CN204272587U - A kind of electromagnetic shielding film - Google Patents

A kind of electromagnetic shielding film Download PDF

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Publication number
CN204272587U
CN204272587U CN201420731917.4U CN201420731917U CN204272587U CN 204272587 U CN204272587 U CN 204272587U CN 201420731917 U CN201420731917 U CN 201420731917U CN 204272587 U CN204272587 U CN 204272587U
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China
Prior art keywords
layer
electromagnetic shielding
shielding film
soft
conductive adhesive
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Active
Application number
CN201420731917.4U
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Chinese (zh)
Inventor
迟大伟
刘彦峰
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BAODING LUCKY INNOVATIVE MATERIALS Co Ltd
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BAODING LUCKY INNOVATIVE MATERIALS Co Ltd
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Abstract

The utility model provides a kind of electromagnetic shielding film with superior chemical patience, described screened film forms insulating barrier by the first soft layer, hard layer and the second soft layer, second soft layer forms metal level, conductive adhesive layer successively, or directly form conductive adhesive layer on the second soft layer.The utility model is attached on flexible print circuit board, there is the flexibility of excellent screening effectiveness, adhesive property and excellence, especially the insulation layer structure of this screened film can realize the superior resistance of screened film to " changing golden liquid medicine ", " OSP liquid medicine ", and has soft sense of touch.

Description

A kind of electromagnetic shielding film
Technical field
The utility model relates to electromagnetic shielding film field, particularly a kind of flexible circuit board electromagnetic shielding film.
Background technology
Flexible circuit board has continued most design considerations of rigid printed board, and on this basis, has the advantage that many rigid printed circuit boards do not possess.It has, and distribution density is high, thickness is thin, lightweight, wiring space limits less, collapsible, flexibility ratio advantages of higher, and move arbitrarily at three dimensions and stretch, thus reach components and parts and assemble the integration be connected with wire, be widely used in narrow space, removable, folding all kinds of electronics and IT products, as PC component markets such as notebook computer, mobile phone, liquid crystal display, plasma display, digital camera, mobile storages.
Along with the raising of people's awareness of safety, precision instrument is anti-interference, keep the needs of precision, " electromagnetic pollution " more and more pay attention to by society, a lot of country has put into effect the electromagenetic wave radiation limitation standard of each electronic product in succession.Present stage, flexible circuit board electromagnetic shielding film effectively outwardly can distribute electromagnetic wave by screening electron interiors of products, effectively can absorb again the electromagnetic wave from the electronic product external world, thus makes electronic product can " not dry disturb " and " without interruption ".Add man-hour in flexible circuit board manufacturers produce, a pilot process is " changing golden liquid medicine " cleaning or " OSP liquid medicine " cleaning, and this makes electromagnetic shielding film have the corrosion of good chemical resistance liquid medicine becomes inevitable.
Publication number is that the Chinese utility model patent of CN101120627A discloses a kind of electromagnetic shielding film, and its structure is made up of two coatings, the insulating barrier in outside and the conductive adhesive layer of inner side.This structure does not have solid metal-layer structure, realizes screening effectiveness by conductive adhesive layer, can realize ultra-thin requirement, and resistance to bending performance is also better, does not have the hidden danger of insulating barrier and metal level layering in " changing golden liquid medicine " or " OSP liquid medicine " Soak Test.But because its coating compactness is not high, barriering effect is poor, " changing golden liquid medicine " or " OSP liquid medicine " easily infiltrates into conductive adhesive layer to coat inside, causes conductive adhesive layer and ground to adhere to hypodynamic phenomenon.
Notification number is that the Chinese utility model patent of CN101176388A discloses a kind of electromagnetic shielding film, its structure forms insulating barrier by outermost layer hard layer and time outer soft layer, soft layer is formed one deck solid metal layer, then in solid metal layer, forms one deck conductive adhesive layer.The electromagnetic shielding film screening effectiveness of this structure is higher, and insulating barrier is by two-layer group of layer, and especially the existence of rigid insulation layer can intercept " changing golden liquid medicine " or " OSP liquid medicine " erosion to coat inside preferably.But because its outermost layer is hard formation, modulus of elasticity is comparatively large, and hand sense of touch is not good, simultaneously because the compactness extent of hard layer is not high, poor to the iris action of " changing golden liquid medicine " or " OSP liquid medicine ".
Utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, provides a kind of electromagnetic shielding film, and this electromagnetic shielding film has superior chemical patience and soft sense of touch.
The technical scheme that the utility model is taked is:
A kind of electromagnetic shielding film; be made up of release carrier film, insulating barrier, metal level, conductive adhesive layer and diaphragm successively; described insulating barrier comprises the first soft layer, the second soft layer, and one deck hard layer formed between the first soft layer and the second soft layer.
Above-mentioned electromagnetic shielding film, sets up metal level between insulating barrier and conductive adhesive layer.
Above-mentioned electromagnetic shielding film, described hard layer thickness is 0.5-5 micron.
Above-mentioned electromagnetic shielding film, described first soft layer and the second soft layer thickness are respectively 1-10 micron.
Above-mentioned electromagnetic shielding film, described conductive adhesive layer thickness is 5-15 micron.
Above-mentioned electromagnetic shielding film, described metal layer thickness is 0.01-0.1 micron.
Beneficial effect
Compared with prior art, the utility model adopts the insulation layer structure accompanying one deck hard layer in the middle of two soft layers, hard layer is the high crosslink density coating through ultra-violet curing, coated inside can better be hindered " to be changed golden liquid medicine " or " OSP liquid medicine " erosion when coating layer thickness is less; The hard layer of high crosslinking degree is wrapped in inside by two soft layers, better can prevent the destruction of electromagnetic shielding film when flexure, bending to hard layer; Outermost first soft layer of insulating barrier also can be electromagnetic shielding film provides soft sense of touch.
Accompanying drawing explanation
Fig. 1 is the structural representation of an embodiment of electromagnetic shielding film;
Fig. 2 is the structural representation of another embodiment of electromagnetic shielding film.
In figure, each label is expressed as: 1. release carrier film, 2. the first soft layer, 3. hard layer, 4. the second soft layer, 5. metal level, 6. conductive adhesive layer, 7. diaphragm.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Embodiment 1
Structure of the present utility model is as shown in Figure 1: using the release polyester film of 50 micron thickness as release carrier film 1, release carrier film 1 is coated with formation 3 micron thickness first soft layer 2, first soft layer 2 is formed 2 micron thickness hard layers 3, hard layer 3 is formed 3 micron thickness second soft layers 4, second soft layer 4 is formed the metal level 5 of 0.05 micron thickness, metal level 5 forms the conductive adhesive layer 6 of 8 micron thickness, the sheets of conductive particle containing diameter 5 microns in conductive adhesive layer 6.The thickness that covering can be release on conductive adhesive layer 6 is the diaphragm 7 of 25 microns, obtains electromagnetic shielding film as shown in Figure 1.
Embodiment 2
As shown in Figure 2, using the release polyester film of 50 micron thickness as release carrier film 1, release carrier film 1 is coated with formation 3 micron thickness first soft layer 2, first soft layer 2 is formed 2 micron thickness hard layers 3, hard layer 3 is formed 3 micron thickness second soft layers 4, second soft layer 4 forms the conductive adhesive layer 6 of 20 micron thickness, the dendroid conducting particles containing diameter 10 microns in conductive adhesive layer 6.The thickness that covering can be release on conductive adhesive layer 6 is the diaphragm 7 of 25 microns, obtains electromagnetic shielding film as shown in Figure 2.
Each functional layer can be prepared as follows:
Hard layer 3 in the utility model is the ultraviolet curable coating that crosslink density is higher; this coating chemical solvent resistance can be good; but this film flexibility is not good; so the hard layer 3 of high crosslink density is arranged in the utility model between the first soft layer 2 and the second soft layer 4, the destruction that better protection hard layer 3 is suffered when electromagnetic shielding film flexure, bending.Meanwhile, electromagnetic shielding film is after peeling off release carrier film 1 through heat pressing process, the first soft layer 2 is exposed in outermost, can be electromagnetic shielding film and provides soft sense of touch.
(4) on the second soft layer 4, metal level 5 is formed, thickness is 0.01-0.1 micron, most preferably be 0.02-0.05 micron, material therefor can be silver, nickel, copper, chromium, gold or nichrome, corronil, most preferably be copper, nickel, silver and alloy thereof, chemical plating mode, evaporation plating, sputtering plating, plating or its combination process can be adopted to be formed, and metal level provides electromagnetic wave shielding performance.
(5) on metal level 5, form conductive adhesive layer 6, conductive adhesive layer 6 thickness is 5-15 μm.
(6) covering on conductive adhesive layer 6 can from the diaphragm 7 of shape, and described diaphragm 7 is selected with low cost and can be tolerated polyester film, polypropylene film, the polycarbonate film of uniform temperature.Thickness is 25-100 micron.
Another embodiment of the present utility model is electromagnetic shielding film, and as shown in Figure 2, its embodiment is:
The formation of release carrier film 1, first soft layer 2, hard layer 3, second soft layer 4, diaphragm 6 is identical with embodiment 1; The formation method of conductive adhesive layer 5 is:
On the second soft layer 4, coating forms conductive adhesive layer 5, and conductive adhesive layer thickness is 15-25 micron, and conductive adhesive layer provides shielding properties.

