CN204613857U - A kind of radiator structure of micromainframe - Google Patents
A kind of radiator structure of micromainframe Download PDFInfo
- Publication number
- CN204613857U CN204613857U CN201520302452.5U CN201520302452U CN204613857U CN 204613857 U CN204613857 U CN 204613857U CN 201520302452 U CN201520302452 U CN 201520302452U CN 204613857 U CN204613857 U CN 204613857U
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- CN
- China
- Prior art keywords
- radiator
- micromainframe
- heat radiation
- cpu
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a kind of radiator structure of micromainframe, comprise the chassis base installing mainboard, mainboard is provided with CPU, described chassis base one end is provided with the radiator raised up, radiator front and back sides is Back Word type, vertically be provided with some radiating grooves along radiator front and back sides direction, be equipped with radiating fin at the medial surface of radiator lateral surface and radiator Back Word cavity; Also comprise a heat radiation connector, heat radiation connector is connected with CPU and radiator respectively.The utility model heat radiation structure design is reasonable, micromainframe and the CPU heat distributed that works can be conducted on radiator fast by heat radiation connector, heat on radiator is fallen by radiating fin Quick diffusing again, thus reduce the temperature of micromainframe inside and CPU fast, ensure that micromainframe and CPU normally work, and extend the serviceable life of micromainframe and CPU20; This radiator structure area of dissipation is large, and good heat dissipation effect, radiating efficiency is high.
Description
Technical field
The utility model belongs to heat sink technology field, specifically a kind of radiator structure of micromainframe.
Background technology
Heating radiator is the important thermal component of computer, but because micromainframe is by space constraint, micromainframe cpu chip cannot directly dispel the heat by installation of heat radiator, if CPU works, the heat distributed does not distribute in time, to the normal work and use life-span of CPU be had a strong impact on, even affect the normal work and use life-span of whole micromainframe.
Summary of the invention
The technical problems to be solved in the utility model is to provide that a kind of area of dissipation is large, the radiator structure of good heat dissipation effect and the high micromainframe of radiating efficiency.
For solving the problems of the technologies described above, the utility model by the following technical solutions:
A kind of radiator structure of micromainframe, comprise the chassis base installing mainboard, mainboard is provided with CPU, described chassis base one end is provided with the radiator raised up, radiator front and back sides is Back Word type, vertically be provided with some radiating grooves along radiator front and back sides direction, be equipped with radiating fin at the medial surface of radiator lateral surface and radiator Back Word cavity; Also comprise a heat radiation connector, heat radiation connector is connected with CPU and radiator respectively.
Preferably, above-mentioned radiating fin is in being horizontally disposed with.
Preferably, above-mentioned heat radiation connector is L-type, and the flat end bottom surface of heat radiation connector is connected with CPU, and the vertical end lateral surface of heat radiation connector is connected with the medial surface of radiator.
Preferably, in above-mentioned heat radiation connector, be provided with hollow duct, in hollow duct, be packaged with working fluid.
Preferably, above-mentioned hollow duct inwall is provided with capillary structure.
Preferably, above-mentioned chassis base and radiator are structure as a whole, and chassis base and radiator are made up of Al squeezing material.
The utility model has following remarkable result:
The utility model heat radiation structure design is reasonable, by adopting said structure, micromainframe and the CPU heat distributed that works can be conducted on radiator fast by heat radiation connector, heat on radiator is fallen by radiating fin Quick diffusing again, thus reduce the temperature of micromainframe inside and CPU fast, ensure that micromainframe and CPU normally work, and extend the serviceable life of micromainframe and CPU20; This radiator structure area of dissipation is large, and good heat dissipation effect, radiating efficiency is high.
Accompanying drawing explanation
Accompanying drawing 1 is the utility model perspective view;
Accompanying drawing 2 is another angle perspective view of the utility model;
Accompanying drawing 3 is the utility model decomposition texture schematic diagram.
Embodiment
The utility model to be explained in further detail below in conjunction with accompanying drawing and embodiment for the ease of it will be appreciated by those skilled in the art that.
As illustrated in the accompanying drawings from 1 to 3, a kind of radiator structure of micromainframe, comprises the chassis base 1 of micromainframe, and the mainboard 10 of micromainframe is installed on chassis base 1, and the CPU20 of micromainframe is installed on mainboard 10.Wherein, be provided with the radiator 2 raised up in chassis base 1 one end, at this, chassis base 1 and radiator 2 are structure as a whole, and chassis base 1 and radiator 2 are made up of Al squeezing material, not only easy to process, and can increasing heat radiation area and improve heat dispersion; Radiator 2 front and back sides is Back Word type, some radiating grooves 21 are vertically provided with along radiator 2 front and back sides direction, radiating fin 22 is equipped with at the medial surface of radiator 2 lateral surface and radiator 2 Back Word cavity, radiating fin 22 is in being horizontally disposed with, greatly can increase area of dissipation, improve heat dispersion.
The present embodiment radiator structure also comprises a heat radiation connector 3, and this heat radiation connector 3 is made up of the material of good heat conductivity; This heat radiation connector 3 is in L-type, and the flat end bottom surface of heat radiation connector 3 is connected with CPU20, and the vertical end lateral surface of heat radiation connector 3 is connected with the medial surface of radiator 2.
When micromainframe works, CPU20 distributes amount of heat, and heat radiation connector 3 flat end carries out absorption heat, the vertical end of heat radiation connector 3 then by heat conduction on radiator 2; Heat on radiator 2 again by radiating fin 22 Quick diffusing, thus reduces the temperature of micromainframe inside and CPU20 fast, ensures that micromainframe and CPU20 normally work, and extends the serviceable life of micromainframe and CPU20.Double-deck radiating fin 22 in this enforcement on radiator 2 designs and is horizontally disposed with by radiating fin 22, all greatly can increase the area of dissipation of radiator 2, improves radiating efficiency; On radiator 2, arrange radiating groove 21 in addition, considerably increase the circulation of air, the heat accelerated on radiator 2 distributes, and improves radiating efficiency.
In order to improve the heat transfer efficiency of heat radiation connector 3, being provided with hollow duct (not shown), in hollow duct, being packaged with working fluid in heat radiation connector 3, this working fluid is low, the volatile liquid of boiling point, is easy to undergo phase transition and takes away heat; Be provided with capillary structure (not shown) at hollow duct inwall, this capillary structure is conducive to working fluid post liquefaction quick backflow.When heat radiation connector 3 flat end is heated, working fluid in heating end is heated and vaporizes, form gas, a large amount of heats is absorbed in the process of vaporization, gas passes to the vertical colling end of heat radiation connector 3 from the straight heating end of heat radiation connector 3, and cooling becomes liquid, and release heat, the ability discharged conducts on radiator 2, and cooled liquid is back to straight heating end by capillary structure under the capillary action of capillary structure.Circulation like this repeatedly, thus realizes the quick transmission of heat.Above-described embodiment is the preferred version that the utility model realizes; and indefiniteness is exhaustive; under same idea, the utility model can also have other variations; it should be noted that; under the prerequisite not departing from the present utility model design, any apparent replacement is all within the utility model protection domain.
Claims (1)
1. the radiator structure of a micromainframe, comprise the chassis base (1) installing mainboard (10), mainboard is provided with CPU(20), it is characterized in that: described chassis base one end is provided with the radiator (2) raised up, radiator front and back sides is Back Word type, vertically be provided with some radiating grooves (21) along radiator front and back sides direction, be equipped with radiating fin (22) at the medial surface of radiator lateral surface and radiator Back Word cavity; Also comprise a heat radiation connector (3), heat radiation connector is connected with CPU and radiator respectively.
2.the radiator structure of micromainframe according to claim 1, is characterized in that: described radiating fin is in being horizontally disposed with.
3.the radiator structure of micromainframe according to claim 2, is characterized in that: described heat radiation connector is L-type, and the flat end bottom surface of heat radiation connector is connected with CPU, and the vertical end lateral surface of heat radiation connector is connected with the medial surface of radiator.
4.the radiator structure of micromainframe according to claim 3, is characterized in that: be provided with hollow duct in described heat radiation connector, in hollow duct, be packaged with working fluid.
5.the radiator structure of micromainframe according to claim 4, is characterized in that: described hollow duct inwall is provided with capillary structure.
6.the radiator structure of the micromainframe according to any one of claim 1-5, is characterized in that: described chassis base and radiator are structure as a whole, and chassis base and radiator are made up of Al squeezing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520302452.5U CN204613857U (en) | 2015-05-12 | 2015-05-12 | A kind of radiator structure of micromainframe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520302452.5U CN204613857U (en) | 2015-05-12 | 2015-05-12 | A kind of radiator structure of micromainframe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204613857U true CN204613857U (en) | 2015-09-02 |
Family
ID=53966397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520302452.5U Expired - Fee Related CN204613857U (en) | 2015-05-12 | 2015-05-12 | A kind of radiator structure of micromainframe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204613857U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105324017A (en) * | 2015-12-02 | 2016-02-10 | 中国航空工业集团公司洛阳电光设备研究所 | Heat radiation device of display device |
-
2015
- 2015-05-12 CN CN201520302452.5U patent/CN204613857U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105324017A (en) * | 2015-12-02 | 2016-02-10 | 中国航空工业集团公司洛阳电光设备研究所 | Heat radiation device of display device |
| CN105324017B (en) * | 2015-12-02 | 2018-06-15 | 中国航空工业集团公司洛阳电光设备研究所 | A kind of radiator of display |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150902 Termination date: 20190512 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |