CN204795900U - Electronic components - Google Patents

Electronic components Download PDF

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Publication number
CN204795900U
CN204795900U CN201520560763.1U CN201520560763U CN204795900U CN 204795900 U CN204795900 U CN 204795900U CN 201520560763 U CN201520560763 U CN 201520560763U CN 204795900 U CN204795900 U CN 204795900U
Authority
CN
China
Prior art keywords
pin
stage
sleeve
circuit board
electronic devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520560763.1U
Other languages
Chinese (zh)
Inventor
黄静芬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Jvsion Technology Co Ltd
Original Assignee
Suzhou Jvsion Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Jvsion Technology Co Ltd filed Critical Suzhou Jvsion Technology Co Ltd
Priority to CN201520560763.1U priority Critical patent/CN204795900U/en
Application granted granted Critical
Publication of CN204795900U publication Critical patent/CN204795900U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses an electronic components, including electronic components body, pin, casing, the pin includes the pin first stage and pin second stage, just the pin second stage is kept away from one end and the welding of circuit board of the pin first stage, its characterized in that: in the pin second stage with contact department of circuit board is provided with the location pit, just the degree of depth of location pit does 13 of pin second stage diameter, the build -up welding has the solder in the pit of location, location pit position department is provided with the welding and is in in the pin second stage the pin second stage with fixed cover on the circuit board. Through set up the location pit on pin and circuit board welded tip, utilize the location pit to realize the accurate positioning of pin and circuit board, catch build -up welding solder in the pit of location, realize pin and circuit board full weld, to catch and set up fixed cover on the pin of fixing a position pit position department, the realization pin is connected with the reliable of circuit board.

Description

A kind of electronic devices and components
Technical field
The utility model relates to a kind of electronic devices and components, the reliable electronic devices and components of especially a kind of bonding strength.
Background technology
Electronic devices and components are parts of the small-sized machine of electronic component and electricity, instrument, and itself is often made up of some parts, can be general in like product; Some part of the industry such as normal finger electrical equipment, radio, instrument, as the general name of the sub-devices such as electric capacity, transistor, hairspring, clockwork spring.Common are diode etc.The encapsulation of traditional electronics unit device is mainly welded on circuit board by the pin be connected with electronic devices and components, but when producing operation in batches, because pin is comparatively tiny, just probably there is the problem of pin and circuit board rosin joint, in addition under operating mode rugged environment, also likely cause welding good pin and occur sealing-off phenomenon, occasion very frequently as very large in vibrations, therefore studies a kind of bonding strength reliable electric motor element device necessary.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of electronic devices and components, has the reliable feature of bonding strength.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of electronic devices and components, comprise electronic devices and components body, the pin be connected with described electronic devices and components body, cover the housing of described electronic devices and components body, described pin comprises pin first stage and pin second stage, the described pin first stage is positioned at described housing, described pin second stage is positioned at outside described housing, and described pin second stage is away from one end of described pin first stage and welding circuit board, its innovative point is: described pin second stage is provided with location dimples with described circuit board contacts place, and the degree of depth of described location dimples is 1/3 of described pin second stage diameter, in described location dimples, heap is welded with solder, in described pin second stage, location dimples position is provided with the fixed cover be welded on described pin second stage and described circuit board.
Preferably, the height of described fixed cover is 1/5 ~ 1/3 of described pin second stage height.
Preferably, described pin second stage is provided with on one end of described body contact the abutment sleeve welded on the housing.
Preferably, described abutment sleeve is several sleeve composition, comprise weld with described fixed cover with the first sleeve of described case weld the second sleeve, be arranged on intermediate sleeve between described first sleeve and described second sleeve, described intermediate sleeve is fastened on described first sleeve and described second sleeve respectively.
Preferably, several described intermediate sleeve is provided with between described first sleeve and described second sleeve.
Preferably, the first sleeve ends described first sleeve welded with described fixed cover and described fixed cover arc transition.
The utility model has the advantage of: by arranging location dimples on the end of pin and welding circuit board, location dimples is utilized to realize the accurate location of pin and circuit board, then built-up welding solder in location dimples, realize pin and circuit board full weld, then fixed cover is set on the pin of location dimples position, realizes pin and be connected with the reliable of circuit board.
The end of pin and body contact arranges the abutment sleeve with case weld, and abutment sleeve weld with fixed cover, thus realizes housing and form one with pin and circuit and be connected reliable entirety, meets the normal work under complex working condition.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Fig. 1 is the structural representation of a kind of electronic devices and components of the utility model.
In figure: 1-electronic devices and components body, 2-pin, 21-pin first stage, 22-pin second stage, 23-location dimples, 3-housing, 4-abutment sleeve, 41-first sleeve, 42-second sleeve, 43-intermediate sleeve, 5-fixed cover.
Embodiment
Electronic devices and components of the present utility model, comprise electronic devices and components body 1, the pin 2 be connected with electronic devices and components body 1, the housing 3 that covers electronic devices and components body 1, pin 2 comprises pin first stage 21 and pin second stage 22, the pin first stage 21 is positioned at housing 3, pin second stage 22 is positioned at outside housing 3, and pin second stage 22 is away from one end of pin first stage 21 and welding circuit board.Pin second stage 22 is provided with location dimples 23 with circuit board contacts place, and the degree of depth of location dimples 23 is 1/3 of pin second stage 22 diameter, in location dimples 23, heap is welded with solder, and in pin second stage 22, location dimples 23 position is provided with the fixed cover 5 be welded on pin second stage 22 and circuit board.By arranging location dimples 23 on pin 2 with the end of welding circuit board, location dimples 23 is utilized to realize the accurate location of pin 2 and circuit board, then built-up welding solder in location dimples 23, realize pin 2 and circuit board full weld, then fixed cover 5 is set on the pin 2 of location dimples 23 position, realizes pin 2 and be connected with the reliable of circuit board.
The height notional result of above-mentioned fixed cover 5 shows, when the height of fixed cover 5 is 1/5 ~ 1/3 of pin second stage 22 height, effect reaches best.
In order to meet the normal work under complex working condition, one end that pin second stage 22 contacts with housing 3 is provided with the abutment sleeve 4 be welded on housing 3.Wherein abutment sleeve 4 is several sleeve composition, comprise the second sleeve 42 that the first sleeve 41 of welding with housing 3 welds with fixed cover 5, be arranged on intermediate sleeve 43 between the first sleeve 41 and the second sleeve 42, intermediate sleeve 43 is fastened on the first sleeve 41 and the second sleeve 42 respectively, the first sleeve 41 end that several intermediate sleeve 43, first sleeve 41 welds with fixed cover 5 and fixed cover 5 arc transition is provided with between first sleeve 41 and the second sleeve 42.The abutment sleeve 4 welded with housing 3 is set by the end contacted with housing 3 by pin 2, and abutment sleeve 4 welds with fixed cover 5, thus realizes housing 3 and pin 2 and circuit and form one and be connected overall reliably, meet the normal work under complex working condition.
Finally it should be noted that, above embodiment is only in order to illustrate technical scheme of the present invention and non-limiting technical scheme, those of ordinary skill in the art is to be understood that, those are modified to technical scheme of the present invention or equivalent replacement, and do not depart from aim and the scope of the technical program, all should be encompassed in the middle of right of the present invention.

Claims (6)

1. electronic devices and components, comprise electronic devices and components body, the pin be connected with described electronic devices and components body, cover the housing of described electronic devices and components body, described pin comprises pin first stage and pin second stage, the described pin first stage is positioned at described housing, described pin second stage is positioned at outside described housing, and described pin second stage is away from one end of described pin first stage and welding circuit board, it is characterized in that: described pin second stage is provided with location dimples with described circuit board contacts place, and the degree of depth of described location dimples is 1/3 of described pin second stage diameter, in described location dimples, heap is welded with solder, in described pin second stage, location dimples position is provided with the fixed cover be welded on described pin second stage and described circuit board.
2. a kind of electronic devices and components as claimed in claim 1, is characterized in that: the height of described fixed cover is 1/5 ~ 1/3 of described pin second stage height.
3. a kind of electronic devices and components as claimed in claim 1, is characterized in that: be provided with the abutment sleeve welded on the housing in described pin second stage with on one end of described body contact.
4. a kind of electronic devices and components as claimed in claim 1, it is characterized in that: described abutment sleeve is several sleeve composition, comprise weld with described fixed cover with the first sleeve of described case weld the second sleeve, be arranged on intermediate sleeve between described first sleeve and described second sleeve, described intermediate sleeve is fastened on described first sleeve and described second sleeve respectively.
5. a kind of electronic devices and components as claimed in claim 4, is characterized in that: be provided with several described intermediate sleeve between described first sleeve and described second sleeve.
6. a kind of electronic devices and components as claimed in claim 4, is characterized in that: the first sleeve ends that described first sleeve welds with described fixed cover and described fixed cover arc transition.
CN201520560763.1U 2015-07-30 2015-07-30 Electronic components Expired - Fee Related CN204795900U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520560763.1U CN204795900U (en) 2015-07-30 2015-07-30 Electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520560763.1U CN204795900U (en) 2015-07-30 2015-07-30 Electronic components

Publications (1)

Publication Number Publication Date
CN204795900U true CN204795900U (en) 2015-11-18

Family

ID=54535857

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520560763.1U Expired - Fee Related CN204795900U (en) 2015-07-30 2015-07-30 Electronic components

Country Status (1)

Country Link
CN (1) CN204795900U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105007694A (en) * 2015-07-30 2015-10-28 苏州佳像视讯科技有限公司 Electronic component
CN110769623A (en) * 2019-11-07 2020-02-07 徐州陀微传感科技有限公司 Mounting structure of electronic component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105007694A (en) * 2015-07-30 2015-10-28 苏州佳像视讯科技有限公司 Electronic component
CN110769623A (en) * 2019-11-07 2020-02-07 徐州陀微传感科技有限公司 Mounting structure of electronic component

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20151118

Termination date: 20160730

CF01 Termination of patent right due to non-payment of annual fee