CN204227114U - Lamp - Google Patents
Lamp Download PDFInfo
- Publication number
- CN204227114U CN204227114U CN201420673735.6U CN201420673735U CN204227114U CN 204227114 U CN204227114 U CN 204227114U CN 201420673735 U CN201420673735 U CN 201420673735U CN 204227114 U CN204227114 U CN 204227114U
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- CN
- China
- Prior art keywords
- substrate
- lamp
- hole
- circuit
- end side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
- F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The utility model provides a kind of lamp, comprising: as the radiator of the housing of the hollow of end side opening; Substrate, has through hole in central authorities, and is arranged on the end side of radiator; Multiple semiconductor light-emitting elements, substrate end side and to be arranged to circle-shaped along the mode of through hole; Lamp circuit, has circuit substrate and is arranged on the circuit component comprising heating part on circuit substrate, and to be arranged on the inside of radiator in the mode being positioned at the region of through hole from heating part during end side observation radiator; And lamp holder, be arranged on another side of radiator.The utility model can reduce the temperature of lamp circuit.
Description
The application based on and advocate priority and the right of No. 2014-006376, the Japanese patent application case of filing an application on January 17th, 2014, the full text of described application case is incorporated to herein by reference.
Technical field
Embodiment of the present utility model relates to a kind of lamp.
Background technology
Such as in illumination or display purposes, use following lamp, this lamp utilizes the luminescence of the semiconductors such as light emitting diode.This lamp comprises semiconductor light-emitting elements, to the lamp circuit of semiconductor light-emitting elements supply electric power and the component etc. of collecting semiconductor light-emitting elements or lamp circuit.
As everyone knows, semiconductor light-emitting elements is because having the long-life, so the life-span of this kind of lamp is longer than the life-span of the lamps such as existing bulb.But because lamp circuit is than the semiconductor light-emitting elements FEFO life-span, thus lamp reaches service life.The life-span of lamp circuit depends on the temperature of the circuit member of the lamp circuit in lighting, thus expects that the temperature of the lamp circuit in lighting is low.
Utility model content
[problem to be solved]
The utility model for solve problem be to provide a kind of lamp reducing the temperature of lamp circuit.
[means of dealing with problems]
In order to reach described problem, the lamp of embodiment comprises: the housing of the hollow of end side opening; Substrate, has through hole in central authorities, and is arranged on the end side of described housing; Multiple semiconductor light-emitting elements, described substrate end side and to be arranged to circle-shaped along the mode of described through hole; Lamp circuit, has circuit substrate and is arranged on the circuit component comprising heating part on described circuit substrate, and be positioned at the mode in the region of described through hole with heating part described when observing described housing from end side, be arranged on the inside of described housing; And power supply, be arranged on another side of described housing.
Lamp according to technical scheme 1, is characterized in that: the size of described through hole is set to L, the width of described circuit substrate is when being set to W, and L/W is more than 0.6.
Lamp according to technical scheme 1, is characterized in that: the size of described through hole is set to L, the width of described circuit substrate is when being set to W, and L/W is more than 0.75.
Lamp according to technical scheme 1, is characterized in that: the size of described through hole is set to L, the width of described circuit substrate is when being set to W, and L/W is less than 1.4.
Lamp according to technical scheme 1, is characterized in that: be installed with the substrate being provided with described multiple semiconductor light-emitting elements or the heat sink being provided with this substrate at the substrate installation portion of the housing of described hollow.
Lamp according to technical scheme 1, it is characterized in that: described substrate is arranged on heat sink, described heat sink has through hole in central authorities, and the mode be communicated with the described through hole of described substrate with the described through hole of described heat sink is arranged on the end side of described housing.
Lamp according to technical scheme 1, is characterized in that: described through hole is communicated with the housing of hollow.
Lamp according to technical scheme 1, is characterized in that: on described through hole, arrange lid (cover) component, described lid component has protuberance, and described protuberance is outstanding and be positioned near described lamp circuit to the direction of described power supply.
Lamp according to technical scheme 8, is characterized in that: described circuit substrate is configured at the inside of described housing along the mode of lamp axle with the face of installing described circuit component, the distance D of described protuberance and described circuit substrate is below 3mm.
Lamp according to technical scheme 8, is characterized in that: the thermal conductivity of described lid component is lower than the thermal conductivity of the substrate arranging described multiple semiconductor light-emitting elements or the heat sink that arranges this substrate.
[effect of utility model]
According to the utility model, the temperature of lamp circuit can be reduced.
Accompanying drawing explanation
Fig. 1 is the figure of the lamp that the first embodiment is described.
Fig. 2 is the figure of the outward appearance of the lamp that the first embodiment is described.
Fig. 3 A ~ Fig. 3 B is the figure in order to the state of observing the lamp of the first embodiment from the end side of housing to be described, Fig. 3 A is the state of lampshade, substrate and heat sink being removed, and Fig. 3 B is the state of being removed by lampshade.
Fig. 4 A ~ Fig. 4 C is the figure of the temperature contrast that the lamp of the first embodiment and the lamp circuit of existing lamp are described.
Fig. 5 is the figure of the section of the lamp that the first embodiment is described.
Fig. 6 is the figure of the lamp that the second embodiment is described.
Fig. 7 A ~ Fig. 7 C is the figure of the variations in temperature of lamp circuit when changing the shape of lid component in the lamp that the second embodiment is described.
Fig. 8 is the figure of another example of the lamp that present embodiment is described.
Reference numeral:
1: radiator
2: heat sink
3: substrate
4：LED
5: lampshade
6: resin-case (insulation shell)
7: lamp circuit
9: lid component
11: substrate installation portion
12: perisporium
13: outstanding wall
14: groove
15: otch
16: boss portion
17: screw
21,31: protuberance
22,32: screw
33: connector support portion
51: top
52: basal part
53: projection
61: body
62: protuberance
63: recess
64: wall in opposite directions
65: projection
71: circuit substrate
72: circuit component
73: connector
81: lamp holder
82: dead ring
91: installation portion
92: protuberance
721: heating part
722: non-heating part
A, B: place
D: the distance of protuberance and circuit substrate
L: the size of through hole
W: the width of circuit substrate
Detailed description of the invention
According to described situation, present embodiment provides the lamp of the temperature that can reduce lamp circuit.
The lamp of embodiment comprises: the housing of the hollow of end side opening; Substrate, has through hole in central authorities, and is arranged on the end side of described housing; Multiple semiconductor light-emitting elements, described substrate end side and to be arranged to circle-shaped along the mode of described through hole; Lamp circuit, has circuit substrate and is arranged on the circuit component comprising heating part on described circuit substrate, and be positioned at the mode in the region of described through hole with heating part described when observing described housing from end side, be arranged on the inside of described housing; And power supply, be arranged on another side of described housing.
(the first embodiment)
With reference to Fig. 1 ~ Fig. 3 A and Fig. 3 B, the first embodiment is described.
To be the figure that the figure of the lamp that the first embodiment is described, Fig. 2 are the outward appearance of the lamp that the first embodiment is described, Fig. 3 A ~ Fig. 3 B be Fig. 1 in order to the figure of the state of observing the lamp of the first embodiment from the end side of housing to be described.
The lamp of present embodiment is for throwing light on or showing light emitting diode (the light-Emitting Diode of purposes, LED) lamp, comprises radiator 1, heat sink 2, substrate 3, LED4, lampshade 5, resin-case 6 (insulation shell), lamp circuit 7, lamp holder 81 and dead ring 82.In addition, in present embodiment, with regard to the central shaft of lamp, be that direction when observing from lamp holder 81 residing for lampshade 5 is called end side, direction when observing from lampshade 5 residing for lamp holder 81 is called another side to be described.
Radiator 1 is the housing of following hollow, that is, comprise the material of excellent thermal conductivity, such as aluminium or pottery, resin etc., and at one end side has opening.Around the opening of the end side of radiator 1, form smooth substrate installation portion 11, and then around this substrate installation portion 11, form the perisporium 12 outstanding to an extreme direction.Perisporium 12 is formed the outstanding wall 13 of the ring-type that internally direction in space is given prominence to, between outstanding wall 13 and substrate installation portion 11, forms the groove 14 of ring-type.And on outstanding wall 13,4 otch 15 with 90 degree of gap-formings, this otch 15 is connected with the groove 14 of ring-type.In the side, inner space of radiator 1,3 from the inwall of radiator 1 boss portion 16 outstanding to center direction with 120 degree of gap-formings.Boss portion 16 is formed as same plane with the face of the end side of substrate installation portion 11.Screw 17 is formed in the end side of boss portion 16.
Heat sink 2 for comprising the material of excellent thermal conductivity, the thin plate of the metals such as such as aluminium.Heat sink 2 forms through hole in central authorities, in the inner wall section of this through hole, 4 protuberances 21 outstanding to center direction with 90 degree of gap-formings.This protuberance 21 is formed screw (not shown).And in this heat sink 2, form screw (not shown) in the position corresponding with screw 17 of heat sink 2, be screwed into by screw 22 in these screws, heat sink 2 can be arranged on substrate installation portion 11 with heat conduction thus.
Substrate 3 for comprising the material of excellent thermal conductivity, the thin plate of such as aluminium or pottery.Substrate 3 forms through hole in central authorities, in the inner wall section of this through hole, 4 protuberances 31 outstanding to center direction with 90 degree of gap-formings in the same manner as the protuberance 21 of heat sink 2.On protuberance 31, formed accordingly with the otch inserted for screw (not shown) with the screw of the protuberance 21 of heat sink 2, by being screwed in this otch and screw by screw 32, and substrate 3 can be arranged on heat sink 2 with heat conduction.In addition, connector support portion 33 is set in the end side of substrate 3.The through hole of substrate 3, heat sink 2 is communicated with the radiator 1 of the housing as hollow.
LED 4 is for being referred to as the semiconductor light-emitting elements of so-called light emitting diode.Specifically, be following light emitting diode, that is, the packaging bodies such as resin installed the luminescence chip sending blue light, and be coated to yellow luminescent coating in the mode covering this luminescence chip.In present embodiment, in the end side of substrate 21 by 27 LED 4 at substantially equal intervals to be mounted to circle-shaped along the mode of through hole.
Lampshade 5 is the lid of the transparent or milky light transmission based on Merlon.Lampshade 5 is spherical, engages form in its maximum diameter portion.Specifically, hemispheric top 51 and the basal part 52 of expanding shape such as utilize ultrasonic fusing and integrated.In the inner side of another side of the basal part 52 of lampshade 5,4 width projection 53 slightly less than the otch 15 of radiator 1 with 90 degree of gap-formings, rotate in groove 14 via otch 15, projection 53 is clamped by substrate installation portion 11 and outstanding wall 13 thus, thus lampshade 5 is held in radiator 1.
Insulation shell 6 is such as comprise the housing of the excellent and thermal conductivity of the electrical insulating property such as polybutylene terephthalate (PBT) lower than the material of metal.Insulation shell 6 has body 61 and protuberance 62.Body 61 therein side, space has 3 recesses 63 with 120 degree of intervals.This recess 63 is corresponding with boss portion 16, and namely recess 63 is embedded in boss portion 16, is configured at by body 61 thus in the inner space of radiator 1.And body 61 therein side, space forms wall 64 in opposite directions.Wall 64 is formed with a pair in opposite directions, and the line linked each other in the space in opposite directions between wall 64 is relative to the misalignment of body 61.Protuberance 62 is formed at another side of body 61, and configures in the mode that the outward opening portion of another side from radiator 1 is outstanding.Spiral helicine projection 65 is formed in the outer surface part outstanding from radiator 1.
Lamp circuit 7 is in order to the circuit to light emitting module supply required electric power, and is contained in the inside of insulation shell 6.Lamp circuit 7 comprises: the circuit substrate 71 arranging the metal wiring of regulation on the substrate with electrical insulating property of epoxy resin etc., is arranged on the circuit component 72 on circuit substrate 71, and is connected to the connector 73 of connector support portion 33.Circuit component 72 comprises: transformer (trans), field-effect transistor (Field-Effect Transistor, the heating part 721 of switch element etc. such as FET), and the non-heating part 722 such as the capacitor that heating is relatively less compared to heating part 721.Lamp circuit 7 by circuit substrate 71 being held in a pair of insulation shell 6 wall 64 in opposite directions, and is configured at the inside of insulation shell 6 along the mode of lamp axle with the face of mounting circuit part 72.Now, the part 721 that at least generates heat is positioned at the region of the through hole of substrate 2 when end side observes radiator 1.
Lamp holder 81, for being provided to the power supply of the lamp socket of utensil, is arranged on the other end of lamp, and is electrically connected with lamp circuit 7.Lamp holder 81 comprises: the spiral helicine metallic member and the helical form portion that are formed at the side of lamp holder 81, be formed at metallic member and the eyelet (eyelet) of the bottom surface of lamp holder 81, and be arranged between helical form portion and eyelet and by them part of electric insulation and insulation division (not shown) each other.
Dead ring 82, for comprising the annular component of the component with insulating properties, is arranged on the peripheral part of the protuberance 62 of insulation shell 6 in the mode between radiator 1 and lamp holder 81.
According to the present embodiment, the temperature of lamp circuit can be reduced.
With regard to the lamp of present embodiment, if utilize external power source to supply alternating electromotive force to lamp holder 81, then utilize lamp circuit 7 to carry out rectification and carry out DC-to-dc (DC-DC) conversion, and direct current power is supplied to LED 4.Thus, LED 4 lighting, LED 4 and lamp circuit 7 generate heat thereupon.The heat produced by LED 4 to be delivered to via substrate 3 and heat sink 2 in radiator 1 and to be dispelled the heat, because arranging through hole in the central authorities of heat sink 2 and substrate 3, so heat is only transmitted in outward direction, and can not to center direction transmission.Namely, the heating part 721 of lamp circuit 7 is when observing radiator 1 from end side, be positioned at the region of the through hole of substrate 2, the heat of LED4 can not be delivered to heating part 721 via substrate 3 and heat sink 2 thus, thus the temperature of heating part 721 can be suppressed to rise.And the temperature of the space in lampshade 5 in lighting is also relatively low, thus heating part 721 can be cooled via through hole.Therefore, the temperature in the lighting of lamp circuit 7 reduces, thus can realize the long lifetime of lamp circuit 7.
Fig. 4 A ~ Fig. 4 C is the figure of the temperature contrast that the lamp of present embodiment and the lamp circuit of existing lamp are described.Fig. 4 A is the existing lamp (conventional example 1) being configured with the substrate 2 being installed with LED 4 at the central portion of the heat sink 2 without through hole, Fig. 4 B is without the heat sink 2 of through hole being configured with by the LED 4 circumferentially existing lamp (conventional example 2) of substrate 2 installed of shape, Fig. 4 C is the lamp (embodiment) of present embodiment, the temperature of the lamp circuit 7 in lighting is represented by the density put, and density is higher then represents that temperature is higher.In addition, LED installation number, connect electric power identical.And the width W of circuit substrate 71 is 45.6mm in Fig. 4 A ~ Fig. 4 C, the size L of the through hole of the substrate 3 of Fig. 4 C is 43mm.
According to result, the lamp of embodiment is compared with the lamp of conventional example 1, conventional example 2, and the temperature of the lamp circuit 7 in lighting is low on the whole.Specifically, with the lamp of conventional example 1 for benchmark, the temperature of the LED side place A on lamp circuit 7 is-0.5 DEG C in conventional example 2, does not almost change compared with the lamp of conventional example 1, and on the other hand, in the lamp of embodiment, be-7.7 DEG C, temperature declines to a great extent.And the temperature of the lamp holder side place B on lamp circuit 7 is-0.2 DEG C in conventional example 2, does not almost change compared with the lamp of conventional example 1, and on the other hand, be-4.7 DEG C in the lamp of embodiment, temperature declines to a great extent.This is with relevant as follows: as described, the major part of lamp circuit 7 is positioned at the region of the through hole of heat sink 2 and substrate 3, the heat of LED 4 is suppressed to be delivered to lamp circuit 7 via substrate 3 and heat sink 2 thus, and lamp circuit 7 exposes under the relatively low environment of temperature in lampshade 5, lamp circuit 7 is cooled thus.Like this, when observing radiator 1 from end side, be configured in the region of the through hole of substrate 2 by the heating part 721 of lamp circuit 7, the temperature that can dramatically inhibition point circuit for lamp 7 thus rises.
Secondly, with reference to Fig. 5, the temperature difference of the lamp circuit 7 when changing the width W of the size L of through hole of heat sink 2 and substrate 3 and circuit substrate 71 is described.The temperature difference with heat sink 2 and substrate 3 are not formed the place A of the lamp of Fig. 4 B of through hole, place B temperature for benchmark.
According to result, L/W is larger, then the temperature of place A, place B all more declines.This is because if L/W is little, then thermal capacitance The book of Changes is by LED 4, substrate 3, heat sink 2 and be delivered to circuit substrate 71, and the cooling effect that the relatively low environment of temperature in lampshade 5 causes reduces.If L/W is more than 0.6, then there is the tendency that the temperature difference increases further.Therefore, it is desirable to L/W is more than 0.6, and then it is desirable to be more than 0.75.L/W is larger, and then effect is higher, if but L/W too increase, cannot guarantee to configure the place of LED 4, or circuit substrate 71 reduces and the configuration of circuit component 72 will become difficult, it is therefore desirable that L/W is less than 1.4.
In first embodiment, through hole is formed in the central authorities of substrate 3, substrate 3 end side and in the mode along through hole, multiple semiconductor light-emitting elements is arranged to circle-shaped, when observing radiator 1 from end side, the mode in the region of through hole is positioned at the part 721 that generates heat, lamp circuit 7 is arranged on the inside of radiator 1, the temperature of suppressible point circuit for lamp 7 rises thus, especially the temperature of heating part 721 can be suppressed to rise, and wherein lamp circuit 7 has circuit substrate 71 and is arranged on the circuit component 72 comprising heating part 721 on circuit substrate 71.And the size of through hole is set to L (mm), the width of circuit substrate 71 is when being set to W (mm), by L/W is set to more than 0.6, and can further improve effect.In addition, even if insert the heat sink 2 with identical through hole between radiator 1 with substrate 3, or, even if omit heat sink 2 and directly utilize screw etc. to be arranged on the substrate installation portion 11 of radiator 1 substrate 3, also this effect can be obtained.
(the second embodiment)
Fig. 6 is the figure of the lamp that the second embodiment of the present utility model is described.For each several part of this second embodiment, represent the part identical with each several part of the first embodiment by identical symbol, and the description thereof will be omitted.
In present embodiment, the through hole of substrate 3 arranges lid component 9.The peucinous component of lid component 9 to be thermal conductivity lower than the such as thermal conductivity of heat sink 2 and substrate 3 be below 0.5W/mK.It is desirable to also possess highly reflective.Thus, if heat sink 2 and substrate 3 have cavity, the loss of light may be produced, but utilize lid component 9 reflect and the utilization ratio of light can be improved, even and if use under lamp holder 81 state upwards, also can suppress foreign matter from the part of lamp circuit 7 drop to lampshade 5 hinders luminous.
In present embodiment, lid component 9 has installation portion 91 and protuberance 92.Installation portion 91 has screw, and for obtaining the solid part of spiral shell by screw 32 in the lump with the screw of the protuberance 21 of heat sink 2 and the protuberance 31 of substrate 3.Protuberance 92 is the part outstanding to the direction of lamp holder 81 from installation portion 91, through the through hole of heat sink 2 and substrate 3, and is positioned near the end side of lamp circuit 7 as the part of the flat board bottom it.Under this shape, utilize protuberance 92 and the relatively low environment of temperature in lampshade 5 is easily delivered to lamp circuit 7, thus can in the same manner as the first embodiment, the temperature of inhibition point circuit for lamp 7 rises.
Fig. 7 A ~ Fig. 7 C is the figure of the variations in temperature of lamp circuit when changing the shape of lid component 9 in the lamp that the second embodiment is described.Fig. 7 A is the situation employing flat lid component 9, and Fig. 7 B employs the situation to the outstanding lid component 9 in the direction of lampshade 5, and Fig. 7 C employs the situation to the outstanding lid component 9 in the direction of lamp holder 81.
Known according to figure, the lamp of Fig. 7 C is compared with Fig. 7 A, Fig. 7 B, and the temperature of lamp circuit reduces.If compared with the lamp of Fig. 4 C, then the temperature of the LED side place A on lamp circuit 7 is+5 DEG C in fig. 7, is+4.7 DEG C in Fig. 7 B, be+1.8 DEG C in Fig. 7 C, the temperature of lamp holder side place B is+2.7 DEG C in fig. 7, is+2.7 DEG C in Fig. 7 B, is+1.7 DEG C in Fig. 7 C.That is, if be the shape of Fig. 7 C, then can rise with the temperature of the first embodiment to same extent inhibition point circuit for lamp 7.If especially protuberance 92 is below 3mm with the distance D of circuit substrate 71, best for making protuberance 92 contact with circuit substrate 71, then can reduce the temperature of lamp circuit 7.As lid component 9, such as, use the Merlon that thickness is 1mm.
In second embodiment, the through hole of substrate 2 arranges lid component 9, thus can improve the utilization ratio of light, and foreign matter can be suppressed the attachment of lampshade 5.The thermal conductivity of the lid component 9 of present embodiment is lower than substrate 2.
And, lid component 9 arranges protuberance 92, makes protuberance 92 outstanding to the direction of lamp holder 81, and be positioned near lamp circuit 7, thus, except described effect, also can rise with the temperature of the first embodiment to same extent inhibition point circuit for lamp 7.And, by protuberance 92 and the distance D of circuit substrate 71 are set to below 3mm, can temperature be suppressed further to rise.
The utility model is not limited to described embodiment, can carry out various distortion.
Such as, the shape of the through hole of substrate 2 or heat sink 3 is not limited to circle, also can be polygon-shaped.
Also can to configure lamp circuit 7 insulation shell 6 inside entirety or a part fill silicone resin.Thus, can further inhibition point circuit for lamp 7 temperature rise.As Fig. 8, fill silicone resin 74 by the inside of the protuberance 62 to insulation shell 6, and the effect reducing about 5 DEG C than unfilled situation temperature can be expected.
Although set forth some embodiment, but these embodiments only provide by way of example and are not intended to limit scope of the present utility model.In fact, the embodiment of these novelties can be embodied as other forms various; In addition, in the scope of purport not departing from utility model, various omission, displacement and change can be carried out in form to embodiment described herein.Technical scheme of enclosing and equivalent scope thereof are intended to comprise and are still in this kind of form in scope of the present utility model or purport and retouching.
Claims (10)
1. a lamp, is characterized in that comprising:
The housing of the hollow of end side opening;
Substrate, has through hole in central authorities, and is arranged on the end side of described housing;
Multiple semiconductor light-emitting elements, described substrate end side and to be arranged to circle-shaped along the mode of described through hole;
Lamp circuit, has circuit substrate and is arranged on the circuit component comprising heating part on described circuit substrate, and be positioned at the mode in the region of described through hole with heating part described when observing described housing from end side, be arranged on the inside of described housing; And
Power supply, is arranged on another side of described housing.
2. lamp according to claim 1, is characterized in that:
The size of described through hole is set to L, the width of described circuit substrate is when being set to W, and L/W is more than 0.6.
3. lamp according to claim 1, is characterized in that:
The size of described through hole is set to L, the width of described circuit substrate is when being set to W, and L/W is more than 0.75.
4. lamp according to claim 1, is characterized in that:
The size of described through hole is set to L, the width of described circuit substrate is when being set to W, and L/W is less than 1.4.
5. lamp according to claim 1, is characterized in that:
At the substrate installation portion of the housing of described hollow, the substrate being provided with described multiple semiconductor light-emitting elements or the heat sink being provided with described substrate are installed.
6. lamp according to claim 1, is characterized in that:
Described substrate is arranged on heat sink, and described heat sink has through hole in central authorities, and is arranged on the end side of described housing in the mode that the described through hole of described heat sink is communicated with the described through hole of described substrate.
7. lamp according to claim 1, is characterized in that:
Described through hole is communicated with the housing of hollow.
8. lamp according to claim 1, is characterized in that:
Described through hole arranges lid component, and described lid component has protuberance, and described protuberance is outstanding to the direction of described power supply, and is positioned near described lamp circuit.
9. lamp according to claim 8, is characterized in that:
Described circuit substrate is configured at the inside of described housing along the mode of lamp axle with the face of installing described circuit component, the distance D of described protuberance and described circuit substrate is below 3mm.
10. lamp according to claim 8, is characterized in that:
The thermal conductivity of described lid component is lower than the thermal conductivity of the substrate arranging described multiple semiconductor light-emitting elements or the heat sink that arranges described substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014006376A JP2015135744A (en) | 2014-01-17 | 2014-01-17 | lamp |
| JP2014-006376 | 2014-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204227114U true CN204227114U (en) | 2015-03-25 |
Family
ID=51453692
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420673735.6U Expired - Fee Related CN204227114U (en) | 2014-01-17 | 2014-11-05 | Lamp |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP2896873A1 (en) |
| JP (1) | JP2015135744A (en) |
| CN (1) | CN204227114U (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8222820B2 (en) * | 2010-07-27 | 2012-07-17 | Cirocomm Technology Corp. | LED lamp with replaceable light unit |
| WO2012101687A1 (en) * | 2011-01-25 | 2012-08-02 | パナソニック株式会社 | Lighting source |
| DE102011005597A1 (en) * | 2011-03-16 | 2012-09-20 | Osram Ag | lighting device |
| US8282250B1 (en) * | 2011-06-09 | 2012-10-09 | Elumigen Llc | Solid state lighting device using heat channels in a housing |
-
2014
- 2014-01-17 JP JP2014006376A patent/JP2015135744A/en active Pending
- 2014-09-03 EP EP14183423.4A patent/EP2896873A1/en not_active Withdrawn
- 2014-11-05 CN CN201420673735.6U patent/CN204227114U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP2896873A1 (en) | 2015-07-22 |
| JP2015135744A (en) | 2015-07-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150325 Termination date: 20201105 |