Claims (7)

1. an electromagnetic shielding film; be made up of release carrier film, insulating barrier, conductive adhesive layer and diaphragm successively; it is characterized in that, described insulating barrier comprises the first soft layer, the second soft layer, and one deck hard layer formed between the first soft layer and the second soft layer.
2. electromagnetic shielding film according to claim 1, is characterized in that, between insulating barrier and conductive adhesive layer, set up metal level.
3. electromagnetic shielding film according to claim 2, is characterized in that, described hard layer thickness is 0.5-5 micron.
4. electromagnetic shielding film according to claim 3, is characterized in that, described first soft layer and the second soft layer thickness are respectively 1-10 micron.
5. electromagnetic shielding film according to claim 4, is characterized in that, described conductive adhesive layer thickness is 5-15 micron.
6. electromagnetic shielding film according to claim 5, is characterized in that, described conductive adhesive layer thickness is 15-25 micron.
7. electromagnetic shielding film according to claim 6, is characterized in that, described metal layer thickness is 0.01-0.1 micron.
CN201420731917.4U 2014-11-30 2014-11-30 A kind of electromagnetic shielding film Active CN204272587U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420731917.4U CN204272587U (en) 2014-11-30 2014-11-30 A kind of electromagnetic shielding film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420731917.4U CN204272587U (en) 2014-11-30 2014-11-30 A kind of electromagnetic shielding film

Publications (1)

Publication Number Publication Date
CN204272587U true CN204272587U (en) 2015-04-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420731917.4U Active CN204272587U (en) 2014-11-30 2014-11-30 A kind of electromagnetic shielding film

Country Status (1)

Country Link
CN (1) CN204272587U (en)

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