CN204482148U - 电路板和电路板设备 - Google Patents

电路板和电路板设备 Download PDF

Info

Publication number
CN204482148U
CN204482148U CN201420807719.1U CN201420807719U CN204482148U CN 204482148 U CN204482148 U CN 204482148U CN 201420807719 U CN201420807719 U CN 201420807719U CN 204482148 U CN204482148 U CN 204482148U
Authority
CN
China
Prior art keywords
circuit board
internal layer
section
skin
power switch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420807719.1U
Other languages
English (en)
Chinese (zh)
Inventor
维尔弗里德·拉斯曼
迈克尔·施佩伯
马蒂亚斯·黑尔德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF Friedrichshafen AG
Original Assignee
ZF Friedrichshafen AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZF Friedrichshafen AG filed Critical ZF Friedrichshafen AG
Application granted granted Critical
Publication of CN204482148U publication Critical patent/CN204482148U/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN201420807719.1U 2013-12-18 2014-12-18 电路板和电路板设备 Expired - Fee Related CN204482148U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013226513.1A DE102013226513A1 (de) 2013-12-18 2013-12-18 Leiterplatte, Verfahren zum Herstellen derselben und Leiterplattenvorrichtung
DE102013226513.1 2013-12-18

Publications (1)

Publication Number Publication Date
CN204482148U true CN204482148U (zh) 2015-07-15

Family

ID=53192490

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420807719.1U Expired - Fee Related CN204482148U (zh) 2013-12-18 2014-12-18 电路板和电路板设备

Country Status (3)

Country Link
CN (1) CN204482148U (de)
DE (1) DE102013226513A1 (de)
FR (1) FR3015177A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109874224A (zh) * 2017-12-05 2019-06-11 Zf 腓德烈斯哈芬股份公司 印制电路板和用于制造印制电路板的方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016204777A1 (de) 2016-03-23 2017-09-28 Zf Friedrichshafen Ag Mehrlagige Hochspannungsleiterplatte

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4305793A1 (de) * 1993-02-25 1994-09-01 Telefunken Microelectron Leistungsmodul
KR100371877B1 (ko) * 1997-04-16 2003-02-11 가부시끼가이샤 도시바 배선기판과 배선기판의 제조방법 및 반도체 패키지
KR100355828B1 (ko) * 2000-01-19 2002-11-04 엘지전자 주식회사 전기/전자 제품용 단일 모듈 시스템
US7629541B2 (en) * 2006-06-19 2009-12-08 Endicott Interconnect Technologies, Inc. High speed interposer
FR2971666B1 (fr) * 2011-02-10 2014-11-14 Hager Controls Bloc electrique de controle utilisant la technologie des circuits imprimes pour le conducteur des lignes de puissance
DE102011077206B4 (de) 2011-06-08 2019-01-31 Zf Friedrichshafen Ag Leiterplatte und Steuergerät für ein Getriebe eines Fahrzeugs mit der Leiterplatte

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109874224A (zh) * 2017-12-05 2019-06-11 Zf 腓德烈斯哈芬股份公司 印制电路板和用于制造印制电路板的方法

Also Published As

Publication number Publication date
FR3015177A1 (fr) 2015-06-19
DE102013226513A1 (de) 2015-06-18

Similar Documents

Publication Publication Date Title
CN104900634A (zh) 封装结构及其所适用的堆栈式封装模块
US10515763B2 (en) Method of assembling a capacitor assembly
US20140334203A1 (en) Power converter and method for manufacturing power converter
JP6358129B2 (ja) 電力変換装置
CN109856734A (zh) 一种光器件的管壳
CN105210281A (zh) 变流器设备和用于制造变流器设备的方法
CN204482148U (zh) 电路板和电路板设备
CN102903681A (zh) 在功率半导体模块中的衬底的柔性连接
JP2014519704A (ja) 電子部品のためのプリント回路基板及びプリント回路基板システム
CN110268520A (zh) 用于集成功率芯片以及形成散热器的汇流条的方法
CN108933126A (zh) 电子组件、照明装置以及用于制造电子组件的方法
CN106717135A (zh) 印刷电路板和印刷电路板布置
US10820408B2 (en) Multi-layer circuit board and electronic assembly having same
EP2819163B1 (de) Chipstapelstruktur
CN103503585A (zh) 电路载体
US20150126049A1 (en) Electrical circuit for the interconnection of an electrical component, such as a power component
US7952204B2 (en) Semiconductor die packages with multiple integrated substrates, systems using the same, and methods using the same
CN102185411A (zh) 一种电压调节器刷架总成
CN109874224A (zh) 印制电路板和用于制造印制电路板的方法
CN106449047B (zh) 大电流平面变压器及其制作方法
CN108122866B (zh) 一种集成化功率模块
CN109496386A (zh) 载板与电路板之间布置有器件的电路板设施、带有该电路板设施的逆变器和机动车驱动系统
CN220586506U (zh) 多层线路连接模块及led模组
CN117412485B (zh) 一种基于pcb的电机控制器
CN102573296B (zh) 用于驱动至少一个光源的电路布置和其制造方法

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150715

Termination date: 20201218

CF01 Termination of patent right due to non-payment of annual fee