KR20140121809A - Inductor and method for manufacturing the same - Google Patents

Abstract

The present invention relates to an inductor. The inductor according to the embodiment of the present invention includes: a ferrite-organic material; an internal electrode which has a multilayered structure formed by stacking the ferrite-organic material in a thickness direction of the ferrite-organic material; a metal-organic material which covers the ferrite-organic material to form a device body with the ferrite-organic material; and an external electrode which covers the device body to be electrically connected to the internal electrode.

Description

≪ Desc / Clms Page number 1 > INDUCTOR AND METHOD FOR MANUFACTURING THE SAME

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inductor and a manufacturing method thereof, and more particularly to an inductor having improved inductance characteristics and a manufacturing method thereof.

Multilayer power inductors are mainly used in power circuits such as DC-DC converters in portable electronic devices. They are used for high currents because they have the feature of suppressing magnetic saturation of inductors in material and structure. The stacked type power inductor has a disadvantage in that the inductance changes largely due to current application compared to the wound type power inductor. However, the stacked type power inductor has advantages of miniaturization and thinning, and can meet the trend of electronic components in recent years.

Typical stacked type power inductors are manufactured by stacking magnetic sheet sheets on which internal electrodes are printed to form a device body, and then forming external electrodes electrically connected to the internal electrodes on the surface of the device body. Here, the magnetic sheets are made of a composite material containing ferrite powder. Alternatively, a gap layer may be formed in the element body to reduce an inductance change to an external current.

However, when the ferrite powder is used as the magnetic material of the multilayer power inductor as described above, since the magnetic moment of the ferrite constituent element is fixed and there is a limit to increase the saturation magnetization (Ms), a bias improvement It is difficult to realize a higher saturation magnetization for the magnetic field. In addition, increasing the magnetic material packing density relatively in the device body can improve the inductance characteristic by increasing the permeability, and therefore, it is necessary to improve the inductor structure for increasing the magnetic material filling density.

Japanese Patent Laid-Open No. 2003-282328

SUMMARY OF THE INVENTION It is an object of the present invention to provide an inductor capable of improving inductance characteristics and a manufacturing method thereof.

SUMMARY OF THE INVENTION An object of the present invention is to provide an inductor having a structure in which the total magnetic permeability of a magnetic layer of a device body of an inductor is increased and a manufacturing method thereof.

An inductor according to the present invention includes a ferrite-organic substance body, an internal electrode laminated on the ferrite-organic substance body along the thickness direction of the ferrite-organic substance body, a multilayered structure, and a ferrite- A metal-organic body constituting a device body, and an external electrode covering the device body to be electrically connected to the internal electrode.

According to an embodiment of the present invention, the metal-organic compound body is made of a metal-organic composite material, and the metal-organic composite material is any one of iron (Fe), iron base alloy, An organic material of at least one of a resin, a curing agent, and a silane coupling agent.

According to an embodiment of the present invention, the metal-organic compound body may be made of a metal-organic composite material containing an organic epoxy resin.

According to an embodiment of the present invention, the ratio of the thickness of the metal-organic body to the thickness of the element body may be 0.2 to 0.8.

According to an embodiment of the present invention, the metal-organic body may be composed of a metal-organic composite material having a metal content of 65 wt% to 95 wt%.

According to an embodiment of the present invention, the ferrite-organic body may be formed of a ferrite-organic composite material, and the ferrite-organic composite material may include a ferrite powder, an organic binder, a dispersing agent, and a plasticizer.

According to an embodiment of the present invention, the ferrite body may be laminated with a plurality of ferrite sheets having the internal electrodes formed thereon.

According to an embodiment of the present invention, a gap layer may be further provided between the ferrite-organic body and the metal-organic body.

A method of manufacturing an inductor according to the present invention includes the steps of preparing a plurality of ferrite sheets having internal electrodes formed on a surface thereof, laminating and pressing the ferrite sheets so that the internal electrodes formed on each of the ferrite sheets form one multilayer coil, Forming an organic body, forming a metal-organic body covering the ferrite-organic body, fabricating an element body, and forming an external electrode electrically connected to the multilayer coil on the surface of the body of the element do.

