CN204408755U - For the embedded magnetic material circuit plate of wireless charging - Google Patents
For the embedded magnetic material circuit plate of wireless charging Download PDFInfo
- Publication number
- CN204408755U CN204408755U CN201520020415.5U CN201520020415U CN204408755U CN 204408755 U CN204408755 U CN 204408755U CN 201520020415 U CN201520020415 U CN 201520020415U CN 204408755 U CN204408755 U CN 204408755U
- Authority
- CN
- China
- Prior art keywords
- magnetic material
- copper
- layers
- prepreg
- solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model belongs to wiring board technology for making field, particularly relates to a kind of embedded magnetic material circuit plate for wireless charging.It solve the technical problems such as existing cost is low.This embedded magnetic material circuit plate being used for wireless charging comprises plate body, this plate body comprises by dielectric material layer and the integral structure magnetosphere being mounted in the magnetic material solid compositions in dielectric material layer, prepreg is respectively equipped with on magnetospheric two sides, have by least one deck layers of copper at every sheet prepreg respectively away from magnetospheric one side, any one deck in two-layer layers of copper or be two-layerly provided with induction structure, is integral type structure by hot pressing mode pressing between prepreg and layers of copper at described magnetosphere.The utility model advantage is: wiring board quality is lighter, volume is less, reliability is higher, design freedom is higher, manufacturing cost is lower.
Description
Technical field
The utility model belongs to wiring board manufacturing technology field, particularly relates to a kind of embedded magnetic material circuit plate for wireless charging.
Background technology
In recent years, comprise the novel hand-held mobile electronic product development such as smart mobile phone, panel computer, electronic reader, music player, digital camera rapidly, service time is more and more longer, and meanwhile, power consumption also doubles.For battery, its endurance is limited all the time, be difficult to the long-play maintaining product, and a lot of product lacks the design changing battery, and this makes charging device become the indispensable accessory of this kind of Novel electronic product of consumption.Due to the feature such as convenient, easy-to-use, intercommunication, compatibility of wireless charging, make the foundation of public mobile charging platform become possibility, it has larger development potentiality than traditional wired charging technique.
At present the wireless charging scheme of most main flow adopts electromagnetic induction technology, namely by the coil-induced generation current of primary and secondary, thus energy transferred to receiving terminal from transmitting terminal.Electromagnetic induction wireless charging product has three critical components, comprises control circuit board, induction coil and magnetic material.Prior art is independent these three parts of manufacture, then adopts bonding mode to realize the assembling of control circuit board, induction coil and magnetic material.There is lower column defects in this technique: 1, owing to adopting the bonding of individual components, increases quality and the volume of product; 2, owing to adopting the bonding of individual components, reliability is reduced; 3, because induction coil finally need be bonded on magnetic material, the design freedom of coil and magnetic material is restricted; 4, because needs independently manufacture induction coil, production cost is added.
Utility model content
The purpose of this utility model is for the problems referred to above, provides a kind of design more reasonable, and the embedded magnetic material circuit plate for wireless charging that quality is light, volume is little, reliability is high.
For achieving the above object, the utility model have employed following technical proposal: this embedded magnetic material circuit plate being used for wireless charging comprises plate body, this plate body comprises by dielectric material layer and the integral structure magnetosphere being mounted in the magnetic material solid compositions in dielectric material layer, prepreg is respectively equipped with on magnetospheric two sides, have by least one deck layers of copper at every sheet prepreg respectively away from magnetospheric one side, any one deck in two-layer layers of copper or be two-layerly provided with induction structure, described magnetosphere, be integral type structure by hot pressing mode pressing between prepreg and layers of copper.By metallizing, logical/blind hole connects.
Above-mentioned in the embedded magnetic material circuit plate of wireless charging, described magnetic material solid is any one in blocks of solid, powder solid and banded solid, and described magnetic material solid is mounted on dielectric material layer by location structure; Described magnetic material solid is made up of any one material of ferrite, iron powder materials, ferromagnetic metal alloy, ferromagnetic amorphous and nanocrystalline material.
Above-mentioned in the embedded magnetic material circuit plate of wireless charging, described location structure comprise be arranged on dielectric material layer logical/blind slot, described magnetic material solid is arranged in logical/blind slot and the thickness of this magnetic material solid is 0.2-2.0mm.The thickness of magnetic material solid 2 is 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4-2.0mm.
Above-mentioned in the embedded magnetic material circuit plate of wireless charging, described plate body also comprises the skin be made up of insulating material, and described magnetosphere, prepreg and layers of copper are fixed in skin.
Above-mentioned in the embedded magnetic material circuit plate of wireless charging, described induction structure is the induction coil manufactured by etching mode, and this induction coil is synchronously arranged in layers of copper when layers of copper circuit etching completes; Described induction coil is one or more.
Alternatively scheme, above-mentioned in the embedded magnetic material circuit plate of wireless charging, a slice prepreg in two panels prepreg and be provided with pcb board and the first prepreg between the layers of copper corresponding with this prepreg.
Moreover alternatively scheme, above-mentioned in the embedded magnetic material circuit plate of wireless charging, any one deck layers of copper in two-layer layers of copper is also provided with the second prepreg and the first layers of copper.
For the processing method of the embedded magnetic material circuit plate of wireless charging, this processing method comprises the steps:
A, build-in: process on dielectric material layer one for build-in magnetic material solid logical/blind slot, be combined to form the magnetosphere of integral structure in the logical/blind slot that then makes magnetic material solid be mounted in;
B, pressing: magnetosphere, two panels prepreg and two-layer layers of copper are carried out lamination typesetting, hot pressing mode is adopted to make skin, magnetosphere, prepreg and layers of copper pressing be integral type structure, and induction coil is by being arranged in one deck layers of copper or two-layer layers of copper by etching mode, when layers of copper circuit etching completes, this induction coil is synchronously arranged in layers of copper, namely obtained half-finished product plate, is then fixed on half-finished product plate in skin.
In above-mentioned processing method, described magnetic material solid is any one in blocks of solid, powder solid and banded solid, and magnetic material solid is made up of any one material of ferrite, iron powder materials, ferromagnetic metal alloy, ferromagnetic amorphous and nanocrystalline material.
In above-mentioned processing method, the resin content in described prepreg is 45%-75%.
Compared with prior art, the utility model has the advantage of: 1, design is more reasonable, owing to adopting the technique being embedded in magnetic material solid and layers of copper facet etch manufacture induction coil at dielectric material layer, a wiring board quality after making is lighter, volume is less, reliability is higher, design freedom is higher, manufacturing cost is lower, and technique used is existing equipment and material can realize; 2, technique is simple and be easy to manipulation; 3, long service life.
Accompanying drawing explanation
Fig. 1 is the embodiment one detonation configuration schematic diagram that the utility model provides.
Fig. 2 is the embodiment one cross section structural representation that the utility model provides.
Fig. 3 is the embodiment two cross section structural representation that the utility model provides.
Fig. 4 is the embodiment two detonation configuration schematic diagram that the utility model provides.
Fig. 5 is multiple induction coil structural representations that the utility model provides.
Fig. 6 is the lateral cross section structural representation of Fig. 5.
Fig. 7 is the embodiment three detonation configuration schematic diagram that the utility model provides.
Fig. 8 is the embodiment three cross section structural representation that the utility model provides.
In figure, plate body a, dielectric material layer 1, logical/blind slot 11, magnetic material solid 2, magnetosphere 3, prepreg 4, layers of copper 5, induction structure 51, skin 6, pcb board 7, first prepreg 8, second prepreg 9, first layers of copper 10.
Embodiment
Be below the specific embodiment of utility model and by reference to the accompanying drawings, the technical solution of the utility model is further described, but the utility model be not limited to these embodiments.
