CN204696090U - Wafer solution bonding apparatus - Google Patents
Wafer solution bonding apparatus Download PDFInfo
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- CN204696090U CN204696090U CN201520495711.0U CN201520495711U CN204696090U CN 204696090 U CN204696090 U CN 204696090U CN 201520495711 U CN201520495711 U CN 201520495711U CN 204696090 U CN204696090 U CN 204696090U
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- wafer
- cutter
- slide glass
- bonding
- table top
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Abstract
The utility model provides a kind of wafer solution bonding apparatus, and it comprises: for placing the table top of wafer and slide glass after bonding; And one with the cutter of venthole, described cutter is arranged near table top by adjustable apparatus, controlling cutter by adjustable apparatus does away from table top or the motion near table top, cutter is provided with cutter head, a breach is stung out on the film or glue of the junction of wafer and slide glass after bonding, described venthole is arranged on cutter head, described cutter is also provided with air admission hole, described air admission hole is communicated with venthole, described air admission hole is connected with a gas generating unit, blows for the junction of wafer and slide glass after the bonding on table top.Adopt above-mentioned wafer solution bonding apparatus automaticity high, operate easier.
Description
Technical field:
The utility model relates to microelectronics technology, is specifically a kind of wafer solution bonding apparatus.
Background technology:
Along with people are to the future development of the requirement of electronic product towards miniaturization, electronic chip is also towards more and more thinner future development, when but if the thickness of Silicon Wafer will be thinned to 100 microns or following, be very easy to occur fragment or when processing wafer because stress causes wafer bow distortion etc., directly cannot process process to this ultra-thin wafers.Therefore, in order to can process process this kind of ultra-thin wafers, need by this ultra-thin wafer first with the interim bonding of a slide glass, after bonding, wafer and slide glass glue joint and are integrated, and just can carry out thinning, the manufacture of TSV, again wiring layer the technique such as manufacture, formation intraconnection to wafer and make.And then wafer is separated with slide glass, and the wafer after thinning is cleaned, the technique such as cutting, complete the processing technology to this ultra-thin wafer.
The wafer bonding method adopted in current industry is generally between slide glass and wafer, applying bonding glue, and then adopts bonder by slide glass together with wafer bonding.The solution bonding of wafer refers to and is separated with wafer by slide glass good for bonding.
Wafer for above-mentioned interim bonding carries out solution bonding generally following several method: the first, bonding glue when utilizing solvent to dissolve bonding from the slide glass of bonding and the edge of wafer, the second adopts heating power to shear exactly and is separated, first method, bonding glue is slowly dissolved in the edge that lytic agent combines from wafer and slide glass, the time that lytic agent arrives crystal circle center is oversize, separative efficiency is too low, and directly slide glass and wafer separate are also needed special support plate fixes wafer, prevent when being separated, wafer and slide glass mixing, operation bothers, and cost is higher.Adopt second method, need special equipment to carry out heating power shearing, cost is higher, and easily damages wafer when shearing, and success rate is lower.
For this reason, a kind of wafer bonding method of applicant's utility model, this method does surface treatment on slide glass, form one deck barrier film, bond degree between barrier film and slide glass is moderate, when deliberately not going to tear, film can not depart from from slide glass, but when force is torn, film can be peeled off from slide glass, then bonding glue is applied by between the front of the slide glass with barrier film and wafer during bonding, wafer and slide glass are bonded together, applicant goes back a kind of wafer solution bonding method of utility model, this method adopts air-stream generating device to produce towards the air-flow of the junction of wafer and slide glass bonding, slide glass and wafer separate is made by air-flow.But applicant finds to adapt to suitability for industrialized production under study for action, still needing a kind of automaticity high, operating easier wafer solution bonding apparatus.
Utility model content:
The technical problem that the utility model solves overcomes existing technological deficiency, provides a kind of automaticity high, operate easier wafer solution bonding apparatus.
The technical scheme that the utility model provides is: the utility model provides a kind of wafer solution bonding apparatus, and it comprises: for placing the table top of wafer and slide glass after bonding; And one with the cutter of venthole, described cutter is arranged near table top by adjustable apparatus, controlling cutter by adjustable apparatus does away from table top or the motion near table top, cutter is provided with cutter head, a breach is stung out on the film or glue of the junction of wafer and slide glass after bonding, described venthole is arranged on cutter head, described cutter is also provided with air admission hole, described air admission hole is communicated with venthole, described air admission hole is connected with a gas generating unit, blows for the junction of wafer and slide glass after the bonding on table top.
After adopting said structure, a breach is first cut in the junction of wafer bonding by cutter, and then utilize gas generating unit to blow to this breach, just can make slide glass and wafer solution bonding, venthole is located on cutter head, just venthole can be faced breach, the effect of concrete use is very good, not needing to apply too large air pressure just can make two pieces of wafers divide, and separating rate quickly, operates very easy.
The vicinity of described table top is also provided with image collecting device and lighting fixture, the collection terminal of described image collecting device aims at the cutter head of cutter, for gathering the image of cutter head junction of wafer and slide glass after pressing close to bonding, described lighting fixture provides light source to make image more clear.Adopt this structure can by image acquisition device to image judge whether cutter head is aimed at the junction of wafer after bonding, if not do not aimed at, then can be adjusted the position of cutter head by adjustment adjustable apparatus.Because general wafer bonding device all carries out in the environment closed, therefore need to arrange the image that lighting fixture makes to collect more clear.
Described wafer solution bonding apparatus also comprises the suctorial manipulator of a band, described manipulator can hold the wafer after bonding table top being positioned at top or slide glass by sucker, for when blowing, after wafer is separated with slide glass, the slide glass or wafer that are positioned at top are taken away.Manipulator holds the upper surface of the wafer after the bonding on table top above wafer by sucker, apply very little power upwards, when blowing, after there is gap between upper and lower two pieces of wafers, bonding force between upper/lower terminal wafer is very little, then upper and lower two pieces of wafers can be easily made to be separated completely by manipulator, then by the movement of manipulator, the wafer be positioned at above after separation can be moved to other position, so that subsequent operation, whole process can complete automatically by arranging programming, and automaticity is high.
Described wafer solution bonding apparatus also comprises a controller, described controller is connected with image collecting device and adjustable apparatus, by the image of the junction of the wafer after image acquisition device to bonding, then after image analysis processing, control adjustable apparatus to regulate the position of cutter, make the junction of wafer and slide glass after the cutter head auto-alignment bonding of cutter.By programming in controller, can according to image acquisition device to image result automatically control the position of cutter head, guarantee cutter head all the time facing to the junction of wafer after bonding, accomplish automatic adjustment, automaticity is high.
The light of described lighting fixture is angularly radiated on the wafer after the bonding on table top and slide glass, described light is the light that can be detected color by image collecting device, described light for wafer and slide glass can be penetrated, and can the light that reflects by the film of wafer and slide glass junction.Adopt this structure, when light-illuminating is on wafer, due to wafer and slide glass and the binding film between wafer and slide glass different for the result of the irradiation of the light of same wavelength, film can reflect, wafer and slide glass then can transmissions, and the color distinction so between film and wafer is just larger, and after the bonding making image acquisition device arrive like this, the resolution of the image of wafer junction is just higher, result is just more accurate, this light such as ultraviolet or visual purple light etc.
It also comprises a gas temperature adjusting device, and described gas temperature adjusting device is located between gas generating unit and pore, the temperature of giving vent to anger for regulating pore.。Adopt said apparatus, can when drying the temperature of adjustment air-flow, that is can blowing hot-air or cold wind, facilitate follow-up processing.
As improvement, described venthole is arranged on the upper surface of the cutter head of cutter.Adopt this structure, when stinging out breach, with regard to can be blown by venthole at once, simple to operation.
The upper surface of the cutter head of described cutter is provided with two ventholes, and the side of described cutter is provided with skewed slot.Adopt two ventholes to make blowing more stable, skewed slot is set and may be used for depositing the tracheae be connected with air admission hole, and place the cable of camera and camera by skewed slot.
Accompanying drawing illustrates:
Accompanying drawing 1 is the structural representation of embodiment of the present utility model;
Accompanying drawing 2 is A place enlarged diagram in Fig. 1;
Accompanying drawing 3 is the structural representation of cutter;
Accompanying drawing 4 is the structural representation of manipulator and sucker;
As shown in the figure: 1, table top, 2 cutters, 2.1, cutter head, 2.2, venthole, 2.3, air admission hole, 2.4, skewed slot, 3, manipulator, 3.1, sucker, 3.2, displacement mechanism, 4, lighting fixture, 5, rack.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is elaborated:
As Figure 1-Figure 4: the utility model provides a kind of wafer solution bonding apparatus, and it comprises: for placing the table top 1 of wafer after bonding, one is provided with the cutter 2 of venthole 2.2 near described table top 1, described cutter 2 is arranged on table top 1 around by adjustable apparatus, controlling cutter 2 by adjustable apparatus does away from table top 1 or the motion near table top 1, described adjustable apparatus adopts displacement mechanism, and can the position of trimming tool bit 2, the electric cylinder of general employing or cylinder, the position of trimming tool bit 2 generally adopts stepping motor, these are prior art, therefore do not describe in detail, cutter 2 is provided with cutter head 2.1, a breach is stung out in junction for wafer and slide glass after bonding, described venthole 2.2 is arranged on the upper surface of cutter head 2.1, certain venthole 2.2 also can be arranged on the lower surface of cutter head 2.1, blown by the junction of lower surface to wafer and slide glass of cutter head 2.1, described cutter 2 is also provided with air admission hole 2.3, described air admission hole 2.3 is communicated with venthole 2.2, described air admission hole 2.3 is connected with a gas generating unit, blow for the junction of wafer and slide glass after the bonding on table top.The delivery outlet of described gas generating unit is connected with air admission hole 2.3, for being blown to the junction of the wafer after bonding by venthole 2.2.General gas flow generating means is all located at the inside of rack, therefore not shown in FIG..
Can find out from embodiment; above-mentioned wafer solution bonding apparatus is adopted also to comprise rack 5 and some other peripheral device structure; these are all the structures can set up when manufacturing equipment or not set up, but as long as basic structure described in the utility model realize wafer solution bonding then all should within the application's protection range.
After adopting said structure, a breach is first cut in the junction of wafer bonding by cutter, and then utilize gas generating unit to blow to this breach, just can make slide glass and wafer solution bonding, venthole is located at the upper surface of cutter, just venthole can be faced breach, the effect of concrete use is very good, not needing to apply too large air pressure just can make two pieces of wafers divide, and separating rate quickly, operates very easy.
The vicinity of described table top is also provided with image collecting device and lighting fixture 4, the collection terminal of described image collecting device aims at the cutter head 2.1 of cutter 2, for gathering the image of cutter head 2.1 junction of wafer after pressing close to bonding, described lighting fixture 4 provides light source to make image more clear.Because rack blocks, therefore, in figure, lighting fixture 4 is only shown, but image collecting device this as prior art, even if therefore not shown, do not affect sake of clarity of the present utility model yet.Image collecting device adopts camera in the present embodiment, adopt this structure can by image acquisition device to image judge whether cutter head is aimed at the junction of wafer after bonding, if do not aimed at, then can be adjusted the position of cutter head by adjustment adjustable apparatus.Because general wafer bonding device all carries out in the environment closed, therefore need to arrange the image that lighting fixture makes to collect more clear.
It also comprises one with the manipulator 3 of sucker 3.1, and described manipulator 3 can hold the wafer after bonding table top being positioned at top or slide glass by sucker 3.1, for when blowing, the slide glass above being positioned at or wafer is taken away after wafer is separated with slide glass.The manipulator that manipulator generally adopts cylinder or electric cylinder to drive, after by the slide glass of the wafer above being positioned at or slide glass and below or wafer separate, can move to other position by the wafer of top or slide glass.Generally slide glass up, and wafer in below, but also can change the position of slide glass and wafer, the table top of below is provided with multiple suction hole, suction is relatively more even, is used for holding the wafer being positioned at below, and slide glass is positioned at top, after air blowing makes slide glass and wafer separate, manipulator utilizes sucker to hold slide glass, and slide glass is moved to other position, so that subsequent operation, whole process can complete automatically by arranging programming, and automaticity is high.
Described wafer solution bonding apparatus also comprises a controller, described controller is connected with image collecting device and adjustable apparatus, by the image of wafer and slide glass junction after image acquisition device to bonding, then after image analysis processing, control adjustable apparatus to regulate the position of cutter, make the cutter head of cutter face wafer and slide glass junction after bonding.By programming in controller, can according to image acquisition device to image result automatically control the position of cutter head, guarantee cutter head all the time facing to the junction of wafer after bonding, accomplish automatic adjustment, automaticity is high.This program controlling the position of object according to image is existing conventional means, therefore, at this in detail its specific procedure is not described in detail.But being used in the method adjusting cutter head position according to the image of the junction of the wafer after bonding in wafer solution bonding apparatus described in the utility model is then the technological means never occurred in this area.
The light of described lighting fixture is angularly radiated on the wafer after the bonding on table top and slide glass, described light is the light that can be detected color by image collecting device, described light for wafer and slide glass can be penetrated, and can the light that reflects by the film of wafer and slide glass junction.Adopt this structure, when light-illuminating is on wafer, due to wafer and slide glass and the binding film between wafer and slide glass different for the result of the irradiation of the light of same wavelength, film can reflect, wafer and slide glass then can transmissions, color distinction so between film and wafer is just larger, after the bonding making image acquisition device arrive like this, the resolution of the image of wafer junction is just higher, result is just more accurate, this light such as ultraviolet, or visual purple light etc., as long as the principle that wafer is different from the wavelength that the light of the film of junction reflects with slide glass can be utilized, employing can be penetrated table top by the coloured illumination of the band of image collecting device identification, this light can penetrate wafer and slide glass, and can reflect by the film of wafer and slide glass junction, the color of the color relation of the part of such film and wafer and slide glass is distinguished larger, can be identified more exactly.
It also comprises a gas temperature adjusting device, and described gas temperature adjusting device is located between gas generating unit and pore, the temperature of giving vent to anger for regulating pore.Adopt said apparatus, can when drying the temperature of adjustment air-flow, that is can blowing hot-air or cold wind, facilitate follow-up processing.
As improvement, described venthole is arranged on the upper surface of the cutter head of cutter.Adopt this structure, when stinging out breach, with regard to can be blown by venthole at once, simple to operation.
The upper surface of the cutter head of described cutter is provided with two ventholes, and the side of described cutter is provided with skewed slot.Adopt two ventholes to make blowing more stable, skewed slot is set and may be used for depositing the tracheae be connected with air admission hole, and place the cable of camera and camera by skewed slot.
Claims (8)
1. a wafer solution bonding apparatus, is characterized in that: it comprises:
For placing the table top of wafer and slide glass after bonding;
And one with the cutter of venthole, described cutter is arranged near table top by adjustable apparatus, controlling cutter by adjustable apparatus does away from table top or the motion near table top, cutter is provided with cutter head, a breach is stung out on the film or glue of the junction of wafer and slide glass after bonding, described venthole is arranged on cutter head, described cutter is also provided with air admission hole, described air admission hole is communicated with venthole, described air admission hole is connected with a gas generating unit, blows for the junction of wafer and slide glass after the bonding on table top.
2. wafer solution bonding apparatus according to claim 1, it is characterized in that: the vicinity of described table top is also provided with image collecting device and lighting fixture, the collection terminal of described image collecting device aims at the cutter head of cutter, for gathering the image of cutter head junction of wafer and slide glass after pressing close to bonding, described lighting fixture provides light source to make image more clear.
3. wafer solution bonding apparatus according to claim 1, it is characterized in that: it also comprises the suctorial manipulator of a band, described manipulator can hold the wafer after bonding table top being positioned at top or slide glass by sucker, for when blowing, after wafer is separated with slide glass, the slide glass or wafer that are positioned at top are taken away.
4. wafer solution bonding apparatus according to claim 2, it is characterized in that: it also comprises a controller, described controller is connected with image collecting device and adjustable apparatus, by the image of the junction of the wafer after image acquisition device to bonding, then after image analysis processing, control adjustable apparatus to regulate the position of cutter, make the junction of wafer and slide glass after the cutter head auto-alignment bonding of cutter.
5. wafer solution bonding apparatus according to claim 2, it is characterized in that: the light of described lighting fixture is angularly radiated on the wafer after the bonding on table top and slide glass, described light is the light that can be detected color by image collecting device, described light for wafer and slide glass can be penetrated, and can the light that reflects by the film of wafer and slide glass junction.
6. wafer solution bonding apparatus according to claim 1, it is characterized in that: it also comprises a gas temperature adjusting device, described gas temperature adjusting device is located between gas generating unit and pore, the temperature of giving vent to anger for regulating pore.
7. wafer solution bonding apparatus according to claim 1, is characterized in that: described venthole is arranged on the upper surface of the cutter head of cutter.
8. wafer solution bonding apparatus according to claim 1, is characterized in that: the upper surface of the cutter head of described cutter is provided with two ventholes, and the side of described cutter is provided with skewed slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520495711.0U CN204696090U (en) | 2015-07-08 | 2015-07-08 | Wafer solution bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520495711.0U CN204696090U (en) | 2015-07-08 | 2015-07-08 | Wafer solution bonding apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204696090U true CN204696090U (en) | 2015-10-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520495711.0U Withdrawn - After Issue CN204696090U (en) | 2015-07-08 | 2015-07-08 | Wafer solution bonding apparatus |
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| CN (1) | CN204696090U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105047589A (en) * | 2015-07-08 | 2015-11-11 | 浙江中纳晶微电子科技有限公司 | Wafer bonding and de-bonding device |
| CN106611717A (en) * | 2015-10-22 | 2017-05-03 | 浙江中纳晶微电子科技有限公司 | Procedure of processing workpiece and apparatus designed for procedure |
| CN109427642A (en) * | 2017-08-31 | 2019-03-05 | 上海微电子装备（集团）股份有限公司 | A kind of Acetabula device and sucker transhipment protective device and substrate transportation resources |
-
2015
- 2015-07-08 CN CN201520495711.0U patent/CN204696090U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105047589A (en) * | 2015-07-08 | 2015-11-11 | 浙江中纳晶微电子科技有限公司 | Wafer bonding and de-bonding device |
| CN105047589B (en) * | 2015-07-08 | 2018-05-29 | 浙江中纳晶微电子科技有限公司 | Wafer solution bonding apparatus |
| CN106611717A (en) * | 2015-10-22 | 2017-05-03 | 浙江中纳晶微电子科技有限公司 | Procedure of processing workpiece and apparatus designed for procedure |
| CN109427642A (en) * | 2017-08-31 | 2019-03-05 | 上海微电子装备（集团）股份有限公司 | A kind of Acetabula device and sucker transhipment protective device and substrate transportation resources |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20151007 Effective date of abandoning: 20180529 |