CN101513661A - Radiator manufacturing method and radiator structure - Google Patents

Abstract

A method for manufacturing a heat sink and a heat sink structure are provided, wherein the method for manufacturing the heat sink comprises the following steps: providing a substrate, wherein the substrate is provided with a top surface, a bottom surface and a side wall, and the side wall of the substrate is provided with a plurality of grooves which are inwards concave and penetrate through the top surface and the bottom surface; providing a plurality of radiating plates, inserting the radiating plates into the corresponding grooves of the substrate, wherein each radiating plate is provided with a top end part and a bottom end part which are opposite; and pressing the substrate by riveting to make the two side wall surfaces of each groove tightly abut against the two opposite surfaces of the radiating plate, so that each radiating plate is positioned at the side wall of the substrate, and the top end part and the bottom end part of each radiating plate respectively extend out of the top surface and the bottom surface of the substrate. By the way, the radiating plate is directly fixed by utilizing the two side wall surfaces of the groove in a riveting mode, so that the radiating plate has the effect of avoiding heat conduction loss.

Description

Radiator manufacturing method and radiator structure

technical field

The invention relates to a heat sink manufacturing method and a heat sink structure, in particular to a heat sink manufacturing method and a heat sink structure formed by riveting instead of soldering.

Background technique

Radiators are widely used, and they are generally used on electronic components that generate heat (such as CPU) or in lamps (such as halogen, LED lamps), etc. to achieve the purpose of assisting heat dissipation, and radiators with cooling fins It is the most common, as shown in Figure 1, it is an existing heat sink, it uses solder 12 on the top surface 111 of the base body 11 and uses the method of reflow to arrange a plurality of heat dissipation fins arranged side by side and equidistant 13 is fixed on the top surface 111 of the seat body 11.

And the effect of radiating fin 13 is to increase the area of radiating heat in a large amount, can contact heat source by the bottom surface 112 of pedestal 11, and then conduct rapidly to each surface 131 of each radiating fin 13 after absorbing its heat by pedestal 11, to realize to assist in cooling purposes.

However, since the heat dissipation fins 13 are welded on the top surface 111 of the base body 11 by solder 12, and the thermal conductivity of the solder 12 is different from that of the base body 11 and the heat dissipation fins 13, when the heat source is conducted to the heat dissipation fins 13, the solder 12 The heat conduction loss will be caused, and the effect of heat dissipation from the heat source to the heat dissipation fins 13 will be deteriorated. Therefore, how to conceive a heat sink that can effectively dissipate heat from the heat source has become an issue that can be improved.

Therefore, the present invention proposes a heat sink manufacturing method and heat sink structure that are reasonably designed and can effectively solve the above problems.

Contents of the invention

The object of the present invention is to provide a heat sink manufacturing method and its structure that avoids the use of solder to avoid heat conduction loss and realizes the heat dissipation effect of electronic components and the like.

According to the characteristics of the present invention, a kind of radiator manufacturing method is proposed, and it comprises the following steps:

A substrate is provided, the substrate has a top surface, a bottom surface and a side wall, and the side wall of the substrate has a plurality of grooves recessed inward and penetrating the top surface and the bottom surface;

providing a plurality of heat dissipation plates, and inserting the heat dissipation plates into corresponding grooves of the substrate, each heat dissipation plate having opposite top and bottom ends; and

pressing the substrate by means of riveting, so that the two side walls of each groove formed on the substrate closely abut against the opposite two surfaces of the heat dissipation plate, so that each heat dissipation plate is located at the side wall of the substrate, and The top end and the bottom end of each cooling plate protrude from the top surface and the bottom surface of the substrate respectively.

According to the characteristics of the present invention, a radiator structure is also proposed, comprising:

A substrate, which has a top surface, a bottom surface and a side wall, the side wall of the substrate is inwardly recessed and provided with a plurality of grooves penetrating the top surface and the bottom surface; and

A plurality of heat dissipation plates are inserted into corresponding grooves of the base plate, each heat dissipation plate has a relative top end and a bottom end portion, and the two side walls of each groove formed on the base plate closely abut against the base plate The two opposite surfaces of the heat dissipation plates, the top end and the bottom end of each heat dissipation plate protrude from the top surface and the bottom surface of the substrate respectively.

The beneficial effects of the present invention are as follows: the heat dissipation plate is inserted through the groove of the base plate, and the heat dissipation plate is directly fixed by the two side walls of the groove in a riveted manner, which is different from the existing heat dissipation fins fixed by welding. Compared with other methods, the present invention avoids the use of solder, so it has the effect of avoiding heat conduction loss, and the overall manufacturing steps of the present invention are simple, and will not increase the difficulty of assembly and manufacture.

Secondly, the top or bottom of the substrate can be used to touch electronic components that generate heat sources, etc., and the top and bottom of each heat sink protrude from the top and bottom of the substrate, so that the airflow can be bidirectional. Inflow/exit direction of the top surface and bottom surface of the substrate, so that it is easier to realize the heat dissipation effect of the electronic components.

