CN204424238U - Wafer mounting apparatus and vapor phase growing apparatus - Google Patents
Wafer mounting apparatus and vapor phase growing apparatus Download PDFInfo
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- CN204424238U CN204424238U CN201520163080.2U CN201520163080U CN204424238U CN 204424238 U CN204424238 U CN 204424238U CN 201520163080 U CN201520163080 U CN 201520163080U CN 204424238 U CN204424238 U CN 204424238U
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- mounting apparatus
- wafer mounting
- circle body
- wafer
- suction disc
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Abstract
The utility model provides a kind of wafer mounting apparatus and vapor phase growing apparatus.Described wafer mounting apparatus comprises circle body and wafer suction disc, wherein, wafer suction disc is provided with at least four symmetrical holding sections, circle body is provided with the snap fit portion matched with described holding section.During installation, circle body is placed on wafer suction disc, and by the align clamping of holding section with snap fit portion, relative position between circle body and wafer suction disc is fixed, thus solve because the relative position of circle body and wafer suction disc is not fixed in existing wafer mounting apparatus, and there is the problem that circle body and wafer suction disc block.In addition, described vapor phase growing apparatus comprises vacuum cavity and described wafer mounting apparatus.When board is safeguarded, the utility model can reduce product loss, reduces use cost, and can eliminate the hidden danger that vacuum cavity environment polluted, and when board operates, can guarantee again the stability of vapor deposition process, and then Improving The Quality of Products.
Description
Technical field
The utility model relates to field of semiconductor processing and manufacturing, particularly a kind of wafer mounting apparatus and vapor phase growing apparatus.
Background technology
In high density plasma CVD (HDP CVD) technique, wafer adsorption carries out vapor deposition process on wafer mounting apparatus.
As shown in Figure 1a, existing wafer mounting apparatus comprises wafer suction disc 100 and circle body 200, and wafer suction disc 100 for adsorbing wafer, and is fixed by circle body 200, to ensure the process of wafer suction disc 100, guarantees the stability of vapor deposition process.
Continue with reference to figure 1a, wafer suction disc 100 comprises platform 101 and is arranged at the boss 102 in platform 101 centre, the sidewall of boss 102 is provided with the first scarf 103, accordingly, the inwall of circle body 200 is provided with the second scarf 201.During assembling, as shown in Figure 1a, according to the direction of arrow, circle body 200 is enclosed within boss 102, and being positioned on platform 101, cooperatively interacting simultaneously by the first scarf 103 and the second scarf 201, locates the installation direction of circle body 200, state after described wafer mounting apparatus assembling, can consult Fig. 1 b.
When carrying out vapor deposition process, first described wafer mounting apparatus is positioned in reaction chamber (chamber), then utilize described wafer mounting apparatus to be fixed in reaction chamber by wafer, molecular pump can be installed in order to produce plasma in the below of described reaction chamber simultaneously.But find in practice, described molecular pump can produce vibrations in operation process, and described in switch, during molecular pump, vibrations can be larger.Like this, if the associated components in described reaction chamber is not fully fixed, the vibrations produced when described molecular pump running or switch, can cause such as the wafer mounting apparatus position of the associated components in reaction chamber to occur to slide or displacement.
Specifically, for wafer mounting apparatus, if skew occurs circle body 200 will certainly affect process stability, and then affect product quality.And, because wafer suction disc 100 and circle body 200 are only positioned by the first scarf 103 and the second scarf 201, the relative position of the two is not fully fixed, therefore, the vibrations produced when molecular pump running or switch can cause circle body 200 to produce slip, then circle body 200 can be subject to the effect of boss 102 to it, and cause circle body 200 because deforming by force unbalance, gap meanwhile between wafer suction disc 100 and circle body 200 arranges again very little, causes the problem very easily occurring that circle body and wafer suction disc block.Once circle body 200 and wafer suction disc 100 block, just need destroy circle body 200 thus taken out, the mode that this destructiveness is taken out not only can cause damage to the precise part in reaction chamber, the damage of wafer suction disc 100 also can be caused time serious, and particle can be produced, thus pollute the vacuum environment in reaction chamber.
