CN204272568U - Be applicable to the heat radiation cooling device of multi-heat source - Google Patents
Be applicable to the heat radiation cooling device of multi-heat source Download PDFInfo
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- CN204272568U CN204272568U CN201420654752.5U CN201420654752U CN204272568U CN 204272568 U CN204272568 U CN 204272568U CN 201420654752 U CN201420654752 U CN 201420654752U CN 204272568 U CN204272568 U CN 204272568U
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- heat
- absorbing member
- heat absorbing
- source
- cooling device
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Abstract
The utility model relates to a kind of heat radiation cooling device being applicable to multi-heat source, comprises one first heat absorbing member, and has the water pump of liquid pumping chamber, a metal tube and one second heat absorbing member; First heat absorbing member is contacted with the first thermal source; Water pump is incorporated on the first heat absorbing member, and water pump has a water inlet and a delivery port, and water pump and a cooling device form the pumping circulation of cooling fluid; The first end of metal tube is connected to water inlet or the delivery port of water pump, and cooling fluid is left by the second end of metal tube by metal tube; Second heat absorbing member is contacted with Secondary Heat Source, and wherein metal tube is incorporated into the second heat absorbing member.The utility model, by the configuration of the second heat absorbing member, makes the water pump that originally only can be used for carrying out the first thermal source cooling, can solve the cooling of one or more Secondary Heat Source further, thus give full play to the cooling usefulness of water pump.
Description
Technical field
The utility model is relevant with the heat abstractor of electronic installation, relates to a kind of heat radiation cooling device being applicable to multi-heat source especially.
Background technology
Many high-power die are provided with in existing electronic installation.High-power die has excellent data processing usefulness, but also does and produce surprising heat thereupon.If these heats are not through suitable cooling, by making, the temperature of aforesaid high-power die is too high, and exceedes its safe operating temperature.
Many circuit boards, such as motherboard or display card, can be configured with the high-power die of more than two usually.For motherboard, central processing unit is main high-power die, but is adjacent to the system chipset of central processing unit or built-in display chip is also high-power die usually.Again for display card, display chip is main high-power die, but display card internal memory or even another display chip also can be the high-power die producing high heat.
No matter existing water pump is air cooling or Water-cooling water pump, there is excellent heat dissipation.High efficiency ventilation type water pump needs larger installation space, for aforesaid display card, if display chip is arranged high efficiency ventilation type water pump, then contiguous display card internal memory or another display chip are just difficult to arranging another high efficiency ventilation type water pump.Again for Water-cooling water pump, need all to arrange water-cooling head in other high-power die individual, and make whole water-cooling system bulky complex, and increase the risk of pipeline liquid leakage.
Summary of the invention
In view of this, the purpose of this utility model is to provide a kind of heat radiation cooling device being applicable to multi-heat source, by single high-effect water pump, solves the cooling problem of multiple thermal source simultaneously.
In order to reach above-mentioned object, the utility model provides a kind of heat radiation cooling device being applicable to multi-heat source, itself and a cooling device form the pumping circulation of a cooling fluid and cool one first thermal source and a Secondary Heat Source, this first thermal source and this Secondary Heat Source are separated by a distance, and this heat radiation cooling device being applicable to multi-heat source comprises:
One first heat absorbing member, it is contacted with this first thermal source;
One water pump with liquid pumping chamber, it is incorporated on this first heat absorbing member; Wherein, this water pump has a water inlet and a delivery port, this cooling fluid enters this liquid pumping chamber by this water inlet and carries out heat exchange with this first heat absorbing member, and this cooling fluid leaves this liquid pumping chamber by this delivery port, and forms the pumping circulation of this cooling fluid with this cooling device;
One metal tube, it has a first end and one second end, and this first end is connected to water inlet or the delivery port of this water pump, and this cooling fluid is left by this second end by this metal tube; And
One second heat absorbing member, it is contacted with this Secondary Heat Source, and wherein this metal tube is incorporated into this second heat absorbing member, and cooling fluid in this metal tube and this second heat absorbing member carry out heat exchange.
As above-mentioned a kind of preferred version being applicable to the heat radiation cooling device of multi-heat source, the wherein said heat radiation cooling device being applicable to multi-heat source more comprises a fixture, and this fixture suppresses this first heat absorbing member on this first thermal source.
As above-mentioned a kind of preferred version being applicable to the heat radiation cooling device of multi-heat source, wherein this fixture comprises:
One framework, it carries this first heat absorbing member, and this first heat absorbing member contacts this first thermal source through this framework; And
Multiple fixing feet, it extends the edge of this framework.
As above-mentioned a kind of preferred version being applicable to the heat radiation cooling device of multi-heat source, wherein this metal tube is directly connected in this water pump.
As above-mentioned a kind of preferred version being applicable to the heat radiation cooling device of multi-heat source, wherein this metal tube is connected to this water pump by a connecting water pipe.
As above-mentioned a kind of preferred version being applicable to the heat radiation cooling device of multi-heat source, wherein this second heat absorbing member is a metal derby.
As above-mentioned a kind of preferred version being applicable to the heat radiation cooling device of multi-heat source, wherein this metal tube fits in this second heat absorbing member surface.
In order to reach above-mentioned object, the utility model provides another kind to be applicable to the heat radiation cooling device of multi-heat source, itself and a cooling device form the pumping circulation of a cooling fluid and cool one first thermal source and a Secondary Heat Source, this first thermal source and this Secondary Heat Source are separated by a distance, and this heat radiation cooling device being applicable to multi-heat source comprises:
One first heat absorbing member, it is contacted with this first thermal source;
One water pump with liquid pumping chamber, it is incorporated on this first heat absorbing member; Wherein, this water pump has a water inlet and a delivery port, this cooling fluid enters this liquid pumping chamber by this water inlet and carries out heat exchange with this first heat absorbing member, and this cooling fluid leaves this liquid pumping chamber by this delivery port, and forms the pumping circulation of this cooling fluid with this cooling device;
One water pipe, its one end is connected to water inlet or the delivery port of this water pump; And
One second heat absorbing member, it is contacted with this Secondary Heat Source, wherein this second heat absorbing member inside has a cooling passage, this second heat absorbing member through, and the other end of this water pipe is connected to this cooling passage, and this cooling fluid circulates in this cooling passage, and this cooling fluid and this second heat absorbing member carry out heat exchange.
Be applicable to the preferred version of the heat radiation cooling device of multi-heat source as above-mentioned another kind, the wherein said heat radiation cooling device being applicable to multi-heat source more comprises a fixture, and this fixture suppresses this first heat absorbing member on this first thermal source.
Be applicable to the preferred version of the heat radiation cooling device of multi-heat source as above-mentioned another kind, wherein this fixture comprises:
One framework, it carries this first heat absorbing member, and this first heat absorbing member contacts this first thermal source through this framework; And
Multiple fixing feet, it extends the edge of this framework.
Be applicable to the preferred version of the heat radiation cooling device of multi-heat source as above-mentioned another kind, wherein this second heat absorbing member is a metal derby.
The utility model, by the configuration of the second heat absorbing member, makes the water pump that originally only can be used for carrying out the first thermal source cooling, can solve the cooling of one or more Secondary Heat Source further, thus give full play to the cooling usefulness of water pump.
Accompanying drawing explanation
Fig. 1 is the exploded view of the utility model first embodiment;
Fig. 2 is the stereogram of the utility model first embodiment;
Fig. 3 is the schematic diagram that the utility model first embodiment is installed on a circuit board;
Fig. 4 is in the utility model first embodiment, the exploded view of the first heat absorbing member, water pump and fixed mount;
Fig. 5 is the stereogram of the utility model second embodiment.
Critical piece title:
100-first heat absorbing member; 1000-is applicable to the heat radiation cooling device of multi-heat source;
200-has the water pump of liquid pumping chamber;
300-metal tube; 310-first end; 320-second end;
400-second heat absorbing member; 400a-second heat absorbing member;
500-fixture; 510-framework; 520-fixing feet;
600-water pipe;
800-cooling device;
900-circuit board; 910-first thermal source; 920-Secondary Heat Source.
Embodiment
In order to allow above-mentioned and other object, feature and advantage of the present utility model can be more obvious, hereafter will coordinate accompanying drawing, being described in detail below.
Referring to shown in Fig. 1, Fig. 2 and Fig. 3, is a kind of heat radiation cooling device 1000 being applicable to multi-heat source of the utility model first embodiment, for being installed on a circuit board 900.Circuit board 900 has one first thermal source 910 and Secondary Heat Source 920, first thermal source 910 and Secondary Heat Source 920 to be separated by a distance.Circuit board 900 can be a display card, and the first thermal source 910 can be respectively drawing chip and drafting card memory modules with Secondary Heat Source 920.But circuit board 900 is not limited with display card, also can be that to close functional circuitry plate 900, first thermal source 910 and Secondary Heat Source 920 be then high-power die on aforementioned motherboard or circuit board 900 for motherboard or appoint.Aforesaid first thermal source 910 is also not limited to Secondary Heat Source 920 and is arranged at same circuit board 900.
Water pump 200, one metal tube 300 and one second heat absorbing member 400 that one first heat absorbing member 100, has liquid pumping chamber is comprised as shown in Figure 1, Figure 2 with the heat radiation cooling device 1000 being applicable to multi-heat source shown in Fig. 3.
As shown in Figure 1, Figure 2 with shown in Fig. 3, the first heat absorbing member 100 in order to contact the first thermal source 910, in order to absorb the heat of the first thermal source 910.Usually, the first heat absorbing member 100 is a metal derby, makes with aluminium or the contour heat-conducting of copper; The form of the first heat absorbing member 100 is not limited to collar plate shape, also can be square plate body or other form.
As shown in Figure 1, Figure 2 with shown in Fig. 3, water pump 200 is incorporated on the first heat absorbing member 100, and water pump 200 has water inlet 210 and a delivery port 220.
As shown in Figure 2 and Figure 3, water inlet 210 enters liquid pumping chamber for a cooling fluid and carries out heat exchange with the first heat absorbing member 100, and then absorb the heat of the first thermal source 910 generation and take away absorbed heat, and delivery port 220 is in order to leave liquid pumping chamber for cooling fluid, and with and form cooling fluid pumping circulation with a cooling device 800, described cooling device 800 can be one heat radiation row.
As shown in Figure 4, the heat radiation cooling device 1000 being applicable to multi-heat source more comprises a fixture 500, is arranged on circuit board 900, suppresses the first heat absorbing member 100 on the first thermal source 910.
Fixture 500 comprises a framework 510 and multiple fixing feet 520.Framework 510 is in order to carry the first heat absorbing member 100, and the first heat absorbing member 100 contacts the first thermal source 910 through framework 510.Fixing feet 520 extends the edge of framework 510, and is fixed on circuit board 900, makes the first heat absorbing member 100 positively contact the first thermal source 910.
As shown in Figure 1, Figure 2 with shown in Fig. 3, metal tube 300 has first end 310 and one second end 320, and first end 310 is connected to the delivery port 220 of water pump 200, and cooling fluid is left by the second end 320 by metal tube 300.Second heat absorbing member 400 is in order to contact Secondary Heat Source 920, and absorb the heat of Secondary Heat Source 920 generation, metal tube 300 is incorporated into the second heat absorbing member 400, makes the cooling fluid in metal tube 300 and the second heat absorbing member 400 carry out heat exchange, thus makes cooling fluid can take away the heat of Secondary Heat Source 920 generation.Second heat absorbing member 400 is a metal derby, and metal tube 300 fixedly fits in the second heat absorbing member 400 surface with welding or other.
First embodiment is connected to the delivery port 220 of water pump 200 for embodiment with first end 310, and in fact the first end 310 of metal tube 300 also can be the water inlet 210 being connected to water pump 200.In addition, in the first embodiment, metal tube 300 is connected to water pump 200 by a connecting water pipe 600, soft water pipe 600, can make the allocation position of metal tube 300 or the second heat absorbing member 400, can configure more neatly, such as Secondary Heat Source 920 can be positioned at another circuit board.Certainly, metal tube 300 also can be directly connected in water pump 200.
By above-mentioned combination, the heat that Secondary Heat Source 920 produces, after absorbing via the second heat absorbing member 400, can be taken away by the cooling fluid of metal tube 300 further, even if make to be separated by between Secondary Heat Source 920 and the first thermal source 910 distance, Secondary Heat Source 920 still carries out cooling by water pump 200, thus gives full play to the cooling performance of water pump 200, and simplifies the cooling framework on circuit board 900.
Should be noted, although the utility model embodiment is described with single Secondary Heat Source 920 for single metal tube 300, single second heat absorbing member 400, but in fact also can be the Secondary Heat Source 920 of more than two, to arrange in pairs or groups the metal tube 300 of more than two and second heat absorbing member 400 of more than two, and the first end 310 of multiple metal tube 300, single water inlet 210 or single delivery port 220 can be connected to by branch pipe device simultaneously.
As shown in Figure 5, for the heat radiation cooling device 1000 being applicable to multi-heat source of the utility model second embodiment comprise water pump 200, water pipe 600 that one first heat absorbing member 100, has a liquid pumping chamber with one second heat absorbing member 400a.
As shown in Figure 5, the first heat absorbing member 100, water pump 200 are roughly identical with the first embodiment, not repeat specification below.
One end of water pipe 600, is connected to water inlet 210 or the delivery port 220 of water pump 200.
Second heat absorbing member 400a in order to contact Secondary Heat Source 920, and absorbs the heat of Secondary Heat Source 920 generation.Second heat absorbing member 400a can be a metal derby, and its inside has a cooling passage 410a, through second heat absorbing member 400a.The other end of water pipe 600, is connected to cooling passage 410a, makes cooling fluid can circulate in cooling passage 410a, makes cooling fluid and the second heat absorbing member 400 carry out heat exchange, thus makes cooling fluid can take away the heat of Secondary Heat Source 920 generation.
Should be noted, although the utility model second embodiment is described for single water pipe 600, single second heat absorbing member 400a and single Secondary Heat Source 920, but in fact also can be the Secondary Heat Source 920 of more than two, arrange in pairs or groups the water pipe 600 of more than two and more than two the second heat absorbing member 400a, and multiple water pipe 600, single water inlet 210 or single delivery port 220 can be connected to by branch pipe device simultaneously.Certainly, also can possess multiple cooling passage 410a in single second heat absorbing member 400 simultaneously, connect multiple water pipe 600, then be connected to single water inlet 210 or single delivery port 220 by branch pipe device simultaneously.
The utility model is by the configuration of the second heat absorbing member 400,400a, make the water pump 200 that originally only can be used for carrying out the first thermal source 910 cooling, the cooling of one or more Secondary Heat Source 920 can be solved further, thus give full play to the cooling usefulness of water pump 200, and solve the too complicated problem of multi-heat source occasion heat radiating structure.
The above; be only preferred embodiment of the present utility model; not thereby scope of patent protection of the present utility model is limited, therefore the equalization change of such as using the utility model specification and accompanying drawing to do and modification, be all protection range of the present utility model and contain.
Claims (11)
1. one kind is applicable to the heat radiation cooling device of multi-heat source, itself and a cooling device form the pumping circulation of a cooling fluid and cool one first thermal source and a Secondary Heat Source, this first thermal source and this Secondary Heat Source are separated by a distance, and it is characterized in that, this heat radiation cooling device being applicable to multi-heat source comprises:
One first heat absorbing member, it is contacted with this first thermal source;
One water pump with liquid pumping chamber, it is incorporated on this first heat absorbing member; Wherein, this water pump has a water inlet and a delivery port, this cooling fluid enters this liquid pumping chamber by this water inlet and carries out heat exchange with this first heat absorbing member, and this cooling fluid leaves this liquid pumping chamber by this delivery port, and forms the pumping circulation of this cooling fluid with this cooling device;
One metal tube, it has a first end and one second end, and this first end is connected to water inlet or the delivery port of this water pump, and this cooling fluid is left by this second end by this metal tube; And
One second heat absorbing member, it is contacted with this Secondary Heat Source, and wherein this metal tube is incorporated into this second heat absorbing member, and cooling fluid in this metal tube and this second heat absorbing member carry out heat exchange.
2. be applicable to the heat radiation cooling device of multi-heat source as claimed in claim 1, it is characterized in that, more comprise a fixture, this fixture suppresses this first heat absorbing member on this first thermal source.
3. be applicable to the heat radiation cooling device of multi-heat source as claimed in claim 2, it is characterized in that, this fixture comprises:
One framework, it carries this first heat absorbing member, and this first heat absorbing member contacts this first thermal source through this framework; And
Multiple fixing feet, it extends the edge of this framework.
4. be applicable to the heat radiation cooling device of multi-heat source as claimed in claim 1, it is characterized in that, this metal tube is directly connected in this water pump.
5. be applicable to the heat radiation cooling device of multi-heat source as claimed in claim 1, it is characterized in that, this metal tube is connected to this water pump by a connecting water pipe.
6. be applicable to the heat radiation cooling device of multi-heat source as claimed in claim 1, it is characterized in that, this second heat absorbing member is a metal derby.
7. be applicable to the heat radiation cooling device of multi-heat source as claimed in claim 1, it is characterized in that, this metal tube fits in this second heat absorbing member surface.
8. one kind is applicable to the heat radiation cooling device of multi-heat source, itself and a cooling device form the pumping circulation of a cooling fluid and cool one first thermal source and a Secondary Heat Source, this first thermal source and this Secondary Heat Source are separated by a distance, and it is characterized in that, this heat radiation cooling device being applicable to multi-heat source comprises:
One first heat absorbing member, it is contacted with this first thermal source;
One water pump with liquid pumping chamber, it is incorporated on this first heat absorbing member; Wherein, this water pump has a water inlet and a delivery port, this cooling fluid enters this liquid pumping chamber by this water inlet and carries out heat exchange with this first heat absorbing member, and this cooling fluid leaves this liquid pumping chamber by this delivery port, and forms the pumping circulation of this cooling fluid with this cooling device;
One water pipe, its one end is connected to water inlet or the delivery port of this water pump; And
One second heat absorbing member, it is contacted with this Secondary Heat Source, wherein this second heat absorbing member inside has a cooling passage, this second heat absorbing member through, and the other end of this water pipe is connected to this cooling passage, and this cooling fluid circulates in this cooling passage, and this cooling fluid and this second heat absorbing member carry out heat exchange.
9. be applicable to the heat radiation cooling device of multi-heat source as claimed in claim 8, it is characterized in that, more comprise a fixture, this fixture suppresses this first heat absorbing member on this first thermal source.
10. be applicable to the heat radiation cooling device of multi-heat source as claimed in claim 9, it is characterized in that, this fixture comprises:
One framework, it carries this first heat absorbing member, and this first heat absorbing member contacts this first thermal source through this framework; And
Multiple fixing feet, it extends the edge of this framework.
11. heat radiation cooling device being applicable to multi-heat source as claimed in claim 8, it is characterized in that, this second heat absorbing member is a metal derby.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420654752.5U CN204272568U (en) | 2014-11-05 | 2014-11-05 | Be applicable to the heat radiation cooling device of multi-heat source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420654752.5U CN204272568U (en) | 2014-11-05 | 2014-11-05 | Be applicable to the heat radiation cooling device of multi-heat source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204272568U true CN204272568U (en) | 2015-04-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420654752.5U Expired - Fee Related CN204272568U (en) | 2014-11-05 | 2014-11-05 | Be applicable to the heat radiation cooling device of multi-heat source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204272568U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109917879A (en) * | 2017-12-13 | 2019-06-21 | 双鸿科技股份有限公司 | Cluster type radiator and cabinet |
-
2014
- 2014-11-05 CN CN201420654752.5U patent/CN204272568U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109917879A (en) * | 2017-12-13 | 2019-06-21 | 双鸿科技股份有限公司 | Cluster type radiator and cabinet |
| CN109917879B (en) * | 2017-12-13 | 2023-04-11 | 双鸿科技股份有限公司 | Cluster type heat dissipation device and case |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150415 Termination date: 20191105 |
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| CF01 | Termination of patent right due to non-payment of annual fee |