CN204257596U - A kind of semiconductor packages bonding die bonding wire special product checking tool - Google Patents
A kind of semiconductor packages bonding die bonding wire special product checking tool Download PDFInfo
- Publication number
- CN204257596U CN204257596U CN201420718352.6U CN201420718352U CN204257596U CN 204257596 U CN204257596 U CN 204257596U CN 201420718352 U CN201420718352 U CN 201420718352U CN 204257596 U CN204257596 U CN 204257596U
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- China
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- semiconductor packages
- bonding wire
- checking tool
- product
- special product
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Abstract
The utility model discloses a kind of semiconductor packages bonding die bonding wire special product checking tool, comprise base, with the vertically arranged column of base, the fixture that can move up and down along column, the microscope be fixed on fixture, described base is provided with substrate and plummer, and described substrate is positioned at immediately below described microscope camera lens.The utility model is in order to solve the problems of the technologies described above; provide bonding die, the special self-inspection instrument of bonding wire product of the exploitation of a kind of new design; can realize and protect the integrity of product; and can the sufficient product appearance of all-dimensional multi-angle check; thus do not have the blank of product self-inspection specific purpose tool before solving, and the many bad and product quality hidden danger occurred when not having special checking tool to check product before solving.
Description
Technical field
The utility model relates to semiconductor packages bonding die, bonding wire station, particularly relates to one and prevents product in extraction process of self-test owing to not having specific purpose tool to occur artificial damage phenomenon semiconductor packages bonding die bonding wire special product checking tool.
Background technology
In existing semiconductor die package process; extremely important in bonding die (Die bonding), bonding wire (wire bonding) protection of station to product; particularly field operation personnel are when production process carries out extraction self-inspection to product, very easily occur due to operation technique, hand shaking move, the not congruent series of problems of self-inspection angle causes product directly can occur bad and that excessive risk is bad quality hidden danger.Patent of the present invention has just carried out manufacturing and designing of special checking tool for this special train, thus solve with the generation of first-class bad phenomenon, the fail safe of specification field operation personnel's self test mode and self-inspection work and comprehensive, for the actual production enterprise being engaged in semiconductor packages bonding wire solves many cost allowances, and the stability of Improving The Quality of Products and subsequent applications reliability.
Utility model content
The utility model is in order to solve the problems of the technologies described above; the special self-inspection instrument of the bonding die providing a kind of new design to develop, bonding wire product; can realize and protect the integrity of product; and can the sufficient product appearance of all-dimensional multi-angle check; thus do not have the blank of product self-inspection specific purpose tool before solving, and the many bad and product quality hidden danger occurred when not having special checking tool to check product before solving.
The technical solution adopted in the utility model is:
A kind of semiconductor packages bonding die bonding wire special product checking tool, comprise base, with the vertically arranged column of base, the fixture that can move up and down along column, the microscope be fixed on fixture, described base is provided with substrate and plummer, and described substrate is positioned at immediately below described microscope camera lens.
Further, the left end of described fixture is provided with screwing bolts.
Further, described column is provided with spacing ring.
Further, on described plummer, left and right edges place is provided with block A and block B.
Further, the thickness L of described block A is 4 ~ 10mm, and the thickness M of described link stopper B is 2 ~ 5mm.
Further, the material of described plummer is antistatic bakelite.
Further, described substrate is provided with fixing block C and active block stop D.
Further, be provided with a projection below described active block stop D, described substrate surface has the groove of one and described male cooperation.
Further, the cross section of described active block stop D is right-angled trapezium, and the angle α of inclined-plane and bottom surface is 80 °.
Further, the thickness N of described block C is 2 ~ 5mm, and the thickness P of described active block stop D is 20 ~ 60mm.
The beneficial effects of the utility model are:
A kind of checking tool being specially adapted for semiconductor packages bonding die, the self-inspection of bonding wire work station product, first the carrying checked compatible all product design width, length dimension, secondly in order to promote convenience, the agility of this inspection instrument, be designed to product left and right entrance and exit type, increase block to prevent product in inspection, slide in moving process, shift out, plummer like the position finally adjusting active block stop becomes can overlook inspection product from 0 ° ~ 80 ° free adjustment are comprehensive.Standardization, standardization semiconductor packages bonding die, bonding wire work station product self-inspection work, the comprehensive fixing and position of limits product in checking tool, arrive our all-dimensional multi-angle and carefully check product appearance, for the actual production enterprise being engaged in semiconductor packages bonding wire solves many cost allowances, and improve stability and the subsequent applications reliability of product quality.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation.
Fig. 2 is plummer structure intention in the utility model.
Fig. 3 is board structure intention in the utility model.
Fig. 4 is active block stop D structural representation in the utility model.
Embodiment
In order to make the advantage of the purpose of this utility model and technical scheme clearly understand, below in conjunction with accompanying drawing and example, the utility model is further elaborated.
A kind of semiconductor packages bonding die bonding wire special product checking tool as shown in Figure 1, comprise base 1, with the vertically arranged column 2 of base 1, the fixture 3 that can move up and down along column 2, the microscope 4 be fixed on fixture 3, described base 1 is provided with substrate 5 and plummer 6, and described substrate 5 is positioned at immediately below described microscope 4 camera lens.Encapsulation bonding die bonding wire product 9 to be detected is placed on plummer 6, by microscope 4, microcosmic amplification detection is carried out to it.The left end of described fixture 3 is provided with screwing bolts 7, in order to position adjust microscope 4 position after, by fixed for fixture 3.Described column 2 is provided with spacing ring 8, the distance that restriction microscope 4 moves down, and is protected the camera lens of microscope 4.
As shown in Figure 2, on described plummer 6, left and right edges place is provided with block A61 and block B62.The thickness L of described block A61 is 4 ~ 10mm, and the thickness M of described link stopper B62 is 2 ~ 5mm.The material of described plummer 6 is antistatic bakelite.Encapsulation bonding die bonding wire product 9 to be detected to be placed on plummer 6 between two pieces of blocks, can prevent and treat that encapsulation bonding die bonding wire product 9 to be detected checks, slides in moving process, shift out, cause ill effect.The Thickness Ratio block B62 of block A61 is large.Control is when plummer 6 tilts, and encapsulation bonding die bonding wire product 9 to be detected does not come off, and block B62 can not impact field of view.
As shown in figures 3 and 4, described substrate 5 is provided with fixing block C51 and active block stop D52.Be provided with a projection 53 below described active block stop D52, described substrate 5 surface have one with described protruding 53 grooves coordinated 54, described active block stop D52 can be movable thus adjust to the angle of inclination of plummer 6 along groove 554.The cross section of described active block stop D52 is right-angled trapezium, and the angle α of inclined-plane and bottom surface is 80 °, and the inclination maximum of plummer 6 is 80 °, can observe from 0 ° ~ 80 ° free adjustment are comprehensive to encapsulation bonding die bonding wire product 9 to be detected.The thickness N of described block C51 is 2 ~ 5mm, and the thickness P of described active block stop D52 is 20 ~ 60mm.Described block C51 plays the effect of fixed pivot, and active block stop D52 plays the effect of moving fulcrum, to regulate the inclination angle of plummer 6.
The carrying that first the utility model checks compatible all product design width, length dimension, secondly in order to promote convenience, the agility of this inspection instrument, be designed to product left and right entrance and exit type, increase block to prevent product in inspection, slide in moving process, shift out, plummer like the position finally adjusting active block stop becomes can overlook inspection product from 0 ° ~ 80 ° free adjustment are comprehensive.Standardization, standardization semiconductor packages bonding die, bonding wire work station product self-inspection work, the comprehensive fixing and position of limits product in checking tool, arrive our all-dimensional multi-angle and carefully check product appearance, for the actual production enterprise being engaged in semiconductor packages bonding wire solves many cost allowances, and improve stability and the subsequent applications reliability of product quality.
Claims (10)
1. a semiconductor packages bonding die bonding wire special product checking tool, it is characterized in that: comprise base (1), with base (1) vertically arranged column (2), the fixture (3) that can move up and down along column (2), the microscope (4) be fixed on fixture (3), described base (1) is provided with substrate (5) and plummer (6), and described substrate (5) is positioned at immediately below described microscope (4) camera lens.
2. a kind of semiconductor packages bonding die bonding wire special product checking tool according to claim 1, is characterized in that: the left end of described fixture (3) is provided with screwing bolts (7).
3. a kind of semiconductor packages bonding die bonding wire special product checking tool according to claim 1, is characterized in that: described column (2) is provided with spacing ring (8).
4. a kind of semiconductor packages bonding die bonding wire special product checking tool according to claim 1, is characterized in that: the upper left and right edges place of described plummer (6) is provided with block A(61) and block B(62).
5. a kind of semiconductor packages bonding die bonding wire special product checking tool according to claim 4, is characterized in that: described block A(61) thickness L be 4 ~ 10mm, described link stopper B(62) thickness M be 2 ~ 5mm.
6. a kind of semiconductor packages bonding die bonding wire special product checking tool according to claim 1, is characterized in that: the material of described plummer (6) is antistatic bakelite.
7. a kind of semiconductor packages bonding die bonding wire special product checking tool according to claim 1, is characterized in that: described substrate (5) is provided with fixing block C(51) and active block stop D(52).
8. a kind of semiconductor packages bonding die bonding wire special product checking tool according to claim 7, it is characterized in that: described active block stop D(52) below be provided with a projection (53), described substrate (5) surface has a groove (54) coordinated with described projection (53).
9. a kind of semiconductor packages bonding die bonding wire special product checking tool according to claim 7 or 8, is characterized in that: described active block stop D(52) cross section be right-angled trapezium, the angle α of inclined-plane and bottom surface is 80 °.
10. a kind of semiconductor packages bonding die bonding wire special product checking tool according to claim 7, is characterized in that: described block C(51) thickness N be 2 ~ 5mm, described active block stop D(52) thickness P be 20 ~ 60mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420718352.6U CN204257596U (en) | 2014-11-26 | 2014-11-26 | A kind of semiconductor packages bonding die bonding wire special product checking tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420718352.6U CN204257596U (en) | 2014-11-26 | 2014-11-26 | A kind of semiconductor packages bonding die bonding wire special product checking tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204257596U true CN204257596U (en) | 2015-04-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420718352.6U Expired - Fee Related CN204257596U (en) | 2014-11-26 | 2014-11-26 | A kind of semiconductor packages bonding die bonding wire special product checking tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204257596U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104810251A (en) * | 2015-04-29 | 2015-07-29 | 海太半导体（无锡）有限公司 | Semiconductor packaging technology |
-
2014
- 2014-11-26 CN CN201420718352.6U patent/CN204257596U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104810251A (en) * | 2015-04-29 | 2015-07-29 | 海太半导体（无锡）有限公司 | Semiconductor packaging technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150408 Termination date: 20151126 |