CN204518054U - A kind of vibrating diaphragm for silicon microphone - Google Patents
A kind of vibrating diaphragm for silicon microphone Download PDFInfo
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- CN204518054U CN204518054U CN201520023310.5U CN201520023310U CN204518054U CN 204518054 U CN204518054 U CN 204518054U CN 201520023310 U CN201520023310 U CN 201520023310U CN 204518054 U CN204518054 U CN 204518054U
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Abstract
A kind of vibrating diaphragm for silicon microphone, it is characterized in that: described vibrating diaphragm comprises basal plane and is arranged on multiple hollow protrusions of described basal plane homonymy, described hollow protrusions has concave surface, bottom surface and sidewall, described concave surface and described basal plane in the same plane, described bottom surface parallels with described basal plane; The height of described hollow protrusions is higher than 1.5 times of described basal plane thickness; The maximum gauge that larger area among described concave surface or described bottom surface has is in 0.5-50 micrometer range, and the ratio of the maximum gauge that has of described larger area and minimum diameter is not more than 5: 1.Proposition of the present utility model, the each local that can be implemented on vibrating diaphragm with existing technological level is all reached and preferably improves effect, thus the mechanical characteristic of adjustment vibrating diaphragm, further to improve the indexs such as sensitivity, the linearity, signal to noise ratio, sensitization capacitance, dynamic response.
Description
Technical field
The utility model relates to a kind of silicon microphone technical field, particularly a kind of silicon microphone vibrating diaphragm through optimizing.
Background technology
Micro electronmechanical (MEMS micro-electro-mechanical system) microphone or claim silicon microphone because its volume is little, be suitable for the advantages such as surface mount and be widely used in the sound collection of tablet electronic device, such as: mobile phone, MP3, recording pen and monitoring equipment etc.In correlation technique, silicon capacitor microphone comprises sensitive structure, supporting integrated circuit and package parts, and sensitive structure comprises again substrate, back pole plate and vibrating diaphragm.Wherein, vibrating diaphragm is the core component of silicon capacitor microphone, both needed responsive sound pressure signal it is converted into the signal of telecommunication delicately, need again to blow at extraneous blast hit, retention normally works substantially unchangeably after the stress of dropping shock and inner processing technology release effect of stress.Vibrating diaphragm, when normally working, is out of shape by the electrostatic force of electrical signal generation and the sound forceful action of acoustic signal generation simultaneously.This distortion is converted into capacitance change signal by sensitive structure, and diaphragm is out of shape corresponding capacitance change signal and detects and be converted into electrical signal and export by supporting integrated circuit by sound forceful action.
What the utility model was paid close attention to is its mechanical characteristic of shape optimum by arranging vibrating diaphragm itself, thus discharges the stress optimization vibration shape.This determines the responsive vibration shape of vibrating diaphragm and suppresses other not need the key technology of the vibration shape, directly relevant to the index such as sensitivity, the linearity, signal to noise ratio, pick-up voltage, sensitization capacitance, dynamic response of silicon capacitor microphone.
Traditional silicon microphone is generally make smooth vibrating diaphragm, because such vibrating diaphragm is produced on, technique to realize difficulty minimum also the most directly perceived, or some elongated folds are set on vibrating diaphragm as Chinese patent CN203206466U, or discharge the stress optimization vibration shape in some girder constructions of vibrating diaphragm edge designs as Chinese patent CN10157285A.
But, find in practice, although these optimization means existing are effective, because vibrating diaphragm is thinner diaphragm, set optimizing structure only has preferably improvement result to neighbouring vibrating diaphragm of optimizing structure, less for the impact from the region away from optimizing structure.Therefore, be necessary to provide a kind of novel vibrating diaphragm for this problem, make its all region optimized that needs on vibrating diaphragm all can obtain preferably improvement result, and for ensureing the substitutability of new vibrating diaphragm scheme, the new departure provided need overcome or avoid the new problem itself introduced of optimizing structure, and compatible to ensure lower cost with the typical production process of existing silicon microphone.
Summary of the invention
The purpose of this utility model is to provide a kind of vibrating diaphragm for silicon microphone, can improve the vibrating diaphragm vibration shape under existing technological level, optimize mechanics I, thus optimize the index such as sensitivity, the linearity, signal to noise ratio, sensitization capacitance, dynamic response.
For reaching above-mentioned purpose, the technical solution adopted in the utility model is:
A kind of vibrating diaphragm for silicon microphone, described vibrating diaphragm comprises basal plane and is arranged on multiple hollow protrusions of described basal plane homonymy, described hollow protrusions has concave surface, bottom surface and sidewall, described concave surface and described basal plane in the same plane, described bottom surface parallels with described basal plane; The height of described hollow protrusions is higher than 1.5 times of described basal plane thickness; The maximum gauge that larger area among described concave surface or described bottom surface has is in 0.5-50 micrometer range, and the ratio of the maximum gauge that has of described larger area and minimum diameter is not more than 5:1.Further mechanical analysis is pointed out, when the height of described hollow protrusions is less than basal plane thickness 1.5 times, projection very depends on rising height to the impact of the mechanical characteristic of its neighboring area, and this can have very high required precision to the height of projection, is equivalent to add the cost of technique in present stage.Hollow protrusions can be subject to larger technological fluctuation impact when size is less than 0.5 micron; And the inconsistency of its technique distribution also can embody in single projection when being greater than 50 microns, thus affect the technique effect that it optimizes vibrating diaphragm mechanical characteristic; When the length-width ratio of projection is more than 5 times, the mechanical characteristic impact of projection on its length and width both direction differs greatly, and inconsistent to the sensitivity of fabrication error.
Preferably for the vibrating diaphragm of silicon microphone, the material of wherein said vibrating diaphragm is doped polycrystalline silicon.Usually, the material for vibrating diaphragm has doped polycrystalline silicon, doped monocrystalline silicon and metal.Polysilicon is isotropic material, and monocrystalline silicon is anisotropic material, and has higher plastic deformation composition in the distortion of metal material, after both will introduce comparatively complicated mechanical characteristic due to material itself.Therefore, in these three kinds of materials, doped polycrystalline silicon is as isotropic elasticity material, the most convenient for arranging vibrating diaphragm mechanical characteristic.
Preferably for the vibrating diaphragm of silicon microphone, the angle between the basal plane of wherein said hollow protrusions and sidewall is between 45 degree of-135 degree.。If described angle is too little, then easily cause stress to be concentrated, vibrating diaphragm reliability is affected; If described angle is too large, then technique realization will by considerable influence.
Preferably for the vibrating diaphragm of silicon microphone, the height of the hollow protrusions of wherein said vibrating diaphragm exceedes 2 times of basal plane thickness.Mention above, when the height of described hollow protrusions is less than basal plane thickness 1.5 times, the mechanical characteristic impact of projection on its neighboring area very depends on rising height; Further mechanical analysis result display, when the height of described hollow protrusions is greater than basal plane thickness 2 times, the mechanical characteristic impact of projection on its neighboring area is very little to the dependence of rising height, so just can need to arrange rising height according to technique, and can ensure that the fabrication error in short transverse is very little on the impact of vibrating diaphragm mechanical characteristic.
Preferably for the vibrating diaphragm of silicon microphone, in wherein said hollow protrusions, the shape of concave surface or bottom surface can be circular or convex polygon.Concave polygon easily causes stress to be concentrated at edge, and vibrating diaphragm reliability is affected.
Preferably for the vibrating diaphragm of silicon microphone, the minimum edge distance wherein between adjacent two hollow protrusions is not less than 3 times of described basal plane thickness.Mechanical analysis shows, when the distance of adjacent two raised edges is less than 3 times of basal plane thickness, the mechanical characteristic of adjacent two projections will influence each other due to hypotelorism, thus make the mechanical characteristic of vibrating diaphragm be subject to the change of manifold type, this, by introducing extra design theory, adds the complexity of mechanical model.
Preferably for the vibrating diaphragm of silicon microphone, wherein said multiple hollow protrusions has identical size shape and by equidistant arrangement.Now all projections and arrangement mode identical, affect all less by fabrication error, can the mechanical characteristic of vibrating diaphragm after calculating and setting projection more exactly.
Preferably for the vibrating diaphragm of silicon microphone, wherein said multiple hollow protrusions arranges different arrangement pitches along with the difference of distance vibrating diaphragm center.。Because general vibrating diaphragm mechanical deformation situation is relevant with from its center distance, the demand therefore optimized the mechanical characteristic of each local of vibrating diaphragm is also relevant with the distance from its center, therefore can arrange arrangement pitches by the relation from its center distance.
Preferably for the vibrating diaphragm of silicon microphone, wherein said multiple hollow protrusions arranges different size and dimensions along with the difference of distance vibrating diaphragm center.Because general vibrating diaphragm mechanical deformation situation is relevant with from its center distance, the demand therefore optimized the mechanical characteristic of each local of vibrating diaphragm is also relevant with the distance from its center, therefore can arrange projection size and shape by the relation from its center distance.
Owing to adopting technique scheme and general MEMS preparation method, vibrating diaphragm arranges projection and uses the MEMS technology with common processes compatibility, the beneficial effects of the utility model are: can under existing technological level, the Stress Release of silicon capacitor microphone vibrating diaphragm and the vibration shape thereof are optimized owing to applying design means of the present utility model, thus the indexs such as its sensitivity, the linearity, signal to noise ratio, sensitization capacitance, dynamic response are improved.Owing to using the technical solution of the utility model, keeping enhancing product performance in the substantially constant basis of production efficiency, reliability, yield and cost, the application scenario of product can be widened, increases product competitiveness.
Accompanying drawing explanation
Fig. 1 is the vibrating diaphragm technical scheme cross-sectional schematic arranging hollow protrusions of the present utility model.
Fig. 2 is the vibrating diaphragm technical scheme schematic three dimensional views of preferred embodiment of the present utility model;
Fig. 3 is the comparison of preferred embodiment of the present utility model to the load-displacement curves of comparative example;
Description of reference numerals: 10-vibrating diaphragm; 101-basal plane; 102-hollow protrusions; 1021-concave surface; 1022-sidewall; 1023-bottom surface; The height of h-hollow protrusions; Minimum edge distance between w-adjacent hollow projection.
Embodiment
The utility model provides a kind of vibrating diaphragm for silicon microphone, can improve the vibrating diaphragm vibration shape under existing technological level, thus optimizes the indexs such as sensitivity, the linearity, signal to noise ratio, pick-up voltage, sensitization capacitance, dynamic response.Below in conjunction with concrete drawings and Examples, the utility model is described in further detail.
As shown in Figure 1, the utility model arranges multiple hollow protrusions 102 on the basal plane 101 of vibrating diaphragm 10, and it has concave surface 1021, sidewall 1022 and bottom surface 1023.The height h of hollow protrusions 102 is all higher than 1.5 times of basal plane 101 thickness, and the maximum direction size of hollow protrusions 102 is in 0.5 ~ 50 micrometer range and length-width ratio is no more than 5 times.Hollow protrusions 102 is set to hollow and non-solid reason by the utility model, is to realize because hollow protrusions is comparatively convenient to technique, and more convenient for the optimization of vibrating diaphragm mechanical characteristic.During concrete enforcement, minimum spacing w between the angle of the concave surface 1021 of hollow protrusions 102 and the shape of bottom surface 1023, size, height h, sidewall 1022 and basal plane 101 and adjacent two hollow protrusions 102, all determines according to the mechanical characteristic optimization needs often locating vibrating diaphragm.
Fig. 2 is a preferred embodiment of the present utility model.The size shape of set hollow protrusions 102 is identical and by equidistantly arrangement.In the present embodiment, the thickness of basal plane 101 is 0.5 micron, and the height h of hollow protrusions 102 is 4 microns, and bottom surface and concave surface are the circle of diameter 8 microns, and the minimum range w at its adjacent two hollow protrusions 102 edges is 4 microns.Whole vibrating diaphragm covering diameter is 800 microns, the border circular areas that edge is fixing.Material is doped polycrystalline silicon.
Comparative example of the present utility model is the smooth vibrating diaphragm of circle that an edge is fixed, and thickness is 0.5 micron, and material is doped polycrystalline silicon.
Fig. 3 is that the preferred embodiment of utility model is to the comparison of the load-displacement curves of comparative example.Can obtain both load-displacement curves shown in Fig. 3 by mechanical analysis, " smooth vibrating diaphragm " represents the result of comparative example, and " projection vibrating diaphragm " represents the analysis result of the utility model preferred embodiment.When silicon microphone normally works, be out of shape by the electrostatic force of electrical signal generation and the sound forceful action of acoustic signal generation, wherein electrostatic force is comparatively large, and sound intensity power is less.In other words, on load-displacement curves, the displacement of each point determines sensitive structure working point under electrostatic forces, and on load-displacement curves, the tangent slope of each point determines the sensitivity of the sensitive structure of silicon capacitor microphone.Obviously, in the first half section of curve, under same displacement (working point), the sensitive structure sensitivity of smooth vibrating diaphragm is higher, and in second half section of curve, under same displacement (working point), the sensitivity of the sensitive structure of the projection vibrating diaphragm of the utility model preferred embodiment is higher.Usually, in order to make the signal of telecommunication of silicon capacitor microphone more by force and not easily be disturbed, all working point can be arranged on the second half section of curve.Therefore, preferred embodiment of the present utility model has comparatively clear superiority than comparative example.
Illustrative to description of the present utility model above; and it is nonrestrictive; those skilled in the art is understood, and can carry out many amendments, change or equivalence, but they all will fall in protection range of the present utility model within the spirit and scope of claim restriction to it.
Claims (8)
1. the vibrating diaphragm for silicon microphone, it is characterized in that: described vibrating diaphragm comprises basal plane and is arranged on multiple hollow protrusions of described basal plane homonymy, described hollow protrusions has concave surface, bottom surface and sidewall, described concave surface and described basal plane in the same plane, described bottom surface parallels with described basal plane; The height of described hollow protrusions is higher than 1.5 times of described basal plane thickness; The maximum gauge that larger area among described concave surface or described bottom surface has is in 0.5-50 micrometer range, and the ratio of the maximum gauge that has of described larger area and minimum diameter is not more than 5:1.
2. the vibrating diaphragm for silicon microphone according to claim 1, is characterized in that, the material of described vibrating diaphragm is doped polycrystalline silicon.
3. the vibrating diaphragm for silicon microphone according to claim 1, is characterized in that, the angle between the basal plane of described hollow protrusions and sidewall is between 45 degree of-135 degree.
4. the vibrating diaphragm for silicon microphone according to claim 1, is characterized in that, the height of the hollow protrusions of described vibrating diaphragm exceedes 2 times of described basal plane thickness.
5. the vibrating diaphragm for silicon microphone according to claim 1, is characterized in that, in described hollow protrusions, the shape of concave surface or bottom surface is circular or convex polygon.
6. the vibrating diaphragm for silicon microphone according to claim 1, is characterized in that, the minimum edge distance between adjacent two hollow protrusions is not less than 3 times of described basal plane thickness.
7. the vibrating diaphragm for silicon microphone according to claim 1, is characterized in that, described multiple hollow protrusions has identical size shape and by equidistant arrangement.
8. the vibrating diaphragm for silicon microphone according to claim 1, is characterized in that, described multiple hollow protrusions arranges different arrangement pitches along with the difference of distance vibrating diaphragm center.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520023310.5U CN204518054U (en) | 2015-01-13 | 2015-01-13 | A kind of vibrating diaphragm for silicon microphone |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520023310.5U CN204518054U (en) | 2015-01-13 | 2015-01-13 | A kind of vibrating diaphragm for silicon microphone |
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| CN204518054U true CN204518054U (en) | 2015-07-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108600919A (en) * | 2018-07-04 | 2018-09-28 | 歌尔股份有限公司 | A kind of vibrating diaphragm and sound-producing device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108600919A (en) * | 2018-07-04 | 2018-09-28 | 歌尔股份有限公司 | A kind of vibrating diaphragm and sound-producing device |
| CN108600919B (en) * | 2018-07-04 | 2024-08-30 | 歌尔股份有限公司 | Vibrating diaphragm and sound production device |
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Effective date of registration: 20180724 Address after: 261206 Fengshan Road, Fangzi District, Weifang, Shandong Province, No. 68 Patentee after: Shandong Gettop Acoustic Co.,Ltd. Address before: 100191 Beijing Haidian District Zhichun Road 23 quantum Ginza 1002 room Patentee before: Beijing Acuti Microsystems Co., Ltd. |