CN204332913U - A kind of wafer cut checkout gear - Google Patents
A kind of wafer cut checkout gear Download PDFInfo
- Publication number
- CN204332913U CN204332913U CN201420799890.2U CN201420799890U CN204332913U CN 204332913 U CN204332913 U CN 204332913U CN 201420799890 U CN201420799890 U CN 201420799890U CN 204332913 U CN204332913 U CN 204332913U
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- CN
- China
- Prior art keywords
- camera bellows
- wafer
- checkout gear
- described camera
- wafer cut
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The utility model provides a kind of wafer cut checkout gear, it is characterized in that: comprise the camera bellows for carrying wafer, place of described camera bellows bottom centre is provided with plummer, directly over described plummer, described camera bellows top is provided with infrared sensor, and described infrared sensor is connected with data display unit.For detecting the otch of wafer cutting, structure is simple, easy to operate.
Description
Technical field
The utility model relates to a kind of checkout equipment, especially relates to a kind of wafer cut checkout gear.
Background technology
In integrated circuit (IC) wafer manufacture process, because Product Precision high size is little, environmental factor, technique not step, technological parameter and human factor all likely cause defect or harmful effect to product.In order to objects such as the monitoring of Product Process and the yields of guarantee product, in technological process, be provided with numerous website carry out defects detection.The steps such as the optical detection after the optical detection such as after development, etching, electron-microscope scanning, probe test, reliability testing and wafer final test.
But in these tests due to considering process efficiency or examine repair, Scanning Detction not to wafer notch part, often in the last step of technological process, adopt light microscope to carry out last Manual Visual Inspection to wafer in prior art, comprise in this course and visual inspection is carried out to the cut out portion of wafer.Like this, the opportunity of disfigurement discovery is more late on the one hand, cannot in technical process, defect be detected in time and remedy, and on the other hand owing to adopting Manual Visual Inspection, inevitably the errors such as omission occurs, affects the yield of product.
Utility model content
The utility model, in order to solve the above-mentioned defect and deficiency that exist in prior art, provides a kind of wafer cut checkout gear, and for detecting the otch of wafer cutting, structure is simple, easy to operate.
For solving the problems of the technologies described above, the utility model provides a kind of wafer cut checkout gear, it is characterized in that: comprise the camera bellows for carrying wafer, place of described camera bellows bottom centre is provided with plummer, directly over described plummer, described camera bellows top is provided with infrared sensor, and described infrared sensor is connected with data display unit.
Preferably, described infrared sensor comprises for launching ultrared infra-red ray transmitting unit and the infrared receiver unit for receiving infrared-ray reverberation, and described infrared receiver unit is connected with CPU.
Preferably, described CPU comprises signal amplification unit, filter unit.
Preferably, the wall of described camera bellows is made up of lucifuge glass.
Preferably, described camera bellows comprises the chamber door for described camera bellows being opened cut out, and described chamber door is horizontally slipped by the chute bottom described camera bellows, and described camera bellows bottom right side is provided with chute, and described camera bellows right side wall to be placed on chute and along slide.
Preferably, described plummer is provided with diaphragm, and diaphragm is provided with wafer.
The Advantageous Effects that the utility model reaches:
Compared with prior art, the utility model structure is simple, easy to operate, infrared ray sensor is utilized to detect otch, by infrared data display unit, wafer reflected wave amount is received, by signal amplification unit and filter unit, signal is inputted CPU control unit, by CPU control unit, result is sent to data display unit.If reflected wave is even, then illustrate that otch is intact, if fluctuation appears in reflected wave, then says otch defectiveness.
Accompanying drawing explanation
Fig. 1 the utility model structural representation.
Wherein: 1 camera bellows; 2 infrared sensors; 3 wafers; 4 diaphragms; 5 plummers; 6 data display unit.
Embodiment
In order to the technique effect that auditor can better understand technical characteristic of the present utility model, technology contents and reach, now accompanying drawing of the present utility model is described in detail in conjunction with the embodiments.But shown accompanying drawing, just in order to better illustrate the technical solution of the utility model; be not actual proportions of the present utility model and best configuration; so, auditor please not arrange and configuration with regard to the ratio of accompanying drawing, limit claims of the present utility model.
Below in conjunction with drawings and Examples, the utility model patent is further illustrated.
As shown in Figure 1, the utility model provides a kind of wafer cut checkout gear to comprise camera bellows 1 for carrying wafer, place of described camera bellows 1 bottom centre is provided with plummer 5, directly over described plummer 5, described camera bellows top is provided with infrared sensor 2, and described infrared sensor 2 is connected with data display unit 6.Described infrared sensor 2 comprises for launching ultrared infra-red ray transmitting unit and the infrared receiver unit for receiving infrared-ray reverberation, and described infrared receiver unit is connected with CPU.Described CPU comprises signal amplification unit, filter unit.Structure is simple, easy to operate, utilize infrared ray sensor to detect otch, by infrared data display unit, wafer reflected wave amount is received, by signal amplification unit and filter unit, signal is inputted CPU control unit, by CPU control unit, result is sent to data display unit.If reflected wave is even, then illustrate that otch is intact, if fluctuation appears in reflected wave, then says otch defectiveness.
The problem of available light interference is often there is in wafer testing process, therefore in order to avoid the interference of light in environment, the wall of described camera bellows 1 is made up of lucifuge glass, in the course of the work, only have infrared ray Ray Of Light in camera bellows, substantially increase accuracy of the present utility model.
Described camera bellows 1 comprises the chamber door for described camera bellows being opened cut out, and described chamber door is horizontally slipped by the chute bottom described camera bellows, and described camera bellows bottom right side is provided with chute, and described camera bellows right side wall to be placed on chute and along slide.During use, can conveniently camera bellows chamber door be opened, and wafer 3 of conveniently taking.
Below disclose the utility model with preferred embodiment, so itself and be not used to limit the utility model, allly take equivalent replacement or technical scheme that the scheme of equivalent transformation obtains, all drop in protection range of the present utility model.
Claims (6)
1. a wafer cut checkout gear, it is characterized in that: comprise the camera bellows for carrying wafer, place of described camera bellows bottom centre is provided with plummer, and directly over described plummer, described camera bellows top is provided with infrared sensor, and described infrared sensor is connected with data display unit.
2. wafer cut checkout gear according to claim 1, it is characterized in that: described infrared sensor comprises for launching ultrared infra-red ray transmitting unit and the infrared receiver unit for receiving infrared-ray reverberation, and described infrared receiver unit is connected with CPU.
3. wafer cut checkout gear according to claim 2, is characterized in that: described CPU comprises signal amplification unit and filter unit.
4. wafer cut checkout gear according to claim 1, is characterized in that: the wall of described camera bellows is made up of lucifuge glass.
5. wafer cut checkout gear according to claim 4, it is characterized in that: described camera bellows comprises the chamber door for described camera bellows being opened cut out, described chamber door is horizontally slipped by the chute bottom described camera bellows, described camera bellows bottom right side is provided with chute, and described camera bellows right side wall to be placed on chute and along slide.
6. the wafer cut checkout gear according to claim 1-5 any one, is characterized in that: described plummer is provided with diaphragm, and diaphragm is provided with wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420799890.2U CN204332913U (en) | 2014-12-16 | 2014-12-16 | A kind of wafer cut checkout gear |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420799890.2U CN204332913U (en) | 2014-12-16 | 2014-12-16 | A kind of wafer cut checkout gear |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204332913U true CN204332913U (en) | 2015-05-13 |
Family
ID=53169238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420799890.2U Expired - Fee Related CN204332913U (en) | 2014-12-16 | 2014-12-16 | A kind of wafer cut checkout gear |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204332913U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104538326A (en) * | 2014-12-16 | 2015-04-22 | 苏州凯锝微电子有限公司 | Detection device for wafer cutting notches |
-
2014
- 2014-12-16 CN CN201420799890.2U patent/CN204332913U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104538326A (en) * | 2014-12-16 | 2015-04-22 | 苏州凯锝微电子有限公司 | Detection device for wafer cutting notches |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150513 Termination date: 20151216 |
|
| EXPY | Termination of patent right or utility model |