According to an embodiment of the present invention, the step of forming the metal-organic body may be performed by using any one of iron (Fe), an iron-based alloy, and a Fe-based amorphous metal and a resin, And a metal-organic composite material containing at least one of the organic materials.

According to an embodiment of the present invention, the step of forming the metal-organic body may include preparing a metal-organic composite material containing a crystalline epoxy resin.

According to an embodiment of the present invention, the step of forming the metal-organic body may comprise a metal-organic composite material having a metal content of 65 wt% to 95 wt%.

According to an embodiment of the present invention, the step of forming the metal-organic body may be such that the ratio of the thickness of the metal-organic body to the thickness of the device body is 0.2 to 0.8.

According to an embodiment of the present invention, the step of preparing the ferrite sheets comprises the steps of preparing a ferrite-organic composite material including ferrite powder, an organic binder, a dispersant, and a plasticizer, and a method of film casting the ferrite organic composite material Step < / RTI >

According to an embodiment of the present invention, a gap layer may be formed between the ferrite-organic body and the metal-organic body.

The inductor according to the present invention comprises a ferrite-organic composite material containing a ferrite magnetic material powder at a portion where internal electrodes are formed and a metal having a saturation magnetization value higher than that of the ferrite powder at the remaining portion, - By constructing a body with an organic composite material, it is possible to have a structure in which the inductance characteristic is improved by increasing the permeability as compared with the case where the whole body of the element is made of ferrite powder.

The inductor according to the present invention can have a structure capable of improving the chip characteristics including the inductance characteristics by adjusting the relative thickness of the metal-organic body to the thickness of the element body to an optimum range.

A method of manufacturing an inductor according to the present invention includes forming a body by a ferrite-organic composite material containing a ferrite magnetic material powder at a portion where an internal electrode is located, and forming a metal material having a saturation magnetization value higher than that of the ferrite powder, It is possible to manufacture an inductor having a structure in which the inductance characteristic is improved by increasing the permeability as compared with the case where the entire body of the element is made of ferrite powder.

The method of manufacturing an inductor according to the present invention is characterized in that a ferrite-organic body portion constituting a core layer is manufactured by a lamination method, and the remaining metal-organic body portion is manufactured by a mold method to form a miniaturized element body of the power inductor Mass production is possible.

1 is a view illustrating an inductor according to an embodiment of the present invention.
2 is a flowchart illustrating a method of manufacturing an inductor according to an embodiment of the present invention.
3A to 3D are views for explaining a manufacturing process of an inductor according to an embodiment of the present invention.
4 is a view showing a modified example of the inductor according to the embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. The present embodiments are provided so that the disclosure of the present invention is complete and that those skilled in the art will fully understand the scope of the present invention. Like reference numerals refer to like elements throughout the specification.

The terms used herein are intended to illustrate the embodiments and are not intended to limit the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is to be understood that the terms 'comprise', and / or 'comprising' as used herein may be used to refer to the presence or absence of one or more other components, steps, operations, and / Or additions.

In addition, the embodiments described herein will be described with reference to cross-sectional views and / or plan views, which are ideal illustrations of the present invention. In the drawings, the thicknesses of the films and regions are exaggerated for an effective description of the technical content. The shape of the illustration may be modified by following and / or by tolerance or the like. Accordingly, the embodiments of the present invention are not limited to the specific forms shown, but also include changes in the shapes that are generated according to the manufacturing process. For example, the etched area shown at right angles may be rounded or may have a shape with a certain curvature.

Hereinafter, an inductor according to an embodiment of the present invention and a method of manufacturing the same will be described in detail with reference to the accompanying drawings.

1 is a view illustrating an inductor according to an embodiment of the present invention. 1, an inductor 100 according to an embodiment of the present invention may include a ferrite-organic body 110, a metal-organic body 130, and an external electrode 140 as a stacked type power inductor .

The ferrite-organic body 110 may be disposed at the center of the inductor 100 to form a core layer of the inductor 100. The ferrite-organic body 110 may include a sheet stack 113 and an internal electrode 115 provided on the sheet stack 113. The sheet stack 113 may be a product formed by stacking and pressing a plurality of ferrite sheets (112 of FIG. 3A) having a conductive pattern (114 of FIG. 3) for forming the internal electrodes 115.

Meanwhile, the sheet stack 113 may be made of a ferrite-organic composite material. As the ferrite-organic composite material, a material containing a ferrite powder, an organic binder, a dispersing agent, and a plasticizer may be used.

The internal electrode 115 may have a multi-layered coil structure having a stacking height along the stacking direction of the sheet stack 113. The internal electrode 115 may have a first electrode 115a formed on one side of the sheet stack 113 and a second electrode 115b formed on the other side of the sheet stack 113. [ The first and second electrodes 115a and 115b are provided to electrically connect the internal electrode 115 to the external electrode 140 and are formed to be exposed to the outside of the ferrite- . Accordingly, the first and second electrodes 115a and 115b may be disposed at an interface between the ferrite-organic body 110 and the metal-organic body 130.

The metal-organic body 130 may cover both surfaces of the ferrite-organic body 110 with a predetermined thickness. The thicknesses of the metal-organic body 130 covering both surfaces of the ferrite-organic body 110 may be substantially the same. Accordingly, the metal-organic body 130 may form the element body 120 of the inductor 100 having a substantially hexahedral shape together with the ferrite-organic body 110.

In addition, the metal-organic composite powder for manufacturing the metal-organic body 130 may be an iron (Fe) based metal powder. The saturation magnetization value of the Fe metal is approximately 218 (emu / g), nearly three times that of the ferrite powder synthesized in the spinel phase through a general calcination process. Referring to the following Table 1, it was confirmed that the saturation magnetization value can be ensured to be 192 (emu / g) or more when Fe is contained in an amount of 99 wt% or more as the metal-organic composite material. In this case, The workability of the electrode is deteriorated, and electrical characteristics can not be secured. Therefore, it may be preferable to use various types of alloys based on Fe. Here, in the case of the alloy as the metal magnetic powder, it is confirmed that the Fe content should be at least about 50 wt% to ensure a saturation magnetization value (Ms) of 150 (emu / g) or more. Though not shown in Table 1, it was confirmed that when the Fe content is less than about 50 wt%, the saturation magnetization value (Ms) is lowered to 100 (emu / g) or less.

No Type of metal magnetic material The saturation magnetization value (Ms) One  Fe (99 wt% or more) 192 (emu / g) 2 Fe- (3-10 wt%) Si-based 172 (emu / g) 3 Series of Fe-Si-Al sanders 115 (emu / g) 4 Fe-Ni series (Fe 50 wt% or more) 150 (emu / g) 5 Fe-Si-Cr series 180 (emu / g) 6 Fe-Si-B-Cr amorphous series 145 (emu / g)

The external electrode 140 may be used as a connection terminal for mounting the device body 120 on an external electronic device (not shown). For this, the external electrode 140 may be formed on the surface of the element body 120. The external electrode 140 is electrically connected to the first electrode 115a at one end of the element body 120 and to the second electrode 115b at the other end of the element body 120. [ As shown in FIG.

On the other hand, the main characteristics of the power inductor are the initial inductance (Ls) at 1 MHz and the direct current (Isat) at the point where the inductance decreases by 30% of the initial value due to the application of the direct current. These two characteristic values tend to be inversely proportional to each other in the same chip design. Therefore, the value obtained by multiplying the Ls value by the Isat value can be used as an index indicating the flux energy use efficiency in the inductor. That is, the Ls x Isat value can be used as an index indicating that the magnetic flux is concentrated at a specific portion and the characteristic value of the inductor is lowered.

The thickness of the metal-organic body 130 with respect to the thickness (hereinafter referred to as a first thickness) T1 of the element body 120 of the inductor 100 as described above (T2) can be adjusted to improve the characteristics of the inductor. Table 2 shows Ls, Isat, and Ls x Isat values according to the ratio of the second thickness (T2) to the first thickness (T1). When the ratio of the second thickness (T2) to the first thickness (T1) is 20% or less, Ls is increased, but Isat is greatly reduced. On the other hand, when the ratio of the second thickness (T2) to the first thickness (T1) is 80% or more, it is confirmed that Ls is greatly decreased and Isat is also decreased. Considering that the approximate average value of the Ls x Isat value of the power inductor is 1.6 or more, it is preferable that the ratio of the second thickness T2 to the first thickness T1 is 0.2 to 0.8.

No T1 (mm) T1 / T2 Ls (μH) (on 1 MHz) Isat (A) Ls x Isat One 1.0 20 2.30 0.17 0.39 2 1.0 30 1.91 1.66 1.66 3 1.0 40 1.57 2.04 2.04 4 1.0 50 1.21 2.35 2.35 5 1.0 60 1.08 2.27 2.27 6 1.0 70 0.96 2.11 2.11 7 1.0 80 0.72 1.42 1.42

As described above, the inductor 100 according to the embodiment of the present invention includes the ferrite-organic substance body 110 having the internal electrode 115 and the metal magnetic body powder while covering the ferrite-organic substance body 110, And a metal-organic substance body 130 constituting the element body 120 together with the ferrite-organic substance body 110. In this case, the permeability can be greatly improved by using the metal-organic substance body 130 using the metal having the relatively high saturation magnetization value as the magnetic substance powder as compared with the general ferrite powder as the element body 120. Accordingly, the inductor according to the present invention comprises a ferrite-organic composite material containing a ferrite magnetic material powder in a portion where internal electrodes are formed, and a metal having a saturation magnetization value higher than that of the ferrite powder in the remaining portion, It is possible to have a structure in which the inductance characteristic is improved by increasing the permeability as compared with the case where the whole body of the element is made of ferrite powder.

The inductor 100 according to the embodiment of the present invention includes a device body 120 composed of a ferrite-organic substance body 110 as a core layer and a metal-organic substance body 130 covering the ferrite-organic substance body 110 The thickness T2 of the metal-organic body 130 with respect to the thickness T1 of the element body 120 may be adjusted to 0.2 to 0.8 so that the characteristics of the inductor may satisfy the reference specification. Accordingly, the inductor according to the present invention can have a structure that improves the chip characteristics including the inductance characteristics by adjusting the relative thickness of the metal-organic body to the thickness of the device body to an optimum range.

Next, a method of manufacturing an inductor according to an embodiment of the present invention will be described in detail. Here, the redundant contents of the inductor 100 can be omitted or simplified.

FIG. 2 is a flow chart showing a method of manufacturing an inductor according to an embodiment of the present invention, and FIGS. 3A to 3D are views for explaining a manufacturing process of an inductor according to an embodiment of the present invention.

Referring to FIGS. 2 and 3A, a ferrite sheet 112 may be prepared (S110). The step of preparing the ferrite sheet 112 may include preparing a ferrite-organic composite material and subjecting the ferrite-organic composite material to film casting to form a sheet. The ferrite-organic composite material may be a slurry prepared by mixing a ferrite powder, an organic binder, a dispersant, a plasticizer, and the like in an organic solvent. As the organic binder, polyvinyl butyrate (PVB) or an acrylic-based material may be used.

The magnetic sheet 111 can be manufactured by forming the conductive pattern 114 on the ferrite sheet 112 (S120). The forming of the conductive pattern 114 may be performed by forming a via hole for the ferrite sheet 112 and printing a conductive paste for the ferrite sheet 112. As the metal paste, a metal paste containing copper (Cu), silver (Ag), nickel (Ni), or the like may be used. The process of the magnetic sheet 111 can be repeated to manufacture a plurality of magnetic sheets 111. [

Referring to FIGS. 2 and 3B, the ferrite-organic body 110 can be manufactured by stacking and pressing the magnetic sheets 111 (S130). The step of fabricating the ferrite-organic body 110 may be performed by laminating the magnetic sheets 111 to produce a sheet laminate 113, followed by pressing the sheet sheet laminate 113. At this time, the step of manufacturing the sheet stack 113 may stack the magnetic sheets 111 such that the conductive pattern 114 is exposed to the outer surface of the final sheet stack 113. That is, the sheet stack 113 includes a first internal electrode 115a disposed on one side of the ferrite-organic body 110 and a second internal electrode 115b disposed on the other side of the ferrite- The magnetic sheets 111 may be aligned and laminated so as to have the first magnetic layer 115b.

Through the above process, the conductive patterns 114 are stacked along the stacking direction of the magnetic sheets 111, and the internal electrode 115 having the multilayer coil structure is manufactured in the sheet stack 113 .

Referring to FIGS. 2 and 3C, the element body 120 may be manufactured by performing a forming process using the metal-organic composite material on the ferrite-organic body 110 (S140). The device body 120 may be manufactured using a molding molding process. More specifically, the element body 120 is prepared by preparing the metal-organic composite material, filling the prepared metal-organic composite material with a predetermined metal mold (not shown), and then placing the ferrite- And pressurizing the metal-organic composite material to form the metal-organic composite material according to the mold.

The step of preparing the metal-organic composite material may include a step of preparing a metal powder of any one of iron (Fe), iron base alloy, and Fe-based amorphous material by using at least one of a resin, a curing agent and a silane coupling agent And the like. As the resin, a crystalline epoxy resin may be preferable. Since the crystalline epoxy resin is excellent in bonding properties, has a glass transition temperature (Tg) of about 100 ° C or more, and has a melting point of about 100 ° C or less, a strong bonding force with the iron base metal can be secured. This may be because a relatively strong bonding force of the crystalline epoxy ensures a low thermal expansion coefficient characteristic. As shown in Table 1 below, it was confirmed that when a crystalline epoxy resin was used, the coefficient of thermal expansion could be lowered to less than about 20.0 (占 퐉 / m 占 폚) as compared with the case of using an amorphous epoxy resin. Therefore, when a crystalline epoxy resin is used as the resin, a strong resistance against an impact such as a solder crack or the like applied to the manufactured inductor can be secured.

No Epoxy type Thermal Expansion Coefficient (CTE) One Crystalline BPF epoxy 16.9 (占 퐉 / m 占 폚) 2 Decision BP Epoxy 17.5 (占 퐉 / m 占 폚) 3 Amorphous OCN epoxy 23.2 (占 퐉 / m 占 폚) 4 Amorphous modified epoxy-1 27.5 (占 퐉 / m 占 폚) 5 Amorphous modified epoxy-2 28.3 (占 퐉 / m 占 폚)

In addition, it may be preferable that the step of preparing the metal-organic composite material includes the metal content to be adjusted to about 65 wt% to 95 wt% with respect to the composite material 20. Referring to Table 2 below, when the content of the metal is less than about 65 wt% with respect to the metal-organic composite material, the permeability is significantly lowered and desired inductance can not be secured. In contrast, when the content of the metal exceeds about 95 wt% with respect to the metal-organic composite material, insulation of the metal-organic composite material is not ensured, so that a local current path between the metals in the metal- path is generated, and the eddy current loss increases, so that the inductor characteristics can not be secured.

No Metal content (wt%) Organic matter content (wt%) Permeability Etc One Greater than 95% Less than 5 40 or more Energizing problem 2 85 ~ 95 5 to 15 30 to 40 3 70 ~ 85 15 to 30 15 to 30 4 65 to 70 30 to 35 5 to 15 5 Less than 65 35 or more 5 or less

Referring to FIGS. 2 and 3, the external electrode 140 may be formed on the element body 120 (S150). The step of forming the external electrode 140 may include a step of electrically connecting the internal electrode 115 to the element body 120 at both ends of the resultant using a plating process and a dipping process, A metal layer may be formed.

As described above, the method of manufacturing the inductor 100 according to the embodiment of the present invention is a method of manufacturing the ferrite-organic body 110 of the element body 120 in which the internal electrode 115 is positioned, as a composite material containing the ferrite magnetic powder The metal-organic body 130, which is the remainder of the element body 120, can be manufactured from a composite material containing a metal magnetic powder having a relatively high saturation magnetization value. In this case, most of the device body can be constituted of a metal-organic composite material using a metal having a relatively high saturation magnetization value as a magnetic powder in comparison with a general ferrite powder, and thus an inductor having a greatly improved magnetic permeability can be manufactured. Accordingly, in the method of manufacturing an inductor according to the present invention, a ferrite-organic composite material containing a ferrite magnetic material powder is formed in a portion where the internal electrode is positioned, and a metal having a saturation magnetization value higher than that of the ferrite powder is formed in the remaining portion The inductor having a structure in which the inductance characteristic is improved by increasing the magnetic permeability can be manufactured as compared with the case where the element body is made of the ferrite powder by constituting the element body with the metal-organic composite material containing the magnetic powder.

The method of manufacturing the inductor 100 according to the embodiment of the present invention may be such that the ferrite-organic element body 110 is manufactured using a sheet lamination method and the metal-organic element body 130 is manufactured using a molding method have. In this case, the device body is manufactured as a composite process of the lamination method and the molding method, and mass production of the device body for manufacturing a small inductor can be achieved. Accordingly, in the method of manufacturing an inductor according to the present invention, the ferrite-organic body portion constituting the core layer is manufactured by the lamination method, and the remaining metal-organic body portion is manufactured by the metal mold method, The device body can be mass-produced.

Hereinafter, a modified example of the inductor according to the embodiment of the present invention will be described in detail. Here, the contents overlapping with the inductor 100 described above with reference to FIG. 1 may be omitted or simplified.

4 is a view showing a modified example of the inductor according to the embodiment of the present invention. 4, an inductor 100a according to a modified embodiment of the present invention includes a ferrite-organic body 110 and a device body 130 composed of a metal-organic body 130 that covers both surfaces of the ferrite- An external electrode 140 formed at both ends of the element body 120 and electrically connected to the internal electrode 115 and an external electrode 140 formed between the ferrite organic body 110 and the metal- May include an intervening gap layer (150).

The gap layer 150 is formed in the element body 120 along the longitudinal direction of the element body 120 in a direction parallel to the magnetic sheet constituting the sheet stack 113 of the ferrite- . The cap layer 150 may partition the ferrite-organic body 110 and the metal-organic body 130. Accordingly, the magnetic field generated in each of the regions defined by the gap layer 150 is blocked by the gap layer 150, so that the flow of the magnetic field between the regions can be minimized.

As the material of the gap layer 150, ZnCu ferrite or a Zn-Ti dielectric is used as a main component, and CuO can be added or Fe content can be controlled for ensuring sinterability. That is, the gap layer 150 is preferably made of a completely nonmagnetic material as the material of the gap layer 150 in terms of its function, but the complete nonmagnetic material can not be sintered in the manufacturing process of the element body. It is possible to add a material such as CuO.

In general Fe metal powder has a very high saturation magnetization value, but its permeability is lower than the permeability required in a stacked power inductor. Therefore, in order to realize the same inductance, the number of internal electrode turns must be increased, Which may lead to an increase in the value. In order to appropriately control the characteristics of the opposing Fe metal powder, the gap layer 150 is provided in a portion where magnetic flux is gathered in the metal-organic substance body 130 having a relatively high saturation magnetization value, -Bias property can be improved. That is, the gap layer 130 is provided between the portions 115a and 115b of the internal electrode 115 exposed on the sheet stack 113 and the metal-organic body 130, and the internal electrode 115 ) And the metal magnetic material powder can be prevented and the DC-Bias characteristic can be improved although the flux of magnetic flux can be cut off and the inductance can be somewhat lowered.

division Device body thickness Ls (μH) (on 1 MHz) Isat (A) Ls x Isat Variation example 1.0 0.72 3.10 2.23 Example 1.0 0.95 2.20 2.09 Conventional technology 1.0 1.86 0.90 1.67

Table 5 shows the characteristics of the inductor according to the embodiment of the present invention in comparison with the prior art. Referring to Table 5, the inductor 100 according to the embodiment of the present invention and the inductor 100a according to the modified embodiment of the present invention have an initial inductance value Ls Although it was confirmed to be relatively low, the Isat value was relatively high, and as a result, the Ls x Isat value was confirmed to be high. In particular, it has been confirmed that the inductor 100a having the gap layer 150 has the highest value of Ls x Isat and the structure in which the magnetic flux energy is most efficiently used in the chip.

