CN204129639U - A kind of active fan assembly of efficient reduction board chip temperature - Google Patents
A kind of active fan assembly of efficient reduction board chip temperature Download PDFInfo
- Publication number
- CN204129639U CN204129639U CN201420619832.7U CN201420619832U CN204129639U CN 204129639 U CN204129639 U CN 204129639U CN 201420619832 U CN201420619832 U CN 201420619832U CN 204129639 U CN204129639 U CN 204129639U
- Authority
- CN
- China
- Prior art keywords
- fan
- fan assembly
- active
- chip temperature
- high density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 230000005855 radiation Effects 0.000 claims abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 abstract description 4
- 238000009434 installation Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of active fan assembly of efficient reduction board chip temperature, comprise fan, be arranged on the heating radiator on fan front surface and exempt from tool mounting structure, this fan assembly can be fixed on high density board by described tool mounting structure of exempting from.This active fan assembly to high density board and chip cooling thereof by fan and heating radiator two-stage radiation mode, is improve the radiating effect of high density board, reduces system loss; Being fixed by exempting from tool mounting structure simultaneously, no longer needing to use the instruments such as screwdriver, making the disassembling operations of fan assembly convenient and swift, effectively improve work efficiency.
Description
Technical field
The utility model relates to radiator fan, specifically a kind of active fan assembly of efficient reduction board chip temperature.
Background technology
Usually on high density board, the heat radiation that plate carries chip is generally passive, thus poor in radiating effect, easily causes chip cannot play due usefulness, and even occurring that Yin Gaowen reports an error affects application.Even if adopt active heat radiation at high density chip on board, fixing means is also more loaded down with trivial details, usually needs by means of instruments such as screwdrivers, use middle installation, dismounting very loaded down with trivial details, bring many unnecessary troubles to user and maintenance repairer.
Utility model content
For the deficiencies in the prior art part, the utility model provides a kind of active fan assembly of efficient reduction board chip temperature.
The active fan assembly of a kind of efficient reduction board chip temperature described in the utility model, its technical scheme solveing the technical problem employing is: described active fan assembly comprises fan and heating radiator, described heating radiator is arranged on described fan front surface, fan and heating radiator form the heat radiation of active the two poles of the earth jointly, described active fan assembly also comprises exempts from tool mounting structure, can be fixed on high density board by this active fan assembly by described tool mounting structure of exempting from; Chip on high density board can be embodied as and carry out the active heat radiation in the two poles of the earth.
Preferably, described heating radiator adopts some heat radiator, and the vertical and fan front surface of these heat radiator is arranged.
Preferably, several heat radiator described are arranged in parallel, improve fan cooling effect.
Preferably, described in exempt from tool mounting structure and comprise several rivets, rivet is arranged with fixing spring simultaneously; On described fan and high density board, correspondence offers mounting hole, and cover has the rivet of fixing spring through both corresponding mounting holes, and described fixing spring is held in mounting hole, can by fan and high-density plate clamping is close is fixed up.
Preferably, on described fan and high density board, correspondence offers four mounting holes, and corresponding described active fan assembly comprises the rivet that four are arranged with fixing spring.
Preferably, described fan is provided with supply lines, powers to fan by the power supply interface that described supply lines is connected to high density board.
Preferably, described heat radiator adopts aluminum material.
The beneficial effect that compared to the prior art the active fan assembly of a kind of efficient reduction board chip temperature of the present utility model has is: described active fan assembly by arranging heating radiator on fan, form two-stage active heat removal mode, improve the radiating effect of high density board, reduce system loss; By exempting from tool mounting structure, this fan assembly being fixed on high density board simultaneously, no longer needing to use the instruments such as screwdriver, making the disassembling operations of fan assembly convenient and swift, effectively improve work efficiency; And this fan assembly is novel in design, structure is simple, easy to use, has good marketing use value.
Accompanying drawing explanation
Accompanying drawing 1 is the structural representation of active fan assembly described in the present embodiment;
Accompanying drawing illustrates: 1, fan; 2, heating radiator; 3, rivet; 4, fixing spring; 5, mounting hole; 6, supply lines.
Embodiment
Below in conjunction with drawings and Examples, the active fan assembly of a kind of efficient reduction board chip temperature described in the utility model is described in further detail.
Active fan assembly described in the utility model, its structure comprises fan and is arranged on the heating radiator on fan, this active fan assembly is arranged on high density board, come to board chip cooling, and realize the active heat radiation in the two poles of the earth by fan and heating radiator, effectively can improve the radiating effect of high-density plate the core of the card sheet, reduce the loss of the parts such as chip on high density board, reduce system power dissipation.
Embodiment:
Active fan assembly described in the present embodiment, as shown in Figure 1, the heating radiator 2 comprising fan 1 and be arranged on fan, heating radiator described in the present embodiment adopts some heat radiator arranged in parallel, vertical and the fan front surface of these heat radiator is arranged, effectively the heat of high density board can be come out by heat radiator, considerably increase the heat-sinking capability of fan.Further, described heat radiator adopts aluminum material to make, economical cheap, and heat-conductive characteristic is good.
When described in the present embodiment, active fan assembly is installed on high density board, tool mounting structure is exempted from employing, exempt from tool mounting structure the instruments such as screwdriver need not be used can to realize the installation and removal of fan by this, decrease dismounting step and used tool, significantly improve dismounