CN207573696U - A kind of printed circuit board encapsulating structure of high-frequency SMA connectors - Google Patents
A kind of printed circuit board encapsulating structure of high-frequency SMA connectors Download PDFInfo
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- CN207573696U CN207573696U CN201721353793.0U CN201721353793U CN207573696U CN 207573696 U CN207573696 U CN 207573696U CN 201721353793 U CN201721353793 U CN 201721353793U CN 207573696 U CN207573696 U CN 207573696U
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- circuit board
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- conductive layer
- printed circuit
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Abstract
The utility model discloses a kind of printed circuit board encapsulating structure of high-frequency SMA connectors, including circuit board body and the conductive layer being arranged in circuit board body；Offer the signal via for being used for transmission signal on conductive layer, a diameter of 0.2mm of signal via is connected with the corresponding position of signal via through ontology signal via, ontology signal via is offered with signal via perforation in circuit board body；The position for being separated by the first pre-determined distance on conductive layer with signal via offers multiple ground hole, the pore size distribution of multiple ground is on the circumference using signal via as the center of circle, using the first pre-determined distance as radius, first pre-determined distance is 0.8mm, with the corresponding position in ground hole through noumenally hole is offered in circuit board body, noumenally hole is connected with the perforation of ground hole.The distance between ground hole and signal via shorten to 0.8mm so that three dB bandwidth can reach 60GHz；A diameter of 0.2mm of signal via, thereby may be ensured that the impedance of signal via.
Description
Technical field
The utility model belongs to circuit board technology field, more specifically, is related to a kind of high-frequency SMA connectors
Printed circuit board encapsulating structure.
Background technology
Printed circuit board (Printed Circuit Board, pcb board) is that the physics of electronic product is made and signal passes
Defeated important component.SMA type radio frequency (RF) coaxial connectors are to be widely used a kind of general radio frequency (RF) coaxial connector at present,
Superior performance, compact, connection are reliable.Wherein, the dismountable SMA connectors of vertical type due to placement location it is flexible, removable
Unload and low-cost characteristic and receive more and more attention.
The frequency that the printed circuit board encapsulating structure of current high-frequency SMA connectors is supported can only reach 30GHz or so,
And for the application of higher frequency, current printed circuit board encapsulating structure can not be supported.
More than it is insufficient, have much room for improvement.
Utility model content
The purpose of this utility model is to provide a kind of printed circuit board encapsulating structure of high-frequency SMA connectors, with
Signal of the frequency higher than 30GHz can not be supported by solving the printed circuit board encapsulating structure of existing high-frequency SMA connectors
Technical problem.
To achieve the above object, technical solutions of the utility model are as described below：
A kind of printed circuit board encapsulating structure of high-frequency SMA connectors including circuit board body and is arranged on described
Conductive layer in circuit board body；
Offer the signal via for being used for transmission signal on the conductive layer, in the circuit board body with the signal mistake
The corresponding position in hole, which is run through, offers ontology signal via, a diameter of 0.2mm of the signal via, the ontology signal mistake
Hole is connected with signal via perforation；
The position for being separated by the first pre-determined distance on the conductive layer with the signal via offers multiple ground hole, Duo Gesuo
Ground pore size distribution is stated on the circumference using the signal via as the center of circle, using first pre-determined distance as radius, described first is pre-
Run through if distance is 0.8mm, in the circuit board body with the corresponding position in described ground hole and offer noumenally hole, described
Body ground hole and described ground hole perforation connection.
Further, the quantity in described ground hole is seven, and the quantity in the noumenally hole mutually should be seven.
Further, seven described ground pore size distributions using the signal via as the center of circle, using first pre-determined distance as
On the circumference of radius.
Further, be further opened with the mounting hole passed through for screw on the conductive layer, the circuit board body with it is described
The corresponding position of mounting hole is also extended through equipped with ontology mounting hole, and the mounting hole is connected with ontology mounting hole perforation, institute
Conductive layer is stated to connect by the screw with the circuit board body.
Further, the quantity of the mounting hole is two, and two mounting holes are respectively distributed to the conductive layer
Both ends.
Further, the material of the conductive layer is copper.
A kind of advantageous effect of the printed circuit board encapsulating structure of high-frequency SMA connectors provided by the utility model exists
In：In the printed circuit board encapsulating structure of traditional high-frequency SMA connectors, in order to ensure the connector of SMA connectors
With the impedance of printed circuit board contact position, the distance between ground hole and signal via on printed circuit board are distant, usually
For 1.5mm, so as to cause the three dB bandwidth (frequency that the peak that three dB bandwidth is often referred to power spectral density defines when dropping to 1/2
Range) it can only achieve 30GHz；In printed circuit board encapsulating structure provided in this embodiment between hole 22 and signal via 21
Distance Shortened is to 0.8mm so that three dB bandwidth can reach 60GHz, so as to support the biography of signal of the frequency higher than 30GHz
It is defeated；A diameter of 0.2mm of signal via 21, thereby may be ensured that the impedance of signal via 21；Print provided in this embodiment simultaneously
Circuit board package structure processed is simple, does not increase cost additionally, does not also improve difficulty of processing.
Description of the drawings
Fig. 1 is the knot of the printed circuit board encapsulating structure of high-frequency SMA connectors that the utility model embodiment provides
Structure schematic diagram one；
Fig. 2 is the knot of the printed circuit board encapsulating structure of high-frequency SMA connectors that the utility model embodiment provides
Structure schematic diagram two.
Wherein, each reference numeral is as follows in figure：
1- circuit board bodies；11- ontology signal vias；12- noumenally holes；13- ontology mounting holes；
2- conductive layers；21- signal vias；22- ground hole；23- mounting holes.
Specific embodiment
Below in conjunction with the accompanying drawings and the utility model is further described in embodiment：
As shown in Figure 1 to Figure 2, a kind of printed circuit board encapsulating structure of high-frequency SMA connectors, including circuit board sheet
Body 1 and the conductive layer 2 being arranged in circuit board body 1；The signal via 21 for being used for transmission signal is offered on conductive layer 2, is believed
A diameter of 0.2mm of number via 21, with 21 corresponding position of signal via through offering ontology signal in circuit board body 1
Via 11, ontology signal via 11 are connected with the perforation of signal via 21；Be separated by conductive layer 2 with signal via 21 first it is default away from
From position offer multiple ground hole 22, multiple ground hole 22 is distributed in signal via 21 as the center of circle, using the first pre-determined distance as
On the circumference of radius, the first pre-determined distance is 0.8mm, runs through in circuit board body 1 with 2 corresponding position of ground hole and offers this
Body ground hole 12, noumenally hole 12 connected with the perforation of ground hole 22.Specifically, it offers to believe around signal via 21 on conductive layer 2
Number via 21 is the through-hole in the center of circle, so that signal via 21 is electrically isolated with the other parts on conductive layer 2.
The advantageous effect set in this way is：In the printed circuit board encapsulating structure of traditional high-frequency SMA connectors
In, in order to ensure the impedance of the connector of SMA connectors and printed circuit board contact position, ground hole and letter on printed circuit board
The distance between number via is distant, usually 1.5mm, and so as to cause three dB bandwidth, (three dB bandwidth is often referred to power spectral density
Peak drops to the frequency range defined when 1/2) it can only achieve 30GHz；Printed circuit board encapsulation knot provided in this embodiment
In structure the distance between hole 22 and signal via 21 shorten to 0.8mm so that three dB bandwidth can reach 60GHz, so as to
Support the transmission of signal of the frequency higher than 30GHz；A diameter of 0.2mm of signal via 21, thereby may be ensured that signal via 21
Impedance；Printed circuit board encapsulating structure provided in this embodiment is simple simultaneously, does not increase cost additionally, does not also improve difficult processing
Degree.
In the present embodiment, the material of conductive layer 2 is copper, and not only electric conductivity is good, but also abundant raw material, at low cost
It is honest and clean.
Preferably, the quantity in ground hole 22 is seven, and noumenally the quantity in hole 12 mutually should be seven, each ground hole 22 with accordingly
Noumenally hole 12 perforation connection；Seven ground hole 22 is distributed in using signal via 21 for the center of circle, using the first pre-determined distance as radius
Circumference on.Preferably, seven ground hole 22 in two of which be adjacent to hole 22 using signal via 21 be the center of circle in angle as
90 °, remaining adjacent vias 22 using signal via 21 by the center of circle in angle as 45 °.When the quantity in local hole 22 is seven, 3dB
Bandwidth can reach 60GHz, so as to support the transmission of signal of the frequency higher than 30GHz, so as to improve printed circuit board envelope
The performance of assembling structure.
Further, the mounting hole 23 passed through for screw, circuit board body 1 and 23 phase of mounting hole are additionally provided on conductive layer 2
Corresponding position is also extended through equipped with ontology mounting hole 13, and mounting hole 23 is connected with the perforation of ontology mounting hole 13, conductive layer 2 and circuit
Plate ontology 1 is connected by screw, and so as to which conductive layer 2 is tightly fixed in circuit board body 1, prevents conductive layer 2 random
It shakes.Preferably, the quantity of mounting hole 23 is two, and two mounting holes 23 are respectively distributed to the both ends of conductive layer 2, so as to
Preferably fixed conductive layer 2.In the present embodiment, the shape of circuit board body 1 is rectangle, and the shape of conductive layer 2 is also rectangle,
Two mounting holes 23 are symmetrically distributed on conductive layer 2 close to the position of two short sides of conductive layer 2, so as to be led by screw
When electric layer 2 is fixed in circuit board body 1, the stress of conductive layer 2 evenly, and can fix more preferably.
The advantageous effect of the printed circuit board encapsulating structure of high-frequency SMA connectors provided in this embodiment is：
(1) the distance between hole 22 and signal via 21 shorten to 0.8mm so that and three dB bandwidth can reach 60GHz,
So as to support the transmission of signal of the frequency higher than 30GHz, the performance of printed circuit board encapsulating structure is improved；
(2) a diameter of 0.2mm of signal via 21, thereby may be ensured that the impedance of signal via 21；
(3) conductive layer 2 is tightly fixed in circuit board body 1 by screw, prevents conductive layer 2 from arbitrarily shaking；
(4) while printed circuit board encapsulating structure provided in this embodiment is simple, does not increase cost additionally, does not also improve and adds
Work difficulty.
It should be understood that for those of ordinary skills, can be improved or converted according to the above description,
And all these modifications and variations should all belong to the protection domain of the appended claims for the utility model.
Illustrative description is carried out to the utility model patent above in conjunction with attached drawing, it is clear that the reality of the utility model patent
Now be not subject to the restrictions described above, if employ the utility model patent methodology and technical solution carry out it is various
Improve or it is not improved the design of the utility model patent and technical solution are directly applied into other occasions, in this reality
With in novel protection domain.
Claims (6)
1. a kind of printed circuit board encapsulating structure of high-frequency SMA connectors, it is characterised in that：Including circuit board body and set
Put the conductive layer in the circuit board body；
Offer the signal via for being used for transmission signal on the conductive layer, in the circuit board body with the signal via phase
Corresponding position is through offering ontology signal via, a diameter of 0.2mm of the signal via, the ontology signal via with
The signal via perforation connection；
The position for being separated by the first pre-determined distance on the conductive layer with the signal via offers multiple ground hole, it is multiple describedly
Pore size distribution on the circumference using the signal via as the center of circle, using first pre-determined distance as radius, described first it is default away from
From for 0.8mm, with the corresponding position in described ground hole through offering noumenally hole in the circuit board body, it is described noumenally
Hole is connected with the perforation of described ground hole.
2. the printed circuit board encapsulating structure of high-frequency SMA connectors according to claim 1, it is characterised in that：Institute
The quantity for stating ground hole is seven, and the quantity in the noumenally hole mutually should be seven.
3. the printed circuit board encapsulating structure of high-frequency SMA connectors according to claim 2, it is characterised in that：Seven
A described ground pore size distribution is on the circumference using the signal via as the center of circle, using first pre-determined distance as radius.
4. the printed circuit board encapsulating structure of high-frequency SMA connectors according to claim 1, it is characterised in that：Institute
State the mounting hole for being further opened with passing through on conductive layer for screw, the circuit board body and the corresponding position of the mounting hole
Through equipped with ontology mounting hole, the mounting hole is connected with ontology mounting hole perforation, the conductive layer and the circuit board
Ontology is connected by the screw.
5. the printed circuit board encapsulating structure of high-frequency SMA connectors according to claim 4, it is characterised in that：Institute
The quantity for stating mounting hole is two, and two mounting holes are respectively distributed to the both ends of the conductive layer.
6. the printed circuit board encapsulating structure of high-frequency SMA connectors according to claim 1, it is characterised in that：Institute
The material for stating conductive layer is copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721353793.0U CN207573696U (en) | 2017-10-20 | 2017-10-20 | A kind of printed circuit board encapsulating structure of high-frequency SMA connectors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721353793.0U CN207573696U (en) | 2017-10-20 | 2017-10-20 | A kind of printed circuit board encapsulating structure of high-frequency SMA connectors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207573696U true CN207573696U (en) | 2018-07-03 |
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ID=62695779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721353793.0U Active CN207573696U (en) | 2017-10-20 | 2017-10-20 | A kind of printed circuit board encapsulating structure of high-frequency SMA connectors |
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| CN (1) | CN207573696U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110213881A (en) * | 2019-05-28 | 2019-09-06 | 四川九洲电器集团有限责任公司 | A kind of printed circuit board and test fixture |
-
2017
- 2017-10-20 CN CN201721353793.0U patent/CN207573696U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110213881A (en) * | 2019-05-28 | 2019-09-06 | 四川九洲电器集团有限责任公司 | A kind of printed circuit board and test fixture |
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| CP01 | Change in the name or title of a patent holder |
Address after: 518000, 12H-12I, 12th Floor, Kangjia Research Building, 28 Science and Technology South 12 Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Yibo Science and Technology Co., Ltd. Address before: 518000, 12H-12I, 12th Floor, Kangjia Research Building, 28 Science and Technology South 12 Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Yi Bo Science and Technology Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 11F, Metro financial technology building, 9819 Shennan Avenue, Shenda community, Yuehai street, Nanshan District, Shenzhen, Guangdong 518000 Patentee after: EDADOC Co.,Ltd. Address before: 518000, 12H-12I, 12th Floor, Kangjia Research Building, 28 Science and Technology South 12 Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: EDADOC Co.,Ltd. |
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