TWI613767B - Electronic package and method for fabricating the same - Google Patents
Electronic package and method for fabricating the same Download PDFInfo
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- TWI613767B TWI613767B TW106113768A TW106113768A TWI613767B TW I613767 B TWI613767 B TW I613767B TW 106113768 A TW106113768 A TW 106113768A TW 106113768 A TW106113768 A TW 106113768A TW I613767 B TWI613767 B TW I613767B
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- electronic package
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- metal frame
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- 238000000034 method Methods 0.000 title abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims description 13
- 239000005022 packaging material Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 10
- 238000004891 communication Methods 0.000 description 9
- 238000012858 packaging process Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- 230000008016 vaporization Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Aerials (AREA)
Abstract
一種電子封裝件及其製法，係於一承載件上設置電子元件與天線結構，其中，該天線結構包含立設於該承載件上金屬架、設於該金屬架與該承載件之間之天線增長部、及設於該承載件上且電性連接該金屬架與該天線增長部之導線，以利用該天線增長部作為增加佈設區域的面積，因而無需於該承載件之表面上增加佈設區域，即可增加該天線結構之長度，以達到天線運作之需求。 An electronic package and a method for manufacturing the same, wherein an electronic component and an antenna structure are disposed on a carrier, wherein the antenna structure comprises a metal frame erected on the carrier, and an antenna disposed between the metal frame and the carrier a growth portion, and a wire disposed on the carrier and electrically connecting the metal frame and the antenna growth portion to utilize the antenna growth portion as an area for increasing the layout area, thereby eliminating the need to add a layout area on the surface of the carrier , the length of the antenna structure can be increased to meet the needs of the antenna operation.
Description
本發明係有關一種電子封裝件，尤指一種具天線結構之電子封裝件。 The present invention relates to an electronic package, and more particularly to an electronic package having an antenna structure.
隨著電子產業的蓬勃發展，電子產品也逐漸邁向多功能、高性能的趨勢。目前無線通訊技術已廣泛應用於各式各樣的消費性電子產品以利接收或發送各種無線訊號。為了滿足消費性電子產品的外觀設計需求，無線通訊模組之製造與設計係朝輕、薄、短、小之需求作開發，其中，平面天線(Patch Antenna)因具有體積小、重量輕與製造容易等特性而廣泛利用於手機(cell phone)、個人數位助理(Personal Digital Assistant，簡稱PDA)等電子產品之無線通訊模組中。 With the rapid development of the electronics industry, electronic products are gradually moving towards multi-functional and high-performance trends. At present, wireless communication technology has been widely used in a variety of consumer electronic products to receive or transmit various wireless signals. In order to meet the design requirements of consumer electronic products, the manufacturing and design of wireless communication modules are developed in light, thin, short and small requirements. Among them, the patch antennas are small in size, light in weight and manufactured. It is easy to use and is widely used in wireless communication modules of electronic products such as cell phones and personal digital assistants (PDAs).
第1圖係習知無線通訊模組之立體示意圖。如第1圖所示，該無線通訊模組1係包括：一基板10、設於該基板10上之複數電子元件11、一天線結構12以及封裝材13。該基板10係為電路板並呈矩形體。該電子元件11係設於該基板10上且電性連接該基板10。該天線結構12係為平面型且具有一天線本體120與一導線121，該天線本體120 藉由該導線121電性連接該電子元件11。該封裝材13覆蓋該電子元件11與該部分導線121。 Figure 1 is a perspective view of a conventional wireless communication module. As shown in FIG. 1 , the wireless communication module 1 includes a substrate 10 , a plurality of electronic components 11 , an antenna structure 12 , and a package 13 disposed on the substrate 10 . The substrate 10 is a circuit board and has a rectangular shape. The electronic component 11 is disposed on the substrate 10 and electrically connected to the substrate 10 . The antenna structure 12 is planar and has an antenna body 120 and a wire 121. The antenna body 120 The electronic component 11 is electrically connected by the wire 121. The package material 13 covers the electronic component 11 and the partial wire 121.
惟，習知無線通訊模組1中，該天線結構12係為平面型，故基於該天線結構12與該電子元件11之間的電磁輻射特性及該天線結構12之體積限制，而於製程中，該天線本體120難以與該電子元件11整合製作，亦即該封裝材13僅覆蓋該電子元件11，並未覆蓋該天線本體120，致使封裝製程之模具需對應該些電子元件11之佈設區域，而非對應該基板10之尺寸，因而不利於封裝製程。 However, in the conventional wireless communication module 1, the antenna structure 12 is planar, so based on the electromagnetic radiation characteristics between the antenna structure 12 and the electronic component 11 and the volume limitation of the antenna structure 12, in the process. The antenna body 120 is difficult to be integrated with the electronic component 11 , that is, the package material 13 covers only the electronic component 11 and does not cover the antenna body 120 , so that the mold of the packaging process needs to correspond to the layout area of the electronic components 11 . Rather than the size of the substrate 10, it is not conducive to the packaging process.
再者，因該天線結構12係為平面型，故當需增加該天線結構12之長度時，需於該基板10之表面上增加佈設區域(未形成封裝材13之區域)以形成該天線本體120，但該基板10之長寬尺寸均為固定，因而難以增加佈設區域的面積，致使無法增加該天線結構12之長度，因而無法達到天線運作之需求。 Furthermore, since the antenna structure 12 is planar, when the length of the antenna structure 12 needs to be increased, a layout area (a region where the package material 13 is not formed) is added to the surface of the substrate 10 to form the antenna body. 120, but the length and width dimensions of the substrate 10 are fixed, so that it is difficult to increase the area of the layout area, so that the length of the antenna structure 12 cannot be increased, and thus the operation of the antenna cannot be achieved.
因此，如何克服上述習知技術之種種問題，實已成目前亟欲解決的課題。 Therefore, how to overcome the various problems of the above-mentioned prior art has become a problem that is currently being solved.
鑑於上述習知技術之種種缺失，本發明係揭露一種電子封裝件，係包括：承載件；至少一電子元件，係設於該承載件上；以及天線結構，係設於該承載件上並電性連接該承載件，其中，該天線結構包含立設於該承載件上之金屬架、位於該金屬架與該承載件之間之天線增長部及設於該承載件上且電性連接該金屬架與該天線增長部之導線。 In view of the above-mentioned various deficiencies of the prior art, the present invention discloses an electronic package comprising: a carrier; at least one electronic component is disposed on the carrier; and an antenna structure is disposed on the carrier and electrically The antenna structure is connected to the carrier, wherein the antenna structure comprises a metal frame erected on the carrier, an antenna growth portion between the metal frame and the carrier, and is disposed on the carrier and electrically connected to the metal A wire that is attached to the growth portion of the antenna.
本發明復揭露一種電子封裝件之製法，係包括：提供一設有至少一電子元件之承載件；以及於該承載件上設置並電性連接一天線結構，其中，該天線結構包含立設於該承載件上之金屬架、位於該金屬架與該承載件之間之天線增長部及設於該承載件上且電性連接該金屬架與該天線增長部之導線。 The method for manufacturing an electronic package includes: providing a carrier having at least one electronic component; and disposing and electrically connecting an antenna structure on the carrier, wherein the antenna structure comprises a metal frame on the carrier, an antenna growth portion between the metal frame and the carrier, and a wire disposed on the carrier and electrically connecting the metal frame and the antenna growth portion.
前述之電子封裝件及其製法中，該電子元件電性連接該承載件。 In the foregoing electronic package and method of manufacturing the same, the electronic component is electrically connected to the carrier.
前述之電子封裝件及其製法中，該電子元件係為主動元件。 In the aforementioned electronic package and method of manufacturing the same, the electronic component is an active component.
前述之電子封裝件及其製法中，該天線結構以其導線電性連接該承載件。 In the foregoing electronic package and method of manufacturing the same, the antenna structure is electrically connected to the carrier by a wire thereof.
前述之電子封裝件及其製法中，該金屬架具有延伸部與至少一支撐部，該延伸部藉由該支撐部架設於該承載件上。例如，該延伸部係為天線本體。 In the above electronic package and method of manufacturing the same, the metal frame has an extension portion and at least one support portion, and the extension portion is erected on the carrier member by the support portion. For example, the extension is an antenna body.
前述之電子封裝件及其製法中，該天線增長部係為被動元件。 In the aforementioned electronic package and method of manufacturing the same, the antenna growth portion is a passive component.
前述之電子封裝件及其製法中，復包括形成封裝材於該承載件上以包覆該電子元件與該天線結構。 In the foregoing electronic package and method of manufacturing the same, the method further comprises forming a package on the carrier to encapsulate the electronic component and the antenna structure.
前述之電子封裝件及其製法中，復包括形成屏蔽結構於該承載件上以遮蓋該電子元件。進一步，該屏蔽結構未遮蓋該天線結構，且該屏蔽結構係位於該封裝材上方或為該封裝材所包覆。 In the foregoing electronic package and method of manufacturing the same, the method further comprises forming a shielding structure on the carrier to cover the electronic component. Further, the shielding structure does not cover the antenna structure, and the shielding structure is located above or covered by the packaging material.
由上可知，本發明之電子封裝件及其製法中，係藉由 該金屬架之設計，以於製程中，該封裝材能覆蓋該電子元件與該天線結構，使封裝製程之模具能對應該承載件之尺寸，而有利於封裝製程。 It can be seen from the above that the electronic package of the present invention and the method for manufacturing the same are The metal frame is designed to cover the electronic component and the antenna structure during the manufacturing process, so that the mold of the packaging process can correspond to the size of the carrier, which is beneficial to the packaging process.
再者，因該金屬架設於該承載件上，且利用該天線增長部作為增加佈設區域的面積，因而無需於該承載件之表面上增加佈設區域，故相較於習知技術，本發明能於預定的承載件尺寸下增加該天線結構之長度，達到天線運作之需求，且能使該電子封裝件符合微小化之需求。 Furthermore, since the metal is mounted on the carrier and the antenna growth portion is used as an area for increasing the layout area, it is not necessary to add a layout area to the surface of the carrier, so that the present invention can be compared with the prior art. The length of the antenna structure is increased under a predetermined carrier size to meet the requirements of the operation of the antenna, and the electronic package can meet the requirements of miniaturization.
1‧‧‧無線通訊模組 1‧‧‧Wireless communication module
10‧‧‧基板 10‧‧‧Substrate
11、21‧‧‧電子元件 11, 21‧‧‧ Electronic components
12、22‧‧‧天線結構 12, 22‧‧‧ antenna structure
120‧‧‧天線本體 120‧‧‧Antenna body
121、22c‧‧‧導線 121, 22c‧‧‧ wires
13、23‧‧‧封裝材 13, 23‧‧‧Package
2‧‧‧電子封裝件 2‧‧‧Electronic package
20‧‧‧承載件 20‧‧‧Carrier
20c‧‧‧側面 20c‧‧‧ side
200‧‧‧線路層 200‧‧‧circuit layer
22a‧‧‧金屬架 22a‧‧‧Metal frame
22b‧‧‧天線增長部 22b‧‧‧Antenna Growth Department
220‧‧‧延伸部 220‧‧‧Extension
221‧‧‧支撐部 221‧‧‧Support
24‧‧‧屏蔽結構 24‧‧‧Shielding structure
A‧‧‧第一區域 A‧‧‧First area
B‧‧‧第二區域 B‧‧‧Second area
第1圖係為習知無線通訊模組之立體示意圖；以及第2A至2C圖係為本發明之電子封裝件之製法的立體示意圖；其中，第2C’圖係為對應第2C圖的剖面示意圖。 1 is a perspective view of a conventional wireless communication module; and 2A to 2C are perspective views of a method for manufacturing an electronic package of the present invention; wherein, the 2C' is a schematic cross-sectional view corresponding to FIG. 2C .
以下藉由特定的具體實施例說明本發明之實施方式，熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。 The other embodiments of the present invention will be readily understood by those skilled in the art from this disclosure.
須知，本說明書所附圖式所繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士之瞭解與閱讀，並非用以限定本發明可實施之限定條件，故不具技術上之實質意義，任何結構之修飾、比例關係之改變或大小之調整，在不影響本發明所能產生之功效及所能達成之目的下，均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時，本說明書中所引用之如“上”、“二”及“一”等之用語，亦僅為便於敘述之明 瞭，而非用以限定本發明可實施之範圍，其相對關係之改變或調整，在無實質變更技術內容下，當亦視為本發明可實施之範疇。 It is to be understood that the structure, the proportions, the size, and the like of the present invention are intended to be used in conjunction with the disclosure of the specification, and are not intended to limit the invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effects and the objectives that can be achieved by the present invention. The technical content disclosed in the invention can be covered. At the same time, the terms "upper", "two" and "one" as quoted in this manual are also for convenience only. The scope of the present invention is not to be construed as limiting the scope of the invention.
第2A至2C圖係為本發明之電子封裝件2之製法之立體示意圖。於本實施例中，該電子封裝件2係例如為系統級封裝(System in package，簡稱SiP)之無線通訊模組。 2A to 2C are perspective views of the manufacturing method of the electronic package 2 of the present invention. In this embodiment, the electronic package 2 is, for example, a system in package (SiP) wireless communication module.
如第2A圖所示，提供一設有至少一電子元件21之承載件20，再於該承載件20上設置一電性連接該承載件20之天線結構22。 As shown in FIG. 2A, a carrier 20 having at least one electronic component 21 is provided, and an antenna structure 22 electrically connected to the carrier 20 is disposed on the carrier 20.
所述之承載件20係例如呈矩形體，並定義有相鄰接之第一區域A與第二區域B。於本實施例中，該承載件20係例如為具有核心層與線路結構之封裝基板(substrate)或無核心層(coreless)之線路結構，其構成係於介電材上形成複數線路層200，如扇出(fan out)型重佈線路層(redistribution layer，簡稱RDL)。應可理解地，該承載件20亦可為其它可供承載如晶片等電子元件之承載單元，例如導線架(leadframe)(其導腳可視為線路結構)，並不限於上述。 The carrier 20 is, for example, in the form of a rectangular body and defines a first region A and a second region B adjacent thereto. In this embodiment, the carrier 20 is, for example, a circuit substrate having a core layer and a circuit structure, or a coreless structure, and is formed by forming a plurality of circuit layers 200 on the dielectric material. Such as a fan out type redistribution layer (RDL). It should be understood that the carrier 20 can also be other carrying units for carrying electronic components such as wafers, such as leadframes (the lead legs can be regarded as a line structure), and are not limited to the above.
所述之電子元件21係為主動元件，例如為半導體晶片，其設於該承載件20之第一區域A上。於本實施例中，該電子元件係藉由複數銲線以打線方式電性連接該線路層200；或者，該電子元件21可藉由藉由複數如銲錫材料之導電凸塊(圖略)以覆晶方式設於該線路層200上並電性連接該線路層200；亦或，該電子元件21可直接接觸該線路 層200。應可理解地，有關該電子元件21電性連接該承載件20之方式繁多，不限於上述。 The electronic component 21 is an active component, such as a semiconductor wafer, which is disposed on the first region A of the carrier 20. In this embodiment, the electronic component is electrically connected to the circuit layer 200 by a plurality of bonding wires; or the electronic component 21 can be formed by using a plurality of conductive bumps (such as solder) of the solder material. The flip chip is disposed on the circuit layer 200 and electrically connected to the circuit layer 200; or the electronic component 21 can directly contact the circuit Layer 200. It should be understood that the electronic component 21 is electrically connected to the carrier 20 in a plurality of ways, and is not limited to the above.
所述之天線結構22係設於該承載件20之第二區域B上，並包含一金屬架22a、至少一天線增長部22b及至少一電性連接該金屬架22a與該天線增長部22b之導線22c。 The antenna structure 22 is disposed on the second area B of the carrier 20 and includes a metal frame 22a, at least one antenna growth portion 22b, and at least one electrically connected to the metal frame 22a and the antenna growth portion 22b. Wire 22c.
於本實施例中，該金屬架22a係為鐵架或其它材質，其具有一延伸部220與一支撐部221，該支撐部221係立設於該承載件20上，且該延伸部220藉由該支撐部221架設於該承載件20上，使該延伸部220之位置高於該電子元件21與該天線增長部22b之位置，且該延伸部220係沿該承載件20之第二區域B之邊緣作相對應延伸。具體地，該延伸部220係作為天線主體，其呈彎曲或彎折狀，例如，呈現具缺口之環狀(如扣環狀或ㄇ字形)、L字型或連續環狀(如口字型)，且該支撐部221係電性連接該導線22c，其為單一柱體，但亦可依需求設計為其它形狀(如牆體)或複數個。 In this embodiment, the metal frame 22a is an iron frame or other material, and has an extending portion 220 and a supporting portion 221. The supporting portion 221 is erected on the carrier 20, and the extending portion 220 is borrowed. The support portion 221 is mounted on the carrier 20 such that the position of the extension portion 220 is higher than the position of the electronic component 21 and the antenna growth portion 22b, and the extension portion 220 is along the second region of the carrier member 20. The edge of B is correspondingly extended. Specifically, the extension portion 220 serves as an antenna body which is curved or bent, for example, in the form of a notched ring (such as a buckled or U-shaped), an L-shaped or a continuous ring (such as a mouth-shaped type). The support portion 221 is electrically connected to the wire 22c, which is a single cylinder, but may be designed into other shapes (such as a wall) or a plurality of materials according to requirements.
再者，該天線增長部22b係例如為被動元件，如電阻、電容及電感，其設於該承載件20上並電性連接該導線22c。具體地，該金屬架22a架設於該承載件20上，會於該延伸部220與該承載件20之間形成容置空間，故能利用該容置空間佈設該天線增長部22b。 Furthermore, the antenna growth portion 22b is, for example, a passive component such as a resistor, a capacitor, and an inductor, and is disposed on the carrier 20 and electrically connected to the wire 22c. Specifically, the metal frame 22a is mounted on the carrier 20, and an accommodation space is formed between the extension portion 220 and the carrier 20. Therefore, the antenna growth portion 22b can be disposed by the accommodation space.
又，該導線22c係設於該承載件20上並電性連接該線路層200，且其中一端部連接該支撐部221，而另一端部連接該天線增長部22b。例如，該導線22c係與該線路層200 一同製作，如RDL製程。應可理解地，該導線22c亦可分為不相連之兩線段，其中一線段連接該支撐部221，而另一線段連接該天線增長部22b。 Moreover, the wire 22c is disposed on the carrier 20 and electrically connected to the circuit layer 200, and one end portion is connected to the support portion 221, and the other end portion is connected to the antenna growth portion 22b. For example, the wire 22c is connected to the circuit layer 200 Made together, such as the RDL process. It should be understood that the wire 22c can also be divided into two non-connected segments, wherein one segment connects the support portion 221 and the other segment connects the antenna growth portion 22b.
另外，該支撐部221係作為訊號輸入端或接地端，使該電子元件21可依需求藉由至少一銲線(圖略)電性連接該延伸部220，且該延伸部220與該導線22c均可作為天線發射源，但藉由該支撐部221架高該延伸部220以強化發射源，故於強度上，該延伸部220大於該導線22c。 In addition, the supporting portion 221 is used as a signal input end or a grounding end, so that the electronic component 21 can be electrically connected to the extending portion 220 by at least one bonding wire (not shown), and the extending portion 220 and the wire 22c It can be used as an antenna emission source, but the extension portion 220 is raised by the support portion 221 to strengthen the emission source, so the extension portion 220 is greater than the wire 22c in strength.
如第2B圖所示，形成封裝材23於該承載件20上，以令該封裝材23包覆該電子元件21與該天線結構22及天線增長部22b。 As shown in FIG. 2B, a package member 23 is formed on the carrier 20 such that the package member 23 covers the electronic component 21, the antenna structure 22, and the antenna growth portion 22b.
於本實施例中，該封裝材23係為聚醯亞胺(polyimide，簡稱PI)、乾膜(dry film)、環氧樹脂(epoxy)或封裝材(molding compound)等，但不限於上述。 In the present embodiment, the encapsulating material 23 is a polyimide, a dry film, an epoxy, a molding compound, or the like, but is not limited thereto.
如第2C圖所示，形成一屏蔽結構24於該封裝材23上，以遮蓋該電子元件21。 As shown in FIG. 2C, a shielding structure 24 is formed on the package 23 to cover the electronic component 21.
於本實施例中，該屏蔽結構24係覆蓋該封裝材23之部分表面與該承載件20之部分側面，亦即僅對應形成於該承載件20之第一區域A，使其與該天線結構22未重疊，亦即該屏蔽結構24未遮蓋該天線結構22。 In this embodiment, the shielding structure 24 covers a part of the surface of the package 23 and a part of the side of the carrier 20, that is, only corresponding to the first area A of the carrier 20, and the antenna structure. 22 does not overlap, that is, the shield structure 24 does not cover the antenna structure 22.
再者，可藉由塗佈金屬層(如銅材)之加工方式形成該屏蔽結構24於該封裝材23上，例如，濺鍍(sputtering)、蒸鍍(vaporing)、電鍍、無電電鍍或化鍍等方式；或者，利用蓋設金屬架或金屬罩、或貼膜(foiling)等設置方式形成該 屏蔽結構24於該封裝材23上；亦或，可先於該承載件20上設置如金屬架或金屬罩之屏蔽結構，再以該封裝材23包覆該屏蔽結構，使外觀如第2B圖所示。 Furthermore, the shielding structure 24 can be formed on the packaging material 23 by processing a metal layer (such as a copper material), for example, sputtering, vaporization, electroplating, electroless plating or chemical conversion. Plating or the like; or, by means of a metal frame or a metal cover, or a foil, etc. The shielding structure 24 is disposed on the packaging material 23; or a shielding structure such as a metal frame or a metal cover may be disposed on the carrier 20, and the shielding structure is covered by the packaging material 23 to make the appearance as shown in FIG. 2B. Shown.
又，該屏蔽結構24可依需求選擇覆蓋該承載件20之第一區域A之垂直投影範圍，如全部、1/2或1/3，甚至可選擇覆蓋該承載件20之第一區域A之部分側面20c或全部側面20c。 Moreover, the shielding structure 24 can select a vertical projection range covering the first area A of the carrier 20, such as all, 1/2 or 1/3, or even cover the first area A of the carrier 20, as needed. Part of the side 20c or all of the side 20c.
另外，藉由該屏蔽結構24之設計，使該電子元件21不會受外界之電磁干擾。 In addition, by the design of the shielding structure 24, the electronic component 21 is not subject to external electromagnetic interference.
本發明之製法中，係利用金屬片摺疊成立體化金屬架22a，再將該延伸部220架設於該承載件20上，使該延伸部220對應第二區域B之邊緣延伸，以於製程中，該延伸部220能與該電子元件21整合製作，亦即一同進行封裝，使該封裝材23能覆蓋該電子元件21與該天線結構22，故封裝製程用之模具能對應該承載件20之尺寸，因而有利於封裝製程。 In the manufacturing method of the present invention, the metallized metal frame 22a is folded by the metal sheet, and the extending portion 220 is placed on the carrier 20 so that the extending portion 220 extends corresponding to the edge of the second region B for the process. The extension portion 220 can be integrated with the electronic component 21, that is, packaged together, so that the package material 23 can cover the electronic component 21 and the antenna structure 22, so that the mold for the packaging process can correspond to the carrier 20 The size is thus advantageous for the packaging process.
再者，該金屬架22a架設於該承載件20上而呈立體式天線本體，且利用該天線增長部22b作為增加佈設區域的面積，因而無需於該承載件20之表面上增加佈設區域，故相較於習知技術，本發明之製法能於預定的承載件20尺寸下增加該天線結構22之長度，因而得以達到天線運作之需求，且能使該電子封裝件2符合微小化之需求。 Furthermore, the metal frame 22a is mounted on the carrier 20 to form a three-dimensional antenna body, and the antenna growth portion 22b is used as an area for increasing the layout area, so that there is no need to add a layout area on the surface of the carrier 20, so Compared with the prior art, the method of the present invention can increase the length of the antenna structure 22 under the predetermined size of the carrier 20, thereby achieving the requirement of the operation of the antenna, and enabling the electronic package 2 to meet the demand for miniaturization.
又，該封裝材23可用於固定該金屬架22a，使該延伸部220位於固定高度而能確保天線穩定性，且利用該封裝 材23之介電係數能縮小天線所需之電氣長度。 Moreover, the package material 23 can be used to fix the metal frame 22a, and the extension portion 220 is located at a fixed height to ensure antenna stability, and the package is utilized. The dielectric constant of material 23 reduces the electrical length required for the antenna.
本發明復提供一種電子封裝件2，其包括：一承載件20、一設於該承載件20上之電子元件21、以及一設於該承載件20上之天線結構22。 The present invention further provides an electronic package 2 comprising: a carrier 20, an electronic component 21 disposed on the carrier 20, and an antenna structure 22 disposed on the carrier 20.
所述之承載件20係具有複數線路層200以電性連接該電子元件21。 The carrier 20 has a plurality of circuit layers 200 for electrically connecting the electronic components 21.
所述之電子元件21係為主動元件且電性連接該承載件20之線路層200。 The electronic component 21 is an active component and is electrically connected to the circuit layer 200 of the carrier 20 .
所述之天線結構22係設於該承載件20上並電性連接該承載件20，其中，該天線結構22包含一金屬架22a、至少一天線增長部22b及至少一電性連接該金屬架22a與該天線增長部22b之導線22c。 The antenna structure 22 is connected to the carrier 20 and electrically connected to the carrier 20. The antenna structure 22 includes a metal frame 22a, at least one antenna growth portion 22b, and at least one electrically connected metal frame. 22a and the wire 22c of the antenna growing portion 22b.
於一實施例中，該天線結構22以其導線22c電性連接該承載件20。 In an embodiment, the antenna structure 22 is electrically connected to the carrier 20 by its wire 22c.
於一實施例中，該金屬架22a具有延伸部220與至少一支撐部221，該延伸部220藉由該些支撐部221架設於該承載件20上。例如，該延伸部220係為天線本體。 In one embodiment, the metal frame 22a has an extending portion 220 and at least one supporting portion 221 . The extending portion 220 is mounted on the carrier 20 by the supporting portions 221 . For example, the extension 220 is an antenna body.
於一實施例中，該天線增長部係為被動元件。 In an embodiment, the antenna growth portion is a passive component.
於一實施例中，復包括封裝材23，係形成於該承載件20上以包覆該電子元件21與該天線結構22。 In one embodiment, a package material 23 is formed on the carrier 20 to encapsulate the electronic component 21 and the antenna structure 22 .
於一實施例中，復包括一形成於該承載件20上之屏蔽結構24，係遮蓋該電子元件21而未遮蓋該天線結構22。 In one embodiment, a shield structure 24 formed on the carrier 20 is covered to cover the electronic component 21 without covering the antenna structure 22.
綜上所述，本發明之電子封裝件及其製法中，主要藉由以立體式天線結構取代習知平面式天線結構，故能將該 天線結構架設於該封裝材形成區域上，以利於封裝製程。 In summary, in the electronic package of the present invention and the manufacturing method thereof, the conventional planar antenna structure is mainly replaced by a stereo antenna structure, so The antenna structure is mounted on the package forming area to facilitate the packaging process.
再者，藉由該天線增長部之設計，因而無需於該承載件之表面上增加佈設區域，即能增加該天線結構之長度，達到天線運作之需求。 Moreover, by the design of the antenna growth portion, it is not necessary to add a layout area to the surface of the carrier, that is, the length of the antenna structure can be increased to meet the requirements of the antenna operation.
上述實施例係用以例示性說明本發明之原理及其功效，而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下，對上述實施例進行修改。因此本發明之權利保護範圍，應如後述之申請專利範圍所列。 The above embodiments are intended to illustrate the principles of the invention and its effects, and are not intended to limit the invention. Any of the above-described embodiments may be modified by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the appended claims.
2‧‧‧電子封裝件 2‧‧‧Electronic package
20‧‧‧承載件 20‧‧‧Carrier
21‧‧‧電子元件 21‧‧‧Electronic components
22‧‧‧天線結構 22‧‧‧Antenna structure
22a‧‧‧金屬架 22a‧‧‧Metal frame
22b‧‧‧天線增長部 22b‧‧‧Antenna Growth Department
22c‧‧‧導線 22c‧‧‧Wire
23‧‧‧封裝材 23‧‧‧Package
24‧‧‧屏蔽結構 24‧‧‧Shielding structure
Claims (20)
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