CN204315572U - 一种三杯支架封装的多色led灯 - Google Patents

一种三杯支架封装的多色led灯 Download PDF

Info

Publication number
CN204315572U
CN204315572U CN201420832351.4U CN201420832351U CN204315572U CN 204315572 U CN204315572 U CN 204315572U CN 201420832351 U CN201420832351 U CN 201420832351U CN 204315572 U CN204315572 U CN 204315572U
Authority
CN
China
Prior art keywords
led
glasss
led lamp
multicolor
supports
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201420832351.4U
Other languages
English (en)
Inventor
王定锋
徐文红
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201420832351.4U priority Critical patent/CN204315572U/zh
Application granted granted Critical
Publication of CN204315572U publication Critical patent/CN204315572U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)

Abstract

本实用新型涉及一种三杯支架封装的多色LED灯，具体而言，将LED支架制作成三个相互隔离分开的凹杯，在每个杯里封装至少一个LED芯片，在其中的两个杯里分别用不同配方的荧光粉胶水封装成两种颜色的白光，在另一个杯里用不含荧光粉的胶水封装成其它颜色的色光，使其在使用时通过控制LED芯片的发光数量和发光强度来达到不同的色光的需求，形成一种具有多种功能的多色LED灯。

Description

一种三杯支架封装的多色LED灯
技术领域
本实用新型涉及LED灯饰照明领域，具体涉及一种三杯支架封装的多色LED灯。
背景技术
现在市面上有一种双杯支架的LED灯珠，只能做两种单一的白光，不能在做两种白光的同时再加其他颜色的光，不能满足市场上对一灯多色的需求。
为了克服以上的缺陷和不足，本实用新型的三杯支架LED灯，不但在两种白光的基础上增加了其他颜色的色光，并且通过控制LED芯片的发光数量和发光强度而能发出更多的混合色光。
发明内容
本实用新型涉及一种三杯支架封装的多色LED灯，具体而言，将LED支架制作成三个相互隔离分开的凹杯，在每个杯里封装至少一个LED芯片，在其中的两个杯里分别用不同配方的荧光粉胶水封装成两种颜色的白光，在另一个杯里用不含荧光粉的胶水封装成其它颜色的色光，使其在使用时通过控制LED芯片的发光数量和发光强度来达到不同的色光的需求，形成一种具有多种功能的多色LED灯。
本实用新型的三杯支架LED灯与现有的双杯支架LED灯相比，不但在两种白光的基础上增加了其他颜色的色光，并且通过控制LED芯片的发光数量和发光强度而能发出更多的混合色光。
根据本实用新型，提供了一种三杯支架封装的多色LED灯，其特征在于，包括：三个相互隔离的凹杯LED支架；每个凹杯里至少封装一个LED芯片；三个杯里相互隔开的封装胶水；其中，在三个相互隔离分开的凹杯里，其中的两个杯里分别用不同配方的荧光粉胶水封装成两种颜色的白光，在另一个杯里用不含荧光粉的胶水封装成其它颜色的色光。
根据本实用新型的一实施例，所述的一种三杯支架封装的多色LED灯，其特征在于，所述的LED支架是采用PPA注塑的LED支架、或者是采用PCT注塑的LED支架、或者是采用EMC注塑的LED支架、或者是采用LCP注塑的LED支架。
根据本实用新型的一实施例，所述的一种三杯支架封装的多色LED灯，其特征在于，所述的LED灯是一灯多色的LED灯。
根据本实用新型的一实施例，所述的一种三杯支架封装的多色LED灯，其特征在于，所述的LED灯，是按不同发光要求，分类对应封装不同配方的荧光粉胶水、或者是不含荧光粉的胶水，同时不同的胶水被分隔开，形成不同的色光。
在以下对附图和具体实施方式的描述中，将阐述本实用新型的一个或多个实施例的细节。从这些描述、附图以及权利要求中，可以清楚本实用新型的其它特征、目的和优点。
附图说明
图1为三杯支架封装的多色LED灯的平面示意图。
图2为“图1”的A-A剖面示意图。
图3为“图1”的B-B剖面示意图。
具体实施方式
下面将以优选实施例为例来对本实用新型进行详细的描述。
但是本领域技术人员应当理解，以下所述仅仅是举例说明和描述一些优选实施方式，对本实用新型的权利要求并不具有任何限制。
如图1至图3所示，在LED支架的塑胶体1.4上，制作有三个相互隔离分开的凹杯1.1、1.2、1.3，在凹杯1.1里设有导电脚1.1.1和1.1.2，在凹杯1.2里设有导电脚1.2.1和1.2.2，在凹杯1.3里设有导电脚1.3.1和1.3.2，LED芯片2固晶在每个凹杯里，LED芯片2的两电极用金属焊线3分别焊接在导电脚1.1.1和1.1.2、1.2.1和1.2.2、1.3.1和1.3.2上(如图1所示)，在凹杯1.1里封装能让LED芯片2发正白色光的荧光粉胶水，在凹杯1.3里封装能让LED芯片2发暧白色光的荧光粉胶水，在凹杯1.2里封装透明胶水，使LED芯片2发出本来的蓝色光，当然，在凹杯1.2里也可以封装红光的LED芯片、或者绿光的LED芯片、或者黄光的LED芯片，或者蓝光的LED芯片、红光的LED芯片、绿光的LED芯片、黄光的LED芯片中任意两种或两种以上芯片的组合，这样制作成一种三杯支架封装的多色LED灯，并且在使用时可通过控制LED芯片的发光数量和发光强度来达到更多的不同色光的需求。
本实用新型的三杯支架LED灯与现有的双杯支架LED灯相比，不但在两种白光的基础上增加了其他颜色的色光，并且通过控制LED芯片的发光数量和发光强度而能发出更多的混合色光。
以上结合附图将一种三杯支架封装的多色LED灯的具体实施例对本实用新型进行了详细的描述。但是，本领域技术人员应当理解，以上所述仅仅是举例说明和描述一些具体实施方式，对本用新型的范围，尤其是权利要求的范围，并不具有任何限制。

Claims (4)

1.一种三杯支架封装的多色LED灯，其特征在于，包括：
三个相互隔离的凹杯LED支架；
每个凹杯里至少封装一个LED芯片；
三个杯里相互隔开的封装胶水；
其中，在三个相互隔离分开的凹杯里，其中的两个杯里分别用不同配方的荧光粉胶水封装成两种颜色的白光，在另一个杯里用不含荧光粉的胶水封装成其它颜色的色光。
2.根据权利要求1所述的一种三杯支架封装的多色LED灯，其特征在于，所述的LED支架是采用PPA注塑的LED支架、或者是采用PCT注塑的LED支架、或者是采用EMC注塑的LED支架、或者是采用LCP注塑的LED支架。
3.根据权利要求1所述的一种三杯支架封装的多色LED灯，其特征在于，所述的LED灯是一灯多色的LED灯。
4.根据权利要求3所述的一种三杯支架封装的多色LED灯，其特征在于，所述的LED灯，是按不同发光要求，分类对应封装不同配方的荧光粉胶水、或者是不含荧光粉的胶水，同时不同的胶水被分隔开，形成不同的色光。
CN201420832351.4U 2014-12-20 2014-12-20 一种三杯支架封装的多色led灯 Active CN204315572U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420832351.4U CN204315572U (zh) 2014-12-20 2014-12-20 一种三杯支架封装的多色led灯

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420832351.4U CN204315572U (zh) 2014-12-20 2014-12-20 一种三杯支架封装的多色led灯

Publications (1)

Publication Number Publication Date
CN204315572U true CN204315572U (zh) 2015-05-06

Family

ID=53137873

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420832351.4U Active CN204315572U (zh) 2014-12-20 2014-12-20 一种三杯支架封装的多色led灯

Country Status (1)

Country Link
CN (1) CN204315572U (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109461722A (zh) * 2018-10-16 2019-03-12 江苏稳润光电科技有限公司 一种双色植物灯照明led光源
CN110190171A (zh) * 2019-04-27 2019-08-30 深圳市长方集团股份有限公司 一种smd-rgbwy多色十脚光源
WO2020232668A1 (en) * 2019-05-22 2020-11-26 Cree Huizhou Solid State Lighting Company Limited Arrangements for light emitting diode packages

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109461722A (zh) * 2018-10-16 2019-03-12 江苏稳润光电科技有限公司 一种双色植物灯照明led光源
CN110190171A (zh) * 2019-04-27 2019-08-30 深圳市长方集团股份有限公司 一种smd-rgbwy多色十脚光源
WO2020232668A1 (en) * 2019-05-22 2020-11-26 Cree Huizhou Solid State Lighting Company Limited Arrangements for light emitting diode packages
CN113875026A (zh) * 2019-05-22 2021-12-31 惠州科锐半导体照明有限公司 用于发光二极管封装件的布置

Similar Documents

Publication Publication Date Title
CN104295945A (zh) 一种全角度发光灯泡及其制造方法
CN203850336U (zh) 高显色锥形螺旋体led封装灯丝
CN103050615B (zh) 一种高显色性白光led器件
CN204315572U (zh) 一种三杯支架封装的多色led灯
CN202268078U (zh) 一种基于红绿光led芯片的交通信号灯
CN203967110U (zh) 一种led灯丝片以及led灯丝片灯泡
CN203312360U (zh) 一种led灯珠封装结构
CN102664229A (zh) 一种发光二极体光源结构
CN207504009U (zh) 一种双色无极灯珠
CN102945910B (zh) 一种混合型桔黄色发光二极管的制备方法
CN105575957A (zh) 一种白光led的cob光源
CN103996787A (zh) 一种高显指高光效白光led结构
CN207993893U (zh) 一种新型混色封装工艺灯
CN201059481Y (zh) 四基色led
CN201964166U (zh) 一种使用荧光粉隔离技术的led灯
CN203415624U (zh) 一种高显色性白光led器件
CN201521811U (zh) 一种色温可调的led灯
CN204358486U (zh) Led环形光源
CN207080814U (zh) 一种可调光led模组
CN204029858U (zh) 一种新型照明用双控三色cob
CN205535158U (zh) 一种led装饰灯泡
CN202977415U (zh) 暖光led灯封装结构
CN203950837U (zh) 全角度白色发光二极管灯条
CN210687798U (zh) 一种led可调cob光源
CN203746905U (zh) 高显指高光效白光led结构

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
DD01 Delivery of document by public notice

Addressee: Xu Wenhong

Document name: Notice of Termination of Patent Rights

DD01 Delivery of document by public notice