Utility model content
The purpose of this utility model is to provide a kind of wafer mounting apparatus, circle body in described wafer mounting apparatus and the relative position between wafer suction disc can fully be fixed, thus reduce the loss of wafer mounting apparatus, reduce use cost, and guarantee the stability of vapor deposition process, and then Improving The Quality of Products.
In order to solve the problems of the technologies described above, the utility model provides a kind of wafer mounting apparatus, comprises wafer suction disc and circle body; Wherein, described wafer suction disc is provided with at least four symmetrical holding sections, described circle body is provided with the snap fit portion matched with described holding section.
Further, in described wafer mounting apparatus, described wafer suction disc comprises a platform and is arranged at the boss at described Platform center position, and described boss and described circle body match.
Further, in described wafer mounting apparatus, the shape and size of described at least four holding sections are identical.
Further, in described wafer mounting apparatus, the shape of described at least four holding sections is identical, but the size of one of them holding section is different from the size of all the other holding sections.
Further, in described wafer mounting apparatus, in described at least four holding sections, the shape of one of them holding section is different from the shape of all the other holding sections.
Further, in described wafer mounting apparatus, described holding section is protruding, and described snap fit portion is through hole, described projection and the mutual clamping of described through hole.
Further, in described wafer mounting apparatus, the sidewall of described boss is provided with the first scarf, the inwall of described circle body is provided with the second scarf matched with described first scarf.
Further, in described wafer mounting apparatus, the sidewall of described boss is provided with extension, the inwall of described circle body is provided with the groove matched with described extension.
Further, in described wafer mounting apparatus, described projection is arranged at the edge, neighboring of described platform.
Further, in described wafer mounting apparatus, the fit clearance between described projection and described through hole is identical with the fit clearance between described boss with described circle body.
Further, in described wafer mounting apparatus, the cross section that described projection and described through hole are parallel to described platform adopts central angle to be 90 ° ~ 180 ° fan-shaped.
Further, in described wafer mounting apparatus, the large 0.5 ~ 1.0mm of height protruding described in the depth ratio of described through hole.
Further, in described wafer mounting apparatus, the fit clearance of described projection and described through hole is 0.05 ~ 0.1mm.
In addition, the utility model additionally provides a kind of vapor phase growing apparatus, and comprise vacuum cavity and wafer mounting apparatus described above, described wafer mounting apparatus is arranged in described vacuum cavity.
Further, in described vapor phase growing apparatus, described vapor phase growing apparatus is high density plasma CVD device.
In sum, wafer mounting apparatus of the present utility model and vapor phase growing apparatus have following beneficial effect:
First, described wafer suction disc is provided with at least four symmetrical holding sections, described circle body is provided with the snap fit portion matched with described holding section, wherein, align with described snap fit portion clamping in described holding section, make the relative position between described circle body and described wafer suction disc fully fixing, in molecular pump operation process, slip and displacement is produced to prevent circle body, make described circle body stress balance simultaneously, and then prevent circle body from deforming, thus the problem that solution circle body and wafer suction disc block mutually, such setting not only can guarantee the stability of vapor deposition process when board operates, Improving The Quality of Products, and product loss can be reduced when board is safeguarded, reduce use cost.
Secondly, described projection is arranged at the edge, platform neighboring of described wafer suction disc, can ensure the structural strength of the circle body coordinated with it on the one hand, and also can not affect the wafer that described wafer mounting apparatus adsorbs carries out vapor deposition process on the other hand.
Accompanying drawing explanation
Fig. 1 a is the structural representation before the assembling of existing wafer mounting apparatus;
Fig. 1 b is the vertical view after the assembling of wafer mounting apparatus shown in Fig. 1 a;
Fig. 2 a is the structural representation before the assembling of the utility model embodiment one wafer mounting apparatus;
Fig. 2 b is the structural representation before the assembling of the utility model embodiment one wafer mounting apparatus;
Fig. 3 a is the vertical view after the assembling of wafer mounting apparatus shown in Fig. 2 a;
Fig. 3 b is the vertical view after the assembling of wafer mounting apparatus shown in Fig. 2 b;
Fig. 4 a is the structural representation before the assembling of the utility model embodiment two wafer mounting apparatus;
Fig. 4 b is the vertical view after the assembling of wafer mounting apparatus shown in Fig. 4 a;
Fig. 5 is the sectional structure schematic diagram of the utility model embodiment three vapor phase growing apparatus.
Embodiment
Below in conjunction with the drawings and specific embodiments, the wafer mounting apparatus that the utility model proposes and vapor phase growing apparatus are described in further detail.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts the form that simplifies very much and all uses non-ratio accurately, only in order to object that is convenient, aid illustration the utility model embodiment lucidly.
The utility model provides a kind of wafer mounting apparatus, described wafer mounting apparatus comprises wafer suction disc and circle body, described wafer suction disc is provided with at least four symmetrical holding sections, described circle body is provided with the snap fit portion matched with described holding section, by the align clamping of described holding section with described snap fit portion, relative position between described circle body and described wafer suction disc is fully fixing, thus ensure that the stability of vapor deposition process, improve product quality, and decrease product loss, reduce the use cost of wafer mounting apparatus, and eliminate the hidden danger that vacuum cavity environment polluted, ensure that product quality.
Embodiment one
As shown in Figure 2 a, described wafer mounting apparatus comprises circle body 300 and wafer suction disc 400, wherein, wafer suction disc 400 is provided with four symmetrical projections 401, circle body 300 is provided with and protruding 401 through holes 301 matched.Preferably, protruding 401 as holding section, and through hole 301, as snap fit portion, utilizes type lock construction, by circle body 300 and wafer suction disc 400 fully fixing, not only locking effect is good, and easy economy.
Wherein, the material of circle body 300 includes but not limited to ceramic material, but in vapour deposition class processing procedure, because of insulation and heat insulation needs, the general circle body 300 adopting ceramic material, same, the material of wafer suction disc 400 includes but not limited to aluminum alloy materials.
As shown in Figure 2 a, wafer suction disc 400 comprises a platform 402 and is arranged at the boss 403 in platform 402 centre, and boss 403 matches with circle body 300.In the present embodiment, the shape and size of four projections 401 are all identical.In this case, the sidewall of boss 403 is provided with the first scarf 404, accordingly, the inwall of circle body 300 is provided with the second scarf 302; Or, as shown in Figure 2 b, the sidewall of boss 403 arranges an extension 405, corresponding, circle body 300 is provided with the groove 303 matched with extension 405.During assembling, described wafer mounting apparatus, just by the first scarf 404 and the second scarf 302 or cooperatively interacting between extension 405 and groove 303, can locate the installation direction of circle body 300.
In the present embodiment, the cross section (being parallel to platform 402) of boss 403 for circular, this be in order to the wafer mating shapes that adsorbs on boss 403.Certainly, the utility model does not limit the shape of cross section of boss 403, can be adjusted accordingly according to described wafer.Same, the utility model does not limit the structure of extension 405 as shape yet, and the particular location on boss 403 sidewall, but carry out vapor deposition process to not affect described wafer, another saving material, the cross section (being parallel to platform 402) of extension 405 is preferably set to semicircular arc, and is positioned at the first scarf 404 place on boss 403 sidewall.
Fig. 3 a is the vertical view after the assembling of wafer mounting apparatus shown in Fig. 2 a, and Fig. 3 b is the vertical view after the assembling of wafer mounting apparatus shown in Fig. 2 b.Below for Fig. 3 b, the assembling mode of described wafer mounting apparatus is described.
During assembling, as shown in Figure 2 a, according to the direction of arrow, circle body 300 is enclosed within the boss 403 of wafer suction disc 400, and is positioned on platform 402, cooperatively interacting simultaneously by extension 405 and groove 303, locate the installation direction of circle body 300, and by the align clamping of projection 401 with through hole 301, the relative position of circle body 300 and wafer suction disc 400 is fixed, as shown in Figure 3 b; And circle body 300 is when dismantling, directly take off from wafer suction disc 400.The easy installation and removal of the utility model wafer mounting apparatus, locking effect is better.
In the present embodiment, the fit clearance between protruding 401 and through hole 301, is set to identical with the fit clearance between boss 403 with circle body 300, can ensures circle body 300 stress balance like this.In addition, in order to make to install compact between circle body 300 and wafer suction disc 400, described fit clearance is preferably 0.05mm ~ 0.1mm.In addition, the degree of depth of through hole 301 is set to the large 0.5mm ~ 1.0mm of height than protruding 401, in case the height of protruding 401 exceeds through hole 301 and affects the normal mounting of wafer.
Further, protruding 401 and the cross section (being parallel to platform 402) of through hole 301 adopt central angle to be 90 ° ~ 180 ° fan-shaped, adopt such cross section can solve better because fit clearance is too small and discontinuity equalization, and make the problem that circle body 300 and wafer suction disc 400 block.When protruding 401 and the cross section of through hole 301 be semicircle time, preferably the size of four projections 402 is: radius 8.95mm ~ 10.95mm, highly 4.5mm ~ 6.5mm; The size of four through holes 301 coordinated with it is: radius 8.975mm ~ 11.0mm, height 5.0mm ~ 7.5mm.Specifically, when the radius of projection 402 with when being highly respectively 8.95mm and 4.5mm, radius and the degree of depth of through hole 301 are respectively 8.975mm and 5.0mm, and now the fit clearance of projection 402 and through hole 301 is 0.05mm, the large 0.5mm of height of the depth ratio projection 402 of through hole 301; Or when the radius of projection 402 with when being highly respectively 10.95mm and 4.5mm, radius and the degree of depth of through hole 301 are respectively 11.0mm and 5.5mm, now the fit clearance of projection 402 and through hole 301 is 0.1mm, the large 1.0mm of height of the depth ratio projection 402 of through hole 301.
Be understandable that, the utility model just gives above-mentioned than better suited size range, and described size is suitable for but is not limited to described scope, finally can determine according to the demand of reality.
As shown in Fig. 2 a to Fig. 3 b, projection 401 is arranged at the edge, neighboring of platform 402, can ensure the structural strength of the circle body 300 coordinated with it on the one hand, and also can not affect the wafer that described wafer mounting apparatus adsorbs carries out vapor deposition process on the other hand.
Embodiment two
Consult Fig. 4 a and Fig. 4 b, embodiment two and embodiment one difference are: for the present embodiment wafer suction disc 600, the sidewall being arranged at the boss 603 in platform 604 centre eliminates the structure for locating circle body 500 installation direction, as the first scarf 404 or extension 405; Same, the present embodiment circle body 500 eliminates the structure for locating circle body 500 installation direction, as the second scarf 302 or groove 303; But, take following setting, locate the installation direction of circle body 500 and the relative position between fixing circle body 500 and wafer suction disc 600.
Concrete, in the present embodiment: described four protruding shapes are set to identical, but the size of one of them projection is different from the size of all the other projections, or in described four projections, the shape of one of them projection is set to different from the shape of all the other projections.So, further can reduce use cost, improve locating effect.
As shown in fig. 4 a, described wafer mounting apparatus comprises circle body 500 and wafer suction disc 600, wherein, be arranged at the projection on wafer suction disc 600, comprise one first protruding 601 and three the second projections 602, first projection 601 is identical with the shape of the second projection 602, but the cross section of the first projection 601 (being parallel to platform 604) size is different from the cross sectional dimensions of the second projection 602, the cross section of the such as first protruding 601 and second projection 602 is semicircle, but the diameter of the two is different; Or also can the cross section of the first projection 601 (being parallel to platform 604) shape be set to different from the shape of cross section of the second projection 602, the such as cross section of the first projection 601 is fan-shaped (not the comprising 180 °) of 90 ° ~ 180 °, central angle, but the cross section of the second projection 602 adopts semicircle; Meanwhile, circle body 500 is provided with the first through hole 501 matched with the first projection 601, and the second through hole 502 matched with the second projection 602.In this case, by arranging the projection of difformity or size, location circle body 500 installation direction and the effect of relative position between fixing circle body 500 and wafer suction disc 600 can be played simultaneously.
In the present embodiment, when the cross section of the first projection 601 is semicircle, the first projection 601 is preferably dimensioned to be: radius 13.95mm ~ 15.95mm, and the first through hole 501 coordinated with it is preferably dimensioned to be: radius 13.975mm ~ 16.0mm.Such as, when the radius of the first projection 601 is 13.95mm, the radius of the first through hole 501 is 13.975mm; Or when the radius of the first projection 601 is 15.95mm, the radius of the first through hole 501 is 16.0mm.
Be understandable that, the utility model just gives than better suited size range, and described size is suitable for but is not limited to described scope, finally can determine according to the demand of reality.
Fig. 4 b is the vertical view after the assembling of wafer mounting apparatus shown in Fig. 4 a.During assembling, as shown in fig. 4 a, according to the direction of arrow, circle body 500 is enclosed within boss 603, and is positioned on platform 604, cooperatively interacting simultaneously by the first protruding 601 and first through hole 501, locate the installation direction of circle body 500, and by the second projection 602 and the clamping of aliging of the second through hole 502, the relative position of circle body 500 and wafer suction disc 600 is fixed, as shown in Figure 4 b.
Embodiment three
The present embodiment provides a kind of vapor phase growing apparatus, and described vapor phase growing apparatus comprises the wafer mounting apparatus as described in embodiment one or embodiment two, concrete, as shown in Figure 5.
Consult Fig. 5, described vapor phase growing apparatus also comprises vacuum cavity 700, and described wafer mounting apparatus is positioned in vacuum cavity 700, for adsorbing wafer 800, and vacuum cavity 700 can be wafer 800 carries out gas-phase deposition and provide a vacuum reaction chamber, described vapor deposition processes carries out wherein.
Further, described vapor phase growing apparatus is physical vapour deposition (PVD) (PVD) device or chemical vapour deposition (CVD) (CVD) device, and chemical vapour deposition (CVD) (CVD) device is described high density plasma CVD (HDP CVD) device such as.
In sum, the wafer mounting apparatus that the utility model provides and vapor phase growing apparatus, not only overcome in existing wafer mounting apparatus, cause circle body 200 to produce because the relative position between circle body 200 and wafer suction disc 100 is unfixing and slide and displacement, and then affect the problem of process stability; Avoid circle body 200 to deform because of unbalance stress simultaneously, and then produce and the problem blocked of wafer suction disc 100.Therefore, when carrying out vapor deposition process, the utility model can ensure the stability of described vapor deposition process, Improving The Quality of Products; Another when board is safeguarded, the utility model can reduce product loss, reduces use cost, and can eliminate the hidden danger that vacuum cavity environment polluted, and guarantees product quality further.
Although the utility model with preferred embodiment openly as above; but it is not for limiting the utility model; any those skilled in the art are not departing from spirit and scope of the present utility model; the Method and Technology content of above-mentioned announcement can be utilized to make possible variation and amendment to technical solutions of the utility model; therefore; every content not departing from technical solutions of the utility model; the any simple modification done above embodiment according to technical spirit of the present utility model, equivalent variations and modification, all belong to the protection range of technical solutions of the utility model.
Claims (15)
1. a wafer mounting apparatus, is characterized in that: comprise wafer suction disc and circle body, described wafer suction disc is provided with at least four symmetrical holding sections, described circle body is provided with the snap fit portion matched with described holding section.
2. wafer mounting apparatus as claimed in claim 1, is characterized in that: described wafer suction disc comprises a platform and is arranged at the boss at described Platform center position, and described boss and described circle body match.
3. wafer mounting apparatus as claimed in claim 2, is characterized in that: the shape and size of described at least four holding sections are identical.
4. wafer mounting apparatus as claimed in claim 2, it is characterized in that: the shape of described at least four holding sections is identical, but the size of one of them holding section is different from the size of all the other holding sections.
5. wafer mounting apparatus as claimed in claim 2, is characterized in that: in described at least four holding sections, the shape of one of them holding section is different from the shape of all the other holding sections.
6. the wafer mounting apparatus according to any one of claim 2 to 5, is characterized in that: described holding section is for protruding, and described snap fit portion is through hole, described projection and the mutual clamping of described through hole.
7. wafer mounting apparatus as claimed in claim 3, is characterized in that: the sidewall of described boss is provided with the first scarf, the inwall of described circle body is provided with the second scarf matched with described first scarf.
8. wafer mounting apparatus as claimed in claim 3, is characterized in that: the sidewall of described boss is provided with extension, the inwall of described circle body is provided with the groove matched with described extension.
9. wafer mounting apparatus as claimed in claim 6, is characterized in that: described projection is arranged at the edge, neighboring of described platform.
10. wafer mounting apparatus as claimed in claim 6, is characterized in that: the fit clearance between described projection and described through hole, identical with the fit clearance between described boss with described circle body.
11. wafer mounting apparatus as claimed in claim 6, is characterized in that: the cross section that described projection and described through hole are parallel to described platform adopts central angle to be 90 ° ~ 180 ° fan-shaped.
12. wafer mounting apparatus as claimed in claim 6, is characterized in that: the large 0.5mm ~ 1.0mm of height protruding described in the depth ratio of described through hole.
13. wafer mounting apparatus as claimed in claim 10, is characterized in that: the fit clearance of described projection and described through hole is 0.05mm ~ 0.1mm.
14. 1 kinds of vapor phase growing apparatus, is characterized in that: comprise vacuum cavity and the wafer mounting apparatus according to any one of claim 1 to 13, described wafer mounting apparatus is arranged in described vacuum cavity.
15. vapor phase growing apparatus as claimed in claim 14, is characterized in that: described vapor phase growing apparatus is high density plasma CVD device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520163080.2U CN204424238U (en) | 2015-03-20 | 2015-03-20 | Wafer mounting apparatus and vapor phase growing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520163080.2U CN204424238U (en) | 2015-03-20 | 2015-03-20 | Wafer mounting apparatus and vapor phase growing apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN204424238U true CN204424238U (en) | 2015-06-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520163080.2U Expired - Fee Related CN204424238U (en) | 2015-03-20 | 2015-03-20 | Wafer mounting apparatus and vapor phase growing apparatus |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106356327A (en) * | 2016-11-18 | 2017-01-25 | 上海华力微电子有限公司 | Device for reducing growth of back of wafer |
| CN109498089A (en) * | 2018-12-05 | 2019-03-22 | 北京派尔特医疗科技股份有限公司 | A kind of hysteroscope stapler steering lock apparatus and the hysteroscope stapler using it |
| CN112030130A (en) * | 2020-08-27 | 2020-12-04 | 上海华力集成电路制造有限公司 | Positioning structure and positioning method thereof |
-
2015
- 2015-03-20 CN CN201520163080.2U patent/CN204424238U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106356327A (en) * | 2016-11-18 | 2017-01-25 | 上海华力微电子有限公司 | Device for reducing growth of back of wafer |
| CN109498089A (en) * | 2018-12-05 | 2019-03-22 | 北京派尔特医疗科技股份有限公司 | A kind of hysteroscope stapler steering lock apparatus and the hysteroscope stapler using it |
| CN112030130A (en) * | 2020-08-27 | 2020-12-04 | 上海华力集成电路制造有限公司 | Positioning structure and positioning method thereof |
| CN112030130B (en) * | 2020-08-27 | 2023-06-13 | 上海华力集成电路制造有限公司 | Positioning structure and positioning method thereof |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150624 Termination date: 20190320 |