CN204255566U - 密封板及使用该密封板的变送器 - Google Patents
密封板及使用该密封板的变送器 Download PDFInfo
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- H01R12/50—Fixed connections
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Abstract
一种密封板包括具有过孔的电路板、导电插脚以及钎焊接头。所述钎焊接头将各个导电插脚连接和密封到单个过孔,从而各个导电插脚延伸通过过孔并且自所述电路板的第一侧和所述电路板的第二侧延伸。所述密封板被安装以盖住将第一腔体(诸如接线板腔体)与第二腔体(诸如电子器件或零件板腔体)隔开的隔离件中的开口。所述密封板在所述腔体之间提供电路径,同时使得所述腔体中的一个的部件免受周围环境的影响。
Description
技术领域
本实用新型总体上涉及用在工业过程中的现场设备。具体地,本实用新型涉及用于诸如工业过程压力变送器等的现场设备的密封板。
背景技术
压力变送器可以被安装成靠近过程并且可被用于测量与工业过程相关的流体压力。压力变送器也能够被用于间接地测量其他参数,诸如速度、流体高度、海拔和流体流量。测得的过程流体压力能够被传送到主机、控制器或其他设备以保证工业过程被监控和控制。
一些压力变送器具有被分成两个腔体的外壳,即,用于端子装置部件的接线板腔体和用于主动电子组件(零件板)的电子腔体被隔离件隔开。接线板腔体允许用户接触到端子装置处的电连接,同时电子腔体使得零件板免受周围环境影响。来自一个腔体的信号经由隔离件被传递到另一腔体。存在如下的需求:使得信号电隔离,并且防止任何外部电子噪音(EMI)进入到电子腔体,同时还在两个腔体之间提供环境密封。具体地,期望一种成本合算的方法以将更大数量(即,更高密度)的独立电信号传送通过隔离件,同时还在彼此之间提供电隔离并且提供壳体密封。一种用于降低EMI噪音的现行技术是使用复杂的冲压焊接射频干扰过滤管组件,该组件使用金属冲压、陶瓷过滤体和环氧封装。该冲压焊接射频干扰过滤管组件的制造难且成本高。另一可选方案使用独立的拧入过滤组件。
实用新型内容
在一个实施方式中,密封板包括电路板、导电插脚和钎焊接头。所述电路板包括第一侧、第二侧、外周和过孔(或通孔)。所述钎焊接头将各个导电插脚连接和密封到单个过孔,使得各个导电插脚延伸通过所述 过孔并且自所述电路板的第一侧和所述电路板的第二侧延伸。
在本实用新型的实施方式中,还包括密封件,所述密封件与所述电路板组件的第一侧接触。
另一实施方式是变送器,所述变送器用于感知和测量过程变量并且将信息传递到控制器。所述变送器包括壳体和密封板。所述壳体包括第一腔体、第二腔体、使得第一腔体和第二腔体隔开的隔离件以及所述隔离件中的位于所述第一腔体和第二腔体之间的开口。所述密封板被定位成使得其盖住和密封所述第一腔体和第二腔体之间的开口。所述密封板包括电路板、导电插脚和钎焊接头。所述电路板包括第一侧、第二侧、外周和过孔。各个导电插脚具有自所述电路板的第一侧延伸的第一端和自所述电路板的第二侧延伸的第二端。所述钎焊接头将各个导电插脚连接和密封到单个过孔,使得各个导电插脚延伸通过所述过孔并且自所述电路板的第一侧和所述电路板的第二侧延伸。在本实用新型的实施方式中,还包括密封件,所述密封件被压缩在所述隔离件和所述电路板的第一侧之间。
附图说明
图1是变送器的立体图。
图2是图1中的变送器的密封板的立体图。
图3是示出安装到图1中的压力变送器的壳体隔离件的密封板的剖面图。
图4A是过孔的剖面图。
图4B是示出过孔的剖面图,其中该过孔中插入有导电插脚并且被焊接到正确位置。
具体实施方式
图1是根据本实用新型的一个实施方式的包括壳体12和密封板14的变送器10的立体图。图2是与变送器20脱离的密封板14的立体图。图1和图2将被一起讨论。
根据该实施方式,壳体12包括第一腔体(接线板腔体16),分隔壁(具有开口18A和颈部18B的隔离件18)和第二腔体(电子器件或零件板腔体20)。附接到壳体12以闭合腔体16和20的盖体已经被移除了,在图1中并未示出。
密封板14包括印刷电路板22、导电插脚24、钎焊接头26和电容器28。电路板22包括过孔30(在图1和图2中以虚线示出)以及锚定孔32。
隔离件18将接线板腔体16和零件板腔体20隔开。隔离件18的颈部18B延伸到零件板腔体20并且在其远端具有开口18A。在如图1所示的实施方式中,密封板14被安装到颈部18B的远端从而其盖住隔离件18的开口18A。在图1中,将密封板14部分移开可以示出开口18A。O环34位于密封板14和隔离件18的颈部18B之间以围绕密封板的外周从而在环境上使得接线板腔体16与零件板腔体20隔开。锚定孔32位于密封板14的外周并且能够与隔离件18中的相应的配合孔一起使用以使用螺钉来将密封板14固定到隔离件18。在电路板组件22中,过孔30位于密封板14的中心区域附近。钎焊接头26将各个导电插脚24连接和密封到单个过孔30从而各个导电插脚24延伸通过过孔30。钎焊接头26既物理上将导电插脚24锚定到密封板14,也环境上密封导电插脚24。密封板14的印刷电路板材料允许插脚24彼此电绝缘并且也与壳体12电绝缘。
印刷电路板22上的电容器28是提供EMI过滤的表面安装式(SMD)片状电容器。该过滤防止不需要的信号噪音在腔体16和20之间传播,并且防止这些信号噪音影响腔体20中的电子组件(零件板等)的性能。
当使用变送器10时,压力被位于零件板腔体20中的压力传感器(未示出)感知到。来自压力传感器的传感器电信号然后经由密封板14从零件板腔体20传递到接线板腔体16。经由延伸通过过孔30的导电插脚24来传递电信号可完成上述的操作。如图2和3所示,导电插脚24具有延伸到接线板腔体16中的第一端24A和延伸到零件板腔体20中的第二端。
根据一个实施方式,密封板14将接线板腔体16环境上与零件板腔 体20隔离。密封板14与通过钎焊接头26而被密封到适当位置的导电插脚24相结合,从而在不允许一个腔体中的环境条件影响另一腔体中的电部件的情况下,允许电子信号在腔体16和20之间传递。该设计提供了一个成本合算的方法以使得更大数量的独立电信号传递通过隔离件18,同时还提供环境上的密封以包装准确且精确的测量,并且允许安装提供诸如EMI过滤的其他功能的部件。
图3是变送器10的局部剖面图,其示出了壳体12中的密封板14。变送器10包括壳体12和密封板14。壳体12包括接线板腔体16、隔离件18和零件板腔体20。隔离件18包括与密封板14的锚定孔32对齐的隔离配合孔36。密封板14包括电路板22、导电插脚24、钎焊接头26和表面安装式电容器28。电路板22包括过孔30以及锚定孔32。钎焊接头26将导电插脚24连接和密封到单个过孔30从而各个导电插脚24延伸通过过孔30,其中各个导电插脚24的第一端24A从电路板22的第一侧向接线板腔体16延伸,并且各个导电插脚24的第二端24B从电路板22的第二侧向零件板腔体20延伸。该布置允许信号在接线板腔体16和零件板腔体20之间被传递,同时还提供环境密封。适配装置38被放置在隔离件18的颈部中并且接收导电插脚24的端部24A。适配装置38包括针脚引导件40和适配盖体42。端子装置44包括插脚接收体46以及保持和提供到插脚接收体46的电连接的电路板48。针脚引导件40和适配盖体42保护导电插脚24的导电插脚端部24A并将其引导至端子装置44中的插脚接收体46。适配装置38允许密封板14被连接到尺寸可变的端子装置44。
图4A是多层电路板22中的过孔30的剖面图。在示出的实施方式中,过孔30包括通孔100、电镀套管102和导电垫104。多层电路板22包括第一绝缘材料层110、第一嵌入接地板112、第二绝缘材料层114、第二嵌入接地板116、第三绝缘材料层118、外部粘合带120、接地板隔离间隙122以及内部连接层124。过孔套管粘合物包括导电垫金属至金属结合物126和内部金属至金属结合物128。第一接地板112被嵌入在第一层110和第二层114之间,第二接地板116被嵌入在第二层114和 第三层118之间。第一接地板112和第二接地板116通过接地板隔离间隙122和内部连接层124而与电镀套管102分开,其中内部连接层124处于接地板隔离间隙122和电镀套管102之间。这样使得电镀套管102与接地板112和116分开。
根据该实施方式,电镀套管102位于通孔100中,并且电镀套管102从第一层110的顶部到第三层118的底部且不包括多层印刷电路板22的中部附近的具有内部金属至金属结合物128的部分,利用金属化的聚合物粘结物而被附接到多层印刷电路板22。导电垫104自电镀套管102的端部径向地延伸以提供较长的泄露路径(leak path)。导电垫104附接到大约与其等半径的外部粘合带120,该外部粘合带120位于多层印刷电路板22的外层的靠近电镀套管102的边缘上。使用金属至金属结合物而将导电垫104附接到外部粘合带120。
过孔30与现有技术相比具有较长的泄露路径,使得泄露不太可能形成。因此,导电垫金属至金属结合物126以及内部金属至金属结合物128不仅增加了泄露路径长度,而且还提供比标准过孔结构更强的粘合。更强的粘合防止过孔30在热循环过程中上升或解散(lifting)。通过将接地板隔离间隙(环形体)122移离电镀套管102并且包括内部连接层124可以达到上述的效果。隔离间隙122允许电镀套管102与多层印刷电路板的电接地板112和114隔离。增加第二接地板不会增加额外的成本。
使用上述设计而构造的过孔30具有多个优点。第一,该过孔30因为增加的金属至金属结合物在初始安装时和过度热循环之后都降低了在通孔100周围形成泄露的可能性。使用此设计而构造的过孔30已经显示为满足4000个周期以上的热循环,在这些循环中,当在-50℃和110℃之间循环时在过孔周围不发生泄露。
图4B示出了放置在过孔30中的导电插脚24,从而该导电插脚24自过孔30的两侧延伸,并且利用钎焊接头26而在多层印刷电路板22的两侧被密封到合适的位置。可选地,一些过孔30能够利用钎焊而被完全密封。
本实用新型的多种其他实施方式也包括使用不同的锚定技术以将密 封板14附接到壳体12。此外,可以使用诸如径向密封件或者传统的橡胶平面垫圈28等不同的密封件以替换O环。
虽然已经参考工业过程设备描述了本实用新型的实施方式,但是本实用新型的实施方式也适用于自动化和通信工业中的设备和具有被放置在多个腔体中的电子连接器的其他任何电子设备。
此外,根据多数设计变化能够使用本实用新型的实施方式,诸如印刷电路板的一侧或两侧上的可分离连接器,附接在印刷电路板的一侧或两侧上的用于永久电连接的导线,其中固体导线或绞合导线能够被用作导电插脚24,以及插脚能够被环氧化或注塑在合适的位置而不是使用电路板。
虽然已经参考示例实施方式说明了本实用新型,但是本领域的技术人员应当理解能够进行多种改变,并且等价物在不脱离本实用新型的范围的情况下能够替代本实用新型的元件。另外,根据本实用新型的启示,在不脱离本实用新型的基本范围的情况下可进行多种修改以适应特定的情况或材料。因此,意图说明本实用新型不限于公开的特定实施方式,而是本实用新型将包括落在所附权利要求的范围之内的所有实施方式。
Claims (19)
1.一种密封板,包括:
电路板,所述电路板包括:
第一侧;
第二侧;
外周;以及
多个过孔;
多个导电插脚;以及
多个钎焊接头,所述钎焊接头将各个导电插脚连接和密封到单个过孔,使得各个导电插脚延伸通过所述过孔并且自所述电路板的第一侧和所述电路板的第二侧延伸。
2.如权利要求1所述的密封板,还包括:
多个片状电容器,其被附接到所述电路板以使得电子噪音降低。
3.如权利要求1所述的密封板,其中,利用焊料密封所述过孔。
4.如权利要求1所述的密封板,其中,所述电路板还包括:
多个绝缘材料层;
内部连接层;
围绕所述过孔的外端的外部粘合带;以及
位于所述多个绝缘材料层中的第一嵌入接地板,所述第一嵌入接地板与各个过孔电隔离。
5.如权利要求4所述的密封板,还包括:
位于所述多个绝缘材料层中并且与所述第一嵌入接地板平行的第二嵌入接地板,所述第二嵌入接地板与各个过孔电隔离。
6.如权利要求4所述的密封板,其中,各个过孔包括:
电镀套管,所述电镀套管利用金属至金属结合物而被连接到所述电路板的内部连接层;以及
导电垫,所述导电垫自所述电镀套管延伸并且覆盖所述外部粘合带。
7.如权利要求4所述的密封板,其中,所述电路板还包括:
多个锚定孔,所述多个锚定孔在所述电路板的外周中以接收多个紧固件。
8.如权利要求4所述的密封板,还包括:
密封件,所述密封件与所述电路板组件的第一侧接触。
9.一种变送器,所述变送器包括:
壳体,所述壳体包括:
第一腔体;
第二腔体;
