CN204262542U - A kind of dip-soldering machine for immersed solder surface-mounted integrated circuit - Google Patents
A kind of dip-soldering machine for immersed solder surface-mounted integrated circuit Download PDFInfo
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- CN204262542U CN204262542U CN201420626994.3U CN201420626994U CN204262542U CN 204262542 U CN204262542 U CN 204262542U CN 201420626994 U CN201420626994 U CN 201420626994U CN 204262542 U CN204262542 U CN 204262542U
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- framework
- immersed solder
- integrated circuit
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- rod
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Abstract
The utility model relates to a kind of dip-soldering machine for immersed solder surface-mounted integrated circuit.This dip-soldering machine comprises frame and immersed solder operating-controlling mechanism; Working space is established in frame; Establish cross slide way above working space, the frame below working space is provided with successively scaling powder atomizing device, pre-heating drying device and immersed solder pond; This immersed solder operating-controlling mechanism comprises installs longitudinal extension guide rail, the first framework, the second framework, link assembly, elastic stretching elastic and cleat assembly.Horizontal blend stop is provided with above first framework; Press down link assembly, when the second framework is displaced downwardly to maximum formation, with the first framework keeping parallelism; Unclamping link assembly second framework is received in the first framework, and elastic stretching elastic is connected between the first framework outer end and the second framework outer end; Cleat assembly is fixed on below the second framework.This dip-soldering machine immersed solder process can control integration circuit board can not excessively shallow, excessive immersed solder and strict control treats that immersed solder surface-mounted integrated circuit immerses tin pond abreast.
Description
Technical field
The utility model belongs to the manufacturing and processing equipment of circuit board, particularly relates to a kind of dip-soldering machine for immersed solder surface-mounted integrated circuit.
Background technology
Existing dip-soldering machine has full automatic, also has automanual, and in order to immersed solder better, a lot of small business often selects automanual.For existing Semiautomatic dip-soldering machine, it is mainly by manual operation one immersed solder operating-controlling mechanism, existing immersed solder operating-controlling mechanism structure is simple, lack rational stopping means and parallel control, easily when immersed solder, surface-mounted integrated circuit is excessively shallow, the excessive or immersion Xi Shui that tilts, cause immersed solder weak effect, even cause surface-mounted integrated circuit to be scrapped, not only the wasting of resources is large, affects overall product control.
Summary of the invention
Goal of the invention of the present utility model be to provide a kind of can control integration circuit board can not excessively shallow, excessive immersed solder and strict control treats that immersed solder surface-mounted integrated circuit immerses the dip-soldering machine in tin pond abreast.
In order to realize foregoing invention object, the utility model have employed following technical scheme:
For a dip-soldering machine for immersed solder surface-mounted integrated circuit, comprise frame and immersed solder operating-controlling mechanism; The working space of an opening towards front side is provided with in described frame; Frame above described working space is provided with cross slide way, the frame below working space is provided with successively scaling powder atomizing device, pre-heating drying device and immersed solder pond; Described immersed solder operating-controlling mechanism comprises: being arranged on the longitudinal extension guide rail on cross slide way, the first framework be arranged on longitudinal extension guide rail, being in the first framework and the second framework, the link assembly connecting the first framework and the second framework, elastic stretching elastic and the cleat assembly for clamping surface-mounted integrated circuit that can move down; Horizontal blend stop is provided with above described first framework; Described link assembly is made up of balancing weight, balancing weight connecting rod, master connecting-rod and handle connecting rod; Described balancing weight is connected to master connecting-rod the inner by balancing weight connecting rod, and described handle connecting rod is connected to master connecting-rod outer end; Described second framework is spacing under horizontal blend stop, and the middle part of the second framework is hinged on master connecting-rod; The second frame side wall be positioned at outside hinged place is provided with limited block, and limited block is positioned at below described master connecting-rod; Described elastic stretching elastic is connected between described first framework outer end and the second framework outer end, to make described second frame parallel in described first framework; Described cleat assembly is vertically fixed on below the second framework.
As optimal technical scheme of the present utility model, also comprise aspirating air pipe, described aspirating air pipe is arranged on frame and is communicated with described working space.
As optimal technical scheme of the present utility model, the described frame below working space is also provided with the triangular baffle for unloading surface-mounted integrated circuit from cleat assembly, described triangular baffle is positioned on front side of scaling powder atomizing device.
As optimal technical scheme of the present utility model, described cleat assembly is made up of pair of parallel strip clamping plate and a pair connecting plate, and connecting plate upper end described in a pair is vertically fixed on the second framework, and lower end is fixedly connected with a pair strip clamping plate respectively; Be respectively equipped with corresponding groove inside strip clamping plate described in a pair, during work, described in treat that immersed solder surface-mounted integrated circuit is clamped in this between groove.
As optimal technical scheme of the present utility model, the master connecting-rod the inner in described link assembly is hinged on the first framework inner end.
As optimal technical scheme of the present utility model, described master connecting-rod the inner is provided with on the folding surface of a downward bending, and described balancing weight connecting rod is fixedly connected on described master connecting-rod by folding surface.When handle connecting rod presses to range, balancing weight had both had larger spatial accommodation, with counterweight better, its balancing weight can be made again to be topmost against in dip-soldering machine frame, play position-limiting action.
Compared with prior art, have employed the dip-soldering machine of technique scheme, the beneficial effects of the utility model are as follows:
One, on dip-soldering machine, immersed solder operating-controlling mechanism carries out in manipulation process, flexible spacing, and when pressing down, the second frame stability does not move down with not rocking, and operating effect is good.
Two, on dip-soldering machine, immersed solder operating-controlling mechanism carries out in manipulation process, because above-mentioned elastic stretching elastic elasticity pulls the second framework outer end, is making the second framework be against below master connecting-rod by limited block simultaneously; Make that the second framework is relatively stable can not be overturn, the position designing limited block just can keep the second frame parallel in the first framework; And then making immersed solder operating-controlling mechanism surface-mounted integrated circuit be sent into the accurate positioning of tin pond immersed solder, not rosin joint, not easily scraps, and immersed solder is effective.
Three, on dip-soldering machine, immersed solder operating-controlling mechanism is is also connected and composed by many guide rails, connecting rod etc., not only simple to operation, and compared with full-automatic dip-soldering machine, it assembles with low cost, and immersed solder effect is not second to full-automatic dip-soldering machine.
Four, because immersed solder process is in inside working space, and fill surface-mounted integrated circuit outside working space, install surface-mounted integrated circuit in outside and move to inner side by immersed solder operating-controlling mechanism, successively through scaling powder atomizing, pre-heating drying, finally press down and enter immersed solder pond, complete immersed solder, immersed solder process safety, clean, sanitary.
Accompanying drawing explanation
Fig. 1: the structural representation of the utility model embodiment.
Fig. 2: the outer face structural representation of immersed solder operating-controlling mechanism in the utility model embodiment.
Fig. 3: the side structure schematic diagram of immersed solder operating-controlling mechanism in the utility model embodiment.
Detailed description of the invention
Below in conjunction with accompanying drawing, the utility model is described further.
Embodiment:
A kind of dip-soldering machine for immersed solder surface-mounted integrated circuit as shown in Figure 1, Figure 2 and Figure 3, this dip-soldering machine comprises frame 2, aspirating air pipe 13 and immersed solder operating-controlling mechanism 1, be provided with the working space of an opening towards front side in its frame 2, aspirating air pipe 3 is arranged on frame 2 and is communicated with described working space.This working space front opening is towards operator, and rear end extends in frame.Frame 2 above working space is provided with cross slide way 22, the frame below working space is provided with successively scaling powder atomizing device 3, pre-heating drying device 4 and immersed solder pond 5.
Above-mentioned immersed solder operating-controlling mechanism 1 is arranged on working space, specifically can in working space external extension, immersed solder operating-controlling mechanism 1 specifically comprises longitudinal extension guide rail 12, first framework 10, second framework 14, connects the link assembly 13 of the first framework 10 and the second framework 14, elastic stretching elastic 16 and for clamping the cleat assembly 15 treating immersed solder surface-mounted integrated circuit.Wherein, longitudinal extension guide rail 12 is for being arranged on dip-soldering machine cross slide way, and the first framework 10 is arranged on longitudinal extension guide rail 12, longitudinally outwards extends and drive in face of the first framework 10 to operator, to load surface-mounted integrated circuit with longitudinal extension guide rail 12.Be provided with horizontal blend stop 101, second framework 14 above first framework 10 spacing under horizontal blend stop 101, be in the first framework 10 and also can move down.
Link assembly 13 is made up of balancing weight 135, balancing weight connecting rod 134, master connecting-rod 130 and handle connecting rod 131.It is inner that balancing weight 135 is connected to master connecting-rod 130 by balancing weight connecting rod 134, and handle connecting rod 131 is connected to master connecting-rod 130 outer end.Master connecting-rod 130 the inner in link assembly 13 is hinged on the first framework 10 inner end, and the middle part of the second framework 14 is hinged on master connecting-rod 130.
In order to allow balancing weight 135, both there is larger spatial accommodation, with counterweight better, its balancing weight 135 can be made again to be against in dip-soldering machine frame topmost, play position-limiting action, master connecting-rod 130 the inner of the present utility model is provided with on the folding surface 133 of a downward bending, and balancing weight connecting rod 134 is fixedly connected on master connecting-rod 130 particular by folding surface 133.
When above-mentioned balancing weight 135 is spacing topmost, when namely handle connecting rod 131 presses to range, the second framework 14 position of the present utility model is in below the first framework 10.The second framework 14 sidewall be positioned at outside hinged place is provided with limited block 141, and limited block 141 is positioned at below described master connecting-rod 130.And above-mentioned elastic stretching elastic 16 is connected between described first framework 10 outer end and the second framework 14 outer end, elastic stretching elastic 16 elasticity can pull the second framework 14 outer end, second framework 14 is against below described master connecting-rod 130 by limited block 141, finally makes the second framework 14 be parallel to described first framework 10.
Why the utility model adopts elastic stretching elastic 16, and can not adopt extension spring herein, and reason is when operator looses one's grip, and the second framework 14 can be made to move to inside the first framework 10 receive under the gravity of balancing weight 135.It is little that elastic stretching elastic 16 of the present utility model shrinks rear spatial accommodation, and the second framework 14 can be made completely to receive to the first framework 10; And according to extension spring, the second framework 14 can be caused cannot intactly to take in inside the first framework 10.
Above-mentioned cleat assembly 15 is vertically fixed on below the second framework 14.Cleat assembly 15 is specifically made up of pair of parallel strip clamping plate 150 and a pair connecting plate 151, and connecting plate 151 upper end described in a pair is vertically fixed on the second framework 14, and lower end is fixedly connected with a pair strip clamping plate 150 respectively.Be respectively equipped with corresponding groove 1501 inside strip clamping plate 150 described in a pair, during work, described in treat that immersed solder surface-mounted integrated circuit is clamped in this between groove 1501.
In order to better unload surface-mounted integrated circuit easily, the frame 2 of the utility model below above-mentioned working space is also provided with the triangular baffle 6 for unloading surface-mounted integrated circuit from cleat assembly 15, triangular baffle 6 is fixed on the table top outside working space, and is positioned on front side of scaling powder atomizing device 3.Need only the immersed solder operating-controlling mechanism 1 after completing immersed solder operation be moved to herein, laterally push through above triangular baffle 6, the table top making surface-mounted integrated circuit deviate to working space can complete the work of unloading.
During operation, first, operator should transverse shifting whole immersed solder operating-controlling mechanism to suitable position, will treat that the surface-mounted integrated circuit of immersed solder loads above-mentioned cleat assembly 15, in namely corresponding a pair groove 1501; Then, press down handle, handle connecting rod 131 overcomes balancing weight 135 by master connecting-rod 130, and because balancing weight 135 is spacing, when making the range pressed down, integrated circuit Board position mates with tin pond.Because above-mentioned elastic stretching elastic 16 elasticity pulls the second framework 14 outer end, the second framework 14 is made to be against below described master connecting-rod 130 by limited block 141, relatively stablely can not overturn, the position designing limited block 141 just can keep the second framework 14 to be parallel to the first framework 10.
By these connecting rods and spacing control, make the manually operated a kind of dip-soldering machine of the utility model in accurate positioning surface-mounted integrated circuit being sent into the immersed solder of tin pond, not rosin joint, not easily scraps, and immersed solder is effective.
Claims (6)
1. for a dip-soldering machine for immersed solder surface-mounted integrated circuit, it is characterized in that: comprise frame (2) and immersed solder operating-controlling mechanism (1); The working space of an opening towards front side is provided with in described frame (2); Frame (2) above described working space is provided with cross slide way (22), the frame below working space is provided with successively scaling powder atomizing device (3), pre-heating drying device (4) and immersed solder pond (5); Described immersed solder operating-controlling mechanism (1) comprising:
-be arranged on longitudinal extension guide rail (12) on cross slide way;
-be arranged on the first framework (10) on longitudinal extension guide rail (12);
-be in second framework (14) that also can move down in the first framework (10);
-connect the link assembly (13) of the first framework (10) and the second framework (14);
-elastic stretching elastic (16); And
-for clamping the cleat assembly (15) of surface-mounted integrated circuit;
Described first framework (10) top is provided with horizontal blend stop (101);
Described link assembly (13) is made up of balancing weight (135), balancing weight connecting rod (134), master connecting-rod (130) and handle connecting rod (131); It is inner that described balancing weight (135) is connected to master connecting-rod (130) by balancing weight connecting rod (134), and described handle connecting rod (131) is connected to master connecting-rod (130) outer end;
Described second framework (14) is spacing under horizontal blend stop (101), and the middle part of the second framework (14) is hinged on master connecting-rod (130); The second framework (14) sidewall be positioned at outside hinged place is provided with limited block (141), and limited block (141) is positioned at described master connecting-rod (130) below; Described elastic stretching elastic (16) is connected between described first framework (10) outer end and the second framework (14) outer end, is parallel to described first framework (10) to make described second framework (14);
Described cleat assembly (15) is vertically fixed on the second framework (14) below.
2. a kind of dip-soldering machine for immersed solder surface-mounted integrated circuit according to claim 1, is characterized in that:
Also comprise aspirating air pipe (30), described aspirating air pipe (30) is arranged on frame (2) and is communicated with described working space.
3. a kind of dip-soldering machine for immersed solder surface-mounted integrated circuit according to claim 1, is characterized in that:
Described cleat assembly (15) is made up of pair of parallel strip clamping plate (150) and a pair connecting plate (151), connecting plate described in a pair (151) upper end is vertically fixed on the second framework (14), and lower end is fixedly connected with a pair strip clamping plate (150) respectively; Described in a pair, strip clamping plate (150) inner side is respectively equipped with corresponding groove (1501).
4. a kind of dip-soldering machine for immersed solder surface-mounted integrated circuit according to claim 3, is characterized in that:
Described frame below working space is also provided with the triangular baffle (6) for unloading surface-mounted integrated circuit from cleat assembly (15), described triangular baffle (6) is positioned at scaling powder atomizing device (3) front side.
5. a kind of dip-soldering machine for immersed solder surface-mounted integrated circuit according to claim 1, is characterized in that:
Master connecting-rod (130) the inner in described link assembly (13) is hinged on the first framework (10) inner end.
6. a kind of dip-soldering machine for immersed solder surface-mounted integrated circuit according to claim 1 or 2 or 3, is characterized in that:
Described master connecting-rod (130) the inner is provided with the folding surface (133) of a downward bending, and described balancing weight connecting rod (134) is fixedly connected on described master connecting-rod (130) by folding surface (133).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420626994.3U CN204262542U (en) | 2014-10-27 | 2014-10-27 | A kind of dip-soldering machine for immersed solder surface-mounted integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420626994.3U CN204262542U (en) | 2014-10-27 | 2014-10-27 | A kind of dip-soldering machine for immersed solder surface-mounted integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204262542U true CN204262542U (en) | 2015-04-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420626994.3U Expired - Fee Related CN204262542U (en) | 2014-10-27 | 2014-10-27 | A kind of dip-soldering machine for immersed solder surface-mounted integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204262542U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108260299A (en) * | 2018-03-22 | 2018-07-06 | 深圳捷创电子科技有限公司 | A kind of full-automatic dip-soldering machine |
-
2014
- 2014-10-27 CN CN201420626994.3U patent/CN204262542U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108260299A (en) * | 2018-03-22 | 2018-07-06 | 深圳捷创电子科技有限公司 | A kind of full-automatic dip-soldering machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Cangnan County Lingxi Town Industrial Park of Wenzhou city in Zhejiang province 325800 (opposite the Zhejiang Fujian logistics center) Patentee after: ZHEJIANG KAIDI ELECTRIC CO., LTD. Address before: 325000 Cangnan Katie Electric Co., Ltd., Cangnan Katie Electric Co., Ltd., Cangnan County, Wenzhou, Zhejiang Province, Bai Zhang Industrial Park (opposite to Zhejiang Fujian logistics center) Patentee before: CANGNAN KAIDI ELECTRIC CO., LTD. |
|
| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150415 Termination date: 20181027 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |