CN204303792U - Multi-chamber stacking-type Wafer processing apparatus - Google Patents
Multi-chamber stacking-type Wafer processing apparatus Download PDFInfo
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- CN204303792U CN204303792U CN201520019032.6U CN201520019032U CN204303792U CN 204303792 U CN204303792 U CN 204303792U CN 201520019032 U CN201520019032 U CN 201520019032U CN 204303792 U CN204303792 U CN 204303792U
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Abstract
The utility model discloses a kind of multi-chamber stacking-type Wafer processing apparatus, this Wafer processing apparatus comprises wafer cache module, processing chamber module, passes sheet module and technique liquid module, by multiple processing chambers that multi-layer annular is arranged, add the processing chamber quantity of unit are, the wafer throughput of unit are equipment can be improved, the manipulator design improved can cater to the demand of multi-layer annular arrangement processing chamber, and the setting of last arm and lower arms can prevent cross pollution, more improve the efficiency picking and placeing wafer.
Description
Technical field
The utility model relates to semiconductor integrated circuit manufacturing equipment technical field, particularly a kind of Wafer processing apparatus of multi-chamber stacking-type.
Background technology
The processing procedure of semiconductor crystal wafer generally comprises and passes sheet and technique two operations, pass sheet operation for realizing the transmission of wafer between wafer buffer area, region such as Wafer processing apparatus such as breach adjustment district and processing chamber etc., technique process, then for realizing wafer process in processing chamber, completes the manufacture of semiconductor crystal wafer.
Fig. 1 shows the vertical view of semiconductor crystal wafer treatment facility of the prior art, and it comprises the technique liquid region at wafer load port, the buffer zone at manipulator 1 and wafer buffer unit (or breach adjustment unit, read wafer ID unit) place, the processing chamber region at processing chamber place, the biography panel region at manipulator 2 place and technique liquid unit place.Wherein, processing chamber region comprises 8 processing chambers, for individual layer arrangement, the manipulator 2 passed in panel region travels to and fro between 8 between processing chamber and buffer zone by cross slide way, and technique liquid region is used for liquid required during processing chamber conveying making processing wafer.Visible, the single layer structure volume of existing Wafer processing apparatus is less, the limits throughput of unit are equipment wafer.
Chinese patent application CN 102820243A discloses a kind of semiconductor wafer fabrication device, and it comprises multiple modular process chamber combination, and each described modular process chamber combination realizes a kind of wafer process; For transmitting the modularization biography chip module of wafer to described modular process chamber combination; Described modularization passes chip module and is connected for dismantled and assembled with between described modular process chamber combination.Although this application can facilitate the I& M of equipment to a certain extent, shorten the time of I& M, but still the limited problem of unit are equipment wafer throughput cannot be solved, affect the treatment effeciency of wafer.
Utility model content
The utility model in order to solve the problems of the technologies described above, and provides a kind of multi-chamber stacking-type Wafer processing apparatus, can improve wafer throughput and the wafer-process efficiency of unit are equipment.
The utility model provides a kind of multi-chamber stacking-type Wafer processing apparatus, and it comprises:
Wafer cache module, for the wafer before placing technique, after technique;
Processing chamber module, for carrying out PROCESS FOR TREATMENT to wafer;
Passing sheet module, there is manipulator, for transmitting wafer between described wafer cache module and processing chamber module;
Technique liquid module, for wafer is provided to described processing chamber module PROCESS FOR TREATMENT needed for liquid;
Wherein, described processing chamber module has at least two layer stacks and multiple processing chambers of every layer of annular arrangement, described biography sheet module is positioned in the middle of multiple processing chambers of annular arrangement, its manipulator is rotatably located on a longitudinal rail, to make manipulator can carry out picking and placeing of wafer to the processing chamber of every layer, the rotating range of described manipulator covers the wafer gateway of each processing chamber of every layer.
Further, in described processing chamber module, every layer comprises four processing chambers, and the wafer gateway of each processing chamber is all established towards the biography sheet module of centre.
Further, the rotation that the wafer gateway of described wafer cache module is positioned at described biography sheet module manipulator picks and places wafer scope.
Further, described manipulator has telescopic last arm and lower arms.
Further, the wafer gateway of described each processing chamber is equipped with movable door, with isolated with biography sheet module region.
Further, described each processing chamber is equipped with independently wind circulating filtration unit, and described biography sheet module is also provided with independently wind circulating filtration unit.
Further, described each processing chamber is also provided with air pressure control unit, is less than to make the air pressure inside of processing chamber the air pressure passing sheet module region.
Further, the wafer gateway of described wafer cache module is also provided with movable door, and with isolated with biography sheet module region, described wafer cache module is also provided with independently wind circulating filtration unit.
Further, described technique liquid module has multiple dismountable technique liquid cavity.
The multi-chamber stacking-type Wafer processing apparatus that the utility model provides, by multiple processing chambers that multi-layer annular is arranged, add the processing chamber quantity of unit are, the wafer throughput of unit are equipment can be improved, the manipulator design improved can cater to the demand of multi-layer annular arrangement processing chamber, and the setting of last arm and lower arms can prevent cross pollution, more improves the efficiency picking and placeing wafer, visible, the utility model can improve output and the treatment effeciency of wafer.In addition, movable door and arranging of wind circulating filtration unit can make each processing chamber, biography sheet module and wafer cache module separate, pass the parts such as the manipulator of panel region to prevent the liquid medicine contamination of processing chamber inside; In technique liquid module, multiple detachable technique liquid cavity arranges the diversified demand that can meet apparatus and process kind, only need to change or increase and decrease technique liquid cavity, and without the need to other modules of more exchange device, improve the technological flexibility of Wafer processing apparatus, interchangeability and variation.
Accompanying drawing explanation
For the purpose of this utility model, feature and advantage clearlyer can be understood, below with reference to accompanying drawing, preferred embodiment of the present utility model is described in detail, wherein:
Fig. 1 is the vertical view of semiconductor crystal wafer treatment facility of the prior art;
Fig. 2 is the vertical view of the Wafer processing apparatus of the utility model one embodiment;
Fig. 3 is the end view of processing chamber module and biography sheet module in the utility model one embodiment;
Fig. 4 is the vertical view of manipulator in the utility model one embodiment;
Fig. 5 is the end view of manipulator in the utility model one embodiment;
Fig. 6 is the Wafer processing apparatus end view in the utility model one embodiment with wind circulating filtration unit;
Fig. 7 is the Wafer processing apparatus vertical view in the utility model one embodiment with wind circulating filtration unit;
Fig. 8 is the Wafer processing apparatus stereogram in the utility model one embodiment with multiple technique liquid cavity.
Embodiment
Refer to Fig. 2 and Fig. 3, a kind of multi-chamber stacking-type Wafer processing apparatus of the present embodiment, it comprises:
Wafer cache module 1, for the wafer before placing technique, after technique;
Processing chamber module 2, for carrying out PROCESS FOR TREATMENT to wafer;
Passing sheet module 3, there is manipulator 31, for transmitting wafer between wafer cache module 1 and processing chamber module 2;
Technique liquid module 4, for wafer is provided to processing chamber module 2 PROCESS FOR TREATMENT needed for liquid;
Wherein, processing chamber module 2 has at least two layer stacks and multiple processing chambers 21 of every layer of annular arrangement, passing sheet module 3 is positioned in the middle of multiple processing chambers 21 of annular arrangement, its manipulator 31 is rotatably located on a longitudinal rail 32, to make manipulator 31 can carry out picking and placeing of wafer to the processing chamber 21 of every layer, the rotating range of manipulator 31 covers the wafer gateway of each processing chamber 21 of every layer.
In the present embodiment, the wafer buffer unit of wafer before wafer cache module 1 can comprise temporary technique, after technique, can also comprise notched wafer adjustment unit or read wafer ID unit.The side of wafer cache module 1 can also comprise wafer load port 9, and buffer memory manipulator 8 is for the transmission of wafer between wafer cache module 1 and wafer load port 9.
In the present embodiment, processing chamber module 2 has the processing chamber 21 of three layer stacks, every layer of four annular arrangement, the wafer gateway of each processing chamber is all established towards the biography sheet module of centre, so that the manipulator passing sheet module picks and places wafer in and out of processing chamber.In other embodiments, the number of plies of processing chamber and every layer of number can adjust according to actual needs, the present embodiment utilizes the processing chamber of three layer stacks, every layer of four annular arrangement, add the processing chamber quantity of unit are, namely be three times in the Wafer processing apparatus of same area, the wafer throughput of unit are equipment can be improved.
In the present embodiment, manipulator for the ease of passing sheet module picks and places wafer in and out of processing chamber, the wafer gateway of processing chamber is or/and the rotation that the wafer gateway of wafer cache module is positioned at manipulator picks and places wafer scope, to make manipulator only rely on longitudinal rail and the telescopic structure of self, the transmission of wafer can be completed and pick and place.If wafer cache module distance manipulator rotating range is comparatively far away, or be laid with distance manipulator rotating range processing chamber far away, then need to set up cross slide way, with make manipulator can to these wafer cache modules or processing chamber carry out wafer transmission, pick and place.
In the present embodiment, manipulator 31 has telescopic last arm 311 and lower arms 312, and as shown in Figure 4 and Figure 5, last arm is for picking and placeing the wafer after technique, and lower arms, for picking and placeing the wafer before technique, avoids cross pollution.
Utilize the above-mentioned manipulator with last arm and lower arms, the embodiment of the wafer processing method of above-mentioned Wafer processing apparatus comprises the following steps:
Step S01, wafer before the lower arms 312 passing sheet module manipulator 31 captures technique from wafer cache module 1;
Step S02, manipulator 31 moves to target process chamber layer by longitudinal rail 32, and manipulator 31 rotates to head for target processing chamber subsequently;
Step S03, the last arm 311 of manipulator 31 stretches out and enters target process chamber, wafer after crawl technique;
Step S04, after manipulator 31 rises to make technique by longitudinal rail 32, wafer leaves process area, and while last arm 311 is regained subsequently, lower arms 312 carries wafer target approach processing chamber before technique;
Step S05, before manipulator 31 declines to make technique by longitudinal rail 32, wafer is placed in process area, and lower arms 312 is regained subsequently;
Step S06, manipulator 31 is moved to by longitudinal rail 32 and rotates extremely towards wafer cache module 1, and wafer after technique is put into wafer cache module 1 by last arm 311.
By above-mentioned wafer processing method, before after last arm takes technique, while wafer withdrawal, lower arms takes technique, wafer stretches out and enters processing chamber, shorten the time that manipulator picks and places wafer, improve the efficiency picking and placeing wafer, and improve efficiency and the output of Wafer processing apparatus.In practical application, the effect of last arm and lower arms can be exchanged, and namely last arm is for picking and placeing the wafer before technique, and lower arms is for picking and placeing the wafer after technique.
Please continue to refer to Fig. 6 and Fig. 7, in order to realize processing chamber internal environment with pass sheet module region separate, isolate, avoid processing chamber inner liquid medicine to enter and pass sheet module region, in one embodiment, the wafer gateway of each processing chamber is equipped with movable door 51, when manipulator picks and places wafer, movable door is opened, other times are then closed, thus make processing chamber inner when carrying out wafer process process, are in relative closure independently region.Preferably, in each processing chamber, be equipped with independently wind circulating filtration unit 52, and independently wind circulating filtration unit 53 is also set in biography sheet module, to realize respective wind circulation, prevent mutual interference.More preferably, air pressure control unit is also provided with in each processing chamber, it can match with wind circulating filtration unit or one, the air pressure passing sheet module region is less than to make processing chamber air pressure inside, ensure when movable door is opened, enter after the liquid of processing chamber inside can not be atomized and pass sheet module region, and the parts such as etching mechanism hand.In another embodiment, the wafer gateway of wafer cache module also can arrange movable door, with isolated with biography sheet module region, meanwhile, also can arrange independently wind circulating filtration unit in wafer cache module.
Please then consult Fig. 8, in order to meet the diversified demand of apparatus and process kind, improve the technological flexibility of Wafer processing apparatus, interchangeability and variation, in one embodiment, technique liquid module in Wafer processing apparatus comprises multiple dismountable technique liquid cavity, Wafer processing apparatus in Fig. 8 has four technique liquid cavitys 41, is powered by regulator cubicle 42, provides different wafer-process technique liquids to processing chamber.When wafer-process technique needs to change, only need to change or increase and decrease technique liquid cavity, and without the need to changing other modules of Wafer processing apparatus.
Claims (9)
1. a multi-chamber stacking-type Wafer processing apparatus, is characterized in that, it comprises:
Wafer cache module, for the wafer before placing technique, after technique;
Processing chamber module, for carrying out PROCESS FOR TREATMENT to wafer;
Passing sheet module, there is manipulator, for transmitting wafer between described wafer cache module and processing chamber module;
Technique liquid module, for wafer is provided to described processing chamber module PROCESS FOR TREATMENT needed for liquid;
Wherein, described processing chamber module has at least two layer stacks and multiple processing chambers of every layer of annular arrangement, described biography sheet module is positioned in the middle of multiple processing chambers of annular arrangement, its manipulator is rotatably located on a longitudinal rail, to make manipulator can carry out picking and placeing of wafer to the processing chamber of every layer, the rotating range of described manipulator covers the wafer gateway of each processing chamber of every layer.
2. multi-chamber stacking-type Wafer processing apparatus according to claim 1, is characterized in that: in described processing chamber module, every layer comprises four processing chambers, and the wafer gateway of each processing chamber is all established towards the biography sheet module of centre.
3. multi-chamber stacking-type Wafer processing apparatus according to claim 2, is characterized in that: the rotation that the wafer gateway of described wafer cache module is positioned at described biography sheet module manipulator picks and places wafer scope.
4. multi-chamber stacking-type Wafer processing apparatus according to claim 1, is characterized in that: described manipulator has telescopic last arm and lower arms.
5. the multi-chamber stacking-type Wafer processing apparatus according to any one of Claims 1-4, is characterized in that: the wafer gateway of described each processing chamber is equipped with movable door, with isolated with biography sheet module region.
6. multi-chamber stacking-type Wafer processing apparatus according to claim 5, is characterized in that: described each processing chamber is equipped with independently wind circulating filtration unit, described biography sheet module is also provided with independently wind circulating filtration unit.
7. multi-chamber stacking-type Wafer processing apparatus according to claim 6, is characterized in that: described each processing chamber is also provided with air pressure control unit, is less than to make the air pressure inside of processing chamber the air pressure passing sheet module region.
8. multi-chamber stacking-type Wafer processing apparatus according to claim 6, it is characterized in that: the wafer gateway of described wafer cache module is also provided with movable door, with isolated with biography sheet module region, described wafer cache module is also provided with independently wind circulating filtration unit.
9. the multi-chamber stacking-type Wafer processing apparatus according to any one of Claims 1-4, is characterized in that: described technique liquid module has multiple dismountable technique liquid cavity.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520019032.6U CN204303792U (en) | 2015-01-12 | 2015-01-12 | Multi-chamber stacking-type Wafer processing apparatus |
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| CN201520019032.6U CN204303792U (en) | 2015-01-12 | 2015-01-12 | Multi-chamber stacking-type Wafer processing apparatus |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104617025A (en) * | 2015-01-12 | 2015-05-13 | 北京七星华创电子股份有限公司 | Multi-cavity stack wafer processing apparatus and wafer processing method |
| CN106292194A (en) * | 2015-05-24 | 2017-01-04 | 上海微电子装备有限公司 | Silicon chip transmission system |
| CN106315210A (en) * | 2015-07-10 | 2017-01-11 | 上海微电子装备有限公司 | Wafer box storing and taking device and method |
| CN113140483A (en) * | 2021-03-03 | 2021-07-20 | 上海璞芯科技有限公司 | Wafer conveying method and wafer conveying platform |
-
2015
- 2015-01-12 CN CN201520019032.6U patent/CN204303792U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104617025A (en) * | 2015-01-12 | 2015-05-13 | 北京七星华创电子股份有限公司 | Multi-cavity stack wafer processing apparatus and wafer processing method |
| CN106292194A (en) * | 2015-05-24 | 2017-01-04 | 上海微电子装备有限公司 | Silicon chip transmission system |
| CN106292194B (en) * | 2015-05-24 | 2018-03-30 | 上海微电子装备（集团）股份有限公司 | Silicon chip transmission system |
| US10254661B2 (en) | 2015-05-24 | 2019-04-09 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Silicon wafer transportation system |
| CN106315210A (en) * | 2015-07-10 | 2017-01-11 | 上海微电子装备有限公司 | Wafer box storing and taking device and method |
| CN106315210B (en) * | 2015-07-10 | 2019-07-23 | 上海微电子装备（集团）股份有限公司 | A kind of film magazine access arrangement and method |
| CN113140483A (en) * | 2021-03-03 | 2021-07-20 | 上海璞芯科技有限公司 | Wafer conveying method and wafer conveying platform |
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