CN204408822U - A kind of radiator - Google Patents

A kind of radiator Download PDF

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Publication number
CN204408822U
CN204408822U CN201420745224.0U CN201420745224U CN204408822U CN 204408822 U CN204408822 U CN 204408822U CN 201420745224 U CN201420745224 U CN 201420745224U CN 204408822 U CN204408822 U CN 204408822U
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CN
China
Prior art keywords
heat radiation
heating panel
radiating
radiator
pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420745224.0U
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Chinese (zh)
Inventor
张于
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN GAOLIN TECHNOLOGY HARDWARE Co Ltd
Original Assignee
KUNSHAN GAOLIN TECHNOLOGY HARDWARE Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN201420745224.0U priority Critical patent/CN204408822U/en
Application granted granted Critical
Publication of CN204408822U publication Critical patent/CN204408822U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to radiating device technical field, it comprises to particularly relate to a kind of radiator: pedestal, described pedestal comprises and treats the heat radiation bottom surface that radiating electronic element abuts against and the heating panel extended upward from bottom surface of dispelling the heat, described heat radiation bottom surface is also provided with multiple heat radiation radiating aperture, and described heat radiation radiating aperture runs through heat radiation bottom surface and heating panel.Adopt die-cut and processing method that is bending, rapid shaping, reach on cost such as making material and work flow etc. and significantly reduce; Adopt the structure of heat radiation bottom surface and heating panel, increase area of dissipation, and structure is simple, and external form is light, processing cost is low, and radiating efficiency is high.

Description

A kind of radiator
Technical field
The utility model relates to radiating device technical field, particularly relates to a kind of radiator.
Background technology
Existing flourish along with electronics technology, arithmetic speed and the operational capability of Computing system improve constantly, and meanwhile, the heat energy that these electronic building bricks produce is also along with increase, therefore the used heat how effectively dispersing electronic building brick just becomes a large key problem in technology of the operational paradigm how improving Computing system, and generally speaking, preferably radiating mode is for dispelling the heat in upper installation one radiator of electronic building brick (such as north and south bridge chip etc.), it utilizes a fixing means to make radiator closely be posted by electronic building brick to be dispelled the heat, effectively to dispel the heat.
But, radiator of the prior art is comprise a contact base portion on structuring concept, then on this contact base portion, elongation moulding has multiple heat radiation radiation elongated hole, but due on current radiator structure and there are no the technological break-through that can improve radiating efficiency, therefore the radiator of traditional standard can generally only be continued to use, and when radiating requirements improves more, then often allow dealer at a loss as to what to do, and the phase-change heat sink possessing higher radiating effect have the problems such as the too complicated and cost of manufacture of structure is high.
Therefore, how progressing greatly improvement to radiator structure under cost effectively controls, is the bottleneck for current radiator correlative technology field research and development meet with.
The many employings of radiator of prior art are squeezed the techniques such as aluminium is shaping, forging, welding and are made, and technique is comparatively complicated, and size is wayward, and processing cost is high, in order to solve the problems of the technologies described above, the utility model provides a kind of manufacture method of radiator, comprises the steps:
Step one, the heating panel 5 punching out heat radiation radiating aperture 2 and be connected with heat radiation bottom surface on radiation panel; Described radiation panel also punches out fixing hole.
Step 2, heating panel 5 to be dispelled the heat on bottom surface from its junction bending being enclosed in heat radiation bottom surface.
Utility model content
The purpose of this utility model is the manufacture method proposing a kind of radiator, adopts die-cut and processing method that is bending, rapid shaping, reach and significantly reduce, and external form is light on cost such as making material and work flow etc.
Also provide with a kind of radiator, adopt the structure of heat radiation bottom surface and heating panel, increase area of dissipation, and structure is simple, processing cost is low, and radiating efficiency is high.
For reaching this object, the utility model by the following technical solutions:
A manufacture method for radiator, comprises the steps:
Step one, the heating panel punching out heat radiation radiating aperture and be connected with heat radiation bottom surface on radiation panel;
Step 2, heating panel to be dispelled the heat on bottom surface from its junction bending being enclosed in heat radiation bottom surface.
Wherein, be also included in described step one on described radiation panel and also punch out fixing hole.
Additionally provide a kind of radiator, the manufacture method of the radiator described in employing is made, it comprises: pedestal, described pedestal comprises and treats the heat radiation bottom surface that radiating electronic element abuts against and the heating panel extended upward from bottom surface of dispelling the heat, described heat radiation bottom surface is also provided with multiple heat radiation radiating aperture, and described heat radiation radiating aperture runs through heat radiation bottom surface and heating panel.
Wherein, described pedestal is also provided with for treating with described the fixing hole that radiating electronic element is fixedly connected.
Wherein, described fixing hole is the PIN location hole of the diagonal position be opened on bottom surface, is provided with PIN in described PIN location hole, and described pedestal is fixed on electronic component plate to be dispelled the heat by PIN.
Wherein, described fixing hole is the PCB location hole of the diagonal position be opened on bottom surface, and described pedestal is fixed on electronic component to be dispelled the heat by the cooperation of PCB location hole and fixture.
Wherein, described heating panel is enclosed on the neighboring of described heat radiation bottom surface, and described heating panel is one-body molded with heat radiation bottom surface.
Wherein, bottom surface is perpendicular is connected for described heating panel and heat radiation.
Wherein, described multiple heat radiation radiating aperture is evenly distributed on pedestal.
Wherein, described heat radiation radiating aperture is long waist-shaped hole.
The beneficial effects of the utility model are: adopt die-cut and processing method that is bending, rapid shaping, reach and significantly reduce on cost such as making material and work flow etc.; Adopt the structure of heat radiation bottom surface and heating panel, increase area of dissipation, and structure is simple, and external form is light, processing cost is low, and radiating efficiency is high.
Accompanying drawing explanation
Fig. 1 is the Facad structure schematic diagram of the radiator that the utility model embodiment provides;
Fig. 2 is the inverse layer structure schematic diagram of the radiator that the utility model embodiment provides.
In figure:
1, pedestal; 2, heat radiation radiating aperture; 3, PIN location hole; 4, PCB location hole; 5, heating panel.
Embodiment
The technical solution of the utility model is further illustrated by embodiment below in conjunction with accompanying drawing.
During concrete enforcement, be square for described radiator, the fixed edge that then first die-cut place is mutually isometric with the base of square heat radiation bottom surface on radiation panel, on fixed edge and heat radiation bottom surface, evenly punch out heat radiation radiating aperture 2, preferred described heat radiation radiating aperture 2 runs through fixed edge and heat radiation bottom surface simultaneously.The shape of described radiator is including but not limited to square.
Be mutually permanently connected by fixture between described fixed edge, also can be interlockingly connected by corresponding crimping, can also be linked together by modes such as spot welding.
Adopt and make radiator by die-cut and technique that is bending on radiation panel, manufacturing process steps is few, and technology difficulty is low, improves production efficiency, reduces production cost.
Additionally provide a kind of radiator, as shown in Figure 1-2, the manufacture method of the radiator described in employing is made, and it comprises: pedestal 1, and described pedestal 1 comprises and treats the heat radiation bottom surface that radiating electronic element abuts against and the heating panel 5 extended upward from bottom surface of dispelling the heat.
The setting of described heating panel 5 adds the area of dissipation of radiator, also accelerates the air flowing of heat sink attachment simultaneously.Described heating panel 5 is enclosed on the neighboring of described heat radiation bottom surface, and described heating panel 5 is one-body molded with heat radiation bottom surface.Preferably, the junction of described heat radiation bottom surface and heating panel 5 is the circular arc of smooth transition.
Further, described heating panel 5 can be obtuse angle or right angle with the angle of heat radiation bottom surface, preferably, described heating panel 5 with dispel the heat that bottom surface is perpendicular to be connected.
Described heat radiation bottom surface is also provided with multiple heat radiation radiating aperture 2, and described heat radiation radiating aperture 2 can be the louvre being covered with heat radiation bottom surface and heating panel 5, and described heat radiation radiating aperture 2 can also be the louvre of the long waist type running through heat radiation bottom surface and heating panel 5.
Wherein, described multiple heat radiation radiating aperture 2 is evenly distributed on pedestal 1.To keep the harmony of radiator heat-dissipation.Between described heat radiation radiating aperture 2, there is gap, to keep robustness and the durability of radiator.
Preferably, described heat radiation radiating aperture 2 is long waist-shaped hole.
In order to solve the connectivity problem of heat radiation system the to be dispelled the heat electronic component corresponding with it, the utility model is also provided with for treating with described the fixing hole that radiating electronic element is fixedly connected on described pedestal 1.
Concrete, described fixing hole is the PIN location hole 3 of the diagonal position be opened on bottom surface, is provided with PIN in described PIN location hole 3, and described pedestal 1 is fixed on electronic component plate to be dispelled the heat by PIN.
Or described fixing hole is the PCB location hole 4 of the diagonal position be opened on bottom surface, and described pedestal 1 is fixed on electronic component to be dispelled the heat by the cooperation of PCB location hole 4 and fixture.
In concrete enforcement, described radiator individually can be offered the PIN location hole 3 in diagonal position and PCB location hole 4, further, in order to diversity and the pardon of the fixed form of radiator, on described radiator, PIN location hole 3 and PCB location hole 4 can be offered respectively along two groups of diagonal positions.
In sum, adopt die-cut and processing method that is bending, rapid shaping, reach on cost such as making material and work flow etc. and significantly reduce; Adopt the structure of heat radiation bottom surface and heating panel, increase area of dissipation, and structure is simple, and external form is light, processing cost is low, and radiating efficiency is high.
Below know-why of the present utility model is described in conjunction with specific embodiments.These describe just in order to explain principle of the present utility model, and can not be interpreted as the restriction to the utility model protection range by any way.Based on explanation herein, those skilled in the art does not need to pay performing creative labour can associate other embodiment of the present utility model, and these modes all will fall within protection range of the present utility model.

Claims (8)

1. a radiator, it is characterized in that, it comprises: pedestal (1), described pedestal (1) comprises and treats the heat radiation bottom surface that radiating electronic element abuts against and the heating panel (5) extended upward from bottom surface of dispelling the heat, described heat radiation bottom surface is also provided with multiple heat radiation radiating aperture (2), described heat radiation radiating aperture (2) runs through heat radiation bottom surface and heating panel (5).
2. radiator according to claim 1, is characterized in that, described pedestal (1) is also provided with for treating with described the fixing hole that radiating electronic element is fixedly connected.
3. radiator according to claim 2, it is characterized in that, described fixing hole is the PIN location hole (3) of the diagonal position be opened on bottom surface, be provided with PIN in described PIN location hole (3), described pedestal (1) is fixed on electronic component plate to be dispelled the heat by PIN.
4. radiator according to claim 2, it is characterized in that, described fixing hole is the PCB location hole (4) of the diagonal position be opened on bottom surface, and described pedestal (1) is fixed on electronic component to be dispelled the heat by the cooperation of PCB location hole (4) and fixture.
5. radiator according to claim 1, is characterized in that, described heating panel (5) is enclosed on the neighboring of described heat radiation bottom surface, and described heating panel (5) is one-body molded with heat radiation bottom surface.
6. radiator according to claim 1, is characterized in that, bottom surface is perpendicular is connected for described heating panel (5) and heat radiation.
7. radiator according to claim 1, is characterized in that, described multiple heat radiation radiating aperture (2) is evenly distributed on pedestal (1).
8. radiator according to claim 1, is characterized in that, described heat radiation radiating aperture (2) is long waist-shaped hole.
CN201420745224.0U 2014-12-01 2014-12-01 A kind of radiator Expired - Fee Related CN204408822U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420745224.0U CN204408822U (en) 2014-12-01 2014-12-01 A kind of radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420745224.0U CN204408822U (en) 2014-12-01 2014-12-01 A kind of radiator

Publications (1)

Publication Number Publication Date
CN204408822U true CN204408822U (en) 2015-06-17

Family

ID=53432647

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420745224.0U Expired - Fee Related CN204408822U (en) 2014-12-01 2014-12-01 A kind of radiator

Country Status (1)

Country Link
CN (1) CN204408822U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150617

Termination date: 20191201

CF01 Termination of patent right due to non-payment of annual fee