CN204130672U - A kind of substrate integration wave-guide millimeter wave filter - Google Patents
A kind of substrate integration wave-guide millimeter wave filter Download PDFInfo
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- CN204130672U CN204130672U CN201420614762.6U CN201420614762U CN204130672U CN 204130672 U CN204130672 U CN 204130672U CN 201420614762 U CN201420614762 U CN 201420614762U CN 204130672 U CN204130672 U CN 204130672U
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- superconducting film
- millimeter wave
- metallic vias
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Abstract
Substrate integration wave-guide millimeter wave filter of the present utility model can not be fitted at millimeter wave band the isoparametric demand of filtering device Insertion Loss, integrated level and Out-of-band rejection to solve existing filter, comprise the superconducting film being covered in rectangle substrate upper and lower surface and the via hole running through substrate, via hole plated metal makes the superconducting film conducting of upper and lower surface.Wherein superconducting film laser deposition on metal substrate is formed, and the one side that metal substrate deposits superconducting film is fixing towards rectangle substrate surface.Superconducting film and metallic vias are combined to form at least two resonant cavitys, and resonant cavity is of coupled connections shaping filter.Change the diameter of metallic vias in order to adjust the coupling coefficient between resonant cavity, change the position of metallic vias in order to change resonant frequency.Beneficial effect is, owing to covering superconducting film to replace traditional coat of metal in substrate upper and lower surface, has Insertion Loss less, the feature that quality factor are higher compared to traditional substrate integration wave-guide millimeter wave filter.
Description
Technical field
The utility model belongs to millimeter waveguide technical field of filtering, relates to millimeter waveguide filter, particularly based on the millimeter wave filter of substrate integrated waveguide technology.
Background technology
Millimeter wave is in an increasingly wide range of applications in the fields such as radar communication, satellite communication and navigation, and filter is as the vitals of millimeter wave receiver, also play very important role, its filtering performance is one of key factor affecting receiver performance.
For adapting to developing rapidly of the industry such as electronics and radio communication, microwave and millimeter wave system is just fast-developing towards aspects such as high-performance, low cost, high integration and miniaturizations.Millimeter wave filter, as the vitals of millimeter-wave systems, is also faced with more and more higher requirement: such as lower Insertion Loss, higher integrated level, less volume and better Out-of-band rejection etc.For the integrated level of lower Insertion Loss and Geng Gao, current study hotspot is mainly E face and inserts waveguide filter and substrate integral wave guide filter.E face insert waveguide filter have be easy to processing, the feature that Insertion Loss is less.Substrate integral wave guide filter has the advantage of waveguide and planar circuit concurrently, has relatively high Q value and is easy to integrated advantage.Substrate integration wave-guide is connected with upper and lower metal by via hole metallized on substrate, forms the version of class waveguide.This version inherits the advantage of waveguide and planar circuit, but via hole causes energy leakage, increases the insertion loss of filter.Be applied to the field such as future electronic and radio communication of high speed development, its performance obviously can not satisfy the demands.Superconducting thin film is at the sheet resistance of a millimeter wave band order of magnitude at least lower than common metal material, and the advantage how making full use of high-temperature superconducting thin film has become current study hotspot to design millimeter wave filter.
Utility model content
The purpose of this utility model is the fast-developing demand that can not adapt to the industry such as electronics and radio communication in order to solve existing millimeter wave filter, especially at millimeter wave band to the isoparametric demand of filtering device Insertion Loss, integrated level and Out-of-band rejection, propose a kind of substrate integration wave-guide millimeter wave filter.
The technical solution of the utility model is: a kind of substrate integration wave-guide millimeter wave filter, is characterized in that, comprise the superconducting film being covered in rectangle substrate upper and lower surface and the via hole running through substrate, via hole plated metal makes the superconducting film conducting of upper and lower surface; Superconducting film and metallic vias are combined to form at least two resonant cavitys, and resonant cavity is of coupled connections shaping filter; Change the diameter of metallic vias in order to adjust the coupling coefficient between resonant cavity, change the position of metallic vias in order to change resonant frequency.
Further, described resonant cavity is class rectangular cavity, and the axes normal of metallic vias is in substrate upper and lower surface.
Further, described superconducting film is formed on metal substrate by laser deposition technique.
Further, the above-mentioned metal substrate one side that deposits superconducting film is fixing towards rectangle substrate surface.
The beneficial effects of the utility model: substrate integration wave-guide millimeter wave filter of the present utility model is owing to covering superconducting film to replace traditional coat of metal in substrate upper and lower surface, compared to traditional substrate integration wave-guide millimeter wave filter, there is Insertion Loss less, the feature that quality factor are higher.
Accompanying drawing explanation
Fig. 1 is a kind of concrete structure of substrate integration wave-guide millimeter wave filter of the present utility model.
Embodiment
Embodiment of the present utility model designs according to principle of the present utility model, is further elaborated principle of the present utility model below in conjunction with accompanying drawing and specific embodiment.
As shown in Figure 1, the substrate integration wave-guide millimeter wave filter of the present embodiment comprises the superconducting film being covered in rectangle substrate 1 upper and lower surface and the via hole 3 running through substrate, and via hole plated metal makes the superconducting film conducting of upper and lower surface; Superconducting film and metallic vias are combined to form at least two resonant cavitys 2, and resonant cavity is of coupled connections shaping filter; Change the diameter of metallic vias in order to adjust the coupling coefficient between resonant cavity, change the position of metallic vias in order to change resonant frequency.
Consider the factor such as processing technology and parameter optimization adjustment, in optimal way of the present utility model, described resonant cavity is class rectangular cavity, and the axes normal of metallic vias is in substrate upper and lower surface.Although traditional superconducting thin film is widely used and easily obtains, its substrate is frangible, not easily processes.Therefore, another preferred embodiment of the present utility model is abandoned adopting superconducting thin film, then uses the superconducting thick-film be deposited on metal as superconducting film.Manufacture craft due to superconducting thick-film is existing mature technology, is such as formed by laser deposition, and superconducting thick-film manufacture craft not innovative point place of the present utility model, therefore omit at this technology description formed about superconducting thick-film.The superconducting film of metal substrate deposition is adopted to be easier to circuit fabrication.In order to reduce the performance error of design of Simulation parameter and actual product, when installing product, the one side that metal substrate deposits superconducting film should be fixed towards rectangle substrate surface.
Be below preferred embodiment of the present utility model: as shown in Figure 1, comprise the substrate 1 being positioned at intermediate layer and the superconducting film being covered in substrate upper and lower surface.Wherein superconducting film laser deposition on metal substrate is formed.Substrate comprises and connects upper and lower surface and the multiple via holes depositing metal, and metallization via hole is for being electrically connected the superconducting film covering substrate upper and lower surface.Multiple metallization via hole forms class rectangular cavity 2 together with substrate, can change resonance frequency, and can change the coupling coefficient between resonant cavity by the diameter changing metallization via hole by the position changing metallization via hole.The number of resonant cavity and coupling coefficient are determined (as centre frequency, bandwidth and Out-of-band rejection) by the technical indicator of the filter of required design.
The filter designed of the present embodiment not only insertion loss little, be easy to integrated with planar circuit, and Out-of-band rejection degree is high.
Those of ordinary skill in the art will appreciate that, embodiment described here is to help reader understanding's principle of the present utility model, should be understood to that protection range of the present utility model is not limited to so special statement and embodiment.Those of ordinary skill in the art can make various other various concrete distortion and combination of not departing from the utility model essence according to these technology enlightenment disclosed in the utility model, and these distortion and combination are still in protection range of the present utility model.
Claims (4)
1. a substrate integration wave-guide millimeter wave filter, is characterized in that, comprise the superconducting film being covered in rectangle substrate upper and lower surface and the via hole running through substrate, via hole plated metal makes the superconducting film conducting of upper and lower surface; Superconducting film and metallic vias are combined to form at least two resonant cavitys, and resonant cavity is of coupled connections shaping filter; Change the diameter of metallic vias in order to adjust the coupling coefficient between resonant cavity, change the position of metallic vias in order to change resonant frequency.
2. substrate integration wave-guide millimeter wave filter according to claim 1, is characterized in that, described resonant cavity is class rectangular cavity, and the axes normal of metallic vias is in substrate upper and lower surface.
3. substrate integration wave-guide millimeter wave filter according to claim 1 and 2, is characterized in that, described superconducting film is formed on metal substrate by laser deposition technique.
4. substrate integration wave-guide millimeter wave filter according to claim 3, is characterized in that, the one side that described metal substrate deposits superconducting film is fixing towards rectangle substrate surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420614762.6U CN204130672U (en) | 2014-10-22 | 2014-10-22 | A kind of substrate integration wave-guide millimeter wave filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420614762.6U CN204130672U (en) | 2014-10-22 | 2014-10-22 | A kind of substrate integration wave-guide millimeter wave filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204130672U true CN204130672U (en) | 2015-01-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420614762.6U Expired - Fee Related CN204130672U (en) | 2014-10-22 | 2014-10-22 | A kind of substrate integration wave-guide millimeter wave filter |
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| CN (1) | CN204130672U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104953214A (en) * | 2015-05-14 | 2015-09-30 | 电子科技大学 | Millimeter-wave SIW (substrate integrated waveguide) filter and design method thereof |
| CN110495047A (en) * | 2017-04-11 | 2019-11-22 | 株式会社藤仓 | Bandpass filter |
-
2014
- 2014-10-22 CN CN201420614762.6U patent/CN204130672U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104953214A (en) * | 2015-05-14 | 2015-09-30 | 电子科技大学 | Millimeter-wave SIW (substrate integrated waveguide) filter and design method thereof |
| CN104953214B (en) * | 2015-05-14 | 2018-06-19 | 电子科技大学 | A kind of millimeter wave SIW wave filters and its design method |
| CN110495047A (en) * | 2017-04-11 | 2019-11-22 | 株式会社藤仓 | Bandpass filter |
| US11158919B2 (en) | 2017-04-11 | 2021-10-26 | Fujikura Ltd. | Band-pass filter comprising a substrate enclosed by conductive layer pairs and a post wall to define a plurality of resonators having recesses of different depths |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150128 Termination date: 20211022 |