隔离件,所述隔离件使得所述壳体中的所述第一腔体和第二腔体分开;以及
所述隔离件中的开口,所述开口位于所述第一腔体和第二腔体之间;以及
密封板,所述密封板盖住所述隔离件中的开口并且使得所述第二腔体与所述第一腔体密封隔开,所述密封板包括;
电路板,所述电路板包括面对所述第一腔体的第一侧,面对所述第二腔体的第二侧,外周以及多个过孔;
多个导电插脚,各个导电插脚具有从所述电路板的第一侧延伸到所述第一腔体中的第一端以及从所述电路板的第二侧延伸到所述第二腔体中的第二端;以及
多个钎焊接头,所述钎焊接头将各个导电插脚连接和密封到单个过孔,使得各个导电插脚延伸通过所述过孔并且提供所述第一腔体和第二腔体之间的电路径。
10.如权利要求9所述的变送器,其中,所述第一腔体是接线板腔体,所述第二腔体是零件板腔体。
11.如权利要求10所述的变送器,还包括:
多个片状电容器,所述片状电容器被附接到所述电路板的表面并且被连接到所述导电插脚以过滤RFI噪音。
12.如权利要求10所述的变送器,其中,各个过孔通过焊接接头被连接和密封到所述导电插脚中的一个。
13.如权利要求10所述的变送器,其中,所述电路板还包括:
多个绝缘材料层;
内部连接层;以及
位于所述多个绝缘材料层中的第一嵌入接地板,所述第一嵌入接地板与各个过孔和所述内部连接层电隔离。
14.如权利要求13所述的变送器,其中,所述电路板还包括:
位于所述多个绝缘材料层中的并且与所述第一嵌入接地板平行的第二嵌入接地板,所述第二嵌入接地板与各个过孔和所述内部连接层电隔离。
15.如权利要求13所述的变送器,其中,每个过孔包括:
电镀套管,所述电镀套管利用金属至金属结合物而被连接到所述电路板的内部连接层;以及
导电垫,所述导电垫从所述电镀套管径向向外延伸。
16.如权利要求15所述的变送器,其中,所述电路板包括围绕各个过孔的外部粘合带,其中所述导电垫覆盖所述粘合带并且被粘合到所述粘合带。
17.如权利要求9所述的变送器,其中,所述电路板还包括:
多个锚定孔,所述多个锚定孔位于所述电路板的外周中并且位于与所述隔离件中的配合孔相对应的位置处以用于接收紧固件,所述紧固件延伸通过所述电路板的外周的所述多个锚定孔以将所述电路板连接到所述隔离件。
18.如权利要求9所述的变送器,还包括:
适配装置,所述适配装置靠近所述电路板的第一侧,用于引导所述导电插脚的第一端与容纳在所述第一腔体中的部件接合。
19.如权利要求9所述的变送器,还包括:
密封件,所述密封件被压缩在所述隔离件和所述电路板的第一侧之间。
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US10663931B2 (en) | 2013-09-24 | 2020-05-26 | Rosemount Inc. | Process variable transmitter with dual compartment housing |
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US10663931B2 (en) | 2013-09-24 | 2020-05-26 | Rosemount Inc. | Process variable transmitter with dual compartment housing |
US9971316B2 (en) | 2013-09-30 | 2018-05-15 | Rosemount Inc. | Process variable transmitter with dual compartment housing |
WO2017003631A1 (en) * | 2015-06-29 | 2017-01-05 | Rosemount Inc. | Terminal block with sealed interconnect system |
US10015899B2 (en) | 2015-06-29 | 2018-07-03 | Rosemount Inc. | Terminal block with sealed interconnect system |
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