CN204482148U - Circuit board and circuit board apparatus - Google Patents

Circuit board and circuit board apparatus Download PDF

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Publication number
CN204482148U
CN204482148U CN201420807719.1U CN201420807719U CN204482148U CN 204482148 U CN204482148 U CN 204482148U CN 201420807719 U CN201420807719 U CN 201420807719U CN 204482148 U CN204482148 U CN 204482148U
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CN
China
Prior art keywords
circuit board
internal layer
section
skin
power switch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420807719.1U
Other languages
Chinese (zh)
Inventor
维尔弗里德·拉斯曼
迈克尔·施佩伯
马蒂亚斯·黑尔德
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ZF Friedrichshafen AG
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ZF Friedrichshafen AG
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Filing date
Publication date
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Publication of CN204482148U publication Critical patent/CN204482148U/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The utility model proposes a kind of circuit board (200) with multiple layers, its have at least one skin (241,246) with at least one the first electric leads adjacent with outer (241,246) with at least one, with the internal layer (243,245) of at least one the second wires.The feature of circuit board (200) is, at least one the first electric leads and at least one the second electric lead cloth are arranged with having identical coverage each other, at this, circuit board (200) have at least one by laser manufacture, for electrical connection and/or at least one skin of hot link (241,246) and at least one break-through contact site (247) with skin (241,246) adjacent internal layer (242,245).The utility model also proposed a kind of circuit board apparatus.

Description

Circuit board and circuit board apparatus
Technical field
The utility model relates to and a kind ofly has the circuit board of multiple layers, a kind of circuit board apparatus with this circuit board and a kind of method of circuit board for the manufacture of having multiple layers.
Background technology
High volt system can comprise several functions.At this, these functions can be assigned to different circuit carriers in other words on circuit board usually.Such as it is possible that arrange a kind of for obtaining or the control circuit carrier of processing signals, wherein, high volt power switch and driving control device thereof can be assemblied on drive circuit carrier.
DE 10 2,011 077 206 A1 relate to a kind of have the circuit board of multiple layers and a kind of gearbox for vehicle, with the controller of this circuit board, particularly relate to application that is outer and the break-through contact site of the first internal layer.
Utility model content
Under this background, the utility model according to independent claims propose a kind of improvement, there is the circuit board of multiple layers, a kind of improvement, the circuit board apparatus with this circuit board and a kind of improvement, for the manufacture of the method for circuit board with multiple layers.Favourable design draws by dependent claims and the following description.
Especially can implement the circuit board of multilayer according to execution mode of the present utility model as follows, that is, the break-through contact site of boring a hole by laser can be adopted in order to connect outer and adjacent internal layer.In order to adopt laser perforation techniques, such as, roughly can be connected in parallel outer and adjacent internal layer the first internal layer in other words, wherein, conductor rail or signal conductor coverage are arranged on outer and adjacent internal layer in the same manner.Therefore, what especially can prevent is, between skin and adjacent internal layer, occur the current potential being greater than 100V, and the spacing that therefore can reduce between outer and adjacent internal layer is until a numerical value, the permission of this numerical value produces the break-through contact site between skin and adjacent inner layer by laser.At this, such as, can provide a kind of and there is the highdensity high volt circuit board by the break-through contact site so-called high-density laser perforation in other words of laser manufacture.
Such as when the most about 0.1 millimeter of the vertical interval of outer and adjacent internal layer, can set up with the hot link of laser break-through contact site or be electrically connected.In high volt application or HV application, there is the regulation of such as IEC60664, described regulation requires: when the current potential of the signal on electric lead is in the different layers greater than 100 volts, these signals must have the spacing of minimum 0.2 millimeter.Can provide a solution according to execution mode of the present utility model, this solution allows to adopt laser drilling processes in high volt application.
According to embodiment of the present utility model, this circuit board in other words circuit carrier does not especially need to be connected by additional plug connector yet.Such as do not need multiple circuit carrier that individually should manufacture, assemble and install.Therefore the interconnection technique realizing expending is not needed in other words between circuit carrier at this circuit board, as such as passing through plug, wire jumper or analog.Thus, connecting portion particularly obtains relative to environmental impact, such as burn into temperature cycle, vibration or the connection that endurance is higher with regard to Electronmagnetic Stamina or EMV.Therefore, particularly durable interconnection technique can be realized in mentioned point according to execution mode of the present utility model.
In an advantageous manner, therefore especially can to consider according to execution mode of the present utility model and the requirement met the favourable and highly integrated Joining Technology that high volt system (HVS) proposes and existing insulating requirements.Convenient and space-saving with the Joining Technology realized by break-through contact site or the so-called laser beam perforation of laser beam perforation.Such as can realize thermal impedance and all low steel structure of electrical impedance thus, this can play active influence to the heat radiation of HV power semiconductor and the EMV characteristic of this kind of circuit board and whole system.Especially can realize according to execution mode of the present utility model, interconnection technique circuit board can saved He expend.Such as can abandon extra outer connecting element at this, and can set up in circuit carrier material sealed, anti-EMV, the connection of heatproof.Especially can make full use of that existed in circuit board, that low thermal impedance and low resistance are anti-connection, this make a kind of anti-EMV's and the good system configuration of thermal conductivity becomes possibility.Necessary structure space can also be reduced by saving outside Connection Element.Possible, itself be incorporated into a circuit board by for the Trigger Function of power switch and HV power switch.
A kind of circuit board with multiple layers, these layers have at least one skin with at least one the first electric leads adjacent with described skin with at least one, with the skin of at least one the second electric leads, it is characterized in that, at least one the first electric leads and at least one the second electric leads construct with having identical coverage each other, wherein, circuit board has at least one break-through contact site by laser manufacture, for being electrically connected and/or at least one outer internal layer adjacent with described skin with at least one of hot link.
Circuit board can be such as a part for the controller for transmission for vehicles or other Vehicular system, such as electric drive, power electronic device or high volt system.Circuit board can be the circuit board of the circuit for assembling or be assembled with electric components.Circuit board can have the pile be made up of multiple layer.Multiple layer can be stacked, so that the basic structure of forming circuit plate.At least one skin of circuit board can be the outermost layer of multiple layers of circuit board.Circuit board can have skin respectively on opposite side.Circuit board can have multiple layer be made up of electrical insulating material, such as, make, such as, by the glass fiber material strengthened through epoxides by compo compound or through fiber strengthened plastics or through the glass fabric that plastics are strengthened.Circuit board can be used as the carrier of circuit.The layer be made up of electrical insulating material can apply the coating that can conduct electricity.The connector that can conduct electricity or electric lead that conductor rail or conducting surface are used as circuit can be formed thus on electrical insulating material.Usually the lamination system of electric conducting material such as copper can be formed or etch and form by very thin by conductive layer.At least one the first electric lead conductor rail or conducting surfaces in other words can be furnished with at least one skin.At least one the second electric lead conductor rail or conducting surfaces in other words can be furnished with at least one internal layer.The electric lead each other with identical coverage can represent identical wire pattern or identical wire trend in skin and internal layer.At least one the first electric leads and at least one the second electric leads can be in parallel or be connected roughly in parallel at this.For this reason, electric lead can be interconnected when applying break-through contact site.At least one break-through contact site such as can be formed by laser technology.Therefore, break-through contact site can be such as so-called miniature break-through contact site or laser beam perforation.Particularly at least one break-through contact site can be shaped as blind hole.At least one break-through contact site may be used for setting up the company's grounding construction between at least one skin of circuit board and at least one internal layer.
According to execution mode, circuit board can be divided at least one control part section for the treatment of control signal and at least one is for triggering the drive division section of at least one high volt power switch.Can occur than at the high current potential of control part Duan Zhonggeng in drive division section.Therefore, such as can realize on same circuit carrier the high control of volt power switch and the function of drived control as high volt power switch itself.Controlling functions such as comprises many constructing modules with highly integrated housing form mostly, such as BGA (ball grid array) or TQFP (slim quad flat package).This can require the highdensity syndeton in from component connector to circuit board, and this can be realized by compact and favourable Joining Technology, such as laser beam perforation technique.Control part section and drive division section can extend through all layer ground of circuit board.This execution mode provides following advantage, that is, different, relevant to function portion's sections of circuit board can be realized by common, continuous print layer building.
At this, at least one the first electric leads and at least one the second electric leads can be arranged while at least there is each other identical coverage in drive division section.This execution mode provides following advantage, that is, can not occur the current potential being greater than 100V between the first electric lead and the second electric lead in drive division section.The little spacing between outer and adjacent internal layer can be realized thus.Can realize in the circuit board thus by the break-through contact site of laser manufacture.
According to execution mode, in control part section, at least one the first electric leads and at least one the second electric lead concentrated vectorings can be become common wire.Common wire can be directed on unique layer of circuit board as unique conductor rail.The conductor layouts in control part section can be simplified by this way.
Circuit board can also have at least one for by least one control part section and the interconnective connecting portion section of at least one drive division section.At this, circuit board can have at least one electrical connecting wire in connecting portion section, or is shaped isolator on circuit and has transmitting device.Connecting portion section can extend through all layer ground of circuit board.Isolation on the circuit can facilitating between control part section and drive division section by high volt power switch in high volt system.For this reason, the conductive material of the existence in the connecting portion section between control part section and drive division section is eliminated, such as copper.Transmitting device such as constructs optically or inductively, for setting up the connection between control part section and drive division section.This execution mode provides following advantage, even if also can abandon outside Connection Element in the flexible program of that is, circuit being isolated.The multilayer execution mode of connecting portion section brings following advantage, that is, one or more layers of copper can be applied in the screen potential for adjacent wire.Whole face particularly in connecting portion section can shield the wire in adjacent layer, is presented as the reverse current path of adjacent wire guide in other words.Therefore, the directed parallel of going stream and adverse current can be realized by the layout of current-symmetrical.This can make the magnetic field outside current-symmetrical structure and interference be completely eliminated.In addition, this ground plane can prevent such as from the impact of interference settling nigh component or wire.Therefore, the further reduction of the structure space of such as electronic control mechanism can be realized.In addition, the filter that face can be used as electric field kept away by the screen closed.Utilize this structure can optimize signal quality and signal integrity.
Especially, circuit board can have the drive division section of multiple isolated layout, and they are connected with common control part section via multiple connecting portion section.Therefore, drived control function can be realized in high volt island.High volt island can be for high volt power switch provides the portion's section driving function at this.These high volt islands usually can with reference to following reference potential at this, the emitter of such as power switch or source electrode.At this, can construct high volt island in order to pilot signal, described signal has the difference having lacked several volts with regard to their reference current potential.This execution mode provides following advantage, that is, laser perforation techniques also can be adopted here to be used for break-through contact site by the almost parallel property in high volt island.
Outer such as can have the constant thickness being less than or equal to 70 μm.Adjacent internal layer can have the thickness being less than or equal to 70 μm.Thus, by the outer break-through contact site realized in laser beam perforation technique, can reliably by internal layer, the wire with very large potential difference can be separated mutually on the other hand on the one hand.
According to execution mode, circuit board can have first outer and the first internal layer, and they are furnished with the circuit board basic material with the first thickness via at least one between which by the first break-through contact site connection of laser manufacture; And there is second outer and the second internal layer, they are furnished with the circuit board basic material with the first thickness via at least one between which by the second break-through contact site connection of laser manufacture.At this, the circuit board basic material with the second thickness can be furnished with between the first internal layer and the second internal layer, described second thickness is greater than the first thickness, or is furnished with at least one extra play, is furnished with the circuit board basic material with the second thickness between this extra play and internal layer.Each layer of circuit board jointly can form pile.Second thickness particularly can be more than or equal to 0.2mm.First thickness can be suitable for realizing producing break-through contact site by laser.Second thickness can be suitable for realizing having the insulation between the layer of high potential difference or isolation.At least one extra play can have at least one other internal layer.At this, at least one extra play may be used for guiding supply power voltage or providing other to construct functionally.The order of layer in pile can be such as: the first skin, circuit board basic material, the first internal layer, circuit board basic material, at least one extra play, circuit board basic material, the second internal layer, circuit board basic material and the second skin.This Rotating fields of circuit board, for being exemplary according to the advantage of execution mode of the present utility model, particularly just being saved space and can realize with regard to laser beam perforation in the layer of the signal for having high potential difference.
Circuit board apparatus has following characteristics:
The execution mode with the circuit board of multilayer previously mentioned;
At least one high volt power switch be electrically connected with circuit board; And
Housing, circuit board and at least one high volt power switch are arranged in this housing at least in part.
Can advantageously adopt or use the execution mode of the circuit board previously mentioned in conjunction with this circuit board apparatus.Circuit board apparatus such as can be used as the high volt system of vehicle.High volt power switch such as can be understood as single MOSFET or IGBT, multiple parallel connection the MOSFET of logic switch function, the B2 electric bridge be provided in common module or B6 electric bridge or similar device are provided.At least one high volt power switch can be electrically connected with the drive division section of circuit board.Also can be adjacent to be furnished with multiple high volt power switch with the skin of circuit board.At least one high volt power switch can be installed or install on circuit boards and/or on housing.Circuit board apparatus may be used for constructing with guiding the high electric current of at least one high-current circuit plate.At this, circuit board apparatus can have circuit board and at least one high-current circuit plate, or circuit board also can have high Ampereconductors function.Therefore, can multiple functions of high volt system be combined to as multifunction circuit board in circuit board, be combined in other words in unique circuit carrier.
High volt power supply connector, expendable part joint can be provided with according to execution mode and control joint.At this, high volt power supply connector and expendable part joint can be arranged in an energy flow plane, wherein, control joint and arrange or be arranged in about this energy flow flat transverse on the normal of this energy flow plane.At this, the connection axis of high volt power supply connector and expendable part joint extends in energy flow plane, and the connection axis controlling joint extends about this energy flow flat transverse or extends on the normal of this energy flow plane.Between high volt power supply connector and expendable part joint, at least one energy path in other words energy flow path extends in energy flow plane.Energy path is following path, that is, the power for running expendable part flows in the path through circuit board, high-current circuit plate or analog ground.Such as at least one energy path can extend from the high voltaic element that can be connected in high volt power supply connector towards the expendable part that can be connected on expendable part joint.Control joint to be electrically connected with circuit board or particularly with the control part section of circuit board.This execution mode provides following advantage, that is, by the joint on layer it is achieved that by signal path and energy flow path decoupling, and therefore, it is possible to signal quality and the signal integrity of improvement can be provided.By will the EMV impact that normal that joint and the cable tree of attaching troops to a unit such as be arranged in energy flow can reduce control signal be controlled.
The topological structure hot property of circuit board to Beneficial Effect can be realized by multiple break-through contact site by laser manufacture.In circuit board the row of heat lead can via conductor rail or conducting surface and break-through contact site or perforation, particularly their copper sleeve carries out.The entire thermal resistance of circuit board is lowered as follows, that is, by use multiple to be made by the break-through contact site of laser manufacture at least one of circuit board outer and at least one abut against internal layer also thermal coupling mutually on skin.Good thermal capacitance is also obtained or hot type is led except improving entire thermal resistance.Particularly can reduce circuit board outer two-layer between thermal resistance.Therefore can be very fast and in large area to the inside transporting heat of circuit board, the circuit transporting such as heated up from being in operation is to the surface of circuit board by multiple miniature break-through contact site.Can disperse these heats on the one hand in the inside of circuit board, and can lead on the opposed side of circuit board by other break-through contact site row on the other hand, this side can as falling hot portion.At circuit board as can by multiple break-through contact site by laser manufacture by heat rapidly and guide away from the inside of circuit board in large area on the surface falling hot portion.Therefore, execution mode of the present utility model provides following advantage, that is, improve the heat radiation of circuit board.Do not need in order to the improvement of hot property to adopt the technique expended, such as ceramic circuit board.Therefore, cost per unit valency can be made to keep lower, and such as can use and expend little bonding technology.Pin, in the strategy (EMV=Electro Magnetic Compatibility) of EMV, also has the performance space of many designs for anti-EMV in addition on circuit boards according to execution mode of the present utility model.
At least one high volt power switch also can lead the direct thermal coupling of portion's section with the hot type of housing, or with the hot type of housing lead portion's section directly and via circuit board the skin towards at least one high volt power switch and adjacent internal layer, Heat Conduction Material and additionally or alternatively indirectly lead portion's section thermal coupling with the hot type of housing via housing boss.Therefore, can provide and directly lead the first hot type guiding path of portion's section to the hot type of housing from least one high volt power switch and lead the second hot type guiding path of portion's section from least one high volt power switch room ground connection via circuit board or high-current circuit plate to the hot type of housing.The hot type guide passage section of housing can with cooling device thermal coupling.The first hot type guiding path for cooling the power switch producing heat can be formed thus, that is, it indirectly utilized its housing to be attached on cooling device.This particularly can be applied in the situation of very large power switch.Second hot type guiding path or hot path additionally can be set.What can make full use of at this is, on circuit boards, or on the high-current circuit plate built with being similar to circuit board, there is large, unbroken thermal conductive surface in that be connected towards the outside of at least one power switch with by laser beam perforation technique, adjacent internal layer.This execution mode provides following advantage, that is, can realize power switch and circuit carrier to short, the large-area hot link on cooling device by this system constructing.This makes to achieve one from thermal source (barrier layer of such as power switch) to the path of low thermal impedance falling hot portion (such as chilled(cooling) water return (CWR)).Possible, such as, by the housing boss that stretches out from cooling circuit or ceiling, and additionally or alternatively by inserting heat-conducting medium to realize the further improvement to hot-fluid between the hot type guide passage section of circuit board or high-current circuit plate and housing.Can be opened the path of a low thermal resistance by outer and adjacent internal layer, this path makes power switch such as can be attached on cooling device via heat-conducting medium in large area.Therefore, entire thermal resistance can be reduced further.This is called as hot reversing principle.Here, heat does not need with being guided through whole circuit board, but extends only through outer and adjacent internal layer.Therefore, the hot break-through contact site through whole circuit board is not needed for this hot reversing principle.Therefore, the extra thermal resistance produced when guiding heat to pass circuit board by hot break-through contact site can be avoided.
A kind of method of the circuit board for the manufacture of having multiple layers has following steps:
Be shaped at least one have the skin of at least one the first electric leads adjacent with this skin with at least one, the internal layer with at least one the second electric leads, wherein, at least one the first electric leads and at least one the second electric leads are arranged with having identical coverage each other; And
At least one break-through contact site is produced, for electrical connection and/or the hot link of at least one outer internal layer adjacent with described skin with at least one by laser.
The execution mode of circuit board noted earlier advantageously can be realized by implementing this method.
Accompanying drawing explanation
By accompanying drawing exemplarily elaboration the utility model.Wherein:
Figure 1A to 1C illustrates circuit board systems;
Fig. 2 A to Fig. 2 D and Fig. 3 illustrates the circuit board according to embodiment of the present utility model;
Fig. 4 A to Fig. 4 F illustrates the circuit board apparatus according to embodiment of the present utility model;
Fig. 5 illustrate according to embodiment of the present utility model, for the manufacture of the flow chart of method of circuit board with multiple layers; And
Fig. 6 illustrates the circuit board according to embodiment of the present utility model.
In the following explanation of preferred embodiment of the present utility model, shown in different figure and act on similar element and use same or similar Reference numeral, wherein, abandon the repeat specification to these elements.
Embodiment
Figure 1A shows a kind of circuit board systems 100.This circuit board systems 100 has for the first circuit carrier 110 of controlling functions, for carrying out the second circuit carrier 12 0 of drived control and the outer connecting element 130 for being electrically connected the first circuit carrier and second circuit carrier to high volt power switch at this.Due to for controlling functions and the current potential for the signal of drived control with differing heights, need separated circuit carrier and Connection Element.
The possible Rotating fields of the first circuit carrier 110 that Figure 1B shows Figure 1A control circuit carrier in other words.The Rotating fields of the first circuit carrier 110 has layer order at this, it comprises the first skin 111 such as containing copper or be made of copper, thickness is less than the layer of the basic material 112 of 0.1 millimeter, the first internal layer 113 such as containing copper or be made of copper, there is the layer that of the basic material 112 of any thickness is other, other possible internal layer 114, there is the layer that of the basic material 112 of any thickness is other, one other such as containing copper or the first internal layer 115 of being made of copper, thickness is less than the other layer of of the basic material 112 of 0.1 millimeter and such as containing copper or the second skin 116 of being made of copper.
In addition, two of the first circuit carrier 110 break-through contact sites 117 or laser beam perforation produced by laser are schematically illustrated.First in break-through contact site 117 is shaped through basic material 112 ground between the first outer 111 and first internal layer 113.Second in break-through contact site 117 is shaped through basic material 112 ground between second outer 116 and another first internal layer 115.
First circuit carrier 110 in other words control circuit carrier only exist the current potential being less than 100 volts.Therefore, there is not following requirement here, that is, layers of copper should at least 0.2 millimeter, interval each other.
The second circuit carrier 12 0 for high volt power switch that Fig. 1 C shows Figure 1A in other words drive circuit carrier in other words with the possible Rotating fields of the carrier of driving control device.The Rotating fields of second circuit carrier 12 0 has layer order at this, it comprises the first skin 121 such as containing copper or be made of copper, thickness is the layer of the basic material 122 of at least 0.2 millimeter, the first internal layer 123 such as containing copper or be made of copper, thickness is the other layer of of the basic material 122 of at least 0.2 millimeter, other possible internal layer 124, thickness is the other layer of of the basic material 122 of at least 0.2 millimeter, one other such as containing copper or the first internal layer 125 of being made of copper, thickness is the other layer of of the basic material 122 of at least 0.2 millimeter and such as containing copper or the second skin 126 of being made of copper.
In addition, two break-through contact sites 127 of second circuit carrier 12 0 or blind perforation is schematically illustrated.First in break-through contact site 127 is shaped through basic material 122 ground between the first outer 121 and first internal layer 123.Second in break-through contact site 127 is shaped through basic material 122 ground between second outer 126 and another first internal layer 125.
Second circuit carrier 12 0 exists the current potential being greater than 100 volts.Therefore there is following requirement here, that is, layers of copper answers at least 0.2 millimeter, interval each other.Laser beam perforation manufacture technics break-through contact site 127 can not be used here, because the spacing between skin 121 or 126 and the first internal layer 123 or 125 is excessive.Here, break-through contact site 127 is embodied as the blind hole of machine-building.
As can be seen from Figure 1B and Fig. 1 C, the Rotating fields of circuit carrier 110 and 120 is different, because have different requirements to interlamellar spacing.Therefore, common Rotating fields can not be had when this circuit carrier 110 and 120.Need the circuit carrier circuit board in other words that two different.
Fig. 2 A show there are multiple layers circuit board 200 in other words according to the schematic diagram schematic diagram in other words of the circuit carrier of embodiment of the present utility model.The control part section 210 of circuit board 200, drive division section 220 and connecting portion section 230 is shown at this.Control part section 210 and drive division section 220 are electrically connected to each other by connecting portion section 230.At this, connecting portion section 230 is arranged between control part section 210 and drive division section 220.
Circuit board 200 is divided into for control and region for driving is divided into control part section 210 and drive division section 220 in other words by settling accordingly with regard to their basal plane at this, and therefore have for controlling functions control part section 210, there is the connecting portion section 230 of the interconnection technique aspect be integrated in circuit board 200 and the drive division section 220 for carrying out drived control at least one high volt power switch.According to embodiment, circuit board 200 is divided at least one control part section 210 for the treatment of control signal, at least one is for triggering the drive division section 220 of at least one high volt power switch and at least one is for by control part section 210 and the interconnective connecting portion section 230 of drive division section 220.
Circuit board 200 has multiple layer, described layer comprise at least one skin with at least one the first electric leads adjacent with this skin with at least one, with the internal layer of at least one the second electric leads, illustrate even if not detailed in fig. 2.At this, at least one the first electric leads and at least one the second electric leads are arranged with having identical coverage each other.According to embodiment, at least one the first electric leads and at least one the second electric leads are arranged in drive division section 220, with at least having identical coverage each other.
Fig. 2 B shows the schematic cross sectional view of the circuit board 200 of Fig. 2 A.In other words, Fig. 2 B shows the schematic diagram of circuit board 200 with the profile of circuit board 200.Show control part section 210, drive division section 220, the Rotating fields of connecting portion section 230 and circuit board 200 or layer compound, this Rotating fields has layer order, it comprises the first skin 241 such as containing copper or be made of copper, thickness is less than the layer of the basic material 242 of 0.1 millimeter, the first internal layer 243 such as containing copper or be made of copper, thickness is the other layer of of the basic material 242 of at least 0.2 millimeter, at least one intermediate layer is another internal layer 244 in other words, thickness is the other layer of of the basic material 242 of at least 0.2 millimeter, one other such as containing copper or the first internal layer 245 of being made of copper, thickness is less than the other layer of of the basic material 242 of 0.1 millimeter and such as containing copper or the second skin 246 of being made of copper.The connection of control part section 210 and drive division section 220 is realized by existing layers of copper in connecting portion section 230.
Fig. 2 C shows the schematic cross sectional view of the circuit board 200 of Fig. 2 A.In other words, Fig. 2 C shows the schematic diagram of circuit board 200 with the profile of circuit board 200.At this, Fig. 2 C is corresponding to Fig. 2 B except following content, that is, only schematically illustrate two break-through contact sites 247 produced by laser in drive division section 220 in fig. 2 c extraly.
First in break-through contact site 247 is shaped through basic material 242 ground between the first outer 241 and first internal layer 243.First in break-through contact site 247 is configured for electrical connection or is electrically connected and hot link first outer 241 and the first internal layer 243.Second in break-through contact site 247 is shaped through basic material 242 ground between second outer 246 and another first internal layer 245.Second in break-through contact site 247 is configured for electrical connection or is electrically connected and hot link second outer 246 and another first internal layer 245.
The current potential avoiding wherein being greater than 100 volts is roughly connected in parallel by making skin 241 and 246 and the first corresponding internal layer 243 and 245.Therefore, it is possible to advantageously evade the requirement that the spacing had between layer that current potential is greater than 100 volts is at least 0.2 millimeter.At this, achieve at least one intermediate layer another spacing internal layer 244 of being greater than 0.2 millimeter in other words.
Fig. 2 D shows the schematic cross sectional view of the circuit board 200 of Fig. 2 A.In other words, Fig. 2 D is to show the schematic diagram of circuit board 200 with the profile of the circuit board 200 of isolating on circuit.At this, Fig. 2 D is corresponding to Fig. 2 C except following content, that is, eliminate the layer be made of copper in the connecting portion section 230 between control part section 210 and drive division section 220 in figure 2d and arrange transmitting device 250.Therefore, circuit board 200 constructs isolator in connecting portion section 230 on circuit.Transmitting device 250 is configured to set up the connection between control area 210 and drive area 220 in connecting portion section 230.Transmitting device 250 such as works optically or inductively.According to embodiment, circuit board 200 has at least one electrical connecting wire in connecting portion section 230.
Fig. 3 show there are multiple layers circuit board 200 in other words according to schematic diagram or the schematic diagram of the circuit carrier of embodiment of the present utility model.The control part section 210, exemplarily multiple and illustrate only the drive division section 220 of wherein six for illustrated reason of circuit board 200 is shown at this, they arrange isolatedly or are embodied as high volt island, and exemplarily multiple and show the connecting portion section with transmitting device 250 of wherein six for illustrated reason.In other words, Fig. 3 shows circuit board 200 as theoretic structure during so-called compoboard, and this compoboard has as the controlling functions in the control part section 210 of common control part section, the transmitting device 250 for realizing isolating on circuit, drive division section 220 as high volt island.The drive division section 220 of multiple isolated layout is connected with common control part section 210 via multiple connecting portion section or transmitting device 250.Common control part section 210 is arranged around drive division section 220 ground.
Therefore, according to embodiment shown in Figure 3 of the present utility model, in the drive division section 220 being embodied as high volt island, achieve drived control function.High volt island is expressed as drive division section 220 at this, and it provides driving function for high volt power switch.Described high volt island is usual with reference to reference potential at this, the emitter of such as power switch or source electrode.At this, the drive division section 220 being embodied as high volt island in this wise can be configured for guiding signal, and these signals have the difference having lacked several volts with regard to their reference potential.Due to the almost parallel property in drive division section 220 in other words high volt island, also in the portions section 220 of circuit board 200, laser perforation techniques can be adopted for break-through contact site.
Fig. 4 A shows the schematic cross sectional view of the circuit board apparatus according to embodiment of the present utility model.Show there are multiple layers circuit board 200, circuit board apparatus 400, housing 410, high volt power supply connector 412 in other words high voltaic element joint, expendable part joint 414, control joint 416, high-current circuit plate 420, only exemplarily and for the high current power switch 430 of three shown in illustrated reason and cooling device 440.Circuit board 200 is a kind of circuit boards with multiple layers, as the circuit board of Fig. 2 A to Fig. 3.In other words, Fig. 4 A shows the theoretical construct with circuit board 200 the circuit board apparatus 400 or high volt system of compoboard in other words.
According to embodiment shown in Figure 4 A of the present utility model, circuit board apparatus 400 has circuit board 200, housing 410, high volt power supply connector 412, expendable part joint 414, controls joint 416, high-current circuit plate 420 and high current power switch 430.
Housing 410 is configured to containment circuit board 200, high-current circuit plate 420 and high current power switch 430.Housing 410 is arranged around circuit board 200, high-current circuit plate 420 and high current power switch 430 ground.At this, the hot type that high current power switch 430 is arranged in high-current circuit plate 420 and housing 410 is led between portion's section.High-current circuit plate 420 is arranged between circuit board 200 and high current power switch 430.Housing 410 utilizes hot type to lead portion's section and cooling device 440 adjoins.Cooling device 440 is such as water cooler.High volt power switch 430 leads the directly thermal coupling of portion's section with the hot type of housing 410.Therefore high current power switch 430 is adjacent to arrange with cooling device 440.
The high volt power supply connector 412 of circuit board apparatus 400 extends through housing 410 ground, and is electrically connected with high-current circuit plate 420.The expendable part joint 414 of circuit board apparatus 400 extends through housing 410 ground, and is electrically connected with high-current circuit plate 420.Control joint 416 to extend through housing 410 ground, and be electrically connected with circuit board 200.At this, control joint 416 and be particularly electrically connected with the control part section of circuit board 200.At this, high volt power supply connector 412 and expendable part joint 414 are arranged in an energy flow plane, this plane is exemplarily expressed as the main extension plane of high-current circuit plate 420, wherein, control joint 416 to arrange or be arranged in about this energy flow flat transverse on the normal of this energy flow plane.
Fig. 4 B shows the circuit board apparatus 400 of Fig. 4 A, and it has contact element 450 as the interspersed connector between high current power switch 430 and circuit board 200.Only exemplarily and due to illustrated reason show six contact elements 450 in figure 4b.Contact element 450 is configured to set up the electrical connection between high current power switch 430 and the drive division section of circuit board 200.At this, the drive division section of circuit board 200 is arranged in the region of high current power switch 430 of circuit board apparatus 400.
In other words, high current power switch 430 and the portions section on circuit board 200 or drive the connection of trigger equipment to be realize by pass through the interspersed technology (THT) of high-current circuit plate 420.Such as immerse tin cream method by compaction techniques, Selective Soldering or pin here and realize the connection with circuit board 200 and 420.This structure is utilized to realize driving the short link of trigger equipment and high current power switch 430.According to embodiment, drive trigger equipment to be integrated in high-current circuit plate 420, and be connected with high current power switch 430 by break-through contact site.
Fig. 4 C shows the circuit board apparatus 400 of Fig. 4 B, and it has housing boss 460 and Heat Conduction Material 470 heat-conducting medium in other words.At this, the hot type that housing boss 460 is arranged in housing 410 is led in portion's section.Housing boss 460 extends to high-current circuit plate 420 from housing 410.At this, housing boss 460 leads the jut of the ceiling shape being configured as ceiling or housing in portion's section at hot type.Housing boss 460 to be arranged between high current power switch 430 and high current power switch 430 region outside.Heat Conduction Material 470 is arranged between housing boss 460 and high-current circuit plate 420.At this, the intermediate space between housing boss 460 and high-current circuit plate 420 is filled by Heat Conduction Material 470.
Therefore, portion's section thermal coupling is directly led with the hot type of housing 410 in high volt power switch 430 1 aspect, and indirectly leads portion's section thermal coupling via high-current circuit plate 420, Heat Conduction Material 470 and housing boss 460 and the hot type of housing 410 on the other hand.Therefore, it is possible to cool high current power switch 430 by high-current circuit plate 420 and cooling device 440.
In other words, Fig. 4 C shows the theoretical construct of the circuit board apparatus 400 or high volt system with circuit board 200, and it has the hot link of interspersed connection from high volt power switch 430 to circuit board 200 and high-current circuit plate 420 and cooling device 440.By shown in figure 4 c can short ground and hot link height volt power switch 430 and circuit carrier in large area with described system configuration.This allows from thermal source (barrier layer such as high volt power switch 430) to the hot chain of low-heat resistance falling hot portion (such as water cooling loop).Possible, such as, by realizing the improvement to possible hot-fluid from the utilization of the outwardly directed housing boss of cooling circuit 460 and Heat Conduction Material 470.
Fig. 4 D shows the circuit board apparatus 400 of Fig. 4 C, wherein, is symbolically indicated extraly by direction arrow in fig. 4d and leads the hot-fluid Q of portion's section to cooling device 440 from high volt power switch 430 through the hot type of housing 410.High-current circuit plate 420 or high volt power switch 430 makes the first hot path from high volt power switch 430 to cooling device 440 become possibility with this hot link of cooling device 440.The first hot path for the high volt power switch 430 cooling generation heat is exactly it indirectly utilized its housing to be attached to cooling device 440.This is a kind of conventional method, especially can be used in large-scale power switch.
Fig. 4 E shows the circuit board apparatus 400 of Fig. 4 D, wherein, in Fig. 4 E, symbolically indicate by direction arrow the hot type passing high-current circuit plate 420, Heat Conduction Material 470, housing boss 460 and housing 410 from high volt power switch 430 extraly and lead the hot-fluid Q of portion's section to cooling device 440.Except first hot path of Fig. 4 D, also show in Fig. 4 E via high-current circuit plate 420, Heat Conduction Material 470, housing boss 460 and housing 410 can realize, parallel second hot path to cooling device 440.
Fig. 4 F shows the flexible program of the circuit board apparatus 400 of Fig. 4 E, and wherein, circuit board 200 is embodied as multifunction circuit board, wherein comprises the function of high-current circuit plate.Here, high volt power supply connector 412 and expendable part joint 414 are also electrically connected with circuit board 200.The hot type that high volt power switch 430 is arranged in circuit board 200 and housing 410 is led between portion's section, is electrically connected with the portions section of circuit board 200, and leads portion's section thermal coupling with the hot type of circuit board 200 and housing 410.Circuit board 200 leads portion's section thermal coupling by Heat Conduction Material 470 and housing boss 460 with the hot type of housing 100.
Therefore, portion's section thermal coupling is directly led with the hot type of housing 410 in high volt power switch 430 1 aspect, and indirectly leads portion's section thermal coupling via the skin towards high volt power switch 430 of circuit board 200 and the hot type of adjacent internal layer, Heat Conduction Material 470 and housing boss 460 and housing 100 on the other hand.Therefore, it is possible to cool high current power switch 430 by circuit board 200 and cooling device 440.
Therefore, provide in circuit board apparatus 400 from high volt power switch 430 directly via first hot path of housing 410 to cooling device 440.Additionally provide from high volt power switch 430 indirectly via circuit board 200, Heat Conduction Material 470 and housing boss 460 the second parallel hot path to cooling device 440.Make full use of at this, circuit board 200 exists large, unbroken thermal conductive surface on the skin and the first adjacent internal layer of cooling device 440.These two layers are here connected via break-through contact site by laser perforation techniques.The path of a low thermal resistance by the layer open described by these two, this paths makes to link with cooling device 440 in large area via Heat Conduction Material 470 to become possibility, and can reduce entire thermal resistance further.
In two parallel hot type guiding path principles or in hot reversing principle, the heat from high volt power switch 430 does not need to be guided through whole circuit board 200, but extend only through the skin towards high volt power switch 430 of circuit board and adjacent internal layer.Therefore, the hot break-through contact site through circuit board 200 is not particularly needed for hot reversing principle.Therefore, advantageously avoid the issuable extra resistance when guiding heat to pass circuit board 200 by hot break-through contact site.
Can find with reference to Fig. 4 A to Fig. 4 F, the high volt system that smooth circuit board apparatus 400 is smooth in other words can be provided, and the interconnection technique in circuit board apparatus 400 can be saved.
Fig. 5 show according to embodiment of the present utility model, for the manufacture of the flow chart of method 500 of circuit board with multiple layers.Advantageously circuit board can be manufactured, just as the circuit board shown by the arbitrary width in Fig. 2 A to Fig. 4 F by implementing the method 500.
Method 500 has step 510, that is, at least one skin with at least one the first electric leads that is shaped adjacent with described skin with at least one, with the internal layer of at least one the second electric leads.At this, implement the step 510 of this shaping as follows, that is, at least one the first electric leads and at least one the second electric leads construct with having identical coverage each other.
Method 500 also has step 520, that is, produce at least one break-through contact site by laser, for being electrically connected and additionally or as an alternative at least one outer internal layer adjacent with described skin with at least one of hot link.
Fig. 6 shows the schematic diagram of the circuit board 200 according to embodiment of the present utility model.Circuit board 200 has the pile be made up of multiple board layer.This pile at least comprises outer 241 and internal layer 243 as layer.Skin 241 and internal layer 243 have at least one conductor rail respectively as electric lead 601,603.According to this embodiment, the first wire 601 is arranged on the outer surface of outer 241.According to this embodiment, the second wire 603 be arranged in internal layer 243 towards on the surface of outer 241.These two wires 601,603 are guided with having identical coverage, such as, have identical wire trend, and described wire trend only staggers to each other and one layer arranges.Circuit board 200 has at least one break-through contact site 247 by laser manufacture, for connecting two wires guided abreast 601,603.
Wire 601,603 can in larger, particularly can be longer than the width of wire 601,603 length in parallel to each other and guided with having identical coverage.Such as this length can be greater than 10mm.Wire 601,603 such as can between two terminals in parallel to each other and extend with having identical coverage, intercepts and captures for feed-in the signal guided via wire 601,603.At this, terminal can be connected with two wires 601,603 respectively, such as via break-through contact site 247 or multiple these wires of connection, break-through contact site through outer 241.
Wire 601,603 such as may be used for constructing with guiding high volt signal, this high volt signal can have the potential difference being greater than 100V compared with an other wire, and a described other wire such as can be guided along the side opposite with wire 603 of internal layer 243.Therefore, one of them wire 601,603 can have the terminal to high volt signal source such as power switch.
Described and shown in the accompanying drawings embodiment is only exemplarily selected.Different embodiments can fully or mutual combination with regard to Individual features.Also another embodiment can be supplemented by the feature of an embodiment.
Reference numerals list
100 circuit board systems
110 first circuit carriers
111 first is outer
112 basic materials
113 first internal layers
114 another possible internal layers
115 another first internal layers
116 second is outer
117 break-through contact sites
120 second circuit carriers
121 first is outer
122 basic materials
123 first internal layers
124 another possible internal layers
125 another first internal layers
126 second is outer
127 break-through contact sites
130 Connection Elements
200 circuit boards
210 control part sections
220 drive division sections
230 connecting portion sections
241 first is outer
242 basic materials
243 first internal layers
244 intermediate layers or another internal layer
245 another first internal layers
246 second is outer
247 break-through contact sites
250 transmitting devices
400 circuit board apparatus
410 housings
412 high volt power supply connectors
414 expendable part joints
416 control joint
420 high-current circuit plates
430 high current power switch
440 cooling devices
450 contact elements
460 housing boss
470 Heat Conduction Materials
500 for the manufacture of method
510 steps be shaped
The step of 520 manufacture break-through contact sites
601 first wires
603 second wires.

Claims (9)

1. there is the circuit board (200) of multiple layers, it has at least one skin (241 with at least one the first electric leads (601), 246) and at least one and described skin (241, 246) adjacent, with the internal layer (243 of at least one the second electric leads (603), 245), it is characterized in that, described at least one the first electric leads (601) and described at least one the second electric leads (603) are arranged with having identical coverage each other, wherein, described circuit board (200) has at least one by laser manufacture, for at least one skin (241 described in electrical connection and/or hot link, 246) and described at least one and this skin (241, 246) adjacent internal layer (242, 245) break-through contact site (247).
2. according to circuit board according to claim 1 (200), it is characterized in that, described circuit board (200) is divided at least one for the treatment of the control part section (210) of control signal with at least one is for triggering the drive division section (220) of at least one high volt power switch (430).
3. according to circuit board according to claim 2 (200), it is characterized in that, described circuit board (200) has at least one for by least one control part section (210) described and the interconnective connecting portion section (230) of at least one drive division section (220) described, wherein, described circuit board (200) has at least one electrical connecting wire or is shaped isolator on circuit and has transmitting device (250) in connecting portion section (230).
4. according to the circuit board (200) according to any one of claim 2 to 3, it is characterized in that, described circuit board (200) has the drive division section (220) that multiple island is arranged, described drive division section is connected with common control part section (210) via multiple connecting portion section (230).
5. according to the circuit board (200) according to any one of claim 1-3, it is characterized in that, outer (241,246) have the thickness that is less than or equal to 70 μm and adjacent internal layer (243,245) has the thickness being less than or equal to 70 μm.
6. according to the circuit board (200) according to any one of claim 1-3, it is characterized in that, described circuit board (200) has the first skin (241) and the first internal layer (243), they via at least one by laser manufacture first break-through contact site (247) connect, and between the first skin and the first internal layer, arrange the circuit board basic material (242) with the first thickness, described circuit board also has the second skin (246) and the second internal layer (245), they via at least one by laser manufacture second break-through contact site (247) connect, and between the second skin and the second internal layer, arrange the circuit board basic material (242) with the first thickness, wherein, the circuit board basic material (242) with the second thickness or at least one extra play (244) is furnished with between described first internal layer (243) and described second internal layer (245), second thickness is greater than the first thickness, at extra play and internal layer (243, 245) the circuit board basic material (242) with the second thickness is furnished with between.
7. circuit board apparatus (400), it has following characteristics:
The circuit board (200) with multiple layers according to any one of the preceding claims;
At least one high volt power switch (430) be electrically connected with circuit board (200); And
Housing (410), circuit board (200) and at least one high volt power switch (430) described are arranged in this housing at least in part.
8. according to circuit board apparatus according to claim 7 (400), it is characterized in that there is high volt power supply connector (412), expendable part joint (414) and control joint (416), wherein, high volt power supply connector (412) and expendable part joint (414) are arranged in an energy flow plane, wherein, control joint (416) to arrange or be arranged in about this energy flow flat transverse on the normal of this energy flow plane.
9. according to the circuit board apparatus (400) according to any one of claim 7 to 8, it is characterized in that, at least one high volt power switch (430) described leads the direct thermal coupling of portion's section with the hot type of housing (410), or lead portion's section directly and via the skin (241 towards at least one high volt power switch (430) described of circuit board (200) with the hot type of housing (410), 246) and adjacent internal layer (243, 245), Heat Conduction Material (470) and/or housing boss (460) lead portion's section thermal coupling with the hot type of housing (410) indirectly.
CN201420807719.1U 2013-12-18 2014-12-18 Circuit board and circuit board apparatus Expired - Fee Related CN204482148U (en)

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DE102013226513.1A DE102013226513A1 (en) 2013-12-18 2013-12-18 Printed circuit board, method for producing the same and printed circuit board device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109874224A (en) * 2017-12-05 2019-06-11 Zf 腓德烈斯哈芬股份公司 Printed circuit board and method for manufacturing printed circuit board

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DE102016204777A1 (en) 2016-03-23 2017-09-28 Zf Friedrichshafen Ag Multi-layer high voltage printed circuit board

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DE4305793A1 (en) * 1993-02-25 1994-09-01 Telefunken Microelectron Power module
WO1998047331A1 (en) * 1997-04-16 1998-10-22 Kabushiki Kaisha Toshiba Wiring board, wiring board fabrication method, and semiconductor package
KR100355828B1 (en) * 2000-01-19 2002-11-04 엘지전자 주식회사 One module system for electric and electronic products
US7629541B2 (en) * 2006-06-19 2009-12-08 Endicott Interconnect Technologies, Inc. High speed interposer
FR2971666B1 (en) * 2011-02-10 2014-11-14 Hager Controls ELECTRICAL CONTROL BLOCK USING PRINTED CIRCUIT TECHNOLOGY FOR POWER LINE DRIVER
DE102011077206B4 (en) 2011-06-08 2019-01-31 Zf Friedrichshafen Ag Printed circuit board and control unit for a transmission of a vehicle with the printed circuit board

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CN109874224A (en) * 2017-12-05 2019-06-11 Zf 腓德烈斯哈芬股份公司 Printed circuit board and method for manufacturing printed circuit board

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