CN204397126U - A kind of rail pressing plate for bonding equipment - Google Patents
A kind of rail pressing plate for bonding equipment Download PDFInfo
- Publication number
- CN204397126U CN204397126U CN201520047607.5U CN201520047607U CN204397126U CN 204397126 U CN204397126 U CN 204397126U CN 201520047607 U CN201520047607 U CN 201520047607U CN 204397126 U CN204397126 U CN 204397126U
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- Prior art keywords
- lead frame
- region
- chamber
- welding
- pressing plate
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Abstract
The utility model relates to semiconductor packaging device field, particularly a kind of rail pressing plate for bonding equipment.Comprise nip region and the rectangular solder region being arranged on nip region central authorities; Described nip region, for lead frame being pressed on the heating base of bonding equipment, described welding region is provided with the welding window that two rows are regularly arranged; The thickness of described welding region is thinner than the thickness of described nip region, thus below described welding region, define welding chamber, and described welding chamber is what tilt in face of chamber, the side wall of lead frame termination, and its incline direction is the direction entered along lead frame.When this structure effectively can avoid lead frame injection pressing plate, the termination due to lead frame props up with the described chamber wall welding chamber and causes lead frame to be out of shape, thus causes the phenomenon that gets stuck.
Description
Technical field
The utility model relates to semiconductor packaging device field, particularly a kind of rail pressing plate for bonding equipment.
Background technology
Rail pressing plate is one of mechanical device of bonding equipment indispensability in semiconductor packaging industry, bonding equipment needs lead frame to be in a highly stable state in wire bonding process can guarantee that solder joint is uniform and stable stressed, this depends on rail pressing plate and realizes, the effect of rail pressing plate is pressed on heating base by framework in bonding equipment wire bonding process, prevent framework left and right shake in equipment rail, its basic functional principle as shown in Figure 1.
The maximum advantage of the more high-density lead frame of current application is exactly under the prerequisite not affecting product device performance and reliability, to reduce the packaging cost of one single chip, but the problem brought is the raising along with framework density, punching quantity on framework base material is just more and more, spacing between Kong Yukong is also more and more less, this makes the strong point of framework itself tail off, overall external hardness also will decrease, and the ability that the decline of the external hardness of framework causes its form opposing external force to cause being out of shape declines.And the compact conformation of the bonding equipment lead-in wire rail pressing plate of SKW-ACB-3000 model; but deficiency is that chamber, the side wall that it enters in face of lead frame termination is right angle; and rail pressing plate is operationally minimum with the fit clearance of heating base; this just causes when lead frame enters the gap between described rail pressing plate and heating base; the right angle of described rail pressing plate feed end often can be encountered in its termination; thus cause the deformation of described lead frame; and then cause this production procedure to get stuck, cause lead frame to scrap.
Utility model content
The purpose of this utility model is to provide a kind of rail pressing plate for bonding equipment avoiding lead frame to get stuck, and comprises nip region and the rectangular solder region being arranged on nip region central authorities; Described nip region, for lead frame being pressed on the heating base of bonding equipment, described welding region is provided with the welding window that two row are regularly arranged; The thickness of described welding region is thinner than the thickness of described nip region, thus below described welding region, define welding chamber, it is characterized in that, described welding chamber is what tilt in face of chamber, the side wall of lead frame termination, and its incline direction is the direction entered along lead frame.
Preferably, described welding chamber is 45 degree in face of the angle of inclination of chamber, the side wall of lead frame termination.
compared with prior art, the beneficial effects of the utility model: the utility model provides a kind of rail pressing plate for bonding equipment, its welding chamber is that the direction entered along lead frame is obliquely installed in face of chamber, the side wall of lead frame termination, when effectively can avoid lead frame injection pressing plate, termination due to lead frame props up with the described chamber wall welding chamber and causes lead frame to be out of shape, thus causes the phenomenon that gets stuck.
Accompanying drawing explanation
Fig. 1 is the sectional view of lead frame injection pressing plate in prior art.
Fig. 2 is the sectional view of the utility model lead frame injection pressing plate.
Mark in figure: 1-rail pressing plate, 11-nip region, 12-welding region, 13-welds cavity, 2-heating base, 3-lead frame.
Detailed description of the invention
Below in conjunction with specific embodiment, the utility model is described in further detail.But this should be interpreted as that the scope of the above-mentioned theme of the utility model is only limitted to following embodiment, all technology realized based on the utility model content all belong to scope of the present utility model.
embodiment 1:as shown in Figure 2, the present embodiment provides a kind of rail pressing plate for bonding equipment avoiding lead frame to get stuck, and described rail pressing plate 1 comprises nip region 11 and is arranged on the rectangular solder region 12 of nip region central authorities; Described nip region 11, for lead frame 3 being pressed on the heating base 2 of bonding equipment, described welding region 12 is provided with the regularly arranged welding window of two row (not showing in figure); The thickness of described welding region 12 is thinner than the thickness of described nip region 11, thus below described welding region 12, define welding chamber 13, it is characterized in that, described welding chamber 13 is what tilt in face of chamber, the side wall of lead frame termination 31, its incline direction is the direction entered along lead frame 3, and its angle of inclination can carry out setting (as 10 degree, 30 degree, 45 degree, 60 degree, 75 degree) as required.
Preferably, described welding chamber 13 is 45 degree in face of the angle of inclination of chamber, the side wall of lead frame termination 31.
Claims (2)
1., for a rail pressing plate for bonding equipment, comprise nip region and the rectangular solder region being arranged on nip region central authorities; Described nip region, for lead frame being pressed on the heating base of bonding equipment, described welding region is provided with the welding window that two rows are regularly arranged; The thickness of described welding region is thinner than the thickness of described nip region, thus below described welding region, define welding chamber, it is characterized in that, described welding chamber is what tilt in face of chamber, the side wall of lead frame termination, and its incline direction is the direction entered along lead frame.
2., as claimed in claim 1 for the rail pressing plate of bonding equipment, it is characterized in that, described welding chamber is 45 degree in face of the angle of inclination of chamber, the side wall of lead frame termination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520047607.5U CN204397126U (en) | 2015-01-23 | 2015-01-23 | A kind of rail pressing plate for bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520047607.5U CN204397126U (en) | 2015-01-23 | 2015-01-23 | A kind of rail pressing plate for bonding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204397126U true CN204397126U (en) | 2015-06-17 |
Family
ID=53421024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520047607.5U Expired - Fee Related CN204397126U (en) | 2015-01-23 | 2015-01-23 | A kind of rail pressing plate for bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204397126U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105047596A (en) * | 2015-06-10 | 2015-11-11 | 江苏杰进微电子科技有限公司 | Integrated circuit chip test positioning device |
-
2015
- 2015-01-23 CN CN201520047607.5U patent/CN204397126U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105047596A (en) * | 2015-06-10 | 2015-11-11 | 江苏杰进微电子科技有限公司 | Integrated circuit chip test positioning device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150617 Termination date: 20160123 |
|
| EXPY | Termination of patent right or utility model |