CN204622354U - A kind of Semi-automatic wafer scribing cut-off machine of many of improvement - Google Patents
A kind of Semi-automatic wafer scribing cut-off machine of many of improvement Download PDFInfo
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- CN204622354U CN204622354U CN201520101831.8U CN201520101831U CN204622354U CN 204622354 U CN204622354 U CN 204622354U CN 201520101831 U CN201520101831 U CN 201520101831U CN 204622354 U CN204622354 U CN 204622354U
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Abstract
The utility model relates to wafer manufacturing equipment technical field, particularly relate to a kind of Semi-automatic wafer scribing cut-off machine of many of improvement, comprise frame, scratch diskette and cutting mechanism, scratch diskette is positioned at frame, cutting mechanism is positioned at the top of scratch diskette, erecting is equipped with the rotary drive mechanism driving scratch diskette rotary motion, drive rotary drive mechanism along X-axis the X-axis driving mechanism moved and the Y-axis driving mechanism driving X-axis driving mechanism to move along Y-axis, marble portal frame is provided with in frame, marble portal frame is provided with the Z axis driving mechanism for driving cutting mechanism to move along Z axis.Marble portal frame of the present utility model adopts marble material, can guarantee that the stability of the Z axis driving mechanism being installed on this marble portal frame is better, and then stability when guaranteeing that Z axis driving mechanism drives cutting mechanism to move up and down along Z axis is better; In addition, to more convenient with the mounting or dismounting of Z axis driving mechanism and cutting mechanism, handled easily.
Description
Technical field
The utility model relates to wafer manufacturing equipment technical field, particularly relates to a kind of Semi-automatic wafer scribing cut-off machine of many of improvement.
Background technology
The application of silicon semiconductor integrated circuit is more and more extensive, and wherein, silicon semiconductor integrated circuit all needs to use wafer, and the wafer being applied in silicon semiconductor integrated circuit carried out processing in earlier stage.Tradition is pure manual operations to the processing of wafer, namely workman uses cutting machine (diamond custting machine, laser cutting machine etc.) to process wafer, this kind of existing wafer processing techniques is because of manual operation, there are the following problems in meeting: one, machining accuracy is low, Artificial Control cutting machine poor stability, the wafer cut out width is apart larger, and the uniformity is poor; The wafer material that two, can cut is single, poor for applicability; Three, percent defective is high, and material consumption is large, and production efficiency is low; Four, high to the required precision of work in process, meanwhile, labour intensity is large, easily damages the health of workman.
Utility model content
The purpose of this utility model is to provide a kind of good stability for the deficiencies in the prior art, the Semi-automatic wafer scribing cut-off machine of many that machining accuracy is high, production efficiency is high.
For achieving the above object, the Semi-automatic wafer scribing cut-off machine of many of a kind of improvement of the present utility model, comprise frame, scratch diskette and cutting mechanism, scratch diskette is positioned at frame, cutting mechanism is positioned at the top of scratch diskette, erecting is equipped with and drives the rotary drive mechanism of scratch diskette rotary motion, drive the X-axis driving mechanism that rotary drive mechanism moves along X-axis and the Y-axis driving mechanism driving X-axis driving mechanism to move along Y-axis, be provided with marble portal frame in frame, marble portal frame is provided with the Z axis driving mechanism for driving cutting mechanism to move along Z axis.
Preferably, be also provided with workbench in described frame, Y-axis driving mechanism is installed on described workbench.
Preferably, described workbench is marble workbench.
Preferably, described rotary drive mechanism is electric rotating machine, and scratch diskette is connected with the main shaft of described electric rotating machine.
Preferably, described cutting mechanism is laser cutting mechanism.
Preferably, described Z axis driving mechanism comprises motor, screw mandrel and travelling nut, and screw mandrel is connected with the main shaft of motor, and travelling nut and screw mandrel are spirally connected, and cutting mechanism is connected with travelling nut.
Preferably, described X-axis driving mechanism and Y-axis driving mechanism include linear electric motors and linear slide rail, the electric mover that linear electric motors comprise motor stator and are connected with motor stator.
Preferably, the periphery of described frame is provided with shell.
Preferably, the bottom of described frame is provided with leg and universal wheel.
The beneficial effects of the utility model: the Semi-automatic wafer scribing cut-off machine of many of a kind of improvement of the present utility model, during work, first unprocessed wafer is positioned over luggage that scratch diskette goes forward side by side clamping fixed, then, control rotary drive mechanism, X-axis driving mechanism, the relative cutting mechanism of wafer that Y-axis driving mechanism controls on scratch diskette respectively carries out circumference, the motion of X-axis and Y direction, Z axis driving mechanism controls the motion that cutting mechanism carries out Z-direction again, namely cutting mechanism realizes the cutting movement of four axles to the wafer on scratch diskette, until complete the wafer processing and arrange shape, finally carry out finished product collection.Semi-automatic wafer scribing cut-off machine of many of the present utility model, wherein marble portal frame adopts marble material, can guarantee that the stability of the Z axis driving mechanism being installed on this marble portal frame is better, and then guarantee that Z axis driving mechanism drives the stability of cutting mechanism when moving up and down along Z axis better; In addition, to more convenient with the mounting or dismounting of Z axis driving mechanism and cutting mechanism, handled easily.
Accompanying drawing explanation
Fig. 1 is perspective view of the present utility model.
Fig. 2 is the perspective view after the utility model hides shell.
Fig. 3 is the perspective view that the utility model cutting mechanism is connected with Z axis driving mechanism.
Reference numeral comprises:
1-frame, 2-scratch diskette, 3-cutting mechanism
4-rotary drive mechanism, 5-X-axis driving mechanism, 6-Y-axis driving mechanism
7-marble portal frame, 8-Z axis driving mechanism, 9-workbench
11-shell, 12-leg, 81-motor
82-screw mandrel, 83-travelling nut.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is described in detail.
As shown in Figure 1 to Figure 3, the Semi-automatic wafer scribing cut-off machine of many of a kind of improvement of the present utility model, comprise frame 1, scratch diskette 2 and cutting mechanism 3, scratch diskette 2 is positioned at frame 1, cutting mechanism 3 is positioned at the top of scratch diskette 2, frame 1 is provided with the rotary drive mechanism 4 driving scratch diskette 2 rotary motion, drive rotary drive mechanism 4 along X-axis the X-axis driving mechanism 5 moved and the Y-axis driving mechanism 6 driving X-axis driving mechanism 5 to move along Y-axis, marble portal frame 7 is provided with in frame 1, marble portal frame 7 is provided with the Z axis driving mechanism 8 for driving cutting mechanism 3 to move along Z axis.During work, first unprocessed wafer is positioned over luggage that scratch diskette 2 goes forward side by side clamping fixed, then, control rotary drive mechanism 4, X-axis driving mechanism 5, the Y-axis driving mechanism 6 relative cutting mechanism 3 of wafer controlled respectively on scratch diskette 2 carry out the motion of circumference, X-axis and Y direction, Z axis driving mechanism 8 controls the motion that cutting mechanism 3 carries out Z-direction again, namely the wafer on cutting mechanism 3 pairs of scratch diskettes 2 realizes the cutting movement of four axles, until complete the wafer processing and arrange shape, finally carry out finished product collection.Semi-automatic wafer scribing cut-off machine of many of the present utility model, wherein marble portal frame adopts marble material, can guarantee that the stability of the Z axis driving mechanism being installed on this marble portal frame is better, and then guarantee that Z axis driving mechanism drives the stability of cutting mechanism when moving up and down along Z axis better; In addition, to more convenient with the mounting or dismounting of Z axis driving mechanism and cutting mechanism, handled easily.
The utility model is first by manually carrying out clamping to wafer, and then realize automation processing to wafer, machining accuracy is high, and product wafer all title property is good; Meanwhile, effectively can reduce manual operation, reduce hand labor intensity, enhance productivity, avoid security incident occurs.
In the present embodiment, be also provided with workbench 9 in described frame 1, Y-axis driving mechanism 6 is installed on described workbench 9; Concrete, the effect of workbench 9 is for installing Y-axis driving mechanism 6, Y-axis driving mechanism 6, X-axis driving mechanism 5 and rotary drive mechanism 4 are played to the effect of support simultaneously, guarantee that Y-axis driving mechanism 6, X-axis driving mechanism 5 and rotary drive mechanism 4 wafer on drive scratch diskette 2 carries out adding having good stability of man-hour, improve machining accuracy and efficiency.More specifically, described workbench 9 is marble workbench, distortion after marble workbench is stressed is little, thus can guarantee that the levelness of the Y-axis driving mechanism 6 being installed on marble workbench is higher, improve the operating accuracy of Y-axis driving mechanism 6, and then the degree of accuracy when scribing improving wafer is further cut, realize high accuracy scribing cutting, reasonable in design, practical.
In the present embodiment, described rotary drive mechanism 4 is electric rotating machine, scratch diskette 2 is connected with the main shaft of described electric rotating machine, the output torque of electric rotating machine is large, the scratch diskette 2 be connected with the main shaft of electric rotating machine can be driven to rotate reposefully, meanwhile, the rotation precision of electric rotating machine is high, effectively can improve the precision that wafer scratch diskette 2 being placed clamping adds man-hour; Concrete, electric rotating machine can adopt direct-drive motor.
In the present embodiment, described cutting mechanism 3 is laser cutting mechanism, and the cutting accuracy that laser cutting mechanism compares traditional diamond cut mechanism is higher, and cutting efficiency is higher.
In the present embodiment, described Z axis driving mechanism 8 comprises motor 81, screw mandrel 82 and travelling nut 83, and screw mandrel 82 is connected with the main shaft of motor 81, and travelling nut 83 and screw mandrel 82 are spirally connected, and cutting mechanism 3 is connected with travelling nut 83; Concrete, the main shaft of motor 81 drives the positive and negative rotation of screw mandrel 82, the travelling nut 83 be threaded with screw mandrel 82 realizes upper and lower reciprocating motion, namely drive the cutting mechanism 3 be connected with travelling nut 83 to realize the upper and lower reciprocating motion of Z axis, the wafer controlled on cutting mechanism 3 pairs of scratch diskettes 2 carries out scribing cutting.
In the present embodiment, described X-axis driving mechanism 5 and Y-axis driving mechanism 6 include linear electric motors and linear slide rail, the electric mover that linear electric motors comprise motor stator and are connected with motor stator; Concrete, X-axis driving mechanism 5 comprises two groups of linear slide rails, and two groups of linear slide rails are that X-axis level is installed, and the linear electric motors of X-axis driving mechanism 5 are installed between the linear slide rail of both sides, in like manner, the linear slide rail of Y-axis driving mechanism 6 and linear electric motors are then installed in Y-axis level; Adopt linear electric motors as driving, the stability of driving is stronger, longer service life, and positioning precision is higher, and dynamic characteristic during motion is good, responds sensitive, and positioning precision can reach 0.5um, can realize nanoscale and control; In addition, the driving mechanism stroke of linear electric motors composition is unrestricted, according to actual needs, can, by travel settings long enough, use flexibility high.
In the present embodiment, the periphery of described frame 1 is provided with shell 11, and each parts arranged in shell 11 pairs of frames 1 play a protective role, and avoids workman to touch parts in frame 1 easily, causes personal injury.
In the present embodiment, the bottom of described frame 1 is provided with leg 12 and universal wheel, and leg 12 is for supporting whole cutting machine, and universal wheel (not drawing in the accompanying drawings) is the convenient movement to whole cutting machine then.
Known the utility model is have above-described good characteristic in sum, is made it in use, promotes in conventional art the usefulness that do not have and has practicality, becoming the product that has practical value.
Above content is only preferred embodiment of the present utility model, for those of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, this description should not be construed as restriction of the present utility model.
Claims (9)
1. the Semi-automatic wafer scribing cut-off machine of many of an improvement, it is characterized in that: comprise frame (1), scratch diskette (2) and cutting mechanism (3), scratch diskette (2) is positioned at frame (1), cutting mechanism (3) is positioned at the top of scratch diskette (2), frame (1) is provided with the rotary drive mechanism (4) driving scratch diskette (2) rotary motion, the Y-axis driving mechanism (6) that the X-axis driving mechanism (5) driving rotary drive mechanism (4) to move along X-axis and driving X-axis driving mechanism (5) are moved along Y-axis, marble portal frame (7) is provided with in frame (1), marble portal frame (7) is provided with the Z axis driving mechanism (8) for driving cutting mechanism (3) to move along Z axis.
2. the Semi-automatic wafer scribing cut-off machine of many of a kind of improvement according to claim 1, is characterized in that: be also provided with workbench (9) in described frame (1), and Y-axis driving mechanism (6) is installed on described workbench (9).
3. the Semi-automatic wafer scribing cut-off machine of many of a kind of improvement according to claim 2, is characterized in that: described workbench (9) is marble workbench.
4. the Semi-automatic wafer scribing cut-off machine of many of a kind of improvement according to claim 1, is characterized in that: described rotary drive mechanism (4) is electric rotating machine, and scratch diskette (2) is connected with the main shaft of described electric rotating machine.
5. the Semi-automatic wafer scribing cut-off machine of many of a kind of improvement according to claim 1, is characterized in that: described cutting mechanism (3) is laser cutting mechanism.
6. the Semi-automatic wafer scribing cut-off machine of many of a kind of improvement according to claim 1, it is characterized in that: described Z axis driving mechanism (8) comprises motor (81), screw mandrel (82) and travelling nut (83), screw mandrel (82) is connected with the main shaft of motor (81), travelling nut (83) and screw mandrel (82) are spirally connected, and cutting mechanism (3) is connected with travelling nut (83).
7. the Semi-automatic wafer scribing cut-off machine of many of a kind of improvement according to claim 1, it is characterized in that: described X-axis driving mechanism (5) and Y-axis driving mechanism (6) include linear electric motors and linear slide rail, the electric mover that linear electric motors comprise motor stator and are connected with motor stator.
8. the Semi-automatic wafer scribing cut-off machine of many of a kind of improvement according to claim 1 ~ 7 any one, is characterized in that: the periphery of described frame (1) is provided with shell (11).
9. the Semi-automatic wafer scribing cut-off machine of many of a kind of improvement according to claim 1, is characterized in that: the bottom of described frame (1) is provided with leg (12) and universal wheel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520101831.8U CN204622354U (en) | 2015-02-12 | 2015-02-12 | A kind of Semi-automatic wafer scribing cut-off machine of many of improvement |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520101831.8U CN204622354U (en) | 2015-02-12 | 2015-02-12 | A kind of Semi-automatic wafer scribing cut-off machine of many of improvement |
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| CN204622354U true CN204622354U (en) | 2015-09-09 |
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| CN201520101831.8U Active CN204622354U (en) | 2015-02-12 | 2015-02-12 | A kind of Semi-automatic wafer scribing cut-off machine of many of improvement |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108788774A (en) * | 2018-06-27 | 2018-11-13 | 中海智能装备制造（深圳）有限公司 | A kind of marble platform process automation equipment |
| CN110744733A (en) * | 2019-09-25 | 2020-02-04 | 林金雄 | Wafer scribing machine with PLC built-in octagon chip based on conveying optimization |
| CN113909684A (en) * | 2021-11-18 | 2022-01-11 | 济南金刚石科技有限公司 | Operation table for crystal cutting of laser cutting machine |
-
2015
- 2015-02-12 CN CN201520101831.8U patent/CN204622354U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108788774A (en) * | 2018-06-27 | 2018-11-13 | 中海智能装备制造（深圳）有限公司 | A kind of marble platform process automation equipment |
| CN110744733A (en) * | 2019-09-25 | 2020-02-04 | 林金雄 | Wafer scribing machine with PLC built-in octagon chip based on conveying optimization |
| CN113909684A (en) * | 2021-11-18 | 2022-01-11 | 济南金刚石科技有限公司 | Operation table for crystal cutting of laser cutting machine |
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