CN204717392U - Led module - Google Patents
Led module Download PDFInfo
- Publication number
- CN204717392U CN204717392U CN201490000308.XU CN201490000308U CN204717392U CN 204717392 U CN204717392 U CN 204717392U CN 201490000308 U CN201490000308 U CN 201490000308U CN 204717392 U CN204717392 U CN 204717392U
- Authority
- CN
- China
- Prior art keywords
- film
- accommodating cavity
- led module
- led
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 9
- 229920000297 Rayon Polymers 0.000 claims abstract description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 239000011241 protective layer Substances 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- 230000001795 light effect Effects 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000005286 illumination Methods 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 208000003351 Melanosis Diseases 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
This application discloses a kind of LED module, comprise: pedestal, the accommodating cavity be opened on described pedestal, the LED chip be arranged in described accommodating cavity bottom metal district, and to cover above described LED chip and with described LED chip, to there is the film of predetermined space, sealed by viscose glue between described film and described accommodating cavity.Like this, due to the sealing function of viscose glue between film and accommodating cavity, block extraneous corrosive deposit and entered bottom it along accommodating cavity, thus avoided accommodating cavity bottom metal district and corroded by extraneous corrosive deposit, ensure that LED light effect and reliability.
Description
Technical field
The application relates to light emitting diode field, particularly relates to a kind of LED module.
Background technology
Increasing large-power light-emitting diodes (Light Emitting Diode in recent years, LED) progressively traffic lighting is applied to, show according to up-to-date result of study, in the coming five years, great power LED technology will significantly replace current various illuminating products, and will the various illuminations of automobile be applicable to, comprising: headlamp, brake lamp, fog lamp, emergency light, room light etc.LED has high security, operates steadily, saves the multiple advantage such as electric power, life-span length, is a development trend of Shape Of Things To Come illumination, the application that LED automobile illumination will become LED industry important.
The reliability of automobile environment for use to vehicle-mounted great power LED proposes higher requirement.At present, the great power LED being applied to automotive lighting adopts pottery as carrier, the metal area of cavity bottom is silver-plated, LED chip is arranged at metal area surface and adopts eutectic Welding, with quick heat radiating, reduces LED junction temperature, improve LED reliability, conventional LED comprises pedestal (ceramic substrate), and pedestal is provided with cavity, and the chamber wall of cavity is provided with some inclined-planes.Cavity bottom metal area is provided with LED chip, metal area and electrode are completed by metal filled and interconnection technique and are electrically connected, also be filled with colloid in the cavities in addition, colloid generally adopts silica gel, have oxygen flow, ventilative, with the characteristic such as the adhesion of inclined pocket surface is weak, oxygen and external substance are easier to the contact surface by colloid and inclined pocket surface and penetrate into cavity bottom.Cavity bottom metal area surface is the silver layer of advantage of lower cost, and silver layer is comparatively active, easily oxidized and sulfuration, very easily cause problem and then generation " melanism " phenomenons such as metal area surface sulfide or oxidation, reduce the light efficiency of LED, reliability is low, can not meet the requirement of LED automotive lighting.
Summary of the invention
The application is intended to one of solve the problems of the technologies described above at least to a certain extent.
The application provides a kind of LED module, comprise: pedestal, the accommodating cavity be opened on described pedestal, the LED chip be arranged in described accommodating cavity bottom metal district, and to cover above described LED chip and with described LED chip, to there is the film of predetermined space, sealed by viscose glue between described film and described accommodating cavity.
Further, the inner side of described pedestal is provided with the buckle structure fastened with described film.
Further, described buckle structure has the barbed body stretched in described film.
Further, described film has the barbed body stretched in described buckle structure.
Further, described film is fluorescence film.
Further, described film comprises: transparent film and fluorescence film.
Further, described film described LED chip opposite side is provided with protective layer.
Further, described protective layer adopts aluminium oxide or titania meterial.
The beneficial effect of the application is:
By providing a kind of LED module, comprise: pedestal, the accommodating cavity be opened on described pedestal, the LED chip be arranged in described accommodating cavity bottom metal district, and to cover above described LED chip and with described LED chip, to there is the film of predetermined space, sealed by viscose glue between described film and described accommodating cavity.Like this, due to the sealing function of viscose glue between film and accommodating cavity, block extraneous corrosive deposit and entered bottom it along accommodating cavity, thus avoided accommodating cavity bottom metal district and corroded by extraneous corrosive deposit, ensure that LED light effect and reliability.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED module of the embodiment of the present application.
Detailed description of the invention
Be described below in detail the embodiment of the application, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the application, and the restriction to the application can not be interpreted as.
In the description of the application, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the application and simplified characterization for convenience of description, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore the restriction to the application can not be interpreted as.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In the description of the application, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In this application, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in this application can be understood as the case may be.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can comprise the first and second features and directly contact, also can comprise the first and second features and not be directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is less than second feature.
By reference to the accompanying drawings the application is described in further detail below by detailed description of the invention.
Please refer to Fig. 1, present embodiments provide a kind of LED module, it mainly can be used for LED illumination on automobile or outdoor display screen or display.
Above-mentioned LED module mainly comprises: pedestal 1, the accommodating cavity 2 be opened on pedestal 1, the LED chip 4 be arranged in accommodating cavity 2 bottom metal district 3, and to cover above LED chip 4 and to have the film 5 of predetermined space with LED chip 4.Sealed by viscose glue 6 between film 5 and accommodating cavity 2.
Like this, due to the sealing function of viscose glue between film and accommodating cavity, block extraneous corrosive deposit and entered bottom it along accommodating cavity, thus avoided accommodating cavity bottom metal district and corroded by extraneous corrosive deposit, ensure that LED light effect and reliability.
In order to stop extraneous corrosive deposit further, the inner side of pedestal 1 is provided with the buckle structure 11 fastened with film 5.Buckle structure 11 has the barbed body 111 stretched in film 5, thus makes extraneous corrosive deposit access path more bending, enters more not easily.Certainly, as other alternate embodiments, film 5 has the barbed body stretched in buckle structure 11.
When embody rule, film 5 can be fluorescent glue sheet, or comprises the combination of transparent film and fluorescence film, and transparent film is arranged at outside fluorescence film, can be sticked or keep at a certain distance away.
For protection film and LED module internal structure, film 5 LED chip 4 opposite side is provided with protective layer.Particularly, protective layer can adopt the material such as aluminium oxide or titanium oxide, or directly adopts silica gel.
In the description of this description, at least one embodiment that specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained in the application or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Above content is the further description done the application in conjunction with concrete embodiment, can not assert that the concrete enforcement of the application is confined to these explanations.For the application person of an ordinary skill in the technical field, under the prerequisite not departing from the application's design, some simple deduction or replace can also be made.
Claims (8)
1. a LED module, comprise: pedestal, the accommodating cavity be opened on described pedestal, the LED chip be arranged in described accommodating cavity bottom metal district, and to cover above described LED chip and with described LED chip, to there is the film of predetermined space, it is characterized in that, sealed by viscose glue between described film and described accommodating cavity.
2. LED module as claimed in claim 1, it is characterized in that, the inner side of described pedestal is provided with the buckle structure fastened with described film.
3. LED module as claimed in claim 2, it is characterized in that, described buckle structure has the barbed body stretched in described film.
4. LED module as claimed in claim 2, it is characterized in that, described film has the barbed body stretched in described buckle structure.
5. LED module as claimed in claim 1, it is characterized in that, described film is fluorescence film.
6. LED module as claimed in claim 1, it is characterized in that, described film comprises: transparent film and fluorescence film.
7. LED module as claimed in claim 1, is characterized in that, described film described LED chip opposite side is provided with protective layer.
8. LED module as claimed in claim 7, is characterized in that, described protective layer adopts aluminium oxide or titania meterial.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2014/091558 WO2016078018A1 (en) | 2014-11-19 | 2014-11-19 | Led module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204717392U true CN204717392U (en) | 2015-10-21 |
Family
ID=54316393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201490000308.XU Expired - Fee Related CN204717392U (en) | 2014-11-19 | 2014-11-19 | Led module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN204717392U (en) |
| WO (1) | WO2016078018A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598248A (en) * | 2018-06-13 | 2018-09-28 | 广东恒润光电有限公司 | A kind of novel light-emitting diode structure with quantum dot diaphragm |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244178A (en) * | 2010-05-14 | 2011-11-16 | 展晶科技(深圳)有限公司 | Encapsulation structure of LED (light emitting diode) |
| CN101931040A (en) * | 2010-07-20 | 2010-12-29 | 嘉兴嘉尼光电科技有限公司 | Packaging of LED area light source |
| CN201812851U (en) * | 2010-08-25 | 2011-04-27 | 良盟塑胶股份有限公司 | Light emitting diode packaging structure |
| CN202025798U (en) * | 2011-04-06 | 2011-11-02 | 广东银雨芯片半导体有限公司 | SMD (Surface Mounted Device) LED (Light Emitting Diode) bracket and LED adopting same |
| CN202120982U (en) * | 2011-06-22 | 2012-01-18 | 深圳市聚飞光电股份有限公司 | Led |
| CN102956764B (en) * | 2011-08-31 | 2015-08-12 | 盈胜科技股份有限公司 | The method for packing of airtight type multilayer array type light emitting diode |
| CN202484653U (en) * | 2011-12-31 | 2012-10-10 | 浙江英特来光电科技有限公司 | Complete outdoor LED lamp with high luminance, density and contrast ratio |
| CN103855274B (en) * | 2013-12-25 | 2016-08-17 | 深圳市瑞丰光电子股份有限公司 | LED encapsulation structure and method for packing thereof |
-
2014
- 2014-11-19 CN CN201490000308.XU patent/CN204717392U/en not_active Expired - Fee Related
- 2014-11-19 WO PCT/CN2014/091558 patent/WO2016078018A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016078018A1 (en) | 2016-05-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151021 Termination date: 20161119 |