CN204761829U - Structure of perpendicular interconnection of radio frequency circuit is realized to multiply wood - Google Patents
Structure of perpendicular interconnection of radio frequency circuit is realized to multiply wood Download PDFInfo
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- CN204761829U CN204761829U CN201520439285.9U CN201520439285U CN204761829U CN 204761829 U CN204761829 U CN 204761829U CN 201520439285 U CN201520439285 U CN 201520439285U CN 204761829 U CN204761829 U CN 204761829U
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Abstract
The utility model discloses a structure of perpendicular interconnection of radio frequency circuit is realized to multiply wood, including 6 layer at least circuit boards, radio frequency microwave device is installed respectively to the top layer of 6 layers of circuit board and bottom, 6 layer circuit board from top layer downward branch maybe top layer radio frequency microwave device ground plane, top layer radio frequency microwave device signal control layer, bottom radio frequency microwave device signal control layer, bottom radio frequency microwave device ground plane, top layer radio frequency microwave device is connected through a metallic interconnect transitional pore with bottom radio frequency microwave device transmission line, centers on the metallic interconnect transitional pore is provided with metal ground connection transitional pore. The utility model discloses simple structure easily realizes, can support the high frequency, the high -speed transmission.
Description
Technical field
The utility model relates to pcb board circuit structure, and particularly a kind of multi-layer sheet realizes the structure of radio circuit vertical interconnect.
Background technology
For in the actual use of frequency microwave printed board, we many times encounter a printed board and can't resolve all problems, at this time just need the printed board of more than two, and often need wherein radio frequency or microwave signal carry out vertical interconnect in these printed boards, current frequency microwave matrix mainly adopts cable, insulator, the connections such as connector, and for the increase of the frequency microwave number of signals along with vertical interconnect, these traditional vertical interconnect modes seem and connect complexity, volume is large, many unfavorable factors such as assembling difficulty, along with frequency increases, especially tradition these vertical interconnect modes or cannot use, or require stricter, cost is more increased, volume is larger, interconnected more loaded down with trivial details.
Summary of the invention
The purpose of this utility model is to provide a kind of multi-layer sheet to realize the structure of radio circuit vertical interconnect, connects transitional pore and realize multi-layer RF circuit board vertical interconnect around being provided with metallic ground transitional pore described metal transfer hole circle week by a metal.
To achieve these goals, scheme of the present utility model is: a kind of multi-layer sheet realizes the structure of radio circuit vertical interconnect, comprise at least 6 sandwich circuit boards, the top layer of 6 sandwich circuit boards and bottom are separately installed with frequency microwave device, wherein, between described 6 sandwich circuit board top layers and bottom from top layer be downwards top layer frequency microwave device ground layer respectively, top layer frequency microwave device signal key-course, bottom frequency microwave device signal key-course, bottom frequency microwave device ground layer, described top layer frequency microwave device and bottom frequency microwave device transmission line are connected transitional pore by a metal to connect, connect transitional pore around described metal and be provided with metallic ground transitional pore.
Scheme is further: described ground connection is connecting line top layer frequency microwave device ground layer and bottom frequency microwave device ground layer.
Scheme is further: described metal connects transitional pore parameter by formula
determine, wherein: Z
0for impedance,
for pcb board material electric medium constant, D be connect transitional pore overall diameter, d is the interior diameter that D subtracts copper facing thickness.
Scheme is further: described impedance Z
0be 50 ohm, it is 0.3mm to 0.4mm that described metal connects transitional pore overall diameter D.
Scheme is further: described metallic ground transitional pore diameter is 0.3mm to 0.4mm, and metallic ground transitional pore distance metal connects transitional pore Edge Distance and is not more than 5mm.
The beneficial effects of the utility model are: structure is simple, are easy to realize, can support high frequency, high-speed transfer.
Below in conjunction with drawings and Examples, the utility model is described in detail.
Accompanying drawing explanation
Fig. 1 the utility model structural profile schematic diagram;
Fig. 2 the utility model structural plan schematic diagram.
Embodiment
A kind of multi-layer sheet realizes the structure of radio circuit vertical interconnect, comprise at least 6 sandwich circuit boards, top layer 1 and the bottom 2 of 6 sandwich circuit boards are separately installed with frequency microwave device 3, wherein, between described 6 sandwich circuit board top layers and bottom from top layer be downwards top layer frequency microwave device ground layer 4 respectively, top layer frequency microwave device signal key-course 5, bottom frequency microwave device signal key-course 6, bottom frequency microwave device ground layer 7, described top layer frequency microwave device and bottom frequency microwave device transmission line are connected transitional pore 8 by a metal to connect, connect transitional pore circumference around described metal and be provided with metallic ground transitional pore 9.
In embodiment: described ground connection is connecting line top layer frequency microwave device ground layer and bottom frequency microwave device ground layer (line power negative pole).
Described metal in embodiment connects transitional pore parameter by formula
determine, wherein: Z
0for impedance,
for multi-layer sheet sheet material electric medium constant, D be connect transitional pore overall diameter, d is the interior diameter that D subtracts copper facing thickness.Electric medium constant wherein
be that constant can be found according to material in table always, usually need the multi-layer sheet sheet material selecting to be suitable for high-frequency transmission.
As a preferred version: described impedance Z
0be 50 ohm, it is 0.3mm to 0.4mm that described metal connects transitional pore overall diameter D.
In embodiment: described metallic ground transitional pore diameter is 0.3mm to 0.4mm, metallic ground transitional pore distance metal connects transitional pore Edge Distance and is not more than 5mm.
For multi-layer sheet coaxial transmission structure in embodiment, metal connects that transitional pore arranges should be The more the better, but considers practical wiring, the impacts such as processing technology, in the interference-free situation that should ensure to connect up, connects transitional pore periphery do as far as possible many ground holes at metal.
The multi-layer sheet of above-described embodiment realizes coaxial microwave transmission structure, uses the inner wire of through hole as coaxial line in suitable aperture, appropriate location, outer ring, do suitable aperture, some grounding through hole, can solve signal at microwave and millimeter wave, double-deck, multi-layer sheet different layers transmission problem.By the accurate TEM mould of multi-layer sheet transmission line, become the TEM mould of coaxial transmission, after degree to the TEM mould of transmission line, realize under pattern of the same race, minimal losses is transmitted.The highest frequency that selected printed board sheet material is supported, this kind of structure also can support this frequency in respective plates.
Claims (5)
1. a multi-layer sheet realizes the structure of radio circuit vertical interconnect, comprise at least 6 sandwich circuit boards, the top layer of 6 sandwich circuit boards and bottom are separately installed with frequency microwave device, it is characterized in that, between described 6 sandwich circuit board top layers and bottom from top layer be downwards top layer frequency microwave device ground layer respectively, top layer frequency microwave device signal key-course, bottom frequency microwave device signal key-course, bottom frequency microwave device ground layer, described top layer frequency microwave device and bottom frequency microwave device transmission line are connected transitional pore by a metal to connect, connect transitional pore around described metal and be provided with metallic ground transitional pore.
2. a kind of multi-layer sheet according to claim 1 realizes the structure of radio circuit vertical interconnect, it is characterized in that, described ground connection is connecting line top layer frequency microwave device ground layer and bottom frequency microwave device ground layer.
3. a kind of multi-layer sheet according to claim 1 realizes the structure of radio circuit vertical interconnect, it is characterized in that, described metal connects transitional pore parameter by formula
determine, wherein: Z
0for impedance,
for pcb board material electric medium constant, D be connect transitional pore overall diameter, d is the interior diameter that D subtracts copper facing thickness.
4. a kind of multi-layer sheet according to claim 3 realizes the structure of radio circuit vertical interconnect, it is characterized in that, described impedance Z
0be 50 ohm, it is 0.3mm to 0.4mm that described metal connects transitional pore overall diameter D.
5. a kind of multi-layer sheet according to claim 1 and 2 realizes the structure of radio circuit vertical interconnect, it is characterized in that, described metallic ground transitional pore diameter is 0.3mm to 0.4mm, and metallic ground transitional pore distance metal connects transitional pore Edge Distance and is not more than 5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520439285.9U CN204761829U (en) | 2015-06-25 | 2015-06-25 | Structure of perpendicular interconnection of radio frequency circuit is realized to multiply wood |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520439285.9U CN204761829U (en) | 2015-06-25 | 2015-06-25 | Structure of perpendicular interconnection of radio frequency circuit is realized to multiply wood |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204761829U true CN204761829U (en) | 2015-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520439285.9U Active CN204761829U (en) | 2015-06-25 | 2015-06-25 | Structure of perpendicular interconnection of radio frequency circuit is realized to multiply wood |
Country Status (1)
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108198788A (en) * | 2017-12-13 | 2018-06-22 | 深圳市时代速信科技有限公司 | A kind of ltcc substrate that transmission performance is vertically interconnected with firing frequency signal |
| CN109560382A (en) * | 2018-11-30 | 2019-04-02 | 惠州市德赛西威汽车电子股份有限公司 | A kind of structure improving MMW RADAR SIGNAL USING vertical interconnection performance |
| TWI665945B (en) * | 2017-11-20 | 2019-07-11 | Avary Holding (Shenzhen) Co., Limited. | Radio frequency printed circuit board and method for manufacturing the same |
| CN110459528A (en) * | 2019-07-25 | 2019-11-15 | 成都嘉纳海威科技有限责任公司 | A kind of New-type radio-frequency transmission structure |
| CN110808745A (en) * | 2019-09-16 | 2020-02-18 | 上海航天测控通信研究所 | Dual-channel transmitting assembly for phased array antenna of carrier rocket relay user terminal |
| CN111640682A (en) * | 2020-05-31 | 2020-09-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Gold wire bonding transition structure of separation device |
| CN112614813A (en) * | 2020-12-17 | 2021-04-06 | 中国电子科技集团公司第十三研究所 | Ultrahigh frequency surface-mounted ceramic vertical interconnection structure and packaging structure |
-
2015
- 2015-06-25 CN CN201520439285.9U patent/CN204761829U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI665945B (en) * | 2017-11-20 | 2019-07-11 | Avary Holding (Shenzhen) Co., Limited. | Radio frequency printed circuit board and method for manufacturing the same |
| CN108198788A (en) * | 2017-12-13 | 2018-06-22 | 深圳市时代速信科技有限公司 | A kind of ltcc substrate that transmission performance is vertically interconnected with firing frequency signal |
| CN109560382A (en) * | 2018-11-30 | 2019-04-02 | 惠州市德赛西威汽车电子股份有限公司 | A kind of structure improving MMW RADAR SIGNAL USING vertical interconnection performance |
| CN110459528A (en) * | 2019-07-25 | 2019-11-15 | 成都嘉纳海威科技有限责任公司 | A kind of New-type radio-frequency transmission structure |
| CN110808745A (en) * | 2019-09-16 | 2020-02-18 | 上海航天测控通信研究所 | Dual-channel transmitting assembly for phased array antenna of carrier rocket relay user terminal |
| CN110808745B (en) * | 2019-09-16 | 2021-07-02 | 上海航天测控通信研究所 | Dual-channel transmitting assembly for phased array antenna of carrier rocket relay user terminal |
| CN111640682A (en) * | 2020-05-31 | 2020-09-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Gold wire bonding transition structure of separation device |
| CN111640682B (en) * | 2020-05-31 | 2022-07-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Gold wire bonding transition structure of separation device |
| CN112614813A (en) * | 2020-12-17 | 2021-04-06 | 中国电子科技集团公司第十三研究所 | Ultrahigh frequency surface-mounted ceramic vertical interconnection structure and packaging structure |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |