CN204303806U - 一种r、g二合一的新型led灯珠 - Google Patents

一种r、g二合一的新型led灯珠 Download PDF

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Publication number
CN204303806U
CN204303806U CN201420663205.3U CN201420663205U CN204303806U CN 204303806 U CN204303806 U CN 204303806U CN 201420663205 U CN201420663205 U CN 201420663205U CN 204303806 U CN204303806 U CN 204303806U
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color chip
chip
pin
lamp pearl
lamp
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郭建良
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Shenzhen Aurora Polytron Technologies Inc
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Shenzhen Jinhuaguang Technology Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

本实用新型公开了一种R、G二合一的新型LED灯珠,该种灯珠包括灯珠胶体和由所述灯珠胶体底部向外延伸的三根接线引脚,三根接线引脚包括公共引脚、R色芯片引脚和G色芯片引脚,所述公共引脚置于灯珠胶体内部空间的部分形成芯片支架,所述芯片支架顶部设有用于容置LED芯片的灯杯,所述灯杯中容置有R色芯片和G色芯片,所述R色芯片和G色芯片通过导电线分别电性连接到上述的R色芯片引脚和G色芯片引脚,该种R、G二合一的新型LED灯珠在生产整个LED显示屏时具有生产效率高、生产成本低、发光显示均匀等优点。

Description

一种R、G二合一的新型LED灯珠
技术领域
本实用新型涉及一种LED应用领域的灯珠,特别是一种R、G二合一的新型LED灯珠。
背景技术
在传统的双色LED显示屏中,由于每一个LED灯珠只能显示一种颜色,显示屏上必须通过插入大量的不同颜色的灯珠才能实现不同颜色的显示功能。然而,过多的灯珠会造成LED生产效率低、生产成本高、发光不均匀等缺陷。有鉴于此,本实用新型提供了一种新的技术方案以解决现存的技术问题。
实用新型内容
为了克服现有技术的不足,本实用新型提供一种R、G二合一的新型LED灯珠,解决了现有LED灯珠带来的LED显示屏生产成本高、生产效率低下、发光不均匀等技术缺陷。
本实用新型解决其技术问题所采用的技术方案是:
一种R、G二合一的新型LED灯珠,该种灯珠包括灯珠胶体和由所述灯珠胶体底部向外延伸的三根接线引脚,三根接线引脚包括公共引脚、R色芯片引脚和G色芯片引脚,所述公共引脚置于灯珠胶体内部空间的部分形成芯片支架,所述芯片支架顶部设有用于容置LED芯片的灯杯,所述灯杯中容置有R色芯片和G色芯片,所述R色芯片和G色芯片通过导电线分别电性连接到上述的R色芯片引脚和G色芯片引脚。
作为上述技术方案的改进,该种新型LED灯珠的灯珠胶体、接线引脚、LED芯片和导电线通过一体成型组构成一个完整的LED灯珠。
作为上述技术方案的进一步改进,所述的导电线为铜线。
本实用新型的有益效果是:本实用新型提供了一种R、G二合一的新型LED灯珠,该种该种新型LED灯珠将R色芯片和G色芯片同时封装在一个灯珠胶体内形成一种R、G二合一的灯珠,可同时实现以前两个灯珠的功能,减少了LED显示屏插入灯珠的数量,提高了LED显示屏的生产效率,降低了生产成本,提高了LED显示屏的发光均匀程度,该种R、G二合一的新型LED灯珠,解决了现有LED灯珠带来的LED显示屏生产成本高、生产效率低下、发光不均匀等技术缺陷。
附图说明
下面结合附图和实施例对本实用新型进一步说明。
图1是本实用新型的主视图;
图2是本实用新型的俯视图。
具体实施方式
以下将结合实施例和附图对本实用新型的构思、具体结构及产生的技术效果进行清楚、完整地描述,以充分地理解本实用新型的目的、特征和效果。显然,所描述的实施例只是本实用新型的一部分实施例,而不是全部实施例,基于本实用新型的实施例,本领域的技术人员在不付出创造性劳动的前提下所获得的其他实施例,均属于本实用新型保护的范围。另外,专利中涉及到的所有联接/连接关系,并非单指构件直接相接,而是指可根据具体实施情况,通过添加或减少联接辅件,来组成更优的联接结构。本实用新型创造中的各个技术特征,在不互相矛盾冲突的前提下可以交互组合。参照图1、图2。
一种R、G二合一的新型LED灯珠,该种灯珠包括灯珠胶体1和由所述灯珠胶体1底部向外延伸的三根接线引脚2,三根接线引脚2包括公共引脚21、R色芯片引脚22和G色芯片引脚(23),所述公共引脚21置于灯珠胶体1内部空间的部分形成芯片支架211,所述芯片支架211顶部设有用于容置LED芯片3的灯杯212,所述灯杯212中容置有R色芯片和G色芯片,所述R色芯片和G色芯片通过导电线4分别电性连接到上述的R色芯片引脚22和G色芯片引脚23,该种新型LED灯珠的灯珠胶体1、接线引脚2、LED芯片3和导电线4通过一体成型组构成一个完整的LED灯珠,这个过程包括固晶、焊线、点胶等若干加工工序。
该种R、G二合一的新型LED灯珠由于在同一灯珠内集成封装了R色芯片和G色芯片,因此,同一灯珠可完成以往两个灯珠的功能,在生产LED显示屏是可有效减少灯珠的数量,从而减少了灯珠的使用数量,降低了生产难度和生产成本,提高组装LED显示屏的效率;同时,该种灯珠由于集成封装,比起以往单独发出一种光的灯珠具有发光更均匀、光线一致、发光效率高的优点;另外,采用本实用新型提供的该种R、G二合一的新型LED灯珠后,同一LED显示屏单位面积集成的灯珠数量将减少,灯珠的失效率将大为降低(单位面积集成的灯珠数量越多,失效率越高)。
在生产本实用提供的R、G二合一的新型LED灯珠时,上述的LED芯片3采用高可靠性芯片,进而使得本灯珠的抗静电能力得到显著提高。
在本实施例中,所述的导电线4为铜线。显然的,导电线4也可以是金线、银线或合金线等等。
以上是对本实用新型的较佳实施进行了具体说明,但本实用新型创造并不限于所述实施例,熟悉本领域的技术人员在不违背本实用新型精神的前提下还可做出种种的等同变形或替换,这些等同的变形或替换均包含在本申请权利要求所限定的范围内。

Claims (3)

1.一种R、G二合一的新型LED灯珠,其特征在于:该种灯珠包括灯珠胶体(1)和由所述灯珠胶体(1)底部向外延伸的三根接线引脚(2),三根接线引脚(2)包括公共引脚(21)、R色芯片引脚(22)和G色芯片引脚(23),所述公共引脚(21)置于灯珠胶体(1)内部空间的部分形成芯片支架(211),所述芯片支架(211)顶部设有用于容置LED芯片(3)的灯杯(212),所述灯杯(212)中容置有R色芯片和G色芯片,所述R色芯片和G色芯片通过导电线(4)分别电性连接到上述的R色芯片引脚(22)和G色芯片引脚(23)。
2.根据权利要求1所述的一种R、G二合一的新型LED灯珠,其特征在于:该种新型LED灯珠的灯珠胶体(1)、接线引脚(2)、LED芯片(3)和导电线(4)通过一体成型组构成一个完整的LED灯珠。
3.根据权利要求1或2所述的一种R、G二合一的新型LED灯珠,其特征在于:所述的导电线(4)为铜线。
CN201420663205.3U 2014-11-07 2014-11-07 一种r、g二合一的新型led灯珠 Expired - Fee Related CN204303806U (zh)

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Address after: 518000 Guangdong province Shenzhen City Pingshan Pingshan street Gauss Industrial Zone Third, 1, 2, thirteenth building 4 floor

Patentee after: Shenzhen Aurora Polytron Technologies Inc

Address before: 518000 Guangdong province Shenzhen City Pingshan New District Pingshan six and second community Gaosite Industrial Zone 301, building third building 1-2

Patentee before: Shenzhen Jinhuaguang Technology Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150429

Termination date: 20201107