CN204375788U - The circular high power integrated LED light source of a kind of composite type - Google Patents
The circular high power integrated LED light source of a kind of composite type Download PDFInfo
- Publication number
- CN204375788U CN204375788U CN201520044785.2U CN201520044785U CN204375788U CN 204375788 U CN204375788 U CN 204375788U CN 201520044785 U CN201520044785 U CN 201520044785U CN 204375788 U CN204375788 U CN 204375788U
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- led
- light source
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The circular high power integrated LED light source of a kind of composite type, the circular high-power LED light source of described composite type is that identical fan-shaped LED is integrated is formed by spelling by several, fan-shaped LED is integrated, comprise metal substrate, mirror-reflection coating above metal substrate, on mirror-reflection coating, be provided with several luminous zones by insulating barrier, in each light-emitting zone, be provided with several LED chips, be provided with metal pad at the edge of each light-emitting zone and by bonding line, LED chip both positive and negative polarity coupled together; The high temperature heat-radiation coating bed of material is provided with on insulating barrier.On the edge high temperature heat-radiation coating bed of material of metal pad, be provided with box dam glue, each light-emitting zone separates by box dam glue, within each light-emitting zone, be provided with fluorescent glue; Solve hot spot problem, improve circuit stability.
Description
Technical field
The utility model belongs to lighting technical field, and it is relevant to be specifically related to a kind of composite type circular high power integrated LED light source.
Background technology
Along with the development of science and technology, LED relies on the high and low power consumption of luminous efficiency, the life-span is long, radiation is low, fail safe advantages of higher, is widely used in various lighting field.
The method that current circular high-capacity LED integration packaging generally adopts is 1W high-power chip, through elargol die bond, then by bonding line by each chip-in series or be together in parallel.And the substrate used is all thick copper base usually, affects the heat radiation of light source to a certain extent.Due to the reason of power and the restriction of package area, circular high-power LED light source is more difficult accomplishes more than multikilowatt.Once have one bad or several bad, whole light source will be caused to occur dark space or scrap.
In addition, existing round LED integrated optical source is comparatively large due to area, and production link also has certain difficulty.And be disposable injecting glue, the regular colloid that causes because area is excessive cannot levelling, causes light source to occur aberration.Meanwhile, because chip power is comparatively large, chip caloric value is also larger, and the elargol therefore needing temperature tolerance higher carrys out die bond.
Utility model content
The purpose of this utility model is the shortcoming overcoming above-mentioned prior art, there is provided a kind of composite type circular high-power LED light source, existing circular high-capacity LED integrated encapsulation structure is improved, solve hot spot problem, decompose integrated optical source simultaneously, change internal design structures, to be divided into several fan-shaped middle low power LED integrated by integrated for circular high-capacity LED, have again by spelling, form circular high-power LED light source.Not only improve circuit stability, thus solve the deficiency of prior art.
For reaching above-mentioned purpose, the utility model adopts following technical scheme:
The circular high power integrated LED light source of a kind of composite type, the circular high-power LED light source of described composite type is that identical fan-shaped LED is integrated forms sphere shape light by spelling by several, each identical fan-shaped LED is integrated to be provided with luminous zone and to connect the pad of each fan-shaped LED integrated circuit, then is gone here and there according to circuit and Power Management Design and couple together.
Further, several described identical fan-shaped LED are integrated collects the wire of being drawn by pad by forming wire hole in the middle of spelling formation sphere shape light, and the outer that described each fan-shaped LED is integrated is provided with location hole.
Further, described fan-shaped LED is integrated, comprise metal substrate, mirror-reflection coating above metal substrate, several luminous zones are provided with by insulating barrier on mirror-reflection coating, in each light-emitting zone, be provided with several LED chips, be provided with metal pad at the edge of each light-emitting zone and by bonding line, LED chip both positive and negative polarity coupled together; The high temperature heat-radiation coating bed of material is provided with on insulating barrier.On the edge high temperature heat-radiation coating bed of material of metal pad, be provided with box dam glue, each light-emitting zone separates by box dam glue, within each light-emitting zone, be provided with fluorescent glue.
Further, described metal substrate is copper base or iron substrate or aluminium base.
Further, the mirror-reflection coating above described metal substrate is electroless plating silver layer or the specular aluminium reflector of high-temperature resistant material.
Further, the insulating barrier on described metal substrate is that heat-conducting resin is attached on substrate.Further, described high temperature heat radiation material layer is fluorocarbon coating layer.
Further, described box dam glue is transparent high-viscosity organosilicon glue.
Further, described fluorescent glue is that resin glue or organic silica gel mixed fluorescent powder form.
Further, described LED chip is the LED blue chip of rated power between 0.3-0.5W.
Adopt technique scheme, the circular high-power LED light source of a kind of composite type of the present utility model is divided into several identical integrated compositions of fan-shaped LED.Each fan-shaped LED integrated morphology, be provided with some LED luminous zones, between luminous zone, circuit passband connects, each luminous zone can need to carry out connection in series-parallel change according to side circuit design, flexibility is high, if after the arbitrary LED chip on any one luminous zone damages, only have this paths of LEDs chip not work, other LED chip still can use as usual.Also by integrated with changing certain bad fan-shaped LED, the replacement cost of whole light source can be reduced.Meanwhile, by the selection at silver coating, improve chip light-emitting efficiency.Designed by spelling, the stroke restricted problem of producing upper die bond bonding wire board can be solved.In addition, not only cost performance is high to use mirror-surface aluminum base board, and good heat dissipation effect.By designing above and can accomplishing between 50W-500W by the power of each sector structure, the power of whole round LED light source can be made to reach a few hectowatt even thousands of watts to the greatest extent.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation;
Fig. 2 is the fan-shaped integrated schematic diagram of the utility model;
Fig. 3 is the utility model luminous zone schematic diagram;
Fig. 4 is the fan-shaped integrated cross-sectional view of the utility model.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail.
Consult Fig. 1-Figure 4 shows that embodiment of the present utility model.
The circular high power integrated LED light source of a kind of composite type, the circular high-power LED light source of described composite type forms sphere shape light by several identical integrated A of fan-shaped LED by spelling, each identical integrated A of fan-shaped LED is provided with luminous zone B and connects the pad C of the integrated A circuit of each fan-shaped LED, then is gone here and there according to circuit and Power Management Design and couple together.Several described identical fan-shaped LED are integrated collects the wire of being drawn by pad by forming wire hole D in the middle of spelling formation sphere shape light, the outer that described each fan-shaped LED is integrated is provided with location hole E, be distributed in three end points edges of sector structure respectively, be convenient to sphere shape light of the present utility model to be installed to required place.
Described fan-shaped LED is integrated, comprise metal substrate 1, mirror-reflection coating 2 above metal substrate 1, several luminous zones are provided with by insulating barrier 5 on mirror-reflection coating 2, in each light-emitting zone, be provided with several LED chips 3, be provided with metal pad 10 at the edge of each light-emitting zone and by bonding line 9, LED chip 3 both positive and negative polarity coupled together; The high temperature heat-radiation coating bed of material 6 is provided with on insulating barrier 5; On the edge high temperature heat-radiation coating bed of material of metal pad 10, be provided with box dam glue 7, each light-emitting zone separates by box dam glue 7, is provided with fluorescent glue 8 within each light-emitting zone.
In actual use, described metal substrate can make copper base, iron substrate and aluminium base etc., the metal aluminum substrate that prioritizing selection sexual valence is better than high thermal conductivity.Reflected coat layer above described metal substrate, can be electroless plating silver, also can make other highly reflective material, this reflector must be high-temperature resistant material.Prioritizing selection specular aluminium reflector.Insulating barrier on described metal substrate is that heat-conducting resin is attached on base plate.Conducting channel is provided with between described each light-emitting zone.The metal welding at the edge of described each light-emitting zone is arranged on conducting channel, can be silver-platedly also can make turmeric, prioritizing selection turmeric.Described bonding line can make copper cash, iron wire, alloy wire and gold thread, prioritizing selection temperature tolerance and the good gold thread of pliability.Described high temperature heat sink material prioritizing selection fluorocarbon coating.Described box dam glue can be white, black and transparent color.Preferentially make transparent high-viscosity organosilicon glue.Described fluorescent glue can be preferentially resin glue, organic silica gel etc., and prioritizing selection temperature tolerance is good, the organic silica gel that refractive index is high.The LED blue chip that described LED chip prioritizing selection rated power caloric value between 0.3-0.5W is relatively little.
The circular high-power LED light source of a kind of composite type of the present utility model is divided into several identical integrated compositions of fan-shaped LED.The fan angle of each fan-shaped LED integrated morphology should be 360 degree/N wherein N be positive integer.Each fan-shaped LED is integrated is provided with some LED luminous zones, between luminous zone, circuit passband connects, each luminous zone can need to carry out connection in series-parallel change according to side circuit design, flexibility is high, if after the arbitrary LED chip on any one luminous zone damages, only have this paths of LEDs chip not work, other LED chip still can use as usual.。Also by integrated with changing certain bad fan-shaped LED, the replacement cost of whole light source can be reduced.Meanwhile, by the selection at silver coating, improve chip light-emitting efficiency.Designed by spelling, the stroke restricted problem of producing upper die bond bonding wire board can be solved.In addition, not only cost performance is high to use mirror-surface aluminum base board, and good heat dissipation effect.By designing above and can accomplishing between 50W-500W by the power of each sector structure, the power of whole round LED light source can be made to reach a few hectowatt even thousands of watts to the greatest extent.
Above-mentioned explanation illustrate and describes preferred embodiment of the present utility model, as previously mentioned, be to be understood that the utility model is not limited to the form disclosed by this paper, should not regard the eliminating to other embodiments as, and can be used for other combinations various, amendment and environment, and can in utility model contemplated scope described herein, changed by the technology of above-mentioned instruction or association area or knowledge.And the change that those skilled in the art carry out and change do not depart from spirit and scope of the present utility model, then all should in the protection range of the utility model claims.
Claims (9)
1. the circular high power integrated LED light source of composite type, it is characterized in that: the circular high-power LED light source of described composite type is that identical fan-shaped LED is integrated forms sphere shape light by spelling by several, each identical fan-shaped LED is integrated to be provided with luminous zone and to connect the pad of each fan-shaped LED integrated circuit, then is gone here and there according to circuit and Power Management Design and couple together.
2. the circular high power integrated LED light source of a kind of composite type as claimed in claim 1, it is characterized in that: several described identical fan-shaped LED are integrated collects the wire of being drawn by pad by forming wire hole in the middle of spelling formation sphere shape light, and the outer that described each fan-shaped LED is integrated is provided with location hole.
3. the circular high power integrated LED light source of a kind of composite type as claimed in claim 1 or 2, it is characterized in that: described fan-shaped LED is integrated, comprise metal substrate, mirror-reflection coating above metal substrate, several luminous zones are provided with by insulating barrier on mirror-reflection coating, in each light-emitting zone, be provided with several LED chips, be provided with metal pad at the edge of each light-emitting zone and by bonding line, LED chip both positive and negative polarity coupled together; The high temperature heat-radiation coating bed of material is provided with on insulating barrier; On the edge high temperature heat-radiation coating bed of material of metal pad, be provided with box dam glue, each light-emitting zone separates by box dam glue, within each light-emitting zone, be provided with fluorescent glue.
4. the circular high power integrated LED light source of a kind of composite type as claimed in claim 3, is characterized in that: described metal substrate is copper base or iron substrate or aluminium base.
5. the circular high power integrated LED light source of a kind of composite type as claimed in claim 3, is characterized in that: the mirror-reflection coating above described metal substrate is electroless plating silver layer or the specular aluminium reflector of high-temperature resistant material.
6. the circular high power integrated LED light source of a kind of composite type as claimed in claim 3, is characterized in that: the insulating barrier on described metal substrate is that heat-conducting resin is attached on substrate.
7. the circular high power integrated LED light source of a kind of composite type as claimed in claim 3, is characterized in that: described high temperature heat radiation material layer is fluorocarbon coating layer.
8. the circular high power integrated LED light source of a kind of composite type as claimed in claim 3, is characterized in that: described box dam glue is transparent high-viscosity organosilicon glue.
9. the circular high power integrated LED light source of a kind of composite type as claimed in claim 3, is characterized in that: described LED chip is the LED blue chip of rated power between 0.3-0.5W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520044785.2U CN204375788U (en) | 2015-01-23 | 2015-01-23 | The circular high power integrated LED light source of a kind of composite type |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520044785.2U CN204375788U (en) | 2015-01-23 | 2015-01-23 | The circular high power integrated LED light source of a kind of composite type |
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| Publication Number | Publication Date |
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| CN204375788U true CN204375788U (en) | 2015-06-03 |
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| CN201520044785.2U Expired - Fee Related CN204375788U (en) | 2015-01-23 | 2015-01-23 | The circular high power integrated LED light source of a kind of composite type |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104617205A (en) * | 2015-01-23 | 2015-05-13 | 厦门多彩光电子科技有限公司 | Combined type round high power integration LED (light emitting diode) light source |
-
2015
- 2015-01-23 CN CN201520044785.2U patent/CN204375788U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104617205A (en) * | 2015-01-23 | 2015-05-13 | 厦门多彩光电子科技有限公司 | Combined type round high power integration LED (light emitting diode) light source |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150603 Termination date: 20200123 |
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| CF01 | Termination of patent right due to non-payment of annual fee |