The foregoing detailed description is illustrative of the present invention. It is also to be understood that the foregoing is illustrative and explanatory of preferred embodiments of the invention only, and that the invention may be used in various other combinations, modifications and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, the disclosure and the equivalents of the disclosure and / or the scope of the art or knowledge of the present invention. The foregoing embodiments are intended to illustrate the best mode contemplated for carrying out the invention and are not intended to limit the scope of the present invention to other modes of operation known in the art for utilizing other inventions such as the present invention, Various changes are possible. Accordingly, the foregoing description of the invention is not intended to limit the invention to the precise embodiments disclosed. It is also to be understood that the appended claims are intended to cover such other embodiments.

100: inductor
110: ferrite-organic body
111: magnetic sheet
112: ferrite sheet
113: Sheet laminate
114: conductive pattern
115: internal electrode
120: element body
130: metal-organic body
140: external electrode
150: Gap layer

Claims (15)

Ferrite - organic body;
An inner electrode laminated on the ferrite-organic substance body along the thickness direction of the ferrite-organic substance body and having a multilayer structure;
A metal-organic substance body covering the ferrite-organic substance body and constituting a device body together with the ferrite-organic substance body; And
And an external electrode covering the element body so as to be electrically connected to the internal electrode. The method according to claim 1,
Wherein the metal-organic body is made of a metal-organic composite material,
Wherein the metal-organic composite material comprises:
Any one of iron (Fe), iron base alloy, and Fe base amorphous metal; And
An inductor comprising an organic material of at least one of a resin, a hardener, and a silane coupling agent. The method according to claim 1,
Wherein the metal-organic body is formed of a metal-organic composite material containing a crystalline epoxy resin as an organic material. The method according to claim 1,
Wherein a ratio of a thickness of the metal-organic substance body to a thickness of the element body is 0.2 to 0.8. The method according to claim 1,
Wherein the metal-organic body is made of a metal-organic composite material having a metal content of 65 wt% to 95 wt%. The method according to claim 1,
Wherein the ferrite-organic body is made of a ferrite-organic composite material,
Wherein the ferrite-organic composite material comprises a ferrite powder, an organic binder, a dispersant, and a plasticizer. The method according to claim 1,
Wherein the ferrite body is formed by stacking a plurality of ferrite sheets on which the internal electrodes are formed. The method according to claim 1,
And an inductor including a gap layer between the ferrite-organic body and the metal-organic body. Preparing a plurality of ferrite sheets having internal electrodes formed on a surface thereof;
Stacking and pressing the ferrite sheets so that internal electrodes formed on each of the ferrite sheets form one multi-layered coil, thereby producing a ferrite-organic body;
Forming a metal-organic body covering the ferrite-organic body, thereby fabricating a device body; And
And forming an outer electrode electrically connected to the multilayer coil on the surface of the element body. 10. The method of claim 9,
The step of forming the metal-organic body may include the step of forming an organic substance of at least one of a metal, a resin, a curing agent, and a silane coupling agent, which is one of iron (Fe), an iron base alloy, Wherein the metal-organic composite material comprises a metal-organic composite material. 10. The method of claim 9,
Wherein the step of forming the metal-organic body comprises the step of preparing a metal-organic composite material containing a crystalline epoxy resin. 10. The method of claim 9,
Wherein the metal-organic body is formed of a metal-organic composite material having a metal content of 65 wt% to 95 wt%. 10. The method of claim 9,
Wherein the step of forming the metal-organic body is such that the ratio of the thickness of the metal-organic body to the thickness of the device body is 0.2 to 0.8. 10. The method of claim 9,
Preparing the ferrite sheets comprises:
Preparing a ferrite-organic composite material including a ferrite powder, an organic binder, a dispersant, and a plasticizer; And
And subjecting the ferrite organic composite material to film casting. 10. The method of claim 9,
And forming a gap layer between the ferrite-organic body and the metal-organic body.

Images