CN204362423U - Device for flattening circuit board - Google Patents
Device for flattening circuit board Download PDFInfo
- Publication number
- CN204362423U CN204362423U CN201420871165.1U CN201420871165U CN204362423U CN 204362423 U CN204362423 U CN 204362423U CN 201420871165 U CN201420871165 U CN 201420871165U CN 204362423 U CN204362423 U CN 204362423U
- Authority
- CN
- China
- Prior art keywords
- wiring board
- base plate
- pressing plate
- bottom plate
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000010959 steel Substances 0.000 claims abstract description 9
- 230000009977 dual effect Effects 0.000 claims description 3
- 230000005484 gravity Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
Landscapes
- Straightening Metal Sheet-Like Bodies (AREA)
Abstract
The utility model discloses a device for flattening circuit board includes the bottom plate that clamp plate and steel material made, and the bottom plate is embedded to have the heating pipe. The circuit board that will flatten is placed between clamp plate and bottom plate, because the bottom plate is made for the steel material, the embedded heating pipe of bottom plate gives the bottom plate with heat transfer, and the bottom plate gives the circuit board with heat transfer, and the circuit board is being heated and is receiving under the state of the pressure of clamp plate, realizes leveling.
Description
Technical field
The utility model relates to a kind of device for flattening wiring board.
Background technology
At present, a lot of universities and colleges, R&D institution, enterprise etc. is had to carry out the reverse engineer work of product.In order to realize reverse engineer success, need wiring board can be smooth, but generally, have part wiring board after the dismounting of device, can produce the phenomenons such as buckling deformation, this unsuccessfully will hide the foreshadowing for reverse engineer.The wiring board that can be ensured distortion by this device becomes smooth, thus offers help for reverse engineer probability of failure reduces.
Summary of the invention
Of the present utility modelly provide a kind of device for flattening wiring board.
In order to solve the problem, by the following technical solutions, a kind of device for flattening wiring board, comprise the base plate that pressing plate and steel material are made, base plate is embedded with heating tube to the utility model.
The surrounding of base plate is provided with multiple bolt connecting hole, and the surrounding of pressing plate arranges multiple bolt mounting holes, when pressing plate is placed on base plate, and described bolt mounting holes and bolt connecting hole position one_to_one corresponding.Wiring board is placed between pressing plate and base plate, and in order to make wiring board more smooth, pressing plate is pressed on base plate through bolt mounting holes and bolt connecting hole by bolt.
In order to make wiring board evenly be heated, heating tube is preferably dual U-shaped.
In order to make pressing plate have larger gravity, pressing plate is made up of steel material.
Beneficial effect: be positioned between pressing plate and base plate by needing the wiring board flattened, because base plate is that steel material is made, can heat conduction, the embedded heating tube of base plate transfers heat to base plate, base plate transfers heat to wiring board, wiring board, under the state of pressure of being heated and be subject to pressing plate, realizes smooth.
Accompanying drawing explanation
Fig. 1 is exploded view of the present utility model.
Embodiment
In order to deepen understanding of the present utility model, below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, and this embodiment, only for explaining the utility model, does not form the restriction to the utility model protection range.
As shown in Figure 1, a kind of device for flattening wiring board, comprise and make base plate 1 by pressing plate 2 and steel material, heating tube 3 is embedded with at base plate 1, heating tube 3 is dual U-shaped in the present embodiment, in order to make wiring board more smooth, the surrounding of base plate is provided with multiple bolt connecting hole 4, the surrounding of pressing plate 2 is provided with multiple bolt mounting holes 5, when pressing plate 2 is placed in upper on base plate 1, described bolt mounting holes 5 and bolt connecting hole 4 position one_to_one corresponding, pressing plate 2 is pressed on base plate 1 through bolt connecting hole 5 and bolt mounting holes 4 by bolt, thus the wiring board between pressing plate 2 and base plate 1 is flattened.
In order to make pressing plate have larger gravity, pressing plate 2 is made up of steel material.
When the components and parts on wiring board are split unsnatch after, wiring board 6 is placed on base plate 1, then pressing plate 2 is placed on the upper of wiring board 6, ensures that the threaded mounting hole 5 on pressing plate 2 aligns one by one with threaded connection hole 4 position of base plate, in bolt inserting bolt installing hole 5 and bolt connecting hole 4.Connect electrothermal tube power, heating tube 3 transfers heat to base plate 1, base plate 1 by heat transfer thermal energy transfer to wiring board 6.If wiring board 6 buckling deformation degree is low, be heated and pressing plate 2 conduct oneself with dignity pressure condition under, can realize within a short period of time smooth; If the buckling deformation degree of wiring board 6 is higher, after being heated making wiring board 6 and being subject to pressing plate 2 gravity pressure a period of time, the hardness of wiring board 6 can reduce, slowly screw the bolt in inserting bolt installing hole 5 and bolt connecting hole 4, wiring board 6 is increased stressed, make the wiring board 6 that buckling deformation degree is higher realize smooth.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any amendment done, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (4)
1. for flattening a device for wiring board, it is characterized in that, comprise the base plate that pressing plate and steel material are made, base plate is embedded with heating tube.
2. a kind of device for flattening wiring board according to claim 1, it is characterized in that, the surrounding of base plate is provided with multiple bolt connecting hole, and the surrounding of pressing plate arranges multiple bolt mounting holes, when pressing plate is placed on base plate, described bolt mounting holes and bolt connecting hole position one_to_one corresponding.
3. a kind of device for flattening wiring board according to claim 1 and 2, is characterized in that heating tube is dual U-shaped.
4. a kind of device for flattening wiring board according to claim 1 and 2, is characterized in that pressing plate is made up of steel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420871165.1U CN204362423U (en) | 2014-12-31 | 2014-12-31 | Device for flattening circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420871165.1U CN204362423U (en) | 2014-12-31 | 2014-12-31 | Device for flattening circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204362423U true CN204362423U (en) | 2015-05-27 |
Family
ID=53263866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420871165.1U Expired - Fee Related CN204362423U (en) | 2014-12-31 | 2014-12-31 | Device for flattening circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204362423U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104540325A (en) * | 2014-12-31 | 2015-04-22 | 南京信息职业技术学院 | Device for flattening circuit board |
-
2014
- 2014-12-31 CN CN201420871165.1U patent/CN204362423U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104540325A (en) * | 2014-12-31 | 2015-04-22 | 南京信息职业技术学院 | Device for flattening circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150527 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |