CN204806338U - Optics is light source circuit for fingerprint identification - Google Patents
Optics is light source circuit for fingerprint identification Download PDFInfo
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- CN204806338U CN204806338U CN201520524066.0U CN201520524066U CN204806338U CN 204806338 U CN204806338 U CN 204806338U CN 201520524066 U CN201520524066 U CN 201520524066U CN 204806338 U CN204806338 U CN 204806338U
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- plastic rectangular
- annular
- rectangular substrate
- substrate frame
- metal line
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Abstract
The utility model discloses an optics is light source circuit for fingerprint identification, including plastic rectangular base plate frame and a plurality of LED emitting diode, the central regional fretwork district that is of plastic rectangular base plate frame, this plastic rectangular base plate frame lower surface outside -in set gradually along the annular positive pole metal line and the annular negative pole metal wire of circumference distribution, and plastic rectangular base plate frame upper surface leans on the marginal zone in the outside to be provided with a plurality of positive pole metal solder joint along circumference, and plastic rectangular base plate frame upper surface leans on inboard marginal zone to follow circumference and is provided with a plurality of negative pole metal solder joint, LED emitting diode just, the negative pole respectively with positive pole metal solder joint, negative pole metal electrical connection of solder joint, annular positive pole metal line and annular negative pole metal wire are from up constituteing by titanium copper layering, the electrically conductive layering of copper and the electrically conductive layering stack of tin down. The utility model discloses guarantee that the illumination intensity who accepts equal around the fingerprint chip, further improve the precision of biological identification module discernment, and reduced the response time of device.
Description
Technical field
The utility model relates to a kind of optical finger print identification circuit of light sources, belongs to technical field of semiconductor encapsulation.
Background technology
Along with the development of development of Mobile Internet technology, security issues become increasingly urgent for mobile Internet terminal user identification information, because identity identification information is stolen and personation and cause the situation of user's economic loss to appear in the newspapers repeatly end.Conventional password formula identification scheme, also exists the problems such as the low and complex operation of low, the consuming time length of efficiency, security, gradually becomes the short slab problem that the development of current development of Mobile Internet technology is universal.Fingerprint identification technology as the unique biological characteristic of user can solve the problem effectively.
For the design of the circuit of light sources of this kind of optical finger print identification, before biological field, the design of relevant source circuit can not followed.
Summary of the invention
The utility model object is to provide a kind of optical finger print identification circuit of light sources, this optical finger print identification circuit of light sources ensures that the intensity of illumination that fingerprint chip surrounding receives is equal, the precision of further raising bio-identification module identification, and reduce the response time of device.
For achieving the above object, the technical solution adopted in the utility model is: a kind of optical finger print identification circuit of light sources, comprise plastic rectangular substrate frame and several LED light emitting diodes, described plastic rectangular substrate frame middle section is vacancy section, this plastic rectangular substrate frame lower surface ecto-entad is disposed with the annular cathode metal line and annular negative metal line that circumferentially distribute, described plastic rectangular substrate frame upper surface marginal zone in the outer part is circumferentially provided with several cathode metal solder joints, described plastic rectangular substrate frame upper surface marginal zone in the inner part is circumferentially provided with several negative metal solder joints,
Distribution is provided with the first through hole between the cathode metal solder joint and annular cathode metal line of plastic rectangular substrate frame upper surface, lower surface, the first metallic conduction post is filled with in this first through hole, distribution is provided with the second through hole between the negative metal solder joint and annular negative metal line of plastic rectangular substrate frame upper surface, lower surface, be filled with the second metallic conduction post in this second through hole, the positive and negative electrode of described LED light emitting diode is electrically connected with cathode metal solder joint, negative metal solder joint respectively;
Described annular cathode metal line and annular negative metal line are from the bottom up by titanium copper layering, copper conduction layering and tin conduction layering superposition composition.
In technique scheme, further improved plan is as follows:
1., in such scheme, the LED light emitting diode number on the described upper and lower limit of plastic rectangular substrate frame is equal.
2., in such scheme, the LED light emitting diode number on the described left and right limit of plastic rectangular substrate frame is equal.
3., in such scheme, described LED light emitting diode number is 4 ~ 20.
4., in such scheme, the diameter of described first through hole, the second through hole is 30 ~ 200 μm.
5., in such scheme, it is 1:0.8 ~ 1.2 that the conduction layering of described copper and tin conduct electricity the Thickness Ratio of layering.
6., in such scheme, the live width of described annular cathode metal line and annular negative metal line is 150 μm ~ 300 μm.
Because technique scheme is used, the utility model compared with prior art has following advantages and effect:
1. the utility model optical finger print identification circuit of light sources, its mode being used in through hole on plastic rectangular substrate carries out being electrically connected the thickness effectively reducing circuit of light sources, this circuit carries out wiring and improves substrate utilization rate and reduce substrate area, because this design greatly reduces the volume of fingerprint recognition circuit of light sources on plastic rectangular substrate two sides; Secondly, its annular cathode metal line and annular negative metal line alleviate stress by titanium copper layering, copper conduction layering and tin conduction layering superposition composition from the bottom up, and reliability is high, in exposed environments, not easily oxidized corrosion, stable chemical nature is good, and reduces the response time of device.
2. the utility model optical finger print identification circuit of light sources, LED light emitting diode number on its upper and lower limit of plastic rectangular substrate frame is equal, LED light emitting diode number on the left and right limit of plastic rectangular substrate frame is equal, the LED number of up and down, left and right is equal, and reserved pad is structurally symmetrical, ensure that the intensity of illumination that fingerprint chip surrounding receives is equal, improve the precision of bio-identification module identification further.
Accompanying drawing explanation
Accompanying drawing 1 is the main TV structure schematic diagram of the utility model optical finger print identification circuit of light sources;
What accompanying drawing 2 was accompanying drawing 1 looks up structural representation;
Accompanying drawing 3 is the A-A cross-sectional view of accompanying drawing 2;
Accompanying drawing 4 is the utility model annular negative metal line structure schematic diagram.
In above accompanying drawing: 1, plastic rectangular substrate frame; 2, LED light emitting diode; 3, vacancy section; 4, annular cathode metal line; 5, annular negative metal line; 6, cathode metal solder joint; 7, negative metal solder joint; 8, the first through hole; 9, the first metallic conduction post; 10, the second through hole; 11, the second metallic conduction post; 12, titanium copper layering; 13, copper conduction layering; 14, tin conduction layering.
Detailed description of the invention
Below in conjunction with embodiment, the utility model is further described:
Embodiment 1: a kind of optical finger print identification circuit of light sources, comprise plastic rectangular substrate frame 1 and several LED light emitting diodes 2, described plastic rectangular substrate frame 1 middle section is vacancy section 3, this plastic rectangular substrate frame 1 lower surface ecto-entad is disposed with the annular cathode metal line 4 and annular negative metal line 5 that circumferentially distribute, described plastic rectangular substrate frame 1 upper surface marginal zone in the outer part is circumferentially provided with several cathode metal solder joints 6, and described plastic rectangular substrate frame 1 upper surface marginal zone in the inner part is circumferentially provided with several negative metal solder joints 7;
Distribution is provided with the first through hole 8 between the cathode metal solder joint 6 and annular cathode metal line 4 of plastic rectangular substrate frame 1 upper surface, lower surface, the first metallic conduction post 9 is filled with in this first through hole 8, distribution is provided with the second through hole 10 between the negative metal solder joint 7 and annular negative metal line 5 of plastic rectangular substrate frame 1 upper surface, lower surface, be filled with the second metallic conduction post 11 in this second through hole 10, the positive and negative electrode of described LED light emitting diode 2 is electrically connected with cathode metal solder joint 6, negative metal solder joint 7 respectively;
Described annular cathode metal line 4 and annular negative metal line 5 superpose composition by titanium copper layering 12, copper conduction layering 13 and the layering 14 of tin conduction from the bottom up.
LED light emitting diode 2 number on the above-mentioned upper and lower limit of plastic rectangular substrate frame 1 is equal.
LED light emitting diode 2 number on the above-mentioned left and right limit of plastic rectangular substrate frame 1 is equal.
Above-mentioned LED light emitting diode 2 number is 8; It is 1:1 that described copper conduction layering 13 and tin conduct electricity the Thickness Ratio of layering 14.
The diameter of above-mentioned first through hole 8, second through hole 10 is 100 μm, utilizes LDS laser boring and changes coating technology, becoming the connection via of positive and negative circuit.
Above-mentioned annular cathode metal line 4 and annular negative metal line 5 utilize LDS precision processing technology, and line width is 220 μm.
Embodiment 2: a kind of optical finger print identification circuit of light sources, comprise plastic rectangular substrate frame 1 and several LED light emitting diodes 2, described plastic rectangular substrate frame 1 middle section is vacancy section 3, this plastic rectangular substrate frame 1 lower surface ecto-entad is disposed with the annular cathode metal line 4 and annular negative metal line 5 that circumferentially distribute, described plastic rectangular substrate frame 1 upper surface marginal zone in the outer part is circumferentially provided with several cathode metal solder joints 6, and described plastic rectangular substrate frame 1 upper surface marginal zone in the inner part is circumferentially provided with several negative metal solder joints 7;
Distribution is provided with the first through hole 8 between the cathode metal solder joint 6 and annular cathode metal line 4 of plastic rectangular substrate frame 1 upper surface, lower surface, the first metallic conduction post 9 is filled with in this first through hole 8, distribution is provided with the second through hole 10 between the negative metal solder joint 7 and annular negative metal line 5 of plastic rectangular substrate frame 1 upper surface, lower surface, be filled with the second metallic conduction post 11 in this second through hole 10, the positive and negative electrode of described LED light emitting diode 2 is electrically connected with cathode metal solder joint 6, negative metal solder joint 7 respectively;
Described annular cathode metal line 4 and annular negative metal line 5 superpose composition by titanium copper layering 12, copper conduction layering 13 and the layering 14 of tin conduction from the bottom up.
LED light emitting diode 2 number on the above-mentioned upper and lower limit of plastic rectangular substrate frame 1 is equal.
LED light emitting diode 2 number on the above-mentioned left and right limit of plastic rectangular substrate frame 1 is equal.
Above-mentioned LED light emitting diode 2 number is 14; It is 1:0.8 that described copper conduction layering 13 and tin conduct electricity the Thickness Ratio of layering 14.
The diameter of above-mentioned first through hole 8, second through hole 10 is 160 μm, utilizes LDS laser boring and changes coating technology, becoming the connection via of positive and negative circuit.
Above-mentioned annular cathode metal line 4 and annular negative metal line 5 utilize LDS precision processing technology, and line width is 180 μm.
When adopting above-mentioned novel optical fingerprint recognition circuit of light sources, its mode being used in through hole on plastic rectangular substrate carries out being electrically connected the thickness effectively reducing circuit of light sources, this circuit carries out wiring and improves substrate utilization rate and reduce substrate area, because this design greatly reduces the volume of fingerprint recognition circuit of light sources on plastic rectangular substrate two sides; Secondly, its annular cathode metal line and annular negative metal line alleviate stress by titanium copper layering, copper conduction layering and tin conduction layering superposition composition from the bottom up, and reliability is high, in exposed environments, not easily oxidized corrosion, stable chemical nature is good, and reduces the response time of device; Again, LED light emitting diode number on its upper and lower limit of plastic rectangular substrate frame is equal, LED light emitting diode number on the left and right limit of plastic rectangular substrate frame is equal, the LED number of up and down, left and right is equal, and reserved pad is structurally symmetrical, ensure that the intensity of illumination that fingerprint chip surrounding receives is equal, improve the precision of bio-identification module identification further.
Above-described embodiment, only for technical conceive of the present utility model and feature are described, its object is to person skilled in the art can be understood content of the present utility model and implement according to this, can not limit protection domain of the present utility model with this.All equivalences done according to the utility model Spirit Essence change or modify, and all should be encompassed within protection domain of the present utility model.
Claims (7)
1. an optical finger print identification circuit of light sources, it is characterized in that: comprise plastic rectangular substrate frame (1) and several LED light emitting diodes (2), described plastic rectangular substrate frame (1) middle section is vacancy section (3), this plastic rectangular substrate frame (1) lower surface ecto-entad is disposed with the annular cathode metal line (4) and annular negative metal line (5) that circumferentially distribute, described plastic rectangular substrate frame (1) upper surface marginal zone in the outer part is circumferentially provided with several cathode metal solder joints (6), described plastic rectangular substrate frame (1) upper surface marginal zone in the inner part is circumferentially provided with several negative metal solder joints (7),
Distribution is positioned at plastic rectangular substrate frame (1) upper surface, the first through hole (8) is provided with between the cathode metal solder joint (6) of lower surface and annular cathode metal line (4), the first metallic conduction post (9) is filled with in this first through hole (8), distribution is positioned at plastic rectangular substrate frame (1) upper surface, the second through hole (10) is provided with between the negative metal solder joint (7) of lower surface and annular negative metal line (5), the second metallic conduction post (11) is filled with in this second through hole (10), described LED light emitting diode (2) just, negative pole respectively with cathode metal solder joint (6), negative metal solder joint (7) is electrically connected,
Described annular cathode metal line (4) and annular negative metal line (5) are from the bottom up by titanium copper layering (12), copper conduction layering (13) and tin conduction layering (14) superposition composition.
2. optical finger print identification circuit of light sources according to claim 1, is characterized in that: LED light emitting diode (2) number on the upper and lower limit of described plastic rectangular substrate frame (1) is equal.
3. optical finger print identification circuit of light sources according to claim 1, is characterized in that: LED light emitting diode (2) number on the left and right limit of described plastic rectangular substrate frame (1) is equal.
4. optical finger print identification circuit of light sources according to claim 1, is characterized in that: described LED light emitting diode (2) number is 4 ~ 20.
5. optical finger print identification circuit of light sources according to claim 1, is characterized in that: the diameter of described first through hole (8), the second through hole (10) is 80 ~ 200 μm.
6. optical finger print identification circuit of light sources according to claim 1, is characterized in that: the live width of described annular cathode metal line (4) and annular negative metal line (5) is 150 μm ~ 300 μm.
7. optical finger print identification circuit of light sources according to claim 1, is characterized in that: it is 1:0.8 ~ 1.2 that described copper conduction layering (13) and tin conduct electricity the Thickness Ratio of layering (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520524066.0U CN204806338U (en) | 2015-07-17 | 2015-07-17 | Optics is light source circuit for fingerprint identification |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520524066.0U CN204806338U (en) | 2015-07-17 | 2015-07-17 | Optics is light source circuit for fingerprint identification |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204806338U true CN204806338U (en) | 2015-11-25 |
Family
ID=54591157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520524066.0U Expired - Fee Related CN204806338U (en) | 2015-07-17 | 2015-07-17 | Optics is light source circuit for fingerprint identification |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204806338U (en) |
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2015
- 2015-07-17 CN CN201520524066.0U patent/CN204806338U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151125 Termination date: 20160717 |