CN204289446U - There is the LED drive IC encapsulating structure of lighting function - Google Patents
There is the LED drive IC encapsulating structure of lighting function Download PDFInfo
- Publication number
- CN204289446U CN204289446U CN201420795901.XU CN201420795901U CN204289446U CN 204289446 U CN204289446 U CN 204289446U CN 201420795901 U CN201420795901 U CN 201420795901U CN 204289446 U CN204289446 U CN 204289446U
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- led
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- insulation
- driver output
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- 238000009413 insulation Methods 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims description 6
- 238000007493 shaping process Methods 0.000 claims description 5
- 230000003321 amplification Effects 0.000 claims description 4
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 4
- 238000004020 luminiscence type Methods 0.000 abstract description 8
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 7
- 230000009977 dual effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Abstract
The utility model discloses a kind of LED drive IC encapsulating structure with lighting function, the some pins comprising insulation-encapsulated body, be arranged at the IC chip in insulation-encapsulated body and stretch out from insulation package interior; The corresponding contact of IC chip is connected with pin; Insulation-encapsulated surface is arranged with accommodating cavity, and each pin is exposed to accommodating cavity bottom surface; Be provided with red LED chips, blue LED die and green LED chip in accommodating cavity, these three kinds of LED chips are connected to separately between corresponding LED driver output pin contact corresponding to IC chip; By this, be packaged in former IC insulation-encapsulated body by LED chip is integrated dexterously, make LED drive IC packaged chip be equivalent to a LED luminescence unit simultaneously, eliminate the encapsulation of an independent LED luminescence unit, simplify manufacture craft and number of spare parts, be conducive to the yields improving product; Meanwhile, when it is applied to the various luminous product such as lamp bar, word string, LED pixel screen, is convenient to arrangement, saves space, more unanimously attractive in appearance.
Description
Technical field
The utility model relates to LED drive IC art, refers in particular to a kind of LED drive IC encapsulating structure with lighting function.
Background technology
LED unit changes its brightness of current value adjustment by LED drive IC usually, and this LED drive IC and LED unit split are independently arranged separately; As shown in Figure 4, which show a lamp bar 100 ' structure of the prior art, the LED drive IC 10 ' be arranged on lamp bar 100 ' can take the arrangement space of lamp bar 100 ', cause the arrangement of each LED unit 20 ' and mode can be subject to certain limitation, also affect the integral product aesthetic property of lamp bar 100 '.Therefore, need to work out a kind of new technical scheme and solve the problems referred to above.
Utility model content
In view of this, the utility model is for the disappearance of prior art existence, and its main purpose is to provide a kind of LED drive IC encapsulating structure with lighting function, that eliminates the encapsulation of an independent LED luminescence unit, simplify manufacture craft and number of spare parts, improve the yields of product; Meanwhile, when it is applied to various luminous product, is convenient to arrangement, saves space, more unanimously attractive in appearance.
For achieving the above object, the utility model adopts following technical scheme:
There is a LED drive IC encapsulating structure for lighting function, include insulation-encapsulated body, be arranged at IC chip in insulation-encapsulated body and stretch out in some pins of insulation-encapsulated external body from insulation package interior; Described pin includes red LED driver output pin, blue led driver output pin, green LED driver output pin, grounding pin, display data output pins, display data-out pin, power pins and vacant pin for subsequent use; The corresponding contact of this IC chip is connected with aforementioned pin; This insulation-encapsulated surface is arranged with accommodating cavity, and aforementioned each pin is exposed to accommodating cavity bottom surface; Be provided with red LED chips, blue LED die and green LED chip in this accommodating cavity, these three kinds of LED chips are connected to separately between corresponding LED driver output pin contact corresponding to IC chip.
As a kind of preferred version, described IC chip is arranged on vacant pin for subsequent use, and described red LED chips, blue LED die and green LED chip respectively correspondence are arranged on red LED driver output pin, blue led driver output pin, green LED driver output pin.
As a kind of preferred version, the corresponding contact of described IC chip respectively by metal wire with aforementioned grounding pin, show data output pins, show data-out pin and power pins is connected; Described red LED chips, blue LED die and green LED chip also respectively by metal wire corresponding be connected to aforementioned red LED driver output pin, blue led driver output pin, between green LED driver output pin and the corresponding contact of IC chip.
As a kind of preferred version, described IC chip includes data latches, signal shaping amplification driving circuit, vibrator and able to programmely determines electric current output driver.
As a kind of preferred version, described IC chip also includes delay turn-on circuit.
As a kind of preferred version, described pin stretches out from insulation-encapsulated body both sides and turns down and is covered on bottom insulation-encapsulated body.
The utility model compared with prior art has obvious advantage and beneficial effect, specifically, as shown from the above technical solution, it is mainly packaged in former IC insulation-encapsulated body by being integrated dexterously by LED chip, make LED drive IC packaged chip be equivalent to a LED luminescence unit simultaneously, eliminate the encapsulation of an independent LED luminescence unit, simplify manufacture craft and number of spare parts, be conducive to the yields improving product; Meanwhile, when it is applied to the various luminous product such as lamp bar, word string, LED pixel screen, LED dual surface LED meteor pipe, is convenient to arrangement, saves space, more unanimously attractive in appearance.
For more clearly setting forth architectural feature of the present utility model and effect, below in conjunction with accompanying drawing and specific embodiment, the utility model is described in detail.
Accompanying drawing explanation
Fig. 1 is the package assembly schematic diagram of the embodiment of the utility model;
Fig. 2 is the perspective view of the embodiment of the utility model;
Fig. 3 is the application schematic diagram of LED chip, IC chip on lamp bar in prior art;
Fig. 4 is the application schematic diagram of LED chip, IC packaged chip on lamp bar in the embodiment of the utility model;
Fig. 5 is the application circuit schematic diagram one of the LED drive IC packaged chip of the embodiment of the utility model;
Fig. 6 is the application circuit schematic diagram two of the LED drive IC packaged chip of the embodiment of the utility model;
Fig. 7 is the application circuit schematic diagram three of the LED drive IC packaged chip of the embodiment of the utility model.
Accompanying drawing identifier declaration:
100 ', lamp bar 10 ', LED drive IC
20 ', LED unit 100, lamp bar
10, LED drive IC packaged chip 11, insulation-encapsulated body
111, accommodating cavity 12, IC chip
13, pin 131, red LED driver output pin
132, blue led driver output pin 133, green LED driver output pin
134, grounding pin 135, display data output pins
136, data-out pin 137, power pins is shown
138, vacant pin for subsequent use 14, red LED chips
15, blue LED die 16, green LED chip
20, LED unit 30, controller.
Embodiment
Please refer to shown in Fig. 1 to Fig. 7, that show the concrete structure of the embodiment of the utility model, application and the contrast with prior art.
As shown in Figure 1, this has the LED drive IC encapsulating structure 10 of lighting function, includes insulation-encapsulated body 11, is arranged at IC chip 12 in insulation-encapsulated body 11 and stretches out in some pins 13 of insulation-encapsulated body 11 outside from insulation packaging body 11 inside; Described pin 13 includes red LED driver output pin 131, blue led driver output pin 132, green LED driver output pin 133, grounding pin 134, display data output pins 135, display data-out pin 136, power pins 137 and vacant pin for subsequent use 138; The corresponding contact of this IC chip 12 is connected with aforementioned pin 13; This insulation-encapsulated body 11 surface is arranged with accommodating cavity 111, and aforementioned each pin 13 is exposed to accommodating cavity 111 bottom surface; Be provided with red LED chips 14, blue LED die 15 and green LED chip 16 in this accommodating cavity 111, these three kinds of LED chips are connected to separately between corresponding LED driver output pin contact corresponding to IC chip 12.
In the present embodiment, described IC chip 12 is arranged on vacant pin for subsequent use 138, and described red LED chips 14, blue LED die 15 and green LED chip 16 respectively correspondence are arranged on red LED driver output pin 131, blue led driver output pin 132, green LED driver output pin 133; The corresponding contact of described IC chip 12 respectively by metal wire with aforementioned grounding pin 134, show data output pins 135, show data-out pin 136 and power pins 137 is connected; Described red LED chips 14, blue LED die 15 and green LED chip 16 also respectively by metal wire corresponding be connected to aforementioned red LED driver output pin 131, blue led driver output pin 132, between green LED driver output pin 133 and the corresponding contact of IC chip 12.
