CN204383940U - Wafer magazine - Google Patents
Wafer magazine Download PDFInfo
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- CN204383940U CN204383940U CN201420753773.2U CN201420753773U CN204383940U CN 204383940 U CN204383940 U CN 204383940U CN 201420753773 U CN201420753773 U CN 201420753773U CN 204383940 U CN204383940 U CN 204383940U
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- wafer
- box body
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- breach
- straight
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Abstract
The utility model provides a kind of wafer magazine, comprise box body, the two side that described box body is relative is respectively arranged with the dividing plate be parallel to each other, form the groove for holding wafer between every two adjacent described dividing plates, the bottom of described box body is provided with for carrying out directed orienting device to the breach of described wafer.Described orienting device comprises the straight-bar be positioned in the middle of bottom described box body, and described straight-bar is perpendicular to described dividing plate.By being provided with bottom wafer magazine for carrying out directed orienting device to the breach of described wafer, the breach of the wafer disk placing each groove is made all to be fixed as same direction.Namely solve warpage wafer disk prealignment platform percent of pass problem, the time of wafer disk when pre-contraposition bench board breach contraposition can be shortened again, improve production efficiency of equipment.
Description
Technical field
The utility model relates to a kind of semiconductor crystal wafer chip level encapsulation technology field, particularly relates to a kind of wafer magazine.
Background technology
Before wafer level packaging product reaches thinning process, disk places magazine is replaced by 13 grooves magazine by the common magazine of 25 grooves.After thinning, the lower thickness of disk, the product disk of part special construction there will be warpage, if still use common magazine, cannot disk transmission be completed in the equipment of wafer level packaging later process, there is disk and mechanical arm and collide and produce sliver risk, therefore need to be replaced by 13 groove magazines.
However in actual production process the special infrastructure product of part thinning after wafer disk can produce warpage (usually within 3mm), wafer level packaging later process all will relate to mechanical arm as printed, planting ball and backflow disk is sent to pre-aligning platform carries out disk breach in advance to bit motion, but due to disk warpage makes prealignment platform cannot be disposable by the contraposition of disk breach, usually there is warning phenomenon, affect operating efficiency.
Utility model content
Provide hereinafter about brief overview of the present utility model, to provide about the basic comprehension in some of the present utility model.Should be appreciated that this general introduction is not summarize about exhaustive of the present utility model.It is not that intention determines key of the present utility model or pith, neither intended limitation scope of the present utility model.Its object is only provide some concept in simplified form, in this, as the preorder in greater detail discussed after a while.
The purpose of this utility model is to provide a kind of wafer magazine.
The wafer magazine that the utility model provides, comprise box body, the two side that described box body is relative is respectively arranged with the dividing plate be parallel to each other, form the groove for holding wafer between every two adjacent described dividing plates, the bottom of described box body is provided with for carrying out directed orienting device to the breach of described wafer.
Compared with prior art, the beneficial effects of the utility model are:
By arranging in the bottom of wafer magazine, directed orienting device being carried out to the breach of wafer, making the otch of the wafer disk be positioned in each groove all be fixed as same direction.Namely solve warpage disk prealignment platform percent of pass problem, the time of disk when pre-contraposition bench board otch contraposition can be shortened again, improve production efficiency of equipment.
Accompanying drawing explanation
With reference to below in conjunction with the explanation of accompanying drawing to the utility model embodiment, above and other objects, features and advantages of the present utility model can be understood more easily.Parts in accompanying drawing are just in order to illustrate principle of the present utility model.In the accompanying drawings, same or similar technical characteristic or parts will adopt same or similar Reference numeral to represent.
The structural representation of the wafer magazine that Fig. 1 provides for the utility model embodiment;
The schematic diagram of the orienting device that Fig. 2 provides for the utility model embodiment.
Description of reference numerals:
1-box body; 2-dividing plate; 3-groove; 4-straight-bar; 5-fixed link
Detailed description of the invention
With reference to the accompanying drawings embodiment of the present utility model is described.The element described in an accompanying drawing of the present utility model or a kind of embodiment and feature can combine with the element shown in one or more other accompanying drawing or embodiment and feature.It should be noted that for purposes of clarity, accompanying drawing and eliminate expression and the description of parts that have nothing to do with the utility model, known to persons of ordinary skill in the art and process in illustrating.
As shown in Figure 1, the wafer magazine that the utility model embodiment provides, comprises box body 1, such as but not limited to, box body 1 can be square substantially, has the cavity of up/down perforation in box body 1, and the opening on cavity top is greater than the opening of bottom.The two side that box body is relative being respectively arranged with the dividing plate 2 be parallel to each other, forming the groove 3 for holding wafer between every two adjacent separator 2, the bottom of box body 1 is provided with for carrying out directed orienting device to the breach of wafer.
By arranging in the bottom of wafer magazine, directed orienting device being carried out to the breach of wafer, making the breach of the wafer disk be positioned in each groove all be fixed as same direction.Namely solve warpage disk prealignment platform percent of pass problem, the time of wafer disk when pre-contraposition bench board breach contraposition can be shortened again, improve production efficiency of equipment.
Preferably, the orienting device that the present embodiment provides comprises the straight-bar 4 be positioned in the middle of bottom box body, and straight-bar 4 is perpendicular to dividing plate 2.The material that straight-bar 4 adopts is to wafer disk without lost material, as acetal etc., to reduce the wearing and tearing of wafer disk on wafer magazine.
Further, the straight-bar that the present embodiment provides is triangle perpendicular to the cross-sectional plane of axis, consistent with the notch geometry of wafer disk, wafer disk breach is coordinated with straight-bar is seamless, ensure that the particularity of wafer disk breach direction orientation.
Further, the summit in straight-bar 4 cross section triangular in shape that the present embodiment provides is towards the opening at box body top, adopt this kind of structure when wafer puts into box body, self aligned function can be had, the particularity that wafer disk puts into rear breach direction orientation can be improved.
Further, see also Fig. 2, the two ends of the straight-bar 4 that the present embodiment provides are provided with fixed link 5, and straight-bar 4 is fixed on the bottom of box body by described fixed link 5, adopts this kind of mode, and structure is simple, connect reliable.
Further, fixed link 5 is mutually vertical with straight-bar 4, and the groove that the end being convenient to fixed link is formed along dividing plate, is installed to the bottom of box body downwards, lays more convenient.
Further, two fixed links 5 are parallel to each other.
Further, the axis of fixed link is parallel with box body 1 dividing plate 2.
Further, the number that box body 1 holds the groove 3 of wafer is 13 grooves, certainly, according to the use needs of reality, can also be the groove 3 of other quantity.
Concrete principle is:
To installing additional bottom wafer magazine, directed orienting device is carried out to notched wafer, the breach of the wafer disk placing each groove of wafer magazine is made all to be fixed as same direction (seeing from the top down: open slot is bottom wafer magazine), after mechanical arm takes out wafer disk from wafer magazine, when the transmission of wafer disk being put on prealignment bench board, disk breach to be just in time positioned at above prealignment platform immediately below laser-scan gap means.Make wafer disk breach just can confirm position when first time laser-scan.
The utility model is provided with in the bottom of wafer magazine for carrying out directed orienting device to the breach of described wafer, makes the breach of the wafer disk placing each groove all be fixed as same direction.Namely solve warpage disk prealignment platform percent of pass problem, the time of disk when pre-contraposition bench board breach contraposition can be shortened again, improve production efficiency of equipment.
Last it is noted that above embodiment is only in order to illustrate the technical solution of the utility model, be not intended to limit; Although be described in detail the utility model with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.
Claims (9)
1. a wafer magazine, comprise box body, the two side that described box body is relative is respectively arranged with the dividing plate be parallel to each other, the groove for holding wafer is formed between every two adjacent described dividing plates, it is characterized in that, the bottom of described box body is provided with for carrying out directed orienting device to the breach of described wafer.
2. wafer magazine according to claim 1, is characterized in that, described orienting device comprises the straight-bar be positioned in the middle of bottom described box body, and described straight-bar is perpendicular to described dividing plate.
3. wafer magazine according to claim 2, is characterized in that, the cross-sectional plane perpendicular to axis of described straight-bar is triangle.
4. wafer magazine according to claim 3, is characterized in that, a described leg-of-mutton summit is towards the opening at described box body top.
5. the wafer magazine according to Claims 2 or 3 or 4, it is characterized in that, the two ends of described straight-bar are provided with fixed link, described straight-bar is fixed on the bottom of described box body by described fixed link.
6. wafer magazine according to claim 5, is characterized in that, described fixed link is mutually vertical with described straight-bar.
7. wafer magazine according to claim 5, it is characterized in that, described in two, fixed link is parallel to each other.
8. wafer magazine according to claim 5, is characterized in that, the axis of described fixed link is parallel with described dividing plate.
9. wafer magazine according to claim 1, is characterized in that, the number of the groove of described accommodation wafer is 13 grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420753773.2U CN204383940U (en) | 2014-12-03 | 2014-12-03 | Wafer magazine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420753773.2U CN204383940U (en) | 2014-12-03 | 2014-12-03 | Wafer magazine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204383940U true CN204383940U (en) | 2015-06-10 |
Family
ID=53356678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420753773.2U Active CN204383940U (en) | 2014-12-03 | 2014-12-03 | Wafer magazine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204383940U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109319254A (en) * | 2018-11-23 | 2019-02-12 | 重庆盟讯电子科技有限公司 | A kind of SMD biscuit quick load box |
-
2014
- 2014-12-03 CN CN201420753773.2U patent/CN204383940U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109319254A (en) * | 2018-11-23 | 2019-02-12 | 重庆盟讯电子科技有限公司 | A kind of SMD biscuit quick load box |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Patentee after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Patentee before: Fujitsu Microelectronics Co., Ltd., Nantong |