CN104411112A - Integrated circuit board processing device - Google Patents
Integrated circuit board processing device Download PDFInfo
- Publication number
- CN104411112A CN104411112A CN201410583883.3A CN201410583883A CN104411112A CN 104411112 A CN104411112 A CN 104411112A CN 201410583883 A CN201410583883 A CN 201410583883A CN 104411112 A CN104411112 A CN 104411112A
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- framework
- integrated circuit
- immersed solder
- assembly
- rod
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to an integrated circuit board processing device. The processing device comprises a dip solder deice, a pin cutting device, a proximity switch, a cylinder and a controller. The dip solder device comprises a frame and a dip solder control mechanism; the frame is internally provided with a work space, and the front side of the work space is provided with a table top; the dip solder control mechanism is movably connected with a transverse guide rail; a clamping plate assembly is arranged below the dip solder control mechanism; the pin cutting device comprises a cutting motor, a cutter disc and a guide rail assembly; the input end of the guide rail assembly is disposed on the table top at one side of the dip solder device, the cylinder is fixed at the central portion of the table top, and the proximity switch comprises a sensor portion and a to-be-sensed portion; the to-be-sensed portion is fixed at one side of the clamping plate assembly, and the sensor portion is fixed at one side opposite to the guide rail assembly; and the sensor portion is in signal connection with the controller, one of the output ends of the controller is in signal connection with the cylinder, and the other output end is connected with the cutting motor. The processing device provided by the invention has the following advantages: dip solder and pin cutting procedures are integrated into one body, and the production efficiency is high.
Description
Technical field
The invention belongs to circuit board process equipment field, particularly relate to a kind of process equipment of surface-mounted integrated circuit.
Background technology
At present, circuit board fabrication process generally all comprises immersed solder and cutting operation, and immersed solder is completed by dip-soldering machine, and cutting is completed by cutter.
With regard to current dip-soldering machine, although existing dip-soldering machine has full automatic, also have automanual, in order to immersed solder better, a lot of small business often selects automanual.For existing Semiautomatic dip-soldering machine, it is mainly by manual operation one immersed solder operating-controlling mechanism.Cutter, the i.e. abbreviation of PCB cutter, with regard to current cutter, it is mainly used in excising components and parts and is welded in the unnecessary pin after wiring board, the pinrshape that is otherwise known as, cuts pin machine etc.Can be divided at a high speed and low speed cutter according to rotating speed cutter.The general movement rotating speed of cutter of low speed, at below 3000r/min, is directly run by motor; High speed cutter, makes movement rotating speed reach more than 4500r/min by speed change.
At present, two equipment are all ripe, and operating personnel generally first carry out immersed solder, then carry out cutting because point to be in two machines complete two originally can continuous print operation, cause present surface-mounted integrated circuit production efficiency low.In addition, with regard to current immersed solder, because existing immersed solder operating-controlling mechanism structure is simple, lack rational stopping means and parallel control, easily when immersed solder, surface-mounted integrated circuit is excessively shallow, the excessive or immersion Xi Shui that tilts, cause immersed solder weak effect, even cause surface-mounted integrated circuit to be scrapped, not only the wasting of resources is large, affects overall product control.With regard to current cutting equipment, its automaticity is low, and cutting has reaction force, cutting work efficient under, and manual operations is dangerous large.
Summary of the invention
Technical problem to be solved of the present invention is that providing a kind of integrates immersed solder operation and cutting operation, and automaticity is high, effective process equipment.
In order to solve above-mentioned technical problem to be solved, present invention employs following technical scheme:
A kind of integrated circuit board processing device, comprises for the immersed solder equipment of immersed solder bottom surface-mounted integrated circuit, cutting equipment, proximity switch, cylinder and the controller for electrical equipment component pin excision bottom surface-mounted integrated circuit; Described immersed solder equipment comprising frame, carrying out immersed solder operating-controlling mechanism and the aspirating air pipe of immersed solder operation for clamping surface-mounted integrated circuit; Be provided with the working space of an opening towards front side in described frame, the frame on front side of working space is provided with a table top; Frame above described working space is provided with cross slide way, the frame below working space is provided with successively scaling powder atomizing device, pre-heating drying device and immersed solder pond; Aspirating air pipe is arranged on frame and is communicated with described working space; Immersed solder operating-controlling mechanism is movably connected on described cross slide way; One is provided with for clamping the cleat assembly of surface-mounted integrated circuit below immersed solder operating-controlling mechanism; Described cutting equipment comprises the cutting pedestal, cutting motor, cutter plate and the guide assembly that are connected to frame side; Described cutting motor to be arranged on cutting pedestal and its output upward, cutter plate is horizontally fixed on cutting motor output, and guide assembly is in above cutter plate; Described guide assembly input is positioned on the side table top of immersed solder equipment, and described cylinder is fixed in the middle part of described table top, leaves the accommodation space of described cleat assembly between described cylinder output and guide assembly input; Described proximity switch bag inductor part and treat sensing part; Describedly treat that sensing part is fixed on cleat assembly side, inductor partial fixing is in the corresponding side of guide assembly; Described inductor part signal connection control device, a controller wherein output end signal connects cylinder, and another output connects cutting motor.
As preferably, described immersed solder operating-controlling mechanism comprises the longitudinal extension guide rail be arranged on cross slide way, the first framework be arranged on longitudinal extension guide rail, is in the first framework and the second framework, the link assembly connecting the first framework and the second framework and the elastic stretching elastic that can move down; Horizontal blend stop is provided with above described first framework; Described link assembly is made up of balancing weight, balancing weight connecting rod, master connecting-rod and handle connecting rod; Described balancing weight is connected to master connecting-rod the inner by balancing weight connecting rod, and described handle connecting rod is connected to master connecting-rod outer end; Described second framework is spacing under horizontal blend stop, and the middle part of the second framework is hinged on master connecting-rod; The second frame side wall be positioned at outside hinged place is provided with guide vane end stop, and guide vane end stop is positioned at below described master connecting-rod; Described elastic stretching elastic is connected between described first framework outer end and the second framework outer end, to make described second frame parallel in described first framework; Described cleat assembly is vertically fixed on below the second framework.
As preferably, the table top between described cylinder output and guide assembly input is provided with guide vane end stop.
As preferably, described cleat assembly is made up of pair of parallel strip clamping plate and a pair connecting plate, and connecting plate upper end described in a pair is vertically fixed on the second framework, and lower end is fixedly connected with a pair strip clamping plate respectively; Corresponding groove is respectively equipped with inside strip clamping plate described in a pair; During work, described in treat that immersed solder surface-mounted integrated circuit is clamped in this between groove.
As preferably, the master connecting-rod the inner in described link assembly is hinged on the first framework inner end; Described master connecting-rod the inner is provided with on the folding surface of a downward bending, and described balancing weight connecting rod is fixedly connected on described master connecting-rod by folding surface; When handle connecting rod presses to range, balancing weight had both had larger spatial accommodation, with counterweight better, its balancing weight can be made again to be topmost against in dip-soldering machine frame, play position-limiting action.
As preferably, described guide assembly is made up of pair of guide rails, is respectively equipped with corresponding guide groove inside pair of guide rails; On described cleat assembly a pair groove Distance geometry described on guide assembly a pair guide groove all match with described surface-mounted integrated circuit width.
Compared with prior art, have employed the process equipment of technique scheme, beneficial effect of the present invention is as follows:
One, this process equipment integrates immersed solder and cutting operation, and after immersed solder terminates, automatically enter cutting operation, shortened production process, efficiency is high, effective.
Two, for the preferred technical solution of the present invention, it adopts the immersed solder operating-controlling mechanism of above-mentioned Rational structure, not only convenient operation immersed solder; And when above-mentioned elastic stretching elastic elasticity pulls the second framework outer end, making the second framework be against below master connecting-rod by guide vane end stop simultaneously; Make that the second framework is relatively stable can not be overturn, the position designing guide vane end stop just can keep the second frame parallel in the first framework; And then making immersed solder operating-controlling mechanism surface-mounted integrated circuit be sent into the accurate positioning of tin pond immersed solder, not rosin joint, not easily scraps, and immersed solder is effective.In addition, upper immersed solder operating-controlling mechanism carries out in manipulation process, flexible spacing, and when pressing down, the second frame stability does not move down with not rocking, and operating effect is good.
Three, because immersed solder work is in inside working space, and fill surface-mounted integrated circuit outside working space, install surface-mounted integrated circuit in outside and move to inner side by immersed solder operating-controlling mechanism, successively through scaling powder atomizing, pre-heating drying, finally press down and enter immersed solder pond, complete immersed solder, immersed solder process safety, clean, sanitary; After completing immersed solder, can surface-mounted integrated circuit be moved to outside working space again, namely move to the accommodation space leaving described cleat assembly between cylinder output and guide assembly input; Now, by proximity switch inductor part induction, open the control procedure of follow-up automatic cutting, therefore make whole immersed solder and cutting process efficiency high, easy to operate, effective.
Accompanying drawing explanation
Fig. 1: the structural representation of the embodiment of the present invention.
The partial enlargement structural representation at A place in Fig. 2: Fig. 1.
Fig. 3: the side structure schematic diagram of immersed solder operating-controlling mechanism in the embodiment of the present invention.
Fig. 4: the outer face structural representation of immersed solder operating-controlling mechanism in the embodiment of the present invention.
Fig. 5: the side structure schematic diagram of cutting equipment in the embodiment of the present invention.
Fig. 6: the structured flowchart of control system in the embodiment of the present invention.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described further.
Embodiment: a kind of integrated circuit board processing device as shown in figures 1 to 6, this process equipment comprises for the immersed solder equipment of immersed solder bottom surface-mounted integrated circuit, cutting equipment 9, proximity switch 8, cylinder 6 and the controller 7 for electrical equipment component pin excision bottom surface-mounted integrated circuit.
Above-mentioned immersed solder equipment comprises frame 2, aspirating air pipe 13 and carries out the immersed solder operating-controlling mechanism 1 of immersed solder operation for clamping surface-mounted integrated circuit, and be provided with the working space of an opening towards front side in its frame 2, aspirating air pipe 3 is arranged on frame 2 and is communicated with described working space.This working space front opening is towards operator, and rear end extends in frame.Frame 2 above working space is provided with cross slide way 22, the frame below working space is provided with successively scaling powder atomizing device 3, pre-heating drying device 4 and immersed solder pond 5.Immersed solder operating-controlling mechanism 1 is movably connected on cross slide way 22, specifically can in working space external extension; One is provided with for clamping the cleat assembly 15 of surface-mounted integrated circuit below immersed solder operating-controlling mechanism 1.
Immersed solder operating-controlling mechanism 1 specifically comprises longitudinal extension guide rail 12, first framework 10, second framework 14, connects link assembly 13 and the elastic stretching elastic 16 of the first framework 10 and the second framework 14.Wherein, longitudinal extension guide rail 12 is for being arranged on dip-soldering machine cross slide way, and the first framework 10 is arranged on longitudinal extension guide rail 12, longitudinally outwards extends and drive in face of the first framework 10 to operator, to load surface-mounted integrated circuit with longitudinal extension guide rail 12.Be provided with horizontal blend stop 101, second framework 14 above first framework 10 spacing under horizontal blend stop 101, be in the first framework 10 and also can move down.Link assembly 13 is made up of balancing weight 135, balancing weight connecting rod 134, master connecting-rod 130 and handle connecting rod 131.It is inner that balancing weight 135 is connected to master connecting-rod 130 by balancing weight connecting rod 134, and handle connecting rod 131 is connected to master connecting-rod 130 outer end.Master connecting-rod 130 the inner in link assembly 13 is hinged on the first framework 10 inner end, and the middle part of the second framework 14 is hinged on master connecting-rod 130.
In order to allow balancing weight 135, both there is larger spatial accommodation, with counterweight better, its balancing weight 135 can be made again to be against in dip-soldering machine frame topmost, play position-limiting action, master connecting-rod 130 the inner of the present invention is provided with on the folding surface 133 of a downward bending, and balancing weight connecting rod 134 is fixedly connected on master connecting-rod 130 particular by folding surface 133.
When above-mentioned balancing weight 135 is spacing topmost, when namely handle connecting rod 131 presses to range, the second framework 14 position of the present invention is in below the first framework 10.The second framework 14 sidewall be positioned at outside hinged place is provided with guide vane end stop 141, and guide vane end stop 141 is positioned at below master connecting-rod 130.And above-mentioned elastic stretching elastic 16 is connected between described first framework 10 outer end and the second framework 14 outer end, elastic stretching elastic 16 elasticity can pull the second framework 14 outer end, second framework 14 is against below described master connecting-rod 130 by guide vane end stop 141, finally makes the second framework 14 be parallel to described first framework 10.
Here, why the present invention adopts elastic stretching elastic 16, and can not adopt extension spring herein, and reason is when operator looses one's grip, and the second framework 14 can be made to move to inside the first framework 10 receive under the gravity of balancing weight 135.It is little that elastic stretching elastic 16 of the present invention shrinks rear spatial accommodation, and the second framework 14 can be made completely to receive to the first framework 10; And according to extension spring, the second framework 14 can be caused cannot intactly to take in inside the first framework 10.
Above-mentioned cleat assembly 15 is specifically vertically fixed on below the second framework 14.Cleat assembly 15 is specifically made up of pair of parallel strip clamping plate 150 and a pair connecting plate 151, and connecting plate 151 upper end described in a pair is vertically fixed on the second framework 14, and lower end is fixedly connected with a pair strip clamping plate 150 respectively.Be respectively equipped with corresponding groove 1501 inside strip clamping plate 150 described in a pair, during work, described in treat that immersed solder surface-mounted integrated circuit is clamped in this between groove 1501.
As shown in Figure 1 and Figure 5, above-mentioned cutting equipment 9 comprises the cutting pedestal 91, cutting motor 90, cutter plate 94 and the guide assembly 92 that are connected to frame 2 side; Cutting motor 90 to be arranged on cutting pedestal 91 and its output upward, cutter plate 94 is horizontally fixed on cutting motor 90 output, and guide assembly 92 is in above cutter plate 94; Guide assembly 92 input is positioned on the side table top of immersed solder equipment, and described cylinder 6 is fixed in the middle part of described table top, leaves the accommodation space of described cleat assembly 15 between cylinder 6 output and guide assembly 92 input;
Above-mentioned guide assembly 92 is specifically made up of pair of guide rails, is respectively equipped with corresponding guide groove 93 inside pair of guide rails.On cleat assembly 15 a pair groove 1501 Distance geometry guide assembly 92 on a pair guide groove 93 all match with surface-mounted integrated circuit width.
Above-mentioned proximity switch 8 comprises inductor part 81 and treats sensing part 80; Treat that sensing part 80 is fixed on the right-hand member of outside strip clamping plate 150 in cleat assembly 15, and inductor part 81 is fixed on the corresponding side of guide assembly 92, i.e. follower rail left end.As shown in Figure 6, its inductor part 81 signal connection control device 7, a controller 7 wherein output end signal connects cylinder 6, and another output connects cutting motor 90.
In addition, cause cleat assembly 15 and guide assembly 92 cannot be corresponding to prevent cleat assembly 15 transition from outwards moving, the table top of the present invention between above-mentioned cylinder 6 output and guide assembly 92 input is provided with positive stop 60, and the interior edge of positive stop 60 is in the length direction on edge in follower rail.
During operation immersed solder operating-controlling mechanism 1, first, operator should transverse shifting whole immersed solder operating-controlling mechanism to suitable position, will treat that the surface-mounted integrated circuit of immersed solder loads above-mentioned cleat assembly 15, in namely corresponding a pair groove 1501; Then, press down handle, handle connecting rod 131 overcomes balancing weight 135 by master connecting-rod 130, and because balancing weight 135 is spacing, when making the range pressed down, integrated circuit Board position mates with tin pond.Because above-mentioned elastic stretching elastic 16 elasticity pulls the second framework 14 outer end, the second framework 14 is made to be against below described master connecting-rod 130 by guide vane end stop 141, relatively stablely can not overturn, the position designing guide vane end stop 141 just can keep the second framework 14 to be parallel to the first framework 10.By these connecting rods and spacing control, make the manually operated a kind of dip-soldering machine of the present invention in accurate positioning surface-mounted integrated circuit being sent into the immersed solder of tin pond, not rosin joint, not easily scraps, and immersed solder is effective.
During complete machine work, first, according to the flow process of aforesaid operations immersed solder operating-controlling mechanism 1 by surface-mounted integrated circuit immersed solder; After immersed solder, pull-out immersed solder operating-controlling mechanism 1, and press down cleat assembly 15 is entered between cylinder 6 output and guide assembly 92 input.Now, what be in the right-hand member of outside strip clamping plate 150 treats the inductor part 81 of sensing part 80 near follower rail left end, and inductor part 81 produces induced signal, and by signal transmission to controller 7, controller 7, according to the signal of input, goes to open cylinder 6.Above-mentioned cylinder 6 output corresponds to the surface-mounted integrated circuit that cleat assembly 15 clamps, and surface-mounted integrated circuit can be beaten to guide assembly 22 until complete the cutting work below it.Controller 7, according to the signal of input, carries out delayed start-up cutting motor 90, and the cutting equipment in the present invention is only opened when needs cutting, energy-efficient.
Claims (6)
1. an integrated circuit board processing device, is characterized in that: comprise for the immersed solder equipment of immersed solder bottom surface-mounted integrated circuit, cutting equipment (9), proximity switch (8), cylinder (6) and the controller (7) for electrical equipment component pin excision bottom surface-mounted integrated circuit;
Described immersed solder equipment comprising frame (2), carrying out immersed solder operating-controlling mechanism (1) and the aspirating air pipe (30) of immersed solder operation for clamping surface-mounted integrated circuit; Be provided with the working space of an opening towards front side in described frame (2), the frame (2) on front side of working space is provided with a table top; Frame (2) above described working space is provided with cross slide way (22), the frame below working space is provided with successively scaling powder atomizing device (3), pre-heating drying device (4) and immersed solder pond (5); Aspirating air pipe (30) is arranged on frame (2) and is communicated with described working space; Immersed solder operating-controlling mechanism (1) is movably connected on described cross slide way (22); Immersed solder operating-controlling mechanism (1) below is provided with one for clamping the cleat assembly (15) of surface-mounted integrated circuit;
Described cutting equipment (9) comprises the cutting pedestal (91), cutting motor (90), cutter plate (94) and the guide assembly (92) that are connected to frame (2) side; Described cutting motor (90) is arranged on upper and its output of cutting pedestal (91) upward, cutter plate (94) is horizontally fixed on cutting motor (90) output, and guide assembly (92) is in cutter plate (94) top; Described guide assembly (92) input is positioned on the side table top of immersed solder equipment, described cylinder (6) is fixed in the middle part of described table top, leaves the accommodation space of described cleat assembly (15) between described cylinder (6) output and guide assembly (92) input;
Described proximity switch (8) bag inductor part (81) and treat sensing part (80); Describedly treat that sensing part (80) is fixed on cleat assembly (15) side, inductor part (81) is fixed on the corresponding side of guide assembly (92);
Described inductor part (81) signal connection control device (7), controller (7) wherein output end signal connects cylinder (6), and another output connects cutting motor (90).
2. a kind of integrated circuit board processing device according to claim 1, is characterized in that: described immersed solder operating-controlling mechanism (1) comprising:
-be arranged on longitudinal extension guide rail (12) on cross slide way;
-be arranged on the first framework (10) on longitudinal extension guide rail (12);
-be in second framework (14) that also can move down in the first framework (10);
-connect the link assembly (13) of the first framework (10) and the second framework (14); And
-elastic stretching elastic (16);
Described first framework (10) top is provided with horizontal blend stop (101);
Described link assembly (13) is made up of balancing weight (135), balancing weight connecting rod (134), master connecting-rod (130) and handle connecting rod (131); It is inner that described balancing weight (135) is connected to master connecting-rod (130) by balancing weight connecting rod (134), and described handle connecting rod (131) is connected to master connecting-rod (130) outer end; Described second framework (14) is spacing under horizontal blend stop (101), and the middle part of the second framework (14) is hinged on master connecting-rod (130); The second framework (14) sidewall be positioned at outside hinged place is provided with guide vane end stop (141), and guide vane end stop (141) is positioned at described master connecting-rod (130) below; Described elastic stretching elastic (16) is connected between described first framework (10) outer end and the second framework (14) outer end, is parallel to described first framework (10) to make described second framework (14);
Described cleat assembly (15) is vertically fixed on the second framework (14) below.
3. a kind of integrated circuit board processing device according to claim 1, is characterized in that: the table top between described cylinder (6) output and guide assembly (92) input is provided with positive stop (60).
4. a kind of integrated circuit board processing device according to claim 2, it is characterized in that: described cleat assembly (15) is made up of pair of parallel strip clamping plate (150) and a pair connecting plate (151), connecting plate described in a pair (151) upper end is vertically fixed on the second framework (14), and lower end is fixedly connected with a pair strip clamping plate (150) respectively; Described in a pair, strip clamping plate (150) inner side is respectively equipped with corresponding groove (1501).
5. a kind of integrated circuit board processing device according to claim 2, is characterized in that: master connecting-rod (130) the inner in described link assembly (13) is hinged on the first framework (10) inner end; Described master connecting-rod (130) the inner is provided with on the folding surface (133) of a downward bending, and described balancing weight connecting rod (134) is fixedly connected on described master connecting-rod (130) by folding surface (133).
6. a kind of integrated circuit board processing device according to claim 1 and 2, is characterized in that: described guide assembly (92) is made up of pair of guide rails, is respectively equipped with corresponding guide groove (93) inside pair of guide rails; Upper a pair guide groove of guide assembly (92) (93) described in the Distance geometry of upper a pair groove of described cleat assembly (15) (1501) all matches with described surface-mounted integrated circuit width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410583883.3A CN104411112B (en) | 2014-10-27 | 2014-10-27 | A kind of integrated circuit board processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410583883.3A CN104411112B (en) | 2014-10-27 | 2014-10-27 | A kind of integrated circuit board processing device |
Publications (2)
| Publication Number | Publication Date |
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| CN104411112A true CN104411112A (en) | 2015-03-11 |
| CN104411112B CN104411112B (en) | 2018-01-12 |
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| CN201410583883.3A Active CN104411112B (en) | 2014-10-27 | 2014-10-27 | A kind of integrated circuit board processing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101306484A (en) * | 2007-05-18 | 2008-11-19 | 天津市松正电动科技有限公司 | Automatic welding device for flow line |
| CN102130410B (en) * | 2011-03-18 | 2012-10-10 | 常熟泓淋电子有限公司 | Knife edge heating lead coating transfer device |
| CN102689069B (en) * | 2012-06-01 | 2016-06-29 | 周秀兰 | A kind of automatic tin welding machine |
| CN203621696U (en) * | 2013-11-13 | 2014-06-04 | 中山实达丰电子电器有限公司 | Automatic-tin-dipping cutting machine for PCBs (printed circuit boards) |
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2014
- 2014-10-27 CN CN201410583883.3A patent/CN104411112B/en active Active
Non-Patent Citations (1)
| Title |
|---|
| 付家才: "《电子工程实践技术》", 30 September 2003 * |
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Effective date of registration: 20190718 Address after: Tiantai County Xinqiao village Taizhou city Zhejiang province 317203 Lei Feng Xiang 1 Group No. 98 Patentee after: Ding Wuxuan Address before: 325600 Zhejiang city of Wenzhou province Yueqing City Yuecheng Town Lake Ao Zhongyang road 37 Lane 2 Patentee before: Wang Hui |
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Effective date of registration: 20200324 Address after: 400800 Pingshan Industrial Park, Wansheng economic and Technological Development Zone, Qijiang District, Chongqing Patentee after: Chongqing teshun Electronic Co., Ltd Address before: Tiantai County Xinqiao village Taizhou city Zhejiang province 317203 Lei Feng Xiang 1 Group No. 98 Patentee before: Ding Wuxuan |