Embodiment one
As shown in Fig. 1-2 and Fig. 5-6, this embedded magnetic material circuit plate being used for wireless charging comprises plate body a, this plate body a comprises by dielectric material layer 1 and is mounted in the integral structure magnetosphere 3 that the magnetic material solid 2 in dielectric material layer 1 combines, prepreg 4 is respectively equipped with on the two sides of magnetosphere 3, have by least one deck layers of copper 5 at every sheet prepreg 4 respectively away from the one side of magnetosphere 3, by metallizing, logical/blind hole connects, any one deck in two-layer layers of copper 5 or be two-layerly provided with induction structure 51, described magnetosphere 3, be integral type structure by hot pressing mode pressing between prepreg 4 and layers of copper 5.
Particularly, the magnetic material solid 2 of the present embodiment is any one in blocks of solid, powder solid and banded solid, and described magnetic material solid 2 is mounted on dielectric material layer 1 by location structure; Secondly, magnetic material solid 2 is made up of any one material of ferrite, iron powder materials, ferromagnetic metal alloy, ferromagnetic amorphous and nanocrystalline material.
Prioritization scheme, the location structure of the present embodiment comprise be arranged on dielectric material layer 1 logical/blind slot 11, described magnetic material solid 2 is arranged in logical/blind slot 11 and the thickness of this magnetic material solid 2 is 0.2-2.0mm.
In addition, the plate body a of the present embodiment also comprises the skin 6 be made up of insulating material, and described magnetosphere 3, prepreg 4 and layers of copper 5 are fixed in outer 6.
Particularly, the induction structure 51 of the present embodiment is the induction coil manufactured by etching mode, and this induction coil is synchronously arranged in layers of copper 5 when layers of copper 5 circuit etching completes; Described induction coil is one or more.Induction coil can be the single induction coil in one deck layers of copper, or the multiple induction coils in one deck layers of copper, or be in multilayer layers of copper multiple induction coils.
In the present embodiment, dielectric is the used composite material be made up of glass fabric and resin of general wiring board, magnetic material is then high magnetic conductance, high saturated material, this magnetic material is arranged on magnetospheric ad-hoc location, can avoid the magnetic field of induction coil that equipment or other components and parts are produced to interference, avoid causing battery-heating, avoid producing the factors such as electric circulation in metal parts.After magnetosphere manufacture completes, employing HTHP carries out interlayer pressing, and induction coil together manufactures when circuit etching.Owing to adopting the technique being embedded in magnetic material solid and layers of copper facet etch manufacture induction coil at dielectric material layer, a wiring board quality after making is lighter, volume is less, reliability is higher, design freedom is higher, manufacturing cost is lower, and technique used is existing equipment and material can realize.
As the present embodiment optimization scheme, the magnetic material solid 2 of the present embodiment is blocks of solid, and magnetic material solid is manganese-zinc ferrite, induction coil be single induction coil and the wiring board of the present embodiment for being double sided board.
For the processing method of the embedded magnetic material circuit plate of wireless charging, this processing method comprises the steps:
A, build-in: process on dielectric material layer 1 one for build-in magnetic material solid 2 logical/blind slot 11, be combined to form the magnetosphere 3 of integral structure in the logical/blind slot 11 that then makes magnetic material solid 2 be mounted in;
B, pressing: magnetosphere 3, two panels prepreg 4 and two-layer layers of copper 5 is carried out lamination typesetting, hot pressing mode is adopted to make skin 6, magnetosphere 3, prepreg 4 and layers of copper 5 pressing be integral type structure, and induction coil is arranged in one deck layers of copper 5 or two-layer layers of copper 5 by etching mode, when layers of copper 5 circuit etching completes, this induction coil is synchronously arranged in layers of copper 5, namely obtained half-finished product plate, is then fixed on half-finished product plate in outer 6.
In above-mentioned step A, described magnetic material solid 2 is any one in blocks of solid, powder solid and banded solid, and magnetic material solid 2 is made up of any one material of ferrite, iron powder materials, ferromagnetic metal alloy, ferromagnetic amorphous and nanocrystalline material.In above-mentioned step B, the resin content in described prepreg 4 is 45%-75%.
Prioritization scheme, in the method: without the groove dielectric material layer 1 of copper milling out a size and be greater than magnetic material solid 2; Pressing: the magnetosphere 3 that layers of copper 5, prepreg 4, the dielectric material layer 1 that embeds magnetic material solid 2 are formed is carried out lamination typesetting, adopts HTHP to be pressed into as a whole.
Wherein, preferably, the thickness of magnetic material solid 2 is 1.2mm; The resin content of prepreg 4 is 68%.
Embodiment two
As shown in Figure 3-4, the present embodiment with the structure of embodiment one and principle substantially identical, different place is: a slice prepreg 4 in two panels prepreg 4 and be provided with pcb board 7 and the first prepreg 8 between the layers of copper 5 corresponding with this prepreg 4.Heat reactive resin is filled into and embeds in the blind slot of magnetic material, and leveling is dried.The thickness of magnetic material solid 2 is 0.4mm, and the resin content of prepreg 4 is 65%.
Embodiment three
As Figure 7-8, the present embodiment with embodiment one with two structure and principle substantially identical, different place is: any one deck layers of copper 5 in two-layer layers of copper 5 is also provided with the second prepreg 9 and the first layers of copper 10.Magnetic material solid 2 form is banded solid.Described magnetic material solid 2 kind is Fe-based amorphous alloy.Described induction coil is two induction coils in one deck layers of copper.The present embodiment wiring board is double sided board.
Wherein, magnetic material solid 2 embeds the manufacturing process of wiring board, comprises the steps, groove milling: without the groove magnetosphere 3 of copper milling out a size and be greater than dielectric material layer 1; Pressing: the magnetosphere 3 of layers of copper 5, prepreg 4, embedding dielectric material layer 1 is carried out lamination typesetting, adopts HTHP to be pressed into as a whole.Wherein, the thickness of magnetic material solid 2 is 1.0mm; The resin content of prepreg 4 is 68%.
Embodiment four
The present embodiment with the structure of embodiment one to embodiment three and principle substantially identical, different place is: magnetic material solid 2 form is powdery solid.Magnetic material solid 2 kind is carbonyl iron particles.Induction coil is two induction coils in two-layer layers of copper.Wiring board is double sided board.Wherein, shown magnetic material solid 2 embeds the manufacturing process of wiring board, groove milling: without the groove magnetosphere 3 of copper milling out a size and be greater than magnetic material solid 2; Pressing: the magnetosphere 3 of layers of copper 5, prepreg 4, embedding magnetic material solid 2 is carried out lamination typesetting, adopts HTHP to be pressed into as a whole; Again the above-mentioned pressing half-finished product plate completing circuit etching is repeated step groove milling and pressing.
Wherein, the thickness of magnetic material solid 2 is 1.0mm; The resin content of prepreg 4 is 71%.
Specific embodiment described herein is only to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various amendment or supplements or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present utility model or surmount the scope that appended claims defines.
Although more employ the terms such as plate body a, dielectric material layer 1, logical/blind slot 11, magnetic material solid 2, magnetosphere 3, prepreg 4, layers of copper 5, induction structure 51, skin 6, pcb board 7, first prepreg 8, second prepreg 9, first layers of copper 10 herein, do not get rid of the possibility using other term.These terms are used to be only used to describe and explain essence of the present utility model more easily; The restriction that they are construed to any one additional is all contrary with the utility model spirit.
Claims (7)
1. the embedded magnetic material circuit plate for wireless charging, comprise plate body (a), it is characterized in that, this plate body (a) comprises by dielectric material layer (1) and is mounted in the integral structure magnetosphere (3) that the magnetic material solid (2) in dielectric material layer (1) combines, prepreg (4) is respectively equipped with on the two sides of magnetosphere (3), have by least one deck layers of copper (5) every sheet prepreg (4) respectively away from the one side of magnetosphere (3), any one deck in two-layer layers of copper (5) or be two-layerly provided with induction structure (51), described magnetosphere (3), be integral type structure by hot pressing mode pressing between prepreg (4) and layers of copper (5).
2. the embedded magnetic material circuit plate for wireless charging according to claim 1, it is characterized in that, described magnetic material solid (2) is blocks of solid, any one in powder solid and banded solid, and described magnetic material solid (2) is mounted on dielectric material layer (1) by location structure; Described magnetic material solid (2) is made up of any one material of ferrite, iron powder materials, ferromagnetic metal alloy, ferromagnetic amorphous and nanocrystalline material.
3. the embedded magnetic material circuit plate for wireless charging according to claim 2, it is characterized in that, described location structure comprise be arranged on dielectric material layer (1) logical/blind slot (11), described magnetic material solid (2) is arranged in logical/blind slot (11) and the thickness of this magnetic material solid (2) is 0.2-2.0mm.
4. the embedded magnetic material circuit plate for wireless charging according to claim 1 or 2 or 3, it is characterized in that, described plate body (a) also comprises the skin (6) be made up of insulating material, and described magnetosphere (3), prepreg (4) and layers of copper (5) are fixed in skin (6).
5. the embedded magnetic material circuit plate for wireless charging according to claim 1 or 2 or 3, it is characterized in that, described induction structure (51) is the induction coil manufactured by etching mode, and this induction coil is synchronously arranged in layers of copper (5) when layers of copper (5) circuit etching completes; Described induction coil is one or more.
6. the embedded magnetic material circuit plate for wireless charging according to claim 1 or 2 or 3, it is characterized in that, a slice prepreg (4) in two panels prepreg (4) and be provided with pcb board (7) and the first prepreg (8) between the layers of copper (5) corresponding with this prepreg (4).
7. the embedded magnetic material circuit plate for wireless charging according to claim 1 or 2 or 3, it is characterized in that, any one deck layers of copper (5) in two-layer layers of copper (5) is also provided with the second prepreg (9) and the first layers of copper (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520020415.5U CN204408755U (en) | 2015-01-12 | 2015-01-12 | For the embedded magnetic material circuit plate of wireless charging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520020415.5U CN204408755U (en) | 2015-01-12 | 2015-01-12 | For the embedded magnetic material circuit plate of wireless charging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204408755U true CN204408755U (en) | 2015-06-17 |
Family
ID=53432581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520020415.5U Active CN204408755U (en) | 2015-01-12 | 2015-01-12 | For the embedded magnetic material circuit plate of wireless charging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204408755U (en) |
-
2015
- 2015-01-12 CN CN201520020415.5U patent/CN204408755U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11120937B2 (en) | High current, low equivalent series resistance printed circuit board coil for power transfer application | |
| CN104602451A (en) | Circuit board with embedded magnetic material and for wireless charging and manufacturing method | |
| CN110444361B (en) | Preparation method of high-frequency high-saturation magnetic flux density ferrite, inductor and transformer | |
| US9647626B2 (en) | LC composite component | |
| CN102544615A (en) | Wireless charging battery | |
| CN1514451A (en) | Iron core structure having gap used for magnetic unit | |
| CN104078193A (en) | Inductor and method for manufacturing the same | |
| CN103617872A (en) | Integrated magnetic element, manufacturing method thereof and integrated LED drive power supply | |
| CN101651404B (en) | Substrate and magnetic device integrated DC-DC converter and preparation process thereof | |
| CN202695101U (en) | Assembled planar transformer | |
| CN204408755U (en) | For the embedded magnetic material circuit plate of wireless charging | |
| CN203760245U (en) | Inductance element | |
| CN206471205U (en) | A kind of adjustable flat surface transformer | |
| CN105632682A (en) | Chip inductor and fabrication method thereof | |
| CN204229966U (en) | Chip inductor | |
| CN108492976B (en) | Coil structure and preparation method of composite coil structure | |
| CN202616007U (en) | Planar transformer | |
| CN201355570Y (en) | EMI integrated inductor | |
| CN106373733B (en) | A kind of adjustable flat surface transformer and its manufacture method | |
| CN201508742U (en) | Common mode filter | |
| CN204795853U (en) | LTCC -LTCF compound circuit base plate structure | |
| CN203562272U (en) | Integrated magnetic component and integrated LED driving power | |
| CN105097227A (en) | Assembled stacked inductor device | |
| KR20140121809A (en) | Inductor and method for manufacturing the same | |
| CN205039047U (en) | Stromatolite power inductance of magnetic circuit structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |