CN204459854U - Lighting device - Google Patents
Lighting device Download PDFInfo
- Publication number
- CN204459854U CN204459854U CN201520148878.XU CN201520148878U CN204459854U CN 204459854 U CN204459854 U CN 204459854U CN 201520148878 U CN201520148878 U CN 201520148878U CN 204459854 U CN204459854 U CN 204459854U
- Authority
- CN
- China
- Prior art keywords
- bearing seat
- load bearing
- lighting device
- emitting diode
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Abstract
The utility model provides a kind of lighting device, comprises: at least one luminescence component, and luminescence component comprises: transparency carrier, has loading end and the second first type surface, loading end and the second first type surface positioned opposite to each other; And multiple light emitting diode construction, be arranged on loading end, and with the part loading end that light emitting diode construction is not set formed can be luminous the first first type surface, the light that at least one light emitting diode construction wherein in multiple light emitting diode construction sends is through transparency carrier and by the second first type surface bright dipping; Load bearing seat; And at least one support member, be coupled to load bearing seat; Wherein luminescence component is arranged on support member, and the central shaft of at least Local Phase to load bearing seat of support member is inside or outward-dipping.Compared with prior art, lighting device of the present utility model can increase the luminous intensity of unit are greatly, and can realize the bright dipping of two-way or multi-direction even omnirange.
Description
Technical field
The utility model relates to a kind of lighting device, refers in particular to a kind of lighting device comprising the luminescence component of at least double-side, belongs to lighting technical field.
Background technology
Only a kind of light source with directive property that light emitting diode (light emitting diode, be called for short LED) sends itself, not as known bulb be a kind of light source of divergence form, therefore can be restricted on applying.For example, known light emitting diode is difficult to provide even cannot provide indoor or required by outdoor lighting lamp illumination effect.In addition, known light emitting diode illuminating apparatus only can one side luminous, therefore illumination efficiency is not high yet.
Summary of the invention
For at least one of solving the problems of the technologies described above, the utility model provides a kind of lighting device, greatly can improve light-out effect and go out luminous intensity, realizing multi-direction bright dipping, solves the problem that light-out effect is bad.
For realizing above-mentioned utility model object, the utility model one embodiment provides a kind of lighting device, and described lighting device comprises:
At least one luminescence component, described luminescence component comprises:
Transparency carrier, has loading end and the second first type surface, described loading end and described second first type surface positioned opposite to each other; And
Multiple light emitting diode construction, be arranged on described loading end, and with the described loading end of the part that described light emitting diode construction is not set formed can be luminous the first first type surface, the light that at least one light emitting diode construction in wherein said multiple light emitting diode construction sends is through described transparency carrier and by described second first type surface bright dipping;
Load bearing seat; And
At least one support member, is coupled to described load bearing seat;
Wherein said luminescence component is arranged on described support member, and the central shaft of at least Local Phase to described load bearing seat of described support member is inside or outward-dipping.
As further improvement of the utility model, there is between described luminescence component and described load bearing seat the first angle, and the angle of described first angle is between 45 degree to 75 degree.
As further improvement of the utility model, described support member comprises the first connecting portion and the second connecting portion, and described second connecting portion is arranged at described load bearing seat, wherein said first connecting portion is connected to described second connecting portion and and has the second angle between described second connecting portion.
As further improvement of the utility model, described first connecting portion stretches out relative to the described central shaft of described load bearing seat, and the angle of described second angle is between 135 degree to 175 degree.
As further improvement of the utility model, described first connecting portion extends internally relative to the described central shaft of described load bearing seat, and the angle of described second angle is between 5 degree to 45 degree.
As further improvement of the utility model, there is between described second connecting portion and described load bearing seat the 3rd angle, and the angle of described 3rd angle is between 45 degree to 85 degree.
As further improvement of the utility model, described support member is arcuate structure.
As further improvement of the utility model, the arc radius of curvature of described arcuate structure is between 10mm to 200mm, and the home position of described arcuate structure is the described central shaft close to or away from described load bearing seat.
As further improvement of the utility model, described support member is Throwing thing linear structure or ellipsoidal structure.
Compared with prior art, the utility model has following Advantageous Effects: light can penetrate transparency carrier and bright dipping smoothly, greatly increase the luminous intensity (brightness) of unit are, and the bright dipping of two-way or multi-direction even omnirange can be realized, strengthen luminous efficiency and light-out effect.
Accompanying drawing explanation
Fig. 1 depicts the sectional view of the luminescence component of a preferred embodiment of the present utility model;
Fig. 2 depicts the structural representation of the luminescence component of a preferred embodiment of the present utility model;
Fig. 3 to Fig. 5 depicts the schematic diagram that the different types of light emitting diode construction of a preferred embodiment of the present utility model is coupled to wire;
Fig. 6 and Fig. 7 depicts the structural representation of the energy conversion layer of a preferred embodiment of the present utility model;
Fig. 8 depicts the profile of the luminescence component of another preferred embodiment of the present utility model;
Fig. 9 depicts the profile of the luminescence component of another preferred embodiment of the present utility model;
Figure 10 depicts the schematic perspective view of the luminescence component of another preferred embodiment of the present utility model;
Figure 11 depicts the schematic diagram of a preferred embodiment load bearing seat of the present utility model;
Figure 12 depicts the schematic diagram of a preferred embodiment load bearing seat of the present utility model and circuit board;
Figure 13 depicts the schematic diagram of the speculum of a preferred embodiment of the present utility model;
Figure 14 depicts the schematic diagram of the quasi cobalt carbon diaphragm of a preferred embodiment of the present utility model;
Figure 15 depicts the schematic diagram of the lighting device of a preferred embodiment of the present utility model;
Figure 16 depicts the schematic appearance of the lighting device of another preferred embodiment of the present utility model;
Figure 17 depicts the schematic appearance of the lighting device of another preferred embodiment of the present utility model;
Figure 18 to Figure 20 depicts the transparency carrier grafting of a preferred embodiment of the present utility model or gluing in the schematic diagram of load bearing seat;
The transparency carrier gluing that Figure 21 and Figure 22 depicts a preferred embodiment of the present utility model is in the schematic diagram of load bearing seat with support member;
Figure 23 depicts the schematic perspective view of the lighting device of another preferred embodiment of the present utility model;
Figure 24 depicts the schematic perspective view of the device pedestal of the lighting device of another preferred embodiment of the present utility model;
Figure 25 depicts the schematic perspective view of the lighting device of another preferred embodiment of the present utility model;
Figure 26 to Figure 29 depicts the top view on load carrier with point symmetry or line symmetric arrays transparency carrier of a preferred embodiment of the present utility model;
Figure 30 depicts the schematic diagram of the lighting device of another preferred embodiment of the present utility model;
Figure 31 and Figure 32 depicts the schematic diagram of the lampshade of a preferred embodiment of the present utility model;
Figure 33 to Figure 37 depicts the schematic diagram of the lighting device of different embodiment of the present utility model.
Detailed description of the invention
Below with reference to detailed description of the invention shown in the drawings, the utility model is described in detail.But these embodiments do not limit the utility model, the structure that those of ordinary skill in the art makes according to these embodiments, method or conversion functionally are all included in protection domain of the present utility model.
Please refer to Fig. 1 and Fig. 2, Fig. 1 depicts the sectional view of the luminescence component of a preferred embodiment of the present utility model; Fig. 2 depicts the structural representation of the luminescence component of a preferred embodiment of the present utility model.Luminescence component 1 comprises: the light emitting diode construction 3 of transparency carrier 2, loading end 210, first first type surface 21A, the second first type surface 21B and at least one multi-direction bright dipping.Wherein, the transparency carrier 2 of flat thin sheet itself has two major surfaces, and wherein arbitrary major surfaces all can be loading end 210.The light emitting diode construction 3 with lighting function is arranged on loading end 210, and light emitting diode construction 3 is not by the light-emitting area 34 that transparency carrier 2 covers, jointly being formed with at least part of loading end 210 not arranging light emitting diode construction 3 can the first first type surface 21A of luminescence.Another major surfaces that transparency carrier 2 is not provided with light emitting diode construction 3 is then the second first type surface 21B.Vice versa for aforementioned arrangements mode, and also can all arrange light emitting diode construction 3 in described two surfaces of transparency carrier 2.In other embodiments, the light emitting diode construction 3 of loading end 210 is staggered corresponding to the light emitting diode construction 3 being arranged at the second first type surface 21B, when making the light emitting diode construction 3 on each luminous, light can penetrate transparency carrier 2 and smoothly from another side bright dipping, and do not covered by the light emitting diode construction 3 on another side, to increase the luminous intensity (brightness) of unit are.The material of transparency carrier 2 can be sapphire, pottery, glass, plastics or rubber, and can comprise aluminium oxide (Al
2o
3), magnesia, beryllium oxide, yittrium oxide, thorium oxide, oxidation Ji, lead zirconate titanate, GaAs, zinc sulphide, zinc selenide, calcirm-fluoride, magnesium fluoride, carborundum (SiC) or its polymer etc. one of them.Wherein, one of the utility model preferred embodiment, for adopting sapphire substrate, because material is substantially mono-crystalline structures for this reason, not only have good light transmittance, and heat-sinking capability is good, can be extended the life-span of luminescence component 1; But use traditional sapphire substrate in the utility model, have easily cracked problem, therefore the utility model is through experimental verification, transparency carrier 2 of the present utility model preferably selects thickness at the sapphire substrate being more than or equal to 200 microns (um), so can reach preferably reliability, and have preferably carrying and light transmission function.Simultaneously for effectively reaching the object of luminescence component 1 two-way or multi-direction even omnirange bright dipping, light emitting diode construction 3 of the present utility model preferably can select rising angle to be greater than the light emitting diode construction of 180 degree.Thus, light emitting diode construction 3 light-emitting area 34 be arranged on transparency carrier 2 can send the light away from transparency carrier 2 direction, and light emitting diode construction 3 can be issued to the light that small part enters transparency carrier 2, and the light entering transparency carrier 2 is except the second first type surface 21B bright dipping of the first first type surface 21A corresponding from transparency carrier 2, also can from the part loading end 210 not arranging light emitting diode construction 3 of transparency carrier 2 and other surperficial bright dippings, make luminescence component 1 can at least two-sided bright dipping, multi-direction bright dipping or omnirange bright dipping.In the utility model, the area of the first first type surface 21A or the second first type surface 21B is more than five times of the summation area of light-emitting area 34, and this takes into account the condition such as luminous efficiency and heat radiation and is preferably allocation ratio.
In addition, another preferred embodiment of the present utility model is that the first first type surface 21A of luminescence component 1 and the colour temperature difference of the second first type surface 21B emitted light are equal to or less than 1500K, makes luminescence component 1 have illumination effect consistent more comprehensively.And on the light transmission features of transparency carrier 2, the wave-length coverage emitted beam when light emitting diode construction 3 is more than or equal to 420 nanometers, and/or when the wave-length coverage of this light is less than or equal to 470 nanometer, under aforementioned transparent substrate 2 thickness condition, the light transmittance of transparency carrier 2 is more than or equal to 70%.
The utility model is not limited with above-described embodiment.Hereafter sequentially will introduce other preferred embodiment of the present utility model, and for the ease of difference place of more each embodiment and simplified illustration, identical symbol is used to mark identical assembly in the following embodiments, and be described mainly for difference place of each embodiment, and no longer repeating part is repeated.
Please refer to Fig. 3 to Fig. 5, Fig. 3 to Fig. 5 depicts the schematic diagram that the different types of light emitting diode construction 3 of a preferred embodiment of the present utility model is coupled to wire 23A, 23B.Light emitting diode construction 3 comprises the first electrode 31A and the second electrode 31B, the first electrode 31A and the second electrode 31B respectively be positioned at first on transparency carrier 2 and be connected wire 23A and second and connect wire 23B and be electrically connected.Be horizontal type light emitting diode construction in Fig. 3, wherein light emitting diode construction 3 is formed on the loading end 210 of transparency carrier 2, and the first electrode 31A and the second electrode 31B system are electrically coupled to first respectively in routing mode and are connected wire 23A and are connected wire 23B with second; It is crystal-coated light-emitting diodes structure in Fig. 4, light emitting diode construction 3 is inverted and is coupled by the first electrode 31A and the second electrode 31B and transparency carrier 2, and wherein the first electrode 31A and the second electrode 31B system are respectively to weld or gluing mode is electrically coupled to first and is connected wire 23A and is connected wire 23B with second; Fig. 5 arranges the first electrode 31A and the second electrode 31B at the two ends of light emitting diode construction 3, and makes the first electrode 31A and the second electrode 31B be connected wire 23A and second respectively with first in the mode uprightly arranged light emitting diode construction 3 to connect wire 23B and be connected.
Please refer to Fig. 6 and Fig. 7, Fig. 6 and Fig. 7 depicts the structural representation of the energy conversion layer of a preferred embodiment of the present utility model.Luminescence component 1 of the present utility model comprises energy conversion layer 4, energy conversion layer 4 is optionally arranged at the first first type surface 21A or/and on the second first type surface 21B, or be directly arranged on light emitting diode construction 3, and it can directly be contacted with light emitting diode construction 3, or a segment distance adjacent with light emitting diode construction 3 and directly not contacting.Energy conversion layer 4 is containing at least one fluorescent material, and the fluorescent material of as inorganic in garnet system, sulfate system or silicate etc. or organic material, to receive and to be converted to the wavelength of small part light emitting diode construction 3 emitted light for another kind of wave-length coverage.Such as, when light emitting diode construction 3 sends blue light, energy conversion layer 4 will conversion portion blue light be gold-tinted, and makes luminescence component 1 send white light after blue light and yellow light mix.In addition due to the direct bright dipping of light-emitting area of the first first type surface 21A light source mainly light emitting diode construction 3, second first type surface 21B light source is then the light that the light penetration transparency carrier 2 of light emitting diode construction 3 sends, two surperficial light intensities are different, therefore the fluorescent material content corresponding configuration of the energy conversion layer 4 of another preferred embodiment luminescence component 1 of the present utility model on the first first type surface 21A and the second first type surface 21B, wherein content ratio scope preferably can from 1:0.5 to 1:3 to the fluorescent material (or the fluorescent material on light emitting diode construction is to the fluorescent material on the second first type surface 21B) on the second first type surface 21B for the first first type surface 21A, the light intensity of luminescence component 1 or light shape is made to meet application demand, and make the colour temperature difference of the first first type surface 21A of luminescence component 1 and the second first type surface 21B emitted light be equal to or less than 1500K, promote wavelength conversion efficiency and the illumination effect of luminescence component 1.
Please refer to Fig. 8.Fig. 8 depicts the profile of the luminescence component of another preferred embodiment of the present utility model.The luminescence component 1 of the present embodiment comprises the light emitting diode construction 14 of transparency carrier 2 and at least one multi-direction bright dipping.Transparency carrier 2 there is loading end 210 and the second first type surface 21B positioned opposite to each other.Light emitting diode construction 14 is arranged on the loading end 210 of transparency carrier 2, and light emitting diode construction 14 comprises the first electrode 16 and the second electrode 18, connects as exposed electrical.Light emitting diode construction 14, not by the light-emitting area 34 that transparency carrier 2 covers, forms the first first type surface 21A jointly with the part loading end 210 do not covered by light emitting diode construction 14.
Light emitting diode construction 14 comprises substrate 141, n type semiconductor layer 142, active layers 143 and p type semiconductor layer 144.In the present embodiment, the substrate 141 of light emitting diode construction 14 utilizes chip join layer 28 to be attached on transparency carrier 2.Chip join layer 28 is except being used for except adhesive light-emitting diode structure 14, and in the selection of material, the refractive index of chip join layer 28 is better between the refractive index of substrate 141 and the refractive index of transparency carrier 2, can increase amount of light by this.In addition, chip join layer 28 is transparent adhesive tape or other grafting materials be applicable to.First electrode 16 and the second electrode 18 opposite chip bonding layer 28 are arranged at the another side of light emitting diode construction 14, and are electrically connected with p type semiconductor layer 144 and n type semiconductor layer 142 respectively (annexation scheming not show the second electrode 18 and n type semiconductor layer 142).First electrode 16 is positioned at identical horizontal level with the upper surface of the second electrode 18 and can be metal electrode, but not as limit.In addition, luminescence component 1 more comprises the first connection wire 20, second and connects wire 22 and energy conversion layer 4.First connection wire 20 is connected wire 22 with second be arranged on transparency carrier 2.First connects wire 20 is connected wire 22 and can be such as metal and connect wire or other conductive patterns with second, but not as limit.First electrode 16 and the second electrode 18 are connected wire 20 respectively and are connected wire 22 with second and are electrically connected with first, and connected mode can utilize routing mode (wire bonding) or welding manner, but not as limit.Energy conversion layer 4 is arranged on transparency carrier 2, and coated light emitting diode construction 14.In addition, energy conversion layer 4 more can arrange further and cover the second first type surface 21B of transparency carrier 2.
In addition, in order to increase amount of light that light leaves from transparency carrier 2 and make being evenly distributed of bright dipping, the first first type surface 21A and the second first type surface 21B of transparency carrier 2 optionally have nonplanar structure 12M respectively.Nonplanar structure 12M can be the geometry of various protrusion or depression, such as pyramid, cone, hemisphere or triangular prism etc., and the arrangement of nonplanar structure 12M can be systematicness arrangement or randomness arrangement.Moreover, the first first type surface 21A and the second first type surface 21B is optionally provided with class and bores carbon (diamond-like carbon, DLC) film 25, in order to increase heat conduction and radiating effect.
Please refer to Fig. 9, Fig. 9 depicts the profile of the luminescence component 1 of another preferred embodiment of the present utility model.Compare with the embodiment of Fig. 4, in the luminescence component 1 of the present embodiment, first electrode 16 and the second electrode 18 and the first chip join layer 28A are arranged at the same surface of light emitting diode construction 14, and are connected wire 20 and second respectively with first and connect wire 22 to cover crystal type (flip chip) and be electrically connected.Wherein, first connects wire 20 is connected the below that wire 22 can extend to the first electrode 16 and the second electrode 18 respectively with second, and the first electrode 16 and the second electrode 18 utilize the second chip join layer 28B to be connected wire 20 respectively with first is connected wire 22 with second and is electrically connected.Second chip join layer 28B is conductive projection (conductive bump) if golden projection (gold bump) or Solder Bumps (solder bump), conducting resinl (conductive glue) are as elargol, or Eutectic Layer (eutectic layer) is as golden tin (Au-Sn) alloy Eutectic Layer or indium bismuth ashbury metal (In-Bi-Sn alloy) Eutectic Layer, but not as limit.Under the situation of use second chip join layer 28B, the first chip join layer 28A such as transparent adhesive tape of the below of light emitting diode construction 14 can omit, or is replaced by energy conversion layer 4.
Please refer to Figure 10, Figure 10 depicts the schematic perspective view of the luminescence component 310 of another preferred embodiment of the present utility model.As shown in Figure 10, luminescence component 310 of the present utility model comprises transparency carrier 2, at least one light emitting diode construction 3, first connecting electrode 311A, the second connecting electrode 311B and at least one energy conversion layer 4.Wherein light emitting diode construction 3 is arranged on the loading end 210 of transparency carrier 2, and forms the first luminous first type surface 21A.In this embodiment, the rising angle of light emitting diode construction 3 is greater than 180 degree, and at least part of light that light emitting diode construction 3 sends can inject transparency carrier 2, and inject light at least partly can from the second first type surface 21B bright dipping of corresponding first first type surface 21A, part from other surperficial bright dippings of transparency carrier 2, and then reaches six luminous illumination effects.First connecting electrode 311A and the second connecting electrode 311B is arranged at two ends or homonymy (not shown) on transparency carrier 2 respectively, and be respectively first on transparency carrier 2 and connect wire and be connected assembly that wire extends with second to external electrode, therefore the first connecting electrode 311A and the second connecting electrode 311B respectively with light emitting diode construction 3 electrical communication.Energy conversion layer 4 at least covers light emitting diode construction 3 and is exposed to small part first connecting electrode 311A and the second connecting electrode 311B, wherein energy conversion layer 4 absorbs at least partly the light that light emitting diode construction 3 and/or transparency carrier 2 send, and convert the light of another wave-length coverage to, then with unabsorbed light mixed light, emission wavelength range and the illumination effect of luminescence component 310 is increased.Luminescence component 310 due to the present embodiment has the first connecting electrode 311A and the second connecting electrode 311B that are arranged at opposite end on transparency carrier 2 respectively, therefore luminescence component 310 combines with the load bearing seat be applicable to after can completing alone making again, effects such as promoting overall fine ratio of product, simplification structure and the load bearing seat design variation joined together by increase therefore can be reached.
Please refer to Figure 11, Figure 11 depicts the schematic diagram of a preferred embodiment load bearing seat 5 of the present utility model.An embodiment of the present utility model is the lighting device 11 using aforementioned luminescence component, wherein lighting device 11 comprises load bearing seat 5, make the transparency carrier 2 of luminescence component can erect or couch thereon and be coupled to load bearing seat 5, and between transparency carrier 2 and load bearing seat 5, there is the first angle theta
1, this first angle theta
1angle can be fixedly installed or need to transfer according to lighting device light shape, the first angle theta of wherein preferred embodiment
1angular range is between 30 degree to 150 degree.
Please refer to Figure 12, Figure 12 depicts the schematic diagram of a preferred embodiment load bearing seat 5 of the present utility model and circuit substrate 6.The load bearing seat 5 of lighting device 11 of the present utility model also comprises circuit substrate 6 and couples with external power source, and the first connection wire and second be electrically coupled on transparency carrier 2 connects wire (not shown), and be electrically connected with light emitting diode construction 3, make external power source supply light emitting diode construction 3 luminous required power supply by circuit substrate 6.If do not arrange this circuit substrate 6, light emitting diode construction 3 also can directly connect wire (not shown) by the first connection wire and second and be electrically connected at load bearing seat 5, and external power source can be powered to this light emitting diode construction 3 via load bearing seat 5.
Please refer to Figure 13, Figure 13 depicts the schematic diagram of the speculum of a preferred embodiment of the present utility model.Lighting device 11 of the present utility model comprises speculum 8 and is arranged on the second first type surface 21B, this speculum 8 can Refl-Luminous diode structure 3 be issued to the light that small part penetrates transparency carrier 2, and light is changed at least partly penetrated by the first first type surface 21A.This speculum 8 comprises at least one metal level or Bragg mirror (Bragg reflector), but not as limit.Wherein, Bragg mirror can have dielectric film institute's storehouse of different refractivity by multilayer and form, or has the dielectric film of different refractivity and multiple layer metal oxide institute's storehouse by multilayer and form.
Please refer to Figure 14, Figure 14 depicts the schematic diagram of the quasi cobalt carbon diaphragm of a preferred embodiment of the present utility model.The transparency carrier 2 of lighting device 11 of the present utility model comprises class and bores carbon (diamond-like carbon, DLC) film 9, wherein on quasi cobalt carbon diaphragm 9 loading end 210 that is arranged at transparency carrier 2 and/or the second first type surface 21B, to increase heat conduction and radiating effect.
Please refer to Figure 15.Figure 15 depicts the schematic diagram of the lighting device of a preferred embodiment of the present utility model.The lighting device 10 of the present embodiment comprises luminescence component as described in the previous embodiments and load bearing seat 26, wherein luminescence component comprises transparency carrier 2 and at least one light emitting diode construction 14, and luminescence component embeds in load bearing seat 26, be electrically connected with the electrode 30,32 of load bearing seat respectively by connecting wire 20,22, make power supply provide driving voltage V+ by electrode 30,32, V-to emit beam L to drive light emitting diode construction 14.Light emitting diode construction 14 comprises the first electrode 16 and the second electrode 18 and utilizes routing mode (wire bonding) to be connected wire 20 with first to be connected wire 22 with second and to be electrically connected, but not as limit.The beam angle of light emitting diode construction 14 emitted light L is greater than 180 degree or have multiple light-emitting area in addition, the light direction of luminescence component is made to comprise from the first first type surface 21A and the second first type surface 21B bright dipping, and some light also can emitted by four sidewalls of light emitting diode construction 14 and/or transparency carrier 2, lighting device 10 is made to have six luminescences or omnirange goes out light characteristic.
Luminescence component comprises energy conversion layer 4 and is arranged on light emitting diode construction 14, first first type surface 21A or the second first type surface 21B.Wherein energy conversion layer 4 is switchable to the light that small part light emitting diode construction 14 sends is the light of another wave-length coverage, lighting device 10 is made to send specific photochromic or light that wave-length coverage is larger, the some blue light that such as light emitting diode construction 14 produces is convertible into as gold-tinted after being irradiated to energy conversion layer 4, and lighting device 10 can send the white light become with yellow light mix by blue light.In addition, transparency carrier 2 is directly or indirectly fixedly arranged on load bearing seat 26 with non-parallel manner and/or parallel mode.Such as, the sidewall of transparency carrier 2 is fixedly arranged on load bearing seat 26 in a vertical manner, or is lain against on load bearing seat 26 by transparency carrier 2, but not as limit.Because the material with good thermal conduction characteristic selected by transparency carrier 2, the heat energy that light emitting diode construction 14 produces can be passed to load bearing seat 26 to dispel the heat quickly through transparency carrier 2, therefore lighting device 10 of the present utility model can use high-power light emitting diode construction, but the lighting device of preferred embodiment is under same power condition, the light emitting diode construction using multiple smaller power instead is arranged on transparency carrier 2, to make full use of the thermal conduction characteristic of transparency carrier 2, power train as the light emitting diode construction 14 of the present embodiment can be less than 0.2 watt, but not as limit.
Please refer to Figure 16.Figure 16 depicts the schematic appearance of the lighting device 10 ' of another preferred embodiment of the present utility model.Compared to Figure 15, the lighting device 10 ' of the present embodiment comprises multiple light emitting diode construction 14, and light emitting diode construction 14 is electrically connected to each other in a series arrangement at least partly.Wherein, each light emitting diode construction 14 comprises the first electrode 16 and one second electrode 18 respectively, first electrode 16 of a light emitting diode construction 14 of series connection head end is connected wire 20 with first and is electrically connected, and the second electrode 18 of another light emitting diode construction 14 of tail end is connected wire 22 with second is electrically connected, but not as limit, light emitting diode construction 14 also can utilize parallel connection or series-parallel system to be electrically connected.The light emitting diode construction 14 of the present embodiment can be selected from the light emitting diode construction sending same a shade, such as blue light-emitting diode structure, or uses the light emitting diode construction of combination different color light according to application demand.The practice of energy conversion layer 4 of arranging in pairs or groups in this situation more can increase lighting device 10 ' and send various photochromic elasticity.
Please refer to Figure 17.Figure 17 depicts the schematic appearance of the lighting device 50 of another preferred embodiment of the present utility model.Compared to Figure 15 and Figure 16, the lighting device 50 of the present embodiment comprises luminescence component as described in the previous embodiments and support member 51, support member 51 is in order to connect luminescence component and load bearing seat 26, wherein the transparency carrier 2 of luminescence component is fixedly arranged on the side of support member 51 by assembly bonding layer 52, and the opposite side of support member 51 is embedded on load bearing seat 26.Support member 51 is elasticity can adjust angle in addition, makes the angle of luminescence component and load bearing seat 26 between 30 degree to 150 degree.The material of support member 51 comprises composite metal material, copper conductor, electric wire or other materials be applicable to.
Please refer to Figure 18 to Figure 20, Figure 18 to Figure 20 depicts transparency carrier 2 grafting of a preferred embodiment of the present utility model or gluing in the schematic diagram of load bearing seat 5.When the transparency carrier 2 in the utility model is arranged on load bearing seat 5, transparency carrier 2 is for grafting or gluing are on load bearing seat 5.
As shown in figure 18, when transparency carrier 2 is arranged on load bearing seat 5, it is plugged in the monotrysian type slot 61 of load bearing seat 5, and makes light-emitting diode component pass through to connect wire slot 61 electric property coupling therewith.Light emitting diode construction (not shown) now on transparency carrier 2 is in order to couple mutually with the power supply supply of load bearing seat 5, therefore circuit pattern or connect wire and be concentrated to transparency carrier 2 edge and be integrated into the golden finger structure with multiple conductive contact blade or as connecting electrode 311A and 311B, namely electrical port.Slot 61 then can allow transparency carrier 2 insert, and make light emitting diode construction (not shown) while acquisition load bearing seat 5 is powered, transparency carrier 2 is also fixedly arranged on the slot 61 of load bearing seat 5.
Then, please refer to Figure 19, Figure 19 is the structural representation by grafting transparency carrier 2 porous type slot on load bearing seat 5.Now transparency carrier 2 has at least a pair of pin configuration, and one of them pin is assembly positive pole, and another is then assembly negative pole, and two places are all has conductive contact blade as port.And accordingly, load bearing seat 5, there are at least two slots 61 conformed to pin inserting surface size, transparency carrier 2 can be engaged smoothly with load bearing seat 5, and allow light emitting diode construction obtain power supply.
Please refer to Figure 20, Figure 20 is that transparency carrier 2 engages with load bearing seat 5 in the mode of gluing by assembly bonding layer.In the process of gluing, welding can be done auxiliary and engage by metals such as gold, tin, indium, bismuth, silver, or making the silica gel of apparatus electric conductivity or epoxy resin assist sets firmly transparency carrier 2 on load bearing seat 5, make the conductive pattern of luminescence component or connect wire to be electrically connected by the electrode on assembly bonding layer and load bearing seat 5.
Please refer to Figure 21 and Figure 22, transparency carrier 2 gluing that Figure 21 and Figure 22 depicts a preferred embodiment of the present utility model is in the schematic diagram of load bearing seat 5 with support member 62.The lighting device 11 of the present embodiment mainly forms with described in preceding embodiment, and wherein load bearing seat 5 is that aluminium sheet or metal substrate such as bent combined type alumina-bearing material, copper conductor or electric wire are formed.The surface of load bearing seat 5 or side have at least one support member 62, and support member 62 is separated with load bearing seat 5 or the mechanism member of integration.Luminescence component couples with support member 62 mutually by the mode of gluing, namely by assembly bonding layer 63, transparency carrier 2 is fixedly arranged on load bearing seat 5, and does not have the surface of the part of support member to maintain with load bearing seat 5 to have the first angle theta
1, and load bearing seat 5 does not have the surface of the part of support member 62 also can arrange the illumination effect of light emitting diode construction lifting lighting device 11; In addition, this luminescence component is also connected with support member 62 by the mode of grafting (not shown), namely by connector coupling unit and support member 62 and/or support member 26 and load bearing seat 5, and is fixedly arranged on load bearing seat 5 by transparency carrier 2.Because load bearing seat 5 and support member 62 are bent, because this increasing the flexibility when applying, simultaneously because multiple luminescence component can be used, therefore also by the luminescence component combination that difference is photochromic, lighting device 11 is made to have color change with satisfied different demand.
Please refer to Figure 23.Figure 23 depicts the schematic perspective view of the lighting device of another preferred embodiment of the present utility model.As shown in figure 23, the lighting device of the present embodiment comprises at least one luminescence component 1 and load bearing seat 5, and wherein load bearing seat 5 comprises at least one support member 62 and at least one circuit pattern P.The main composition of luminescence component 1 as described in the previous embodiments, and couples mutually with one end of transparency carrier and support member 62, to avoid or to reduce the screening effect of support member 62 pairs of luminescence components 1 bright dipping.Load bearing seat 5 is made up of combined type aluminum metal substrate, copper conductor or electric wire, and support member 62 is cut bending angle (as first angle theta of above-mentioned Figure 21 and Figure 22 from a part for load bearing seat 5
1) form.Circuit pattern P is arranged on load bearing seat 5, and has at least one group of electrical end points and power supply is electrically connected, and some extends to support member 62 and is electrically connected with luminescence component 1, and luminescence component 1 is electrically connected by the circuit pattern P of load bearing seat 5 and power supply.Load bearing seat 5 comprises at least one hole H or at least one breach G in addition, make to set firmly part such as screw, nail or latch etc. by hole H or breach G, load bearing seat 5 and other assemblies to be made further structure according to bright application of installation situation and fill or install, hole H or breach G also increases the area of dissipation of load bearing seat 5 simultaneously, promotes the radiating effect of lighting device.
Please refer to Figure 24, Figure 24 depicts the schematic perspective view of the device pedestal 322 of the lighting device of another preferred embodiment of the present utility model.The device pedestal 322 of the present embodiment comprises load bearing seat 5 and at least one support member 62, compare with the embodiment of Figure 11, the support member 62 of the present embodiment comprises at least one stripes 342 and breach 330, wherein electrode 30,32 is arranged at the both sides of breach 330 respectively, and stripes 342 at least forms the abutment wall of this breach 330.The corresponding breach 330 of luminescence component couples with support member 62, and the connection wire system of luminescence component and electrode 30,32 are electrically connected, and luminescence component is driven by the circuit pattern on support member 62 and load bearing seat and power supply electric property coupling.Wherein breach 330 size need be not less than the main exiting surface of luminescence component, and the bright dipping of luminescence component in the face of support member 62 direction can not be covered by support member 62.The movable design in junction between support member 62 and load bearing seat 5, can optionally adjust to make angle between support member 62 and load bearing seat 5.
Please refer to Figure 24 and Figure 25.Figure 25 depicts the schematic perspective view of the lighting device 302 of another preferred embodiment of the present utility model.Compare with the embodiment of Figure 24, lighting device 302 shown in Figure 25 comprises the support member 62 that at least one has multiple breach 330, wherein the plurality of breach 330 is arranged at the corresponding both sides of support member 62 respectively, makes stripes 342 form the abutment wall of the plurality of breach 330 at least simultaneously.Multiple luminescence component 310 is arranges corresponding with multiple breach 330, and the circuit pattern of each luminescence component 310 or connecting electrode (not shown) are corresponding with electrode 30 and electrode 32 respectively arranges and electrically connect.The lighting device 302 of the present embodiment further comprises multiple support member 62, respectively be provided with angle between the support member 62 of luminescence component 310 and load bearing seat 5 can optionally adjust separately, in other words, angle between at least part of support member 62 and load bearing seat 5 can be different to reach required illumination effect each other, but not as limit.The luminescence component 310 that also can arrange different emission wavelength range in addition on identical or different support member 62 combines, and makes the color effect of lighting device 302 abundanter.
In order to improve brightness and improve illumination effect, on the load bearing seat that the luminescence component that multiple transparency carrier 2 is formed is arranged in embodiment as previously mentioned by the lighting device of another embodiment of the present utility model simultaneously or other load carriers, the form now can adopting symmetry or asymmetric geometry is arranged, preferably the luminescence component that multiple transparency carrier 2 is formed namely is arranged on load carrier 60 with the form of point symmetry or line symmetry by asymmetrical arrangement.Please refer to Figure 26 to Figure 29, the lighting device 11 of each embodiment arranges multiple luminescence component on various difform load carrier 60, and allow the bright dipping of integral illumination device 11 can evenly (light emitting diode construction omits signal) with the form of point symmetry or line symmetry, the light-out effect of lighting device 11 also can be done further adjustment again by the size changing the first above-mentioned angle and improve.As shown in figure 26, between luminescence component, press from both sides an angle of 90 degrees in point symmetry mode, now see all just at least two luminescence components from any surface at lighting device 11 four sides toward lighting device 11; Between the luminescence component of the lighting device 11 shown in Figure 27, angle is less than 90 degree; Between the luminescence component of the lighting device 11 shown in Figure 29, angle system is greater than 90 degree.Multiple luminescence component is then concentrated or scattering device in asymmetric arrangement mode by another embodiment at least partly, needs (not shown) to reach the light shape of lighting device 11 when the different application.
Please refer to Figure 30, Figure 30 depicts the generalized section of the lighting device 301 of another preferred embodiment of the present utility model.As shown in figure 30, lighting device 301 comprises luminescence component 310 and support member 321.Support member 321 comprises breach 330, and luminescence component 310 is corresponding with breach 330 arranges.Wherein, the bottom of the support member 321 of the present embodiment also can be used as pin or is bent into connection pad needed for surface soldered, in order to set firmly or/and be electrically connected at other required components such as load bearing seat.Because the exiting surface of luminescence component 310 is arranged in breach 330, no matter therefore whether support member 321 is light transmissive material, lighting device 301 all can possess six luminous illumination effects.
Please refer to Figure 31 and Figure 32, Figure 31 and Figure 32 depicts the schematic diagram of the lampshade 7 of a preferred embodiment of the present utility model.This lighting device comprises elongate tubular lampshade 7, at least one luminescence component 1 and its load carrier 60, and wherein luminescence component 1 to be arranged on load carrier 60 and to be positioned at the space that elongate tubular lampshade 7 formed at least partially.As shown in figure 32, when more multiple optical assembly 1 is arranged in lampshade 7, be arrange in mode not parallel to each other between the first first type surface 21A of luminescence component 1.In addition, luminescence component 1 is placed in the space that lampshade 7 formed at least partly, and is not close to the inwall of lampshade 7, and preferred embodiment is have the distance D being greater than 500 microns (μm) between luminescence component 1 and lampshade 7; But also can design and form lampshade 7 in encapsulating mode, and make this lampshade 7 coated at least partly and be directly contacted with this luminescence component 1.
Please refer to Figure 33, the lighting device 303 of another preferred embodiment of the present utility model comprises at least one luminescence component 1, load bearing seat 5 and at least one support member 62.Luminescence component 1 is arranged on support member 62 and support member 62 is coupled to load bearing seat 5.Compared to the embodiment of Figure 21, the support member 62 of the present embodiment is for being obliquely installed, and therefore at least a part for support member 62 can closer to the central shaft D1 of load bearing seat 5.More particularly, the lighting device 303 of the present embodiment luminescence component 1 that comprises two support members 62 and be arranged at respectively on two support members 62.Two support members 62 are connected to make thermal conduction effect better with load bearing seat 5.Support member 62 slopes inwardly relative to the central shaft D1 of load bearing seat 5, and as shown in FIG., has the first angle theta between luminescence component 1 and load bearing seat 5
1(angle namely between support member 62 and load bearing seat 5).First angle theta
1angle between 45 degree to 75 degree, the embodiment that therefore size of lighting device 303 can compare the 21st figure more reduces, and can promote this lighting device 303 in the brightness near this central shaft D1 position.
Please refer to Figure 34 to Figure 37, compared to above-described embodiment, the lighting device 304/305/306/307 of Figure 34 to Figure 37 has more evolutions and application, and wherein lighting device 304/305/306/307 can be Crystal lamp.As shown in figure 34, lighting device 304 comprises at least one luminescence component 1, load bearing seat 5 and at least one support member 62.Support member 62 comprises the first connecting portion 621 and the second connecting portion 623.One end of second connecting portion 623 is arranged at load bearing seat 5, and the other end is connected to one end of the first connecting portion 621.Luminescence component 1 is arranged at the other end that the first connecting portion 621 corresponds to the second connecting portion 623.First connecting portion 621 can rotate relative to the second connecting portion 623 further.More particularly, the central shaft D1 of the relative load bearing seat 5 of the first connecting portion 621 in the present embodiment is inside or outward-dipping, and has the second angle theta between the first connecting portion 621 and the second connecting portion 623
2, the second angle theta
2angle between 135 degree to 175 degree, can further improve in the brightness close to central shaft D1 position or reduce by this, look closely practical application and determine.Second connecting portion 623 is perpendicular to load bearing seat 5, but is not limited thereto.In other embodiments of the utility model, there is between the second connecting portion 623 and load bearing seat 5 the 3rd angle theta
3, and the 3rd angle theta
3angle can between 45 degree to 85 degree.In addition, the second connecting portion 623 also can rotate relative to load bearing seat 5 further.In the present embodiment, lighting device 304 is higher compared to the embodiment of the 21st figure in the brightness of the central shaft D1 position close to load bearing seat 5, and size is less.
Please refer to Figure 35, compared to the embodiment of Figure 34, the lighting device 305 of the present embodiment comprises at least one support member 62, support member 62 comprises the first connecting portion 621 and the second connecting portion 623, and wherein luminescence component 1 is arranged at one end of the first connecting portion 621 and this end is also connected to one end of the second connecting portion 623.The other end of the second connecting portion 623 is coupled to load bearing seat 5.One end that first connecting portion 621 is not connected with the second connecting portion 623 is inside or outward-dipping relative to the central shaft D1 of load bearing seat 5, and has the second angle theta between the first connecting portion 621 and the second connecting portion 623
2.Second angle theta
2angle can between 5 degree to 45 degree, to improve in the brightness close to central shaft D1 position.Other assemblies of lighting device 305 can be identical with lighting device 304, repeats no more in this.
In addition, please refer to Figure 36, the lighting device 306 of the present embodiment comprises support member 62, and support member 62 is flexible to form arcuate structure.The arc radius of curvature of curved support part 62 is between 10mm to 200mm, and the home position of this arcuate structure can be close to (as shown in figure 37) or the central shaft D1 away from (as shown in figure 36) this load bearing seat 5.Please refer to Figure 37, the lighting device 307 of the present embodiment comprises support member 62, and support member 62 is parabolic configuration further.Two luminescence components 1 are arranged at the relative both sides of support member 62.The utility model can be not limited thereto, and support member 62 also may further be ellipsoidal structure.
The foregoing is only the preferred embodiment of the utility model, all equalizations done according to the utility model claim change and modify, and all should belong to the covering scope of the utility model.
Detailed description listed is above only illustrating for feasibility embodiment of the present utility model; they are also not used to limit protection domain of the present utility model, all do not depart from the utility model skill equivalent implementations of doing of spirit or change all should be included within protection domain of the present utility model.
Claims (9)
1. a lighting device, is characterized in that, described lighting device comprises:
At least one luminescence component, described luminescence component comprises:
Transparency carrier, has loading end and the second first type surface, described loading end and described second first type surface positioned opposite to each other; And
Multiple light emitting diode construction, be arranged on described loading end, and with the described loading end of the part that described light emitting diode construction is not set formed can be luminous the first first type surface, the light that at least one light emitting diode construction in wherein said multiple light emitting diode construction sends is through described transparency carrier and by described second first type surface bright dipping;
Load bearing seat; And
At least one support member, is coupled to described load bearing seat;
Wherein said luminescence component is arranged on described support member, and the central shaft of at least Local Phase to described load bearing seat of described support member is inside or outward-dipping.
2. lighting device as claimed in claim 1, it is characterized in that having the first angle between described luminescence component and described load bearing seat, and the angle of described first angle is between 45 degree to 75 degree.
3. lighting device as claimed in claim 1 or 2, it is characterized in that, described support member comprises the first connecting portion and the second connecting portion, described second connecting portion is arranged at described load bearing seat, and wherein said first connecting portion is connected to described second connecting portion and and has the second angle between described second connecting portion.
4. lighting device as claimed in claim 3, it is characterized in that, described first connecting portion stretches out relative to the described central shaft of described load bearing seat, and the angle of described second angle is between 135 degree to 175 degree.
5. lighting device as claimed in claim 3, it is characterized in that, described first connecting portion extends internally relative to the described central shaft of described load bearing seat, and the angle of described second angle is between 5 degree to 45 degree.
6. lighting device as claimed in claim 3, it is characterized in that having the 3rd angle between described second connecting portion and described load bearing seat, and the angle of described 3rd angle is between 45 degree to 85 degree.
7. lighting device as claimed in claim 1 or 2, it is characterized in that, described support member is arcuate structure.
8. lighting device as claimed in claim 7, it is characterized in that, the arc radius of curvature of described arcuate structure is between 10mm to 200mm, and the home position of described arcuate structure is the described central shaft close to or away from described load bearing seat.
9. lighting device as claimed in claim 1 or 2, it is characterized in that, described support member is Throwing thing linear structure or ellipsoidal structure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/218,869 | 2014-03-18 | ||
| US14/218,869 US9488321B2 (en) | 2012-05-29 | 2014-03-18 | Illumination device with inclined light emitting element disposed on a transparent substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204459854U true CN204459854U (en) | 2015-07-08 |
Family
ID=53666737
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520148878.XU Active CN204459854U (en) | 2014-03-18 | 2015-03-16 | Lighting device |
| CN201510114728.1A Pending CN104930368A (en) | 2014-03-18 | 2015-03-16 | Lighting device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510114728.1A Pending CN104930368A (en) | 2014-03-18 | 2015-03-16 | Lighting device |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN204459854U (en) |
| TW (2) | TWM507528U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104930368A (en) * | 2014-03-18 | 2015-09-23 | 璨圆光电股份有限公司 | Lighting device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM319375U (en) * | 2007-04-23 | 2007-09-21 | Guo-Chiou Jiang | LED lamp |
| CN201218482Y (en) * | 2008-05-26 | 2009-04-08 | 邹永祥 | Angle-fixing high-brightness polycrystal packaging LED heat radiating device |
| CN201277506Y (en) * | 2008-09-28 | 2009-07-22 | 黄勇斌 | Angle-adjustable LED reflectoscope |
| TWM358245U (en) * | 2008-12-31 | 2009-06-01 | Hsiuping Inst Technology | LED desk lamp |
| CN101936465B (en) * | 2009-07-01 | 2013-07-03 | 富准精密工业(深圳)有限公司 | Light-emitting diode lamp |
| CN102130239B (en) * | 2011-01-31 | 2012-11-07 | 郑榕彬 | Omnibearing lighting LED (light-emitting diode) packaging method and LED packaging part |
| US9166116B2 (en) * | 2012-05-29 | 2015-10-20 | Formosa Epitaxy Incorporation | Light emitting device |
| CN203190144U (en) * | 2013-04-16 | 2013-09-11 | 胜华科技股份有限公司 | Light emitting device |
| TWM507528U (en) * | 2014-03-18 | 2015-08-21 | Formosa Epitaxy Inc | Illumination device |
-
2015
- 2015-03-04 TW TW104203212U patent/TWM507528U/en unknown
- 2015-03-04 TW TW104106877A patent/TWI660494B/en active
- 2015-03-16 CN CN201520148878.XU patent/CN204459854U/en active Active
- 2015-03-16 CN CN201510114728.1A patent/CN104930368A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104930368A (en) * | 2014-03-18 | 2015-09-23 | 璨圆光电股份有限公司 | Lighting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104930368A (en) | 2015-09-23 |
| TWM507528U (en) | 2015-08-21 |
| TWI660494B (en) | 2019-05-21 |
| TW201537742A (en) | 2015-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103456728B (en) | Light-emitting component and light-emitting device thereof | |
| US20220178527A1 (en) | Light emitting apparatus | |
| US10453827B1 (en) | LED apparatuses and methods | |
| KR102011100B1 (en) | Tubular light emitting apparatus integrated photo sensor and lighting system | |
| CN204118121U (en) | Light-emitting device | |
| CN203521459U (en) | Light-emitting assembly and light-emitting device | |
| CN204459854U (en) | Lighting device | |
| TWI614886B (en) | Light-emitting device and lamp having the same | |
| CN204668357U (en) | Semiconductor light-emitting elements and light-emitting device thereof | |
| CN203948978U (en) | Light-emitting device | |
| TWI533468B (en) | Light emitting element and illumination device thereof | |
| JP2011114342A (en) | Light emitting element package | |
| TWI570350B (en) | Illumination device | |
| CN106169467A (en) | Light-emitting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20161031 Address after: Taiwan, China Hsinchu Science Park Road No. five, No. 5 Patentee after: Jingyuan Optoelectronics Co., Ltd. Address before: China Longtan Taiwan Taoyuan County Rural Science and Technology Park Longtan Dragon Garden Road No. 99 Patentee before: Formosa Epitaxy Incorporation |