CN101513661A - Method for manufacturing radiator and radiator structure - Google Patents

Method for manufacturing radiator and radiator structure Download PDF

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Publication number
CN101513661A
CN101513661A CNA200810080519XA CN200810080519A CN101513661A CN 101513661 A CN101513661 A CN 101513661A CN A200810080519X A CNA200810080519X A CN A200810080519XA CN 200810080519 A CN200810080519 A CN 200810080519A CN 101513661 A CN101513661 A CN 101513661A
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China
Prior art keywords
substrate
heat radiation
radiation plate
heat
face
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Pending
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CNA200810080519XA
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Chinese (zh)
Inventor
魏文珍
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NENGTI PRECISION INDUSTRY Co Ltd
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NENGTI PRECISION INDUSTRY Co Ltd
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Priority to CNA200810080519XA priority Critical patent/CN101513661A/en
Publication of CN101513661A publication Critical patent/CN101513661A/en
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a method for manufacturing a radiator and a radiator structure, wherein the manufacturing method comprises the following steps that: a substrate provided with a top surface, a bottom surface and side walls is provided, the side walls of the substrate are provided with a plurality of grooves which are concave inwards and run through the top surface and the bottom surface; a plurality of heat sinks are provided and inserted into the grooves corresponding to the substrate, and each heat sink is provided with a top end part and a bottom end part which are opposite; and the substrate is pressed in a riveting mode to make both side wall surfaces forming each groove closely butt against the opposite two surfaces of each heat sink so as to make each heat sink positioned on the side walls of the substrate, and the top end part and the bottom end part of each heat sink extend out of the top surface and the bottom surface of the substrate respectively. Accordingly, the heat sinks are directly fixed by using both side wall surfaces of each groove in the riveting mode, so that the radiator has the advantage of avoiding losing thermal conduction.

Description

Manufacturing method of heat radiator and heat spreader structures
Technical field
The present invention relates to a kind of manufacturing method of heat radiator and heat spreader structures, refer to a kind of manufacturing method of heat radiator and heat spreader structures of exempting the welding manner that uses scolder and forming in the mode of riveted especially.
Background technology
Heat sink applications is very widely, it generally is to be used for producing the purpose that waits in the electronic building brick (as CPU) of heat or the light fixture (as halogen, LED lamp) to realize assisting dispelling the heat, with the radiator with radiating fin is the most general, as shown in Figure 1, it is existing a kind of radiator, and it is utilizing scolder 12 and is using the mode of reflow that a plurality of equidistant side by side radiating fins 13 that are provided with are fixed on the end face 111 of pedestal 11 on end face 111 of a pedestal 11.
And the effect of radiating fin 13 is to roll up the area of heat radiation, and the bottom surface 112 by pedestal 11 can contact thermal source, and then absorbs each surface 131 that conducts to each radiating fin 13 behind its heats rapidly by pedestal 11, to realize assisting the purpose of heat radiation.
But because radiating fin 13 is to utilize scolder 12 to be welded on the end face 111 of pedestal 11, and the coefficient of heat conduction of scolder 12 is different with radiating fin 13 with pedestal 11, thereby make when thermal source conducts to radiating fin 13, scolder 12 will cause the situation of heat conduction loss, make thermal source conduct to the deleterious of radiating fin 13 heat radiations.Therefore, how to visualize a kind of radiator that thermal source is effectively dispelled the heat, become a problem that can make improvements.
Therefore, the present invention proposes a kind of reasonable in design and the manufacturing method of heat radiator and the heat spreader structures that can effectively address the above problem.
Summary of the invention
The objective of the invention is to propose a kind of the release uses scolder to avoid heat conduction loss and to have the manufacturing method of heat radiator and the structure thereof of the heat radiation function of realizing electronic building brick etc.
According to characteristics of the present invention, a kind of manufacturing method of heat radiator is proposed, it comprises following step:
One substrate is provided, and this substrate has end face, bottom surface and sidewall, and the sidewall of this substrate has a plurality of grooves that set to the concave and run through this end face and bottom surface;
A plurality of heat radiation plates are provided, described heat radiation plate is plugged into the corresponding groove of this substrate, each heat radiation plate all has relative top ends and bottom; And
Utilize the mode of riveted to oppress this substrate, make relative two surfaces that form this heat radiation plate of the tight butt of two side walls of each groove on this substrate, so that each heat radiation plate is positioned at the side-walls of this substrate, and the top ends of each heat radiation plate and end face and the bottom surface that the bottom is stretched out this substrate respectively.
According to characteristics of the present invention, a kind of heat spreader structures is also proposed, comprising:
One substrate, it has end face, bottom surface and sidewall, and the sidewall of this substrate is concaved with a plurality of grooves that run through this end face and bottom surface; And
A plurality of heat radiation plates, it is inserted in the corresponding groove of this substrate, each heat radiation plate all has relative top ends and bottom, the tight butt of two side walls that forms each groove on this substrate is somebody's turn to do relative two surfaces of heat radiation plate, the top ends of each heat radiation plate and end face and bottom surface that the bottom is stretched out this substrate respectively.
Beneficial effect of the present invention is: the groove via substrate is inserted with the heat radiation plate, and utilize the two side walls of groove directly to fix the heat radiation plate in the mode of riveted, compare with existing mode with the welding fixed radiator fin, the present invention exempts the use scolder, thereby has an effect of avoiding heat conduction loss, and whole manufacturing step of the present invention is simple, can't increase the degree of difficulty in the assembly.
Secondly, the electronic building brick that can produce thermal source etc. can be touched in order to subsides in the end face of substrate or bottom surface, the top ends of each heat radiation plate and end face and the bottom surface that the bottom stretches out in substrate respectively, so, make air-flow can two-way ground water conservancy diversion go into/for the end face of substrate and the direction of bottom surface, thereby have more the effect of easy realization electronic building brick heat radiation.
In order further to understand technology, method and the effect that the present invention is taked for the set purpose of realization, see also following about detailed description of the present invention and accompanying drawing, believe purpose of the present invention, feature and characteristics, when being goed deep into thus and concrete understanding, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Fig. 1 is the schematic perspective view of existing radiator.
Fig. 2 is a flow chart of steps of the present invention.
Fig. 3 is a substrate top perspective view of the present invention.
Fig. 4 is the three-dimensional exploded view of substrate of the present invention and heat radiation plate.
Fig. 5 is the three-dimensional combination figure of substrate of the present invention and heat radiation plate.
Fig. 6 is the A front view partly of Fig. 5.
Fig. 7 is about to oppress substrate so that the enforcement view of its plastic deformation for the blade of describing among the present invention.
Fig. 8 is another embodiment of substrate of the present invention and the three-dimensional exploded view of heat radiation plate.
Fig. 9 is another three-dimensional exploded view of substrate of the present invention and heat radiation plate.
Figure 10 is the three-dimensional exploded view of another embodiment of substrate of the present invention and heat radiation plate.
Figure 11 is the three-dimensional combination figure of another embodiment of substrate of the present invention and heat radiation plate.
Wherein, description of reference numerals is as follows:
Pedestal 11 end faces 111
Bottom surface 112 scolders 12
Radiating fin 13 surfaces 131
Substrate 20
End face 201 bottom surfaces 202
Sidewall 203
Groove 21 side wall surfaces 211
Heat radiation plate 30
Top ends 301 bottoms 302
Lateral margin 303
Surface 31 spacing recesses 32
Blade 4
The specific embodiment
See also Fig. 2 to shown in Figure 6, the present invention proposes a kind of manufacturing method of heat radiator and heat spreader structures, and wherein, this manufacture method comprises the following steps:
(1) provide a tabular substrate 20, this substrate 20 has end face 201, bottom surface 202 and sidewall 203, and the sidewall 203 of substrate 20 has a plurality of setting to the concave and runs through the groove 21 of end face 201 and bottom surface 202.
(2) provide a plurality of heat radiation plates 30, described heat radiation plate 30 is plugged in the substrate 20 corresponding grooves 21, and each heat radiation plate 30 all has relative top ends 301 and bottom 302.
(3) utilize the technical approach of riveted to oppress this substrate 20, make relative two surfaces 31 of two side walls 211 tight these heat radiation plates 30 of butt that form each groove 21, so that each heat radiation plate 30 is positioned at sidewall 203 places of this substrate 20, and the top ends 301 of each heat radiation plate 30 and end face 201 and the bottom surface 202 that bottom 302 stretches out in this substrate 20 respectively, and then become radiator goods.
Please cooperate and consult Fig. 7, the mode of described riveted is in two-way compressing mode by a plurality of blades 4, oppress respectively in the end face 201 and the bottom surface 202 of this substrate 20 corresponding grooves 21 both sides, make substrate 20 plastic deformations, so that the two side walls 211 of each groove 21 closely is connected to two surfaces 31 of heat radiation plate 30.
In addition, the substrate 20 of above-mentioned steps (1) is optional from circular plate body (as Fig. 4) or polygon plate body (as Fig. 8), preferably, this substrate 20 is chosen as circular plate body, therefore, the heat radiation plate 30 that can be convenient to step (2) plugs in the automation mode, thus the energy large production; Say that further each heat radiation plate 30 can adopt manual type and be inserted in regular turn on the substrate 20, also can make certainly to plug in an automated fashion, and realize the purpose of production fast.
In addition, the external form form of the heat radiation plate 30 of above-mentioned steps (2) can rounded plate body (as Fig. 4) or polygon plate body (as Figure 10) all can, do not limited in this present invention, and substrate 20 with the heat radiation plate 30 can be metalwork identical material, that have thermal diffusivity, as copper, aluminium etc.
Wherein, as shown in Figure 9, in the present embodiment, the lateral margin 303 of each heat radiation plate 30 also can be concaved with a spacing recess 32 that runs through two surfaces 31 of this heat radiation plate 30, when each heat radiation plate 30 plugs into the corresponding groove 21 of substrate 20, the end face 201 of this substrate 20 of spacing recess 32 inlay cards of this heat radiation plate 30 and fix, plate 30 can fitly be inserted in this substrate 20 so that each dispels the heat.
Further, as shown in Figure 9, described spacing recess 32 can be a recess, but the end face 201 of this substrate 20 of its inlay card and bottom surface 202; Perhaps, as Figure 10 and shown in Figure 11, described spacing recess 32 also can be a recess that slightly is inverted L shape, but the end face 201 of this substrate 20 of its inlay card.
Via above-mentioned explanation, heat spreader structures of the present invention includes above-mentioned substrate 20 and heat radiation plate 30, the groove 21 of substrate 20 is for plugging heat radiation plate 30, and two surfaces 31 of the two side walls 211 tight butt heat radiation plates 30 of each groove 21 of substrate 20 are fixed it, and the top ends 301 of each heat radiation plate 30 and end face 201 and the bottom surface 202 that bottom 302 stretches out in substrate 20 respectively.
Wherein, each heat radiation plate 30 is connected with the mode of substrate 20 with riveted, so that by this substrate 20 of compressing, make relative two surfaces 31 of two side walls 211 tight these heat radiation plates 30 of butt of each groove 21, and described riveted mode in above chat bright, so no longer given unnecessary details at this, in addition, each heat radiation plate 30 also can have the above-mentioned structure as spacing recess 32 grades.
Comprehensive above-mentioned explanation, the present invention is that the groove 21 via substrate 20 is inserted with heat radiation plate 30, and with the mode of riveted utilize the two side walls 211 of groove 21 directly fix the heat radiation plate 30, compare with existing mode with the welding fixed radiator fin, the present invention exempts the use scolder, thereby have the effect of avoiding heat conduction loss, and whole manufacturing step of the present invention is simple, can't increase the degree of difficulty in the assembly; Simultaneously, exempt the use of scolder, (scolder contains lead usually to have more environmental protection function; Lead-free solder then has the possibility that raises the cost).
Secondly, and the electronic component that can produce thermal source (as LED etc.) can be touched in order to subsides in the end face 201 of substrate 20 or bottom surface 202, the top ends 301 of each heat radiation plate 30 and end face 201 and the bottom surface 202 that bottom 302 stretches out in substrate 20 respectively, so, make the air-flow of cooling/thermal source can two-way ground water conservancy diversion go into/, to be easy to the effect that realizes that electronic building brick dispels the heat thereby have more for the end face 201 of substrate 20 and the direction of bottom surface 202.
More than disclosed accompanying drawing and explanation; only be embodiments of the invention; those skilled in the art works as can do other all modifications according to above-mentioned explanation, and these modifications still belong to inventive concept of the present invention, do not break away from the protection domain of appended claims.

Claims (9)

1. a manufacturing method of heat radiator is characterized in that, this method comprises the following steps:
One substrate is provided, and this substrate has end face, bottom surface and sidewall, and the sidewall of this substrate has a plurality of setting to the concave and runs through the groove of this end face and bottom surface;
A plurality of heat radiation plates are provided, described heat radiation plate is plugged into the corresponding groove of this substrate, each heat radiation plate all has relative top ends and bottom; And
Utilize the mode of riveted to oppress this substrate, make relative two surfaces of this heat radiation plate of the tight butt of two side walls that forms each groove, so that each heat radiation plate is positioned at the side-walls of this substrate, and the top ends of each heat radiation plate and end face and the bottom surface that the bottom is stretched out this substrate respectively.
2. manufacturing method of heat radiator as claimed in claim 1 is characterized in that, this substrate is circular plate body or polygon plate body.
3. manufacturing method of heat radiator as claimed in claim 1, it is characterized in that, the lateral margin of each heat radiation plate is concaved with a spacing recess that runs through two surfaces of this heat radiation plate, when each heat radiation plate plugs into the corresponding groove of this substrate, the end face of spacing this substrate of recess inlay card of this heat radiation plate.
4. manufacturing method of heat radiator as claimed in claim 1, it is characterized in that, the mode of above-mentioned riveted is by the mode of a plurality of blades with two-way compressing, oppress respectively in the end face and the bottom surface of the corresponding groove of this substrate both sides, make this substrate plastic deformation, two surfaces of plate so that the tight butt of the two side walls of each groove should dispel the heat.
5. a heat spreader structures is characterized in that, this heat spreader structures comprises:
One substrate, it has end face, bottom surface and sidewall, and the sidewall of this substrate is concaved with a plurality of grooves that run through this end face and bottom surface; And
A plurality of heat radiation plates, it is inserted in the corresponding groove of this substrate, each heat radiation plate all has relative top ends and bottom, the tight butt of the two side walls of this each groove of substrate is somebody's turn to do relative two surfaces of heat radiation plate, the top ends of each heat radiation plate and end face and bottom surface that the bottom is stretched out this substrate respectively.
6. heat spreader structures as claimed in claim 5 is characterized in that, this substrate is circular plate body or polygon plate body.
7. heat spreader structures as claimed in claim 5 is characterized in that, the lateral margin of each described heat radiation plate is concaved with a spacing recess that runs through two surfaces of this heat radiation plate, the end face of this substrate of the spacing recess inlay card of this of each described heat radiation plate.
8. heat spreader structures as claimed in claim 5 is characterized in that, each heat radiation plate is connected with the mode of this substrate with riveted, so that by this substrate of compressing, makes relative two surfaces of this heat radiation plate of the tight butt of two side walls of each groove.
9. heat spreader structures as claimed in claim 8, it is characterized in that, the mode of above-mentioned riveted is by the mode of a plurality of blades with two-way compressing, oppress respectively in the end face and the bottom surface of the corresponding groove of this substrate both sides, make this substrate plastic deformation, two surfaces of plate so that the tight butt of the two side walls of each groove should dispel the heat.
CNA200810080519XA 2008-02-20 2008-02-20 Method for manufacturing radiator and radiator structure Pending CN101513661A (en)

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Application Number Priority Date Filing Date Title
CNA200810080519XA CN101513661A (en) 2008-02-20 2008-02-20 Method for manufacturing radiator and radiator structure

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Application Number Priority Date Filing Date Title
CNA200810080519XA CN101513661A (en) 2008-02-20 2008-02-20 Method for manufacturing radiator and radiator structure

Publications (1)

Publication Number Publication Date
CN101513661A true CN101513661A (en) 2009-08-26

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104289614A (en) * 2014-09-29 2015-01-21 苏州市世纪晶源光电科技有限公司 Positioning and fastening device of heat dissipation plate machining and forming machine of power distribution cabinet
CN112911893A (en) * 2020-12-25 2021-06-04 Oppo广东移动通信有限公司 Radiator and electronic equipment
CN115682810A (en) * 2022-10-27 2023-02-03 常州富烯科技股份有限公司 Graphene metal composite radiating fin, radiator and preparation method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2624400Y (en) * 2003-02-24 2004-07-07 陈世明 Inclined riveted construction of radiating fin and baseboard

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2624400Y (en) * 2003-02-24 2004-07-07 陈世明 Inclined riveted construction of radiating fin and baseboard

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104289614A (en) * 2014-09-29 2015-01-21 苏州市世纪晶源光电科技有限公司 Positioning and fastening device of heat dissipation plate machining and forming machine of power distribution cabinet
CN112911893A (en) * 2020-12-25 2021-06-04 Oppo广东移动通信有限公司 Radiator and electronic equipment
CN112911893B (en) * 2020-12-25 2023-05-05 Oppo广东移动通信有限公司 Radiator and electronic equipment
CN115682810A (en) * 2022-10-27 2023-02-03 常州富烯科技股份有限公司 Graphene metal composite radiating fin, radiator and preparation method

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Open date: 20090826