In order to further understand the technology, method and effect that the present invention takes to achieve the intended purpose, please refer to the following detailed description and accompanying drawings of the present invention, and believe that the purpose, characteristics and characteristics of the present invention can be deepened and concretely However, the drawings are provided for reference and illustration only, and are not intended to limit the present invention.

Description of drawings

FIG. 1 is a three-dimensional schematic diagram of a conventional radiator.

Fig. 2 is a flowchart of steps of the present invention.

FIG. 3 is a top perspective view of the substrate of the present invention.

FIG. 4 is a three-dimensional exploded view of the substrate and the heat dissipation plate of the present invention.

FIG. 5 is a three-dimensional assembly view of the substrate and the heat dissipation plate of the present invention.

FIG. 6 is a front view of part A of FIG. 5 .

FIG. 7 is a schematic diagram of an implementation state in which the blade described in the present invention is about to press the substrate to make it plastically deformed.

FIG. 8 is a three-dimensional exploded view of another embodiment of the substrate and the heat dissipation plate of the present invention.

FIG. 9 is another perspective exploded view of the substrate and the heat dissipation plate of the present invention.

FIG. 10 is a three-dimensional exploded view of another embodiment of the substrate and heat sink of the present invention.

FIG. 11 is a three-dimensional assembled view of another embodiment of the substrate and the heat sink of the present invention.

Wherein, the reference signs are explained as follows:

Seat body 11 Top surface 111

Bottom 112 Solder 12

Heat dissipation fin 13 surface 131

Substrate 20

Top 201 Bottom 202

side wall 203

Groove 21 side wall surface 211

Heat sink plate 30

Top part 301 Bottom part 302

Side edge 303

Surface 31 Limiting recess 32

Blade 4

Detailed ways

Please refer to Fig. 2 to Fig. 6, the present invention proposes a radiator manufacturing method and a radiator structure, wherein the manufacturing method includes the following steps:

(1) A plate-shaped substrate 20 is provided, the substrate 20 has a top surface 201, a bottom surface 202 and a side wall 203, and the side wall 203 of the substrate 20 has a plurality of grooves that are concave inward and run through the top surface 201 and the bottom surface 202 twenty one.

(2) Provide a plurality of heat dissipation plates 30, insert the heat dissipation plates 30 into the corresponding grooves 21 of the substrate 20, and each heat dissipation plate 30 has an opposite top end 301 and a bottom end 302 .

(3) Utilize riveting technology to press the substrate 20, so that the two side wall surfaces 211 forming each groove 21 are closely abutted against the opposite two surfaces 31 of the heat dissipation plate 30, so that each heat dissipation plate 30 is located at the The sidewall 203 of the substrate 20 , and the top end 301 and the bottom end 302 of each heat sink 30 protrude from the top surface 201 and bottom surface 202 of the substrate 20 respectively, thereby forming a heat sink product.

Please refer to FIG. 7 , the riveting method is to press the top surface 201 and the bottom surface 202 on both sides of the corresponding groove 21 of the substrate 20 in a two-way pressing manner by multiple blades 4 to make the substrate 20 plastic. The deformation is such that the two side wall surfaces 211 of each groove 21 are closely abutted against the two surfaces 31 of the heat dissipation plate 30 .

In addition, the substrate 20 of the above-mentioned step (1) can be selected from a circular plate (as shown in Figure 4) or a polygonal plate (as shown in Figure 8), preferably, the substrate 20 can be selected as a circular plate, therefore, it can be convenient The heat dissipation plate 30 in step (2) is inserted in an automated manner, thereby enabling mass production; further, each heat dissipation plate 30 can be manually inserted on the substrate 20 in sequence, of course, automation can also be used. The method is inserted to achieve the purpose of rapid production.

In addition, the outer shape of the heat dissipation plate 30 in the above step (2) can be a circular plate (as shown in Figure 4) or a polygonal plate (as shown in Figure 10). The present invention is not limited here, and the substrate The heat sink 20 and the heat sink 30 can be made of the same material and have heat dissipation properties, such as copper, aluminum, and the like.

Wherein, as shown in FIG. 9 , in this embodiment, the side edge 303 of each heat dissipation plate 30 can also be recessed with a limiting recess 32 that runs through the two surfaces 31 of the heat dissipation plate 30. When each heat dissipation plate When the sheet 30 is inserted into the corresponding groove 21 of the substrate 20, the limiting recess 32 of the heat sink 30 is embedded in the top surface 201 of the substrate 20 and fixed so that each heat sink 30 can be neatly inserted. on the substrate 20 .

Furthermore, as shown in FIG. 9 , the limiting recess 32 can be a notch, which can engage the top surface 201 and the bottom surface 202 of the substrate 20; or, as shown in FIG. 10 and FIG. 11 , The limiting recess 32 can also be an inverted L-shaped concave wall, which can engage the top surface 201 of the substrate 20 .

Through the above description, the heat sink structure of the present invention includes the above-mentioned substrate 20 and heat dissipation plate 30, the groove 21 of the substrate 20 is used for inserting the heat dissipation plate 30, and the two side walls 211 of each groove 21 of the substrate 20 The two surfaces 31 of the heat dissipation plate 30 are closely abutted to fix them, and the top portion 301 and the bottom end portion 302 of each heat dissipation plate 30 respectively protrude from the top surface 201 and the bottom surface 202 of the substrate 20 .

Wherein, each heat dissipation plate 30 is riveted to the base plate 20, so that by pressing the base plate 20, the two side walls 211 of each groove 21 are closely abutted against the opposite two surfaces 31 of the heat dissipation plate 30, The riveting method has been described above, so it will not be repeated here. In addition, each heat dissipation plate 30 can also have the above-mentioned structure such as the limiting recess 32 .

Based on the above description, the present invention inserts the heat dissipation plate 30 through the groove 21 of the substrate 20, and uses the two side walls 211 of the groove 21 to directly fix the heat dissipation plate 30 in a riveted manner. Compared with the way of welding and fixing the heat dissipation fins, the present invention avoids the use of solder, so it has the effect of avoiding heat conduction loss, and the overall manufacturing steps of the present invention are simple, and will not increase the difficulty of assembly and manufacturing; at the same time, the use of solder is eliminated , more environmentally friendly functionality (usually the solder contains lead; lead-free solder may increase the cost).

Secondly, while the top surface 201 or the bottom surface 202 of the substrate 20 can be used to attach and touch electronic components (such as LEDs, etc.) that generate heat sources, the top portion 301 and the bottom end portion 302 of each heat sink 30 protrude from the bottom of the substrate 20 respectively. The top surface 201 and the bottom surface 202 are like this, so that the airflow of the cooling/heat source can be bidirectionally guided into/out of the top surface 201 and the bottom surface 202 of the substrate 20 , so that it is easier to realize the effect of heat dissipation of the electronic components.

The drawings and descriptions disclosed above are only embodiments of the present invention, and those skilled in the art can make other various modifications according to the above descriptions, and these modifications still belong to the inventive concept of the present invention and do not depart from the stated The scope of protection of the appended claims.

Claims (9)

1. a manufacturing method of heat radiator is characterized in that, this method comprises the following steps:

One substrate is provided, and this substrate has end face, bottom surface and sidewall, and the sidewall of this substrate has a plurality of setting to the concave and runs through the groove of this end face and bottom surface;

A plurality of heat radiation plates are provided, described heat radiation plate is plugged into the corresponding groove of this substrate, each heat radiation plate all has relative top ends and bottom; And

Utilize the mode of riveted to oppress this substrate, make relative two surfaces of this heat radiation plate of the tight butt of two side walls that forms each groove, so that each heat radiation plate is positioned at the side-walls of this substrate, and the top ends of each heat radiation plate and end face and the bottom surface that the bottom is stretched out this substrate respectively.

2. manufacturing method of heat radiator as claimed in claim 1 is characterized in that, this substrate is circular plate body or polygon plate body.

3. manufacturing method of heat radiator as claimed in claim 1, it is characterized in that, the lateral margin of each heat radiation plate is concaved with a spacing recess that runs through two surfaces of this heat radiation plate, when each heat radiation plate plugs into the corresponding groove of this substrate, the end face of spacing this substrate of recess inlay card of this heat radiation plate.

4. manufacturing method of heat radiator as claimed in claim 1, it is characterized in that, the mode of above-mentioned riveted is by the mode of a plurality of blades with two-way compressing, oppress respectively in the end face and the bottom surface of the corresponding groove of this substrate both sides, make this substrate plastic deformation, two surfaces of plate so that the tight butt of the two side walls of each groove should dispel the heat.

5. a heat spreader structures is characterized in that, this heat spreader structures comprises:

One substrate, it has end face, bottom surface and sidewall, and the sidewall of this substrate is concaved with a plurality of grooves that run through this end face and bottom surface; And

A plurality of heat radiation plates, it is inserted in the corresponding groove of this substrate, each heat radiation plate all has relative top ends and bottom, the tight butt of the two side walls of this each groove of substrate is somebody's turn to do relative two surfaces of heat radiation plate, the top ends of each heat radiation plate and end face and bottom surface that the bottom is stretched out this substrate respectively.

6. heat spreader structures as claimed in claim 5 is characterized in that, this substrate is circular plate body or polygon plate body.

7. heat spreader structures as claimed in claim 5 is characterized in that, the lateral margin of each described heat radiation plate is concaved with a spacing recess that runs through two surfaces of this heat radiation plate, the end face of this substrate of the spacing recess inlay card of this of each described heat radiation plate.

8. heat spreader structures as claimed in claim 5 is characterized in that, each heat radiation plate is connected with the mode of this substrate with riveted, so that by this substrate of compressing, makes relative two surfaces of this heat radiation plate of the tight butt of two side walls of each groove.

9. heat spreader structures as claimed in claim 8, it is characterized in that, the mode of above-mentioned riveted is by the mode of a plurality of blades with two-way compressing, oppress respectively in the end face and the bottom surface of the corresponding groove of this substrate both sides, make this substrate plastic deformation, two surfaces of plate so that the tight butt of the two side walls of each groove should dispel the heat.

Images