As shown in Figure 2, which show the perspective view of the embodiment of the utility model, this pin 13 stretches out from insulation-encapsulated body 11 both sides and turns down and is covered on bottom insulation-encapsulated body 11.
In the present embodiment, this IC chip 12 indoor design is triple channel LED drived control special circuit, it includes, and intelligent digital interface data latch, signal shaping amplification driving circuit, high-precision internal oscillator and 15V high pressure are able to programme determines electric current output driver, simultaneously, in order to reduce power supply ripple, be provided with delay turn-on circuit, 3 passages have certain Delayed conducting function, like this when frame refreshing, circuit ripple can be reduced.
As shown in Figure 4, its LED drive IC encapsulating structure 10 with lighting function being the utility model is applied to the structural representation of lamp bar 100, comparison diagram 4 and Fig. 5 can obviously find out, the global consistency of the LED unit 20 on the lamp bar 100 of the utility model shown in Fig. 5, LED drive IC packaged chip 10 is good, more attractive in appearance, its LED drive IC encapsulating structure 10 with lighting function is equivalent to a LED luminescence unit, is equivalent to save the space (shown in Fig. 4) that former LED drive IC takies; The LED drive IC encapsulating structure 10 with lighting function of the utility model can be widely used in LED full-color light-emitting word lamp string, the full-color module of ED, the hard lamp bar of the full-color soft lamp bar of LED, LED guardrail tube, LED point light source, LED pixel is shielded, LED abnormity screen, electric equipment horse race lamp, LED dual surface LED meteor pipe (meteor shower) and various electronic products etc., its applying flexible, be convenient to arrange.
As shown in Figure 5, this LED drive IC encapsulating structure 10 with lighting function may be used for external driving LED unit 20, also can the more than one multiple LED unit 20 (as shown in Figure 6 and Figure 7) of external driving;
In the present embodiment, the LED drive IC encapsulating structure 10 with lighting function adopts the communication modes of single line NRZ, after electrification reset, its display data-out pin (i.e. DIN end) accepts the data transmitted from LED controller 30, first after the 24bit data brought are extracted by first LED drive IC packaged chip, deliver to the data latches of IC chip internal, remaining data start to forward by DO port the LED drive IC packaged chip exporting to next cascade after internal signal shaping amplification driving circuit amplifies, often through the transmission of a LED drive IC packaged chip, signal reduces 24bit, LED drive IC packaged chip herein adopts automatic shaping retransmission technique, make the cascade number of its LED drive IC packaged chip not by the restriction that signal transmits, only constrained signal transmission speed requirement, therefore, some LED drive IC packaged chips and corresponding LED unit can be arranged on demand, Full-color color-changing etc. is controlled by same LED controller.
Design focal point of the present utility model is, it is mainly packaged in former IC insulation-encapsulated body by being integrated dexterously by LED chip, make LED drive IC packaged chip be equivalent to a LED luminescence unit simultaneously, eliminate the encapsulation of an independent LED luminescence unit, simplify manufacture craft and number of spare parts, be conducive to the yields improving product; Meanwhile, when it is applied to the various luminous product such as lamp bar, word string, LED pixel screen, LED dual surface LED meteor pipe, is convenient to arrangement, saves space, more unanimously attractive in appearance.
The above, it is only preferred embodiment of the present utility model, not technical scope of the present utility model is imposed any restrictions, therefore every above embodiment is done according to technical spirit of the present utility model any trickle amendment, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (6)
1. there is a LED drive IC encapsulating structure for lighting function, it is characterized in that: include insulation-encapsulated body, be arranged at IC chip in insulation-encapsulated body and stretch out in some pins of insulation-encapsulated external body from insulation package interior; Described pin includes red LED driver output pin, blue led driver output pin, green LED driver output pin, grounding pin, display data output pins, display data-out pin, power pins and vacant pin for subsequent use; The corresponding contact of this IC chip is connected with aforementioned pin; This insulation-encapsulated surface is arranged with accommodating cavity, and aforementioned each pin is exposed to accommodating cavity bottom surface; Be provided with red LED chips, blue LED die and green LED chip in this accommodating cavity, these three kinds of LED chips are connected to separately between corresponding LED driver output pin contact corresponding to IC chip.
2. the LED drive IC encapsulating structure with lighting function according to claim 1, it is characterized in that: described IC chip is arranged on vacant pin for subsequent use, described red LED chips, blue LED die and green LED chip respectively correspondence are arranged on red LED driver output pin, blue led driver output pin, green LED driver output pin.
3. the LED drive IC encapsulating structure with lighting function according to claim 1 and 2, is characterized in that: the corresponding contact of described IC chip respectively by metal wire with aforementioned grounding pin, show data output pins, show data-out pin and power pins is connected; Described red LED chips, blue LED die and green LED chip also respectively by metal wire corresponding be connected to aforementioned red LED driver output pin, blue led driver output pin, between green LED driver output pin and the corresponding contact of IC chip.
4. the LED drive IC encapsulating structure with lighting function according to claim 1, is characterized in that: described IC chip includes data latches, signal shaping amplification driving circuit, vibrator and able to programmely determines electric current output driver.
5. the LED drive IC encapsulating structure with lighting function according to claim 4, is characterized in that: described IC chip also includes delay turn-on circuit.
6. the LED drive IC encapsulating structure with lighting function according to claim 1, is characterized in that: described pin stretches out from insulation-encapsulated body both sides and turns down and is covered on bottom insulation-encapsulated body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420795901.XU CN204289446U (en) | 2014-12-17 | 2014-12-17 | There is the LED drive IC encapsulating structure of lighting function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420795901.XU CN204289446U (en) | 2014-12-17 | 2014-12-17 | There is the LED drive IC encapsulating structure of lighting function |
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| Publication Number | Publication Date |
|---|---|
| CN204289446U true CN204289446U (en) | 2015-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420795901.XU Active CN204289446U (en) | 2014-12-17 | 2014-12-17 | There is the LED drive IC encapsulating structure of lighting function |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104637932A (en) * | 2014-12-17 | 2015-05-20 | 东莞市欧思科光电科技有限公司 | LED driver IC (integrated circuit) package structure with light-emitting function |
| CN107342020A (en) * | 2017-06-07 | 2017-11-10 | 莱特泰克（昆山）光电科技有限公司 | Reduce the LED photovoltaic glass and its operation method and production method of circuit number |
| CN108321151A (en) * | 2018-01-24 | 2018-07-24 | 矽力杰半导体技术(杭州)有限公司 | Chip encapsulation assembly and its manufacturing method |
-
2014
- 2014-12-17 CN CN201420795901.XU patent/CN204289446U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104637932A (en) * | 2014-12-17 | 2015-05-20 | 东莞市欧思科光电科技有限公司 | LED driver IC (integrated circuit) package structure with light-emitting function |
| CN107342020A (en) * | 2017-06-07 | 2017-11-10 | 莱特泰克（昆山）光电科技有限公司 | Reduce the LED photovoltaic glass and its operation method and production method of circuit number |
| CN108321151A (en) * | 2018-01-24 | 2018-07-24 | 矽力杰半导体技术(杭州)有限公司 | Chip encapsulation assembly and its manufacturing method |
| US10950528B2 (en) | 2018-01-24 | 2021-03-16 | Silergy Semiconductor Technology (Hangzhou) Ltd | Chip package assembly and method for manufacturing the same |
| US11605578B2 (en) | 2018-01-24 | 2023-03-14 | Silergy Semiconductor Technology (Hangzhou) Ltd | Chip package assembly and method for manufacturing the same |
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| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: No. 3 Shangmei Road, Qishi Town, Dongguan City, Guangdong Province, 523000 Patentee after: DONGGUAN OPCSO OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 523000 Dongguan Ousike Optoelectronic Technology Co., Ltd., located next to Yucai Road East Expressway in Dongshan Village, Qishi Town, Dongguan City, Guangdong Province Patentee before: DONGGUAN OPCSO OPTOELECTRONICS TECHNOLOGY Co.,Ltd. |
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| CP02 | Change in the address of a patent holder |