CN204808363U - 指纹传感器模块、具有此的便携式电子设备 - Google Patents
指纹传感器模块、具有此的便携式电子设备 Download PDFInfo
- Publication number
- CN204808363U CN204808363U CN201390000913.2U CN201390000913U CN204808363U CN 204808363 U CN204808363 U CN 204808363U CN 201390000913 U CN201390000913 U CN 201390000913U CN 204808363 U CN204808363 U CN 204808363U
- Authority
- CN
- China
- Prior art keywords
- fingerprint sensor
- support
- detecting part
- sensor module
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Dispersion Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Manufacturing & Machinery (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0131704 | 2012-11-20 | ||
KR20120131704 | 2012-11-20 | ||
KR10-2012-0148555 | 2012-12-18 | ||
KR20120148555 | 2012-12-18 | ||
KR10-2013-0037107 | 2013-04-04 | ||
KR1020130037107A KR20140079254A (ko) | 2012-12-18 | 2013-04-04 | 지문센서 패키지 및 그 제조방법 |
PCT/KR2013/010590 WO2014081203A1 (ko) | 2012-11-20 | 2013-11-20 | 지문센서 모듈, 이를 구비한 휴대용 전자기기 및 그 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204808363U true CN204808363U (zh) | 2015-11-25 |
Family
ID=54265308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201390000913.2U Expired - Fee Related CN204808363U (zh) | 2012-11-20 | 2013-11-20 | 指纹传感器模块、具有此的便携式电子设备 |
Country Status (2)
Country | Link |
---|---|
US (2) | US9443126B2 (zh) |
CN (1) | CN204808363U (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106022253A (zh) * | 2016-05-17 | 2016-10-12 | 深圳天珑无线科技有限公司 | 移动终端及其指纹模组 |
CN107016328A (zh) * | 2015-12-31 | 2017-08-04 | 速博思股份有限公司 | 指纹辨识装置 |
CN107545231A (zh) * | 2016-06-27 | 2018-01-05 | 速博思股份有限公司 | 指纹识别装置及其制作方法 |
CN108334226A (zh) * | 2016-08-16 | 2018-07-27 | 广东欧珀移动通信有限公司 | 装饰圈及终端 |
CN110298215A (zh) * | 2018-03-23 | 2019-10-01 | 致伸科技股份有限公司 | 组装指纹辨识模块的方法 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150029259A (ko) * | 2013-09-09 | 2015-03-18 | 삼성전자주식회사 | 전자 장치의 입력장치 |
US20150091588A1 (en) * | 2013-10-01 | 2015-04-02 | Synaptics Incorporated | Compact and durable button with biometric sensor having improved sensor signal production and method for making same |
TWM491216U (zh) * | 2014-08-25 | 2014-12-01 | Superc Touch Corp | 具高正確性指紋辨識之行動裝置 |
CN105512634B (zh) * | 2015-12-14 | 2019-01-15 | 联想(北京)有限公司 | 一种感应装置以及一种电子设备 |
US9904776B2 (en) * | 2016-02-10 | 2018-02-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fingerprint sensor pixel array and methods of forming same |
KR101796660B1 (ko) | 2016-04-19 | 2017-11-10 | 삼성전자주식회사 | 지문 인식 기능을 지원하는 전자 장치 및 이의 운용 방법 |
WO2017201755A1 (zh) * | 2016-05-27 | 2017-11-30 | 华为技术有限公司 | 指纹模组及电子设备 |
US10037453B2 (en) * | 2016-08-26 | 2018-07-31 | Wu-Hsu Lin | Capacitive fingerprint sensing module |
KR102603448B1 (ko) * | 2017-02-02 | 2023-11-17 | 엘지전자 주식회사 | 키모듈 및 이를 포함하는 이동 단말기 |
TWI642158B (zh) * | 2017-07-21 | 2018-11-21 | 致伸科技股份有限公司 | 指紋感測晶片封裝結構 |
TWI627720B (zh) * | 2017-08-25 | 2018-06-21 | 致伸科技股份有限公司 | 指紋感測晶片封裝結構 |
CN109697384A (zh) * | 2017-10-20 | 2019-04-30 | 南昌欧菲生物识别技术有限公司 | 指纹识别模组的制造方法、指纹识别模组和电子装置 |
SE1751447A1 (en) | 2017-11-24 | 2019-05-25 | Fingerprint Cards Ab | Cost-efficient fingerprint sensor component and manufacturing method |
TWI663551B (zh) * | 2018-03-23 | 2019-06-21 | 致伸科技股份有限公司 | 組裝指紋辨識模組之方法 |
WO2019211941A1 (ja) * | 2018-05-01 | 2019-11-07 | 株式会社村田製作所 | 電子デバイスおよびそれを搭載した指紋認証装置 |
EP3836010B1 (en) | 2019-12-12 | 2024-07-24 | Fingerprint Cards Anacatum IP AB | A biometric sensor module for card integration |
KR20210158459A (ko) * | 2020-06-23 | 2021-12-31 | 삼성디스플레이 주식회사 | 표시 장치 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020075087A (ko) | 2001-03-23 | 2002-10-04 | 엘지전자 주식회사 | 영상표시장치의 지문인식 센서 고정구조 |
JP3766034B2 (ja) | 2002-02-20 | 2006-04-12 | 富士通株式会社 | 指紋センサ装置及びその製造方法 |
US8358816B2 (en) * | 2005-10-18 | 2013-01-22 | Authentec, Inc. | Thinned finger sensor and associated methods |
JP2010122015A (ja) | 2008-11-18 | 2010-06-03 | Fujitsu Ltd | センサユニット及び電子装置の製造方法 |
GB2489100A (en) | 2011-03-16 | 2012-09-19 | Validity Sensors Inc | Wafer-level packaging for a fingerprint sensor |
US9152838B2 (en) | 2012-03-29 | 2015-10-06 | Synaptics Incorporated | Fingerprint sensor packagings and methods |
-
2013
- 2013-11-20 CN CN201390000913.2U patent/CN204808363U/zh not_active Expired - Fee Related
- 2013-11-20 US US14/443,886 patent/US9443126B2/en active Active
-
2016
- 2016-08-09 US US15/232,792 patent/US9552508B2/en active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107016328A (zh) * | 2015-12-31 | 2017-08-04 | 速博思股份有限公司 | 指纹辨识装置 |
CN107016328B (zh) * | 2015-12-31 | 2020-07-21 | 速博思股份有限公司 | 指纹辨识装置 |
CN106022253A (zh) * | 2016-05-17 | 2016-10-12 | 深圳天珑无线科技有限公司 | 移动终端及其指纹模组 |
CN107545231A (zh) * | 2016-06-27 | 2018-01-05 | 速博思股份有限公司 | 指纹识别装置及其制作方法 |
CN108334226A (zh) * | 2016-08-16 | 2018-07-27 | 广东欧珀移动通信有限公司 | 装饰圈及终端 |
CN110298215A (zh) * | 2018-03-23 | 2019-10-01 | 致伸科技股份有限公司 | 组装指纹辨识模块的方法 |
Also Published As
Publication number | Publication date |
---|---|
US20150294135A1 (en) | 2015-10-15 |
US9443126B2 (en) | 2016-09-13 |
US20160350575A1 (en) | 2016-12-01 |
US9552508B2 (en) | 2017-01-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160203 Address after: Seoul, South Korea Patentee after: Korea Industrial Bank Address before: Chungnam Asan City, South Korea Patentee before: CRUCIALTEC CO LTD |
|
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: CRUCIALTEC CO LTD Assignor: Korea Industrial Bank Contract record no.: 2016990000429 Denomination of utility model: Fingerprint sensor module, has this portable electronic equipment Granted publication date: 20151125 License type: Exclusive License Record date: 20161013 |
|
LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190114 Address after: Gyeonggi Do city of South Korea Patentee after: CRUCIALTEC CO LTD Address before: Seoul, South Korea Patentee before: Korea Industrial Bank |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151125 Termination date: 20191120 |