CN204177922U - Antisticking air blowing type integrated circuit testing tool - Google Patents
Antisticking air blowing type integrated circuit testing tool Download PDFInfo
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- CN204177922U CN204177922U CN201420471590.1U CN201420471590U CN204177922U CN 204177922 U CN204177922 U CN 204177922U CN 201420471590 U CN201420471590 U CN 201420471590U CN 204177922 U CN204177922 U CN 204177922U
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Abstract
The utility model discloses a kind of Antisticking air blowing type integrated circuit testing tool, be made up of cap body, chip pressing plate, air briquetting and back-moving spring.Described chip pressing plate and air briquetting are arranged in cap body, are provided with cavity between chip pressing plate and air briquetting, and air briquetting is movable to change cavity volume, and back-moving spring is arranged between cap body and air briquetting; Described chip pressing plate is provided with at least one overflow vent, and overflow vent communicates with cavity.Measurement jig of the present utility model utilizes space compression, and the chip of adhesion blows off by the high pressure draught formed instantaneously, may damage the problem of chip when avoiding traditional thimble structure roof fall chip; When chip testing, do not have external force to act on chip surface, avoid the impact of applied external force on chip testing result.In addition, measurement jig of the present utility model is simple for structure, working service convenient, can be satisfied with the requirement of large-scale batch production, and its usable range is wide.
Description
Technical field
The utility model relates to integrated circuit testing tool, is specifically related to a kind of Antisticking air blowing type integrated circuit testing tool.
Background technology
Along with development in science and technology, headed by electron trade, the Highgrade integration of every profession and trade product is increasingly competitive.Semi-conductor chip is also just towards the trend development of high integration and high electrical performance.Present stage, the packing forms of high density, compact semi-conductor chip also got more and more, as wafer stage chip encapsulation, micro electro-mechanical system packaging, multimode encapsulation, system in package, Flip-Chip Using etc.
When semiconductor die package completes, all need to use chip testing socket to test chip, guarantee that the function of packaged chip is normally intact.When using traditional test socket test chip, first chip to be measured is put into test jack, closed chip testing lid.By chip pressing to be measured to chip testing station.In chip pressing process, the spring probe top in test jack can puncture the oxide layer on chip pin surface, with chip good contact.Test board pin is pressed on, chip pin, spring probe, test board pin three good contact bottom spring probe.Then connect test board power supply, chip is tested.Etc. test to be done, disconnect test board power supply.Open chip testing lid, taken out the chip of test, put into lower a slice chip to be measured and proceed test.But for the chip of some special package, traditional die test jack can not meet the requirement of test and production efficiency.As present stage, just have part micro electro-mechanical system packaging chip, in encapsulation production run, chip end face can be coated with the special colloid of one deck.To the micro electro-mechanical system packaging chip of this class technique encapsulation, test in the test jack of use traditional die, when completing test and opening chip testing socket, because the reason that colloid is residual, chip have may stick to chip testing lid greatly briquetting on; In addition, when the chip of test wafer level chip package, because chip surface is smooth, between the surface of contact of chip surface and chip pressing plate, easily form little vacuum, also can there is chip and be attracted to situation on chip pressing plate.Once chip is bonded on test lid pressing plate, then this chip just can only do and scrap process.
For the problems referred to above, Chinese patent CN103399268A discloses a kind of integrated circuit testing tool of thimble-type, it increases stepped thimble structure that can be freely up and down in chamber in cap body, thimble is fixed in pressing plate under the effect that the spring of the first spring is done, under non-test mode, thimble protrudes the plane of pressing plate, due to the effect of pressure during test, top nail is pushed back in cap body by chip, after test terminates, namely pressure eliminated, and the chip sticked on lid presses down by thimble under the action of the spring.But, the pressure sensor chip of micro electro-mechanical system packaging, because chip functions is pressure transducer, do not allow External Force Acting during chip testing on chip carrier socket, so outside ejecting mechanism should not be increased on socket, in order to avoid the acting force of outside ejecting mechanism presses on chip, affect test result; The chip surface of wafer stage chip encapsulation is wafer body, for exempting to scratch chip surface, affecting chip functions, outside ejecting mechanism should not be used to be ejected by adhesion chip; The chip of system in package and Flip-Chip Using, substrate layer is very thin very crisp, should not use outside ejecting mechanism, in order to avoid applied external force is uncontrolled, is damaged by the chip of fragility.
In sum, develop and a kind ofly will chip be separated from measurement jig and don't can test process be affected and can not become particularly important to the integrated circuit testing tool that chip produces damage.
Utility model content
The purpose of this utility model is to solve the problem, and providing a kind of can not affect measuring accuracy also can not produce damage simultaneously integrated circuit testing tool to test chip.
In order to achieve the above object, the technical scheme that the utility model adopts is:
A kind of Antisticking air blowing type integrated circuit testing tool, is made up of cap body, chip pressing plate, air briquetting and back-moving spring.Described chip pressing plate and air briquetting are arranged in cap body, cavity is provided with between chip pressing plate and air briquetting, air briquetting is movable to change cavity volume, and the free gap between air briquetting and cap body mainly goes out to flow out from overflow vent much smaller than the size of overflow vent to make main body; Back-moving spring is arranged between cap body and air briquetting; Described chip pressing plate is provided with at least one overflow vent, and overflow vent communicates with cavity.
After adopting such scheme, be completed rear pressing air briquetting, air briquetting inwardly moves, thus gases at high pressure are sprayed from overflow vent, is blown off by the test chip sticked on lid.Use high pressure draught blow off chip process in can not produce any damage to chip; Meanwhile, in test process, air pressure block is in reset mode, can not have acting force to chip, thus also can not produce any interference to test result.
Preferably, on described chip pressing plate, the position corresponding with each test station is equipped with overflow vent.Current measurement jig often has multiple test station, and each test station is equipped with overflow vent can make each test chip be blown off.
Further, on described chip pressing plate, the position corresponding with overflow vent is provided with air chamber.
Further, described air chamber and overflow vent are arranged perpendicular to chip clamp surface.
Further, on described air pressing plate, relevant position is provided with several projections matched with air chamber, and air chamber is separated into areola independent of each other by projection.Separate areola structure can make the chip of each test station blow off can not to influence each other, and avoids gas flow out from the overflow vent blown off and cause chip not by situation that this chip can not blow off by overflow vent pressure not that blow off.
Further, described cap body both sides are respectively provided with a snap fit; Described snap fit is connected with snap fit spring by pin with cap body.Snap fit is used for fixed cover main body, avoids it to come off in test process.
Measurement jig of the present utility model utilizes space compression, the chip of adhesion blows off by the high pressure draught formed instantaneously, high pressure draught blow off chip time do not have physical construction directly to contact with chip, the problem of chip may be damaged when avoiding the chip that traditional thimble structure roof fall adheres to; When chip testing, do not have external force to act on chip surface, avoid the impact of applied external force on chip testing result.In addition, measurement jig of the present utility model is identical with the using method of traditional die test jack but inner structure is more succinct, and working service is convenient, and its serviceable life and test yield can be satisfied with large-scale batch production requirements; And its usable range is wide, is applicable to the chip testing of multiple encapsulated type.
Accompanying drawing explanation
Fig. 1 is the perspective view of embodiment one, two;
Fig. 2 is the perspective view of embodiment one, two;
Fig. 3 is the AA cross section structure schematic diagram of embodiment one in Fig. 2;
Fig. 4 is the AA cross-sectional view of embodiment one in Fig. 2;
Fig. 5 is the partial enlarged drawing in C region in Fig. 4;
Fig. 6 is the AA cross-sectional view of embodiment two in Fig. 2;
Wherein: 1, cap body, 2, chip pressing plate, 3, air briquetting, 4, back-moving spring, 11, cavity, 12, snap fit, 13, pin, 14, snap fit spring, 21, overflow vent, 22, air chamber, 23, areola, 31, projection.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in detail, the utility model can be understood better with those skilled in the art.
Embodiment one
As Figure 1-5, a kind of Antisticking air blowing type integrated circuit testing tool, is made up of cap body 1, chip pressing plate 2, air briquetting 3 and back-moving spring 4.
Chip pressing plate 2 and air briquetting 3 are arranged in cap body 1, chip pressing plate 2 and air briquetting 3 are relatively arranged on the two sides of cap body 1, there is certain gap between chip pressing plate 2 and air briquetting 3 thus define cavity 11, air briquetting 3 can towards or away from chip pressing plate 2 activity to change the volume of cavity 11, free gap between air briquetting 3 and cap body 1 much smaller than the size of overflow vent 21, thus makes gas mainly flow out from overflow vent.Back-moving spring 4 is arranged in cavity 11, and back-moving spring 4 resets for making air briquetting 3.Position corresponding with each test station on chip pressing plate 2 is equipped with overflow vent 21, overflow vent 21 arrayed; Position corresponding with overflow vent 11 on chip pressing plate 2 is provided with air chamber 22, and overflow vent 21 is connected by air chamber with cavity 11, and overflow vent 21 and air chamber 22 are arranged perpendicular to chip pressing plate 2 surface.
Cap body 1 both sides are respectively provided with a snap fit 12; Snap fit 12 is connected with snap fit spring 14 by pin 13 with cap body 1; Snap fit 12, for fixed cover main body 1, avoids it to come off in test process, and snap fit spring 14 resets for making snap fit.
During test, chip is placed on corresponding test station, be completed and press snap fit and take off cap body, pressing air briquetting, air briquetting is to towards chip presser motion, cavity volume reduces, air pressure in cavity increases, thus gases at high pressure are sprayed from overflow vent, is blown off by the test chip sticked on lid.After chip is blown off, unclamp air briquetting, air briquetting can rely on the acting force auto-returned original state of back-moving spring.
Embodiment two
As shown in Fig. 1,2,6, a kind of Antisticking air blowing type integrated circuit testing tool, is made up of cap body 1, chip pressing plate 2, air briquetting 3 and back-moving spring 4.
Chip pressing plate 2 and air briquetting 3 are arranged in cap body 1, chip pressing plate 2 and air briquetting 3 are relatively arranged on the two sides of cap body 1, there is certain gap between chip pressing plate 2 and air briquetting 3 thus define cavity 11, air briquetting 3 can towards or away from chip pressing plate 2 activity to change the volume of cavity 11, free gap between air briquetting 3 and cap body 1 much smaller than the size of overflow vent 21, thus makes gas mainly flow out from overflow vent 21.Back-moving spring 4 is arranged in cavity 11, and back-moving spring 4 resets for making air briquetting 3.Position corresponding with each test station on chip pressing plate 2 is equipped with overflow vent 21, overflow vent 21 arrayed.Position corresponding with overflow vent 11 on chip pressing plate 2 is provided with air chamber 22, and overflow vent 21 is connected by air chamber 22 with cavity 11; On air pressing plate 3, relevant position is provided with several projections 31 matched with air chamber 22, and air chamber 22 is separated into areola 23 independent of each other by projection 31, and the volume of areola can be compressed by projection 31; The separate structure of areola 23 can make the chip of each test station blow off can not to influence each other, avoid gas flow out from the overflow vent 21 blown off and cause chip not by the situation that this chip can not blow off by overflow vent 21 pressure not that blow off, overflow vent 21, air chamber 22 and areola 23 are all arranged perpendicular to chip pressing plate 2 surface.
Cap body 1 both sides are respectively provided with a snap fit 12; Snap fit 12 is connected with snap fit spring 14 by pin 13 with cap body 1; Snap fit 12, for fixed cover main body 1, avoids it to come off in test process, and snap fit spring 14 resets for making snap fit.
During test, chip is placed on corresponding test station, be completed and press snap fit and take off cap body, pressing air briquetting, air briquetting is to towards chip presser motion, areola volume reduces, and the air pressure in areola increases, thus gases at high pressure are sprayed from overflow vent, the test chip sticked on lid is blown off, use high pressure draught blow off chip process in can not produce any damage to chip.The separate structure of areola can make the chip of each test station blow off can not to influence each other, avoid gas flow out from the overflow vent blown off and cause chip not by the situation that this chip can not blow off by overflow vent pressure not that blow off, thus the result of use of measurement jig of the present utility model can be improved further.Meanwhile, in test process, adopt the cap body of this structure can not have extra acting force to chip, thus also can not produce any interference to test result.
Claims (6)
1. an Antisticking air blowing type integrated circuit testing tool, comprises cap body (1) and chip pressing plate (2), and described chip pressing plate (2) is arranged in cap body (1);
It is characterized in that, described measurement jig also comprises air briquetting (3) and back-moving spring (4);
Described air briquetting (3) is arranged in cap body (1), be provided with cavity (11) between chip pressing plate (2) and air briquetting (3), air briquetting (3) is movable to change cavity (11) volume; Back-moving spring (4) is arranged between cap body (1) and air briquetting (3);
Described chip pressing plate (2) is provided with at least one overflow vent (21), and overflow vent (21) communicates with cavity (11).
2. integrated circuit testing tool as claimed in claim 1, is characterized in that: the upper position corresponding with test station of described chip pressing plate (2) is equipped with overflow vent (21).
3. integrated circuit testing tool as claimed in claim 2, is characterized in that: the upper position corresponding with overflow vent (21) of described chip pressing plate (2) is provided with air chamber (22).
4. integrated circuit testing tool as claimed in claim 3, is characterized in that: described air chamber (22) and overflow vent (21) are arranged perpendicular to chip pressing plate (2) surface.
5. integrated circuit testing tool as claimed in claim 3, it is characterized in that: the upper relevant position of described air pressing plate (3) is provided with several projections (31) matched with air chamber (22), and air chamber (22) is separated into areola independent of each other (23) by projection (31).
6. the integrated circuit testing tool as described in as arbitrary in claim 3-5, is characterized in that: described cap body (1) both sides are respectively provided with a snap fit (12); Described snap fit (12) is connected with snap fit spring (14) by pin (13) with cap body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420471590.1U CN204177922U (en) | 2014-08-20 | 2014-08-20 | Antisticking air blowing type integrated circuit testing tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420471590.1U CN204177922U (en) | 2014-08-20 | 2014-08-20 | Antisticking air blowing type integrated circuit testing tool |
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| CN204177922U true CN204177922U (en) | 2015-02-25 |
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| CN201420471590.1U Active CN204177922U (en) | 2014-08-20 | 2014-08-20 | Antisticking air blowing type integrated circuit testing tool |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021253735A1 (en) * | 2020-06-16 | 2021-12-23 | 法特迪精密科技（苏州）有限公司 | Auxiliary test fixture for accuracy debugging of testing machine |
| CN114690023A (en) * | 2022-05-30 | 2022-07-01 | 徐州标格电子科技有限公司 | Flexible circuit board detection device convenient to operate |
-
2014
- 2014-08-20 CN CN201420471590.1U patent/CN204177922U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021253735A1 (en) * | 2020-06-16 | 2021-12-23 | 法特迪精密科技（苏州）有限公司 | Auxiliary test fixture for accuracy debugging of testing machine |
| CN114690023A (en) * | 2022-05-30 | 2022-07-01 | 徐州标格电子科技有限公司 | Flexible circuit board detection device convenient to operate |
| CN114690023B (en) * | 2022-05-30 | 2022-10-11 | 江苏振宁半导体研究院有限公司 | Flexible circuit board detection device convenient to operate |
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| GR01 | Patent grant |