CN204558439U - A kind of vacuum cup taking off film for Taiko wafer - Google Patents
A kind of vacuum cup taking off film for Taiko wafer Download PDFInfo
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- CN204558439U CN204558439U CN201520239467.1U CN201520239467U CN204558439U CN 204558439 U CN204558439 U CN 204558439U CN 201520239467 U CN201520239467 U CN 201520239467U CN 204558439 U CN204558439 U CN 204558439U
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Abstract
The utility model describes a kind of vacuum cup taking off film for Taiko wafer, and comprise suction cup main body and be positioned at the sucker pipeline external tapping outside suction cup main body, the upper surface of this suction cup main body is provided with several micropores; Meanwhile, the inside of suction cup main body is provided with sucker pipeline, this sucker pipeline, micropore and sucker pipeline external tapping are communicated with mutually; In addition, the bottom of suction cup main body is provided with fixing sucking disk pedestal; Wherein, the edge of suction cup main body is provided with ledge structure, and sucker pipeline external tapping is provided with several fixing sucking disk screws.Owing to have employed above-mentioned technology, namely the utility model is provided with ledge structure by the edge in suction cup main body, and utilize the 3mm trough of this ledge structure and Taiko crystal round fringes to match, thus the leakage vacuum problem that occurs when can effectively avoid using Tiako wafer, and then reduce the risk of breaking when wafer takes off film, and finally reach the object improving product yield.
Description
Technical field
The utility model relates to field of semiconductor package, particularly relates to a kind of vacuum cup taking off film for Taiko wafer.
Background technology
Nowadays, in field of semiconductor package, the thickness after people require wafer thinning is more and more thinner, and wafer size is larger, and the warpage of thinning rear wafer is also more serious, causes the subsequent job (as operations such as back face metalizations) that cannot meet power device.
For above-mentioned warpage issues, the Tiako grinding wafer equipment of Disco commercial firm provides a kind of solution preferably, when namely grinding being carried out to wafer, retain the marginal portion (about about 3mm) of wafer periphery, make the warpage that effectively can be reduced wafer by this technique, reduce the risk of thin wafer carrying.
But, after wafer is thinning, also need the diaphragm removing wafer frontside; Now, wafer firmly holds with wafer size vacuum cup of the same size by general employing, more artificial or take off film arm and peeled off by wafer frontside diaphragm.Due to edge part about the 3mm remaining periphery of Tiako wafer, there is step at the back side, so when adopting existing vacuum cup, the situation of leaking vacuum easily occurs, thus causes product to break, thus cause the raising of production cost.
Utility model content
In order to solve above-mentioned mismatch problem, the utility model provides a kind of vacuum cup taking off film for Taiko wafer, can well mate the marginal texture of Tiako wafer, thus avoids the generation of the Lou situation such as vacuum.
Above-mentioned a kind of vacuum cup taking off film for Taiko wafer, comprise suction cup main body and be positioned at the sucker pipeline external tapping outside suction cup main body, the upper surface of described suction cup main body is provided with several micropores, the inside of described suction cup main body is provided with sucker pipeline, and described sucker pipeline, micropore and sucker pipeline external tapping are communicated with mutually; The bottom of described suction cup main body is provided with fixing sucking disk pedestal;
Wherein, the edge of described suction cup main body is provided with ledge structure, and described sucker pipeline external tapping is provided with several fixing sucking disk screws.
In the said equipment, the width of described ledge structure is 3mm.
In the said equipment, the height of described ledge structure is 4 ~ 5mm.
In the said equipment, the quantity of described fixing sucking disk screw is 8.
Advantage of the present utility model and beneficial effect are: the utility model provides a kind of vacuum cup taking off film for Taiko wafer, ledge structure is provided with by the edge in suction cup main body, and utilize the 3mm trough of this ledge structure and Taiko crystal round fringes to match, thus the leakage vacuum problem that occurs when can effectively avoid using Tiako wafer, and then reduce the risk of breaking when wafer takes off film, and finally reach the object improving product yield.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the end view of vacuum cup in the utility model;
Fig. 2 is the vertical view of vacuum cup in the utility model.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is further described.Following examples only for clearly the technical solution of the utility model being described, and can not limit protection range of the present utility model with this.
As depicted in figs. 1 and 2, the utility model describes a kind of vacuum cup taking off film for Taiko wafer, the sucker pipeline external tapping 5 comprising suction cup main body 1 and be positioned at outside it.
Wherein, the upper surface of suction cup main body 1 is provided with several micropores (not marking in the drawings), the inside of suction cup main body 1 is provided with sucker pipeline (not marking in the drawings) simultaneously, this sucker pipeline, micropore and sucker pipeline external tapping 5 are communicated with mutually, thus can the grinding part of Taiko wafer and edge step part mutually be held simultaneously.
In addition, be also provided with fixing sucking disk pedestal 4 in the bottom of suction cup main body 1, this fixing sucking disk pedestal 4 primary responsibility fixing sucking disk main body 1, thus ensure that the stable of technique carries out.
Unlike the prior art, the risk of breaking when Taiko wafer takes off film, the edge of the suction cup main body 1 in the utility model is provided with ledge structure 2, the width of this ledge structure 2 have employed the 3mm consistent with the trough, edge of Taiko wafer, be highly then 4 ~ 5mm, thus reach the object improving product yield.
Further, above-mentioned sucker pipeline external tapping 5 is provided with several fixing sucking disk screws 3; Meanwhile, in order to reach better fixed effect, in the utility model, the quantity of fixing sucking disk screw 3 is 8, and these 8 fixing sucking disk screws 3 are uniformly distributed in the surface of sucker pipeline external tapping 5, thus further increase firm performance.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (4)
1. take off the vacuum cup of film for Taiko wafer for one kind, comprise suction cup main body and be positioned at the sucker pipeline external tapping outside suction cup main body, the upper surface of described suction cup main body is provided with several micropores, the inside of described suction cup main body is provided with sucker pipeline, and described sucker pipeline, micropore and sucker pipeline external tapping are communicated with mutually; The bottom of described suction cup main body is provided with fixing sucking disk pedestal; It is characterized in that, the edge of described suction cup main body is provided with ledge structure, and described sucker pipeline external tapping is provided with several fixing sucking disk screws.
2. a kind of vacuum cup taking off film for Taiko wafer as claimed in claim 1, it is characterized in that, the width of described ledge structure is 3mm.
3. a kind of vacuum cup taking off film for Taiko wafer as claimed in claim 2, it is characterized in that, the height of described ledge structure is 4 ~ 5mm.
4. a kind of vacuum cup taking off film for Taiko wafer as claimed in claim 1, it is characterized in that, the quantity of described fixing sucking disk screw is 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520239467.1U CN204558439U (en) | 2015-04-20 | 2015-04-20 | A kind of vacuum cup taking off film for Taiko wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520239467.1U CN204558439U (en) | 2015-04-20 | 2015-04-20 | A kind of vacuum cup taking off film for Taiko wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204558439U true CN204558439U (en) | 2015-08-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520239467.1U Active CN204558439U (en) | 2015-04-20 | 2015-04-20 | A kind of vacuum cup taking off film for Taiko wafer |
Country Status (1)
| Country | Link |
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| CN (1) | CN204558439U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109887876A (en) * | 2017-12-06 | 2019-06-14 | 上海微电子装备（集团）股份有限公司 | Vacuum chuck, substrate adsorption method, laser anneal device and method |
| CN111312649A (en) * | 2020-02-25 | 2020-06-19 | 中芯集成电路制造(绍兴)有限公司 | Vacuum carrying platform, semiconductor machine table and film sticking device |
-
2015
- 2015-04-20 CN CN201520239467.1U patent/CN204558439U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109887876A (en) * | 2017-12-06 | 2019-06-14 | 上海微电子装备（集团）股份有限公司 | Vacuum chuck, substrate adsorption method, laser anneal device and method |
| CN109887876B (en) * | 2017-12-06 | 2020-02-21 | 上海微电子装备（集团）股份有限公司 | Vacuum chuck, substrate adsorption method, laser annealing device and method |
| CN111312649A (en) * | 2020-02-25 | 2020-06-19 | 中芯集成电路制造(绍兴)有限公司 | Vacuum carrying platform, semiconductor machine table and film sticking device |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |