurality of heat radiation small pieces, and the shape of each described heat radiation small pieces is identical, and distance between each described heat radiation small pieces is equal.
Above-mentioned radome, wherein, described fin is formed by a plurality of heat radiation small pieces, and the shape of each described heat radiation small pieces is identical, interval one preset space length between each described fin.
Above-mentioned radome, wherein, the material of described fin is metal.
Above-mentioned radome, wherein, described pcb board is also provided with welding resistance district, and described pad is mated in described welding resistance district, and described welding resistance district forms the area of coverage of described radome lid.
Above-mentioned radome, wherein, described pad is formed by steel mesh layer, scribbles tin cream, to be fixed on described pcb board by described radome lid in described fin and described steel mesh layer contact position.
Above-mentioned radome, wherein, described fin is arranged on the upper surface of described pcb board, and described pcb board is also provided with holding wire, in the described holding wire of described heat sink area, be arranged at the back side of described pcb board and the region relative with described heat sink area by a via hole.
Above-mentioned radome, wherein, the material of described radome lid is metal.
Above-mentioned radome, wherein, the material of described fin and described radome lid is metallic copper.
Above-mentioned radome, wherein, described radome lid is rectangular-shaped.
In sum, a kind of radome of the utility model design, by arranging fin on radome, increases the contact area of radome and pcb board, makes radome more firm, should not offset.Without the design of base type radome, save the space of PCB, the cost of at least 1/3 can have been reduced again.Secondly, because be provided with fin, thus increase the contact area of radome and pcb board, allow radome become a heat carrier, absorb the temperature of pcb board, heat is dispersed in air.Namely play the effect of shielding, play again the effect of heat radiation.And the design flexibility of radome is stronger, profile can make the shape of various realistic Production requirement according to the actual requirements.
Accompanying drawing explanation
With reference to appended accompanying drawing, to describe embodiment of the present utility model more fully.But, appended accompanying drawing only for illustration of and elaboration, do not form the restriction to the utility model scope.
Fig. 1 is the utility model structural representation;
Fig. 2 is the utility model end view;
Fig. 3 is the schematic diagram in conventional shields and contact pads face.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment, the utility model is further described, but not as restriction of the present utility model.
The utility model relates to a kind of covering and the design of radome on screened circuit substrate, and first the base of radome directly designs on pcb board, but with in the past unlike, radome, by being originally connected with pcb board vertical point, changing into and being connected with pcb board face.Not only achieve in the past cost-saving but also play the effect of heat radiation.
As Figure 1-Figure 2, this radome comprises a radome lid 1, and this radome lid 1 is arranged on a pcb board, receiving circuit, equipment or system is surrounded with this radome lid 1, places the interference that they receive external electromagnetic field.
In the utility model, pcb board is provided with a pad 3, this pad 3 includes steel mesh layer, equally arranges this pad with conventional design, is then arranged on pad by radome lid.This pcb board is also provided with welding resistance district, welding resistance district and pad match, welding resistance district forms the area of coverage of radome lid, in the place that radome lid is connected with pad, some fin 2 are set, heat on pcb board can be distributed in air by these fin 2, these fin 2 are export-oriented bottom radome lid 1 to be extended, then this fin 2 is fitted with pad and contact, because fin 2 and radome lid 1 are all metal materials, so the heat on pcb board can be passed on fin 2, then heat is passed on radome lid 1 by fin 2, such heat just can distribute.
In the utility model, the steel mesh layer brush tin cream of pad 3, to be fixed on pcb board by fin 2, says it is be fixed on pcb board by radome lid accurately.Because the interference signal that will shield different frequency ranges of radome, so carry out certain setting to fin, these fin 2 are equidistantly arranged on the place that radome lid 1 contacts with pad 3, for different frequency range, distance between each fin 2 is not identical yet, can adjust according to the situation of reality to the spacing between fin 2.
Conventional pcb board all can be provided with some holding wires, and the material of fin in the utility model and radome lid adopts metal, so be set directly at the short circuit that pcb board will cause holding wire, estimating so original will should from the lower surface cabling of pcb board at the holding wire of fin (i.e. pad place) cabling, and then on pcb board, the holding wire of the upper surface of punching and pcb board links together.If run into device, being also same way, or changing direction of routing, is make fin and radome lid any device or cabling do not have interference with other in a word.
In the utility model, radome lid can make difformity according to actual needs, such as spherical, cylindric etc., in the utility model, preferred employing is rectangular-shaped, and structure is simple and attractive in appearance, conserve space.
Be described below in conjunction with specific embodiment
Embodiment one
As shown in Figure 1-Figure 3, be first solder mask aspect on pcb board and steel mesh layer by layer face designed size be the copper sheet of a*b, having solder mask aspect not greenwash the process of oil in PCB manufacturing process, steel mesh layer is also the aspect of brush tin cream.The effect of tin cream is exactly with fixing being bonded together of pcb board radome.
The base of radome is made up of the little copper sheet section of N number of a*b, keeps certain spacing before every section little copper sheet, because different spacing is different to the screening effectiveness of different frequency range, so, can according to actual conditions, the spacing between the little copper sheet of adjustment section.
The little copper sheet of a*b keeps identical spacing with when little copper sheet, and when running into holding wire, holding wire changes layer to reverse side by beating via hole, dodges little copper sheet.Running into device is equally also that device is shifted out radome path, make radome not with other any device, or cabling is interfered, and reaches shield effectiveness.
On radome and pcb board, the width in contact pads face was c (i.e. radome lid lateral thickness) in the past, and when paster, radome easily offsets.And the design can increase the width of pad on pcb board according to actual needs, the contact-making surface of radome and pcb board is increased to as much as possible maximum.
Originally the size of pad is a*b, the real contact area of radome and PCB pad is a*c, so only only used a fraction of pad, and the contact area of radome in the utility model and pad is close to a*b, because be all at regular intervals between copper sheet, so just that the width design of copper sheet is identical with the width of pad at the beginning of design.So existing shielding area as required, design and place radome, and then with the device overlap on pcb board or can not contact when placing copper sheet, running into device will remove radome path device, and any device or cabling do not have interference with other to make radome.
Can be found out by above embodiment, the utility model is just at the enterprising row relax of the PCB of interiors of products, do not affect the outward appearance of product, can not design in addition because the running environment of device products is different with use field, namely society any one device needing shielding can be used for, the profile of radome does not limit, and the effect of the existing shielding external electromagnetic field of radome, can play again the effect of heat radiation.
By illustrating and accompanying drawing, giving the exemplary embodiments of the ad hoc structure of embodiment, based on the utility model spirit, also can do other conversion.Although above-mentioned utility model proposes existing preferred embodiment, but these contents are not as limitation.
For a person skilled in the art, after reading above-mentioned explanation, various changes and modifications undoubtedly will be apparent.Therefore, appending claims should regard the whole change and correction of containing true intention of the present utility model and scope as.In Claims scope, the scope of any and all equivalences and content, all should think and still belong in intention of the present utility model and scope.
Claims (10)
1. a radome, is applied on pcb board, it is characterized in that, comprising:
Pad, is arranged on described pcb board;
Radome lid, is arranged on described pad, with shield electromagnetic;
Fin, is arranged at the export-oriented extended spot bottom described radome lid, fits on described pad.
2. radome according to claim 1, is characterized in that, described fin is formed by a plurality of heat radiation small pieces, and the shape of each described heat radiation small pieces is identical, and distance between each described heat radiation small pieces is equal.
3. radome according to claim 1, is characterized in that, described fin is formed by a plurality of heat radiation small pieces, and the shape of each described heat radiation small pieces is identical, interval one preset space length between each described fin.
4. radome according to claim 1, is characterized in that, the material of described fin is metal.
5. radome according to claim 1, is characterized in that, described pcb board is also provided with welding resistance district, and described pad is mated in described welding resistance district, and described welding resistance district forms the area of coverage of described radome lid.
6. radome according to claim 1, is characterized in that, described pad is formed by steel mesh layer, scribbles tin cream, to be fixed on described pcb board by described radome lid in described fin and described steel mesh layer contact position.
7. radome according to claim 1, it is characterized in that, described fin is arranged on the upper surface of described pcb board, and described pcb board is also provided with holding wire, in the described holding wire of described heat sink area, be arranged at the back side of described pcb board and the region relative with described heat sink area by a via hole.
8. radome according to claim 1, is characterized in that, the material of described radome body is metal.
9. radome according to claim 8, is characterized in that, the material of described fin and described radome body is metallic copper.
10. radome according to claim 1, is characterized in that, described radome body is rectangular-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520500750.5U CN204810676U (en) | 2015-07-10 | 2015-07-10 | Screening cap |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520500750.5U CN204810676U (en) | 2015-07-10 | 2015-07-10 | Screening cap |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204810676U true CN204810676U (en) | 2015-11-25 |
Family
ID=54595418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520500750.5U Expired - Fee Related CN204810676U (en) | 2015-07-10 | 2015-07-10 | Screening cap |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204810676U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472873A (en) * | 2015-12-28 | 2016-04-06 | 联想(北京)有限公司 | Resonant component and electronic equipment |
-
2015
- 2015-07-10 CN CN201520500750.5U patent/CN204810676U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472873A (en) * | 2015-12-28 | 2016-04-06 | 联想(北京)有限公司 | Resonant component and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151125 Termination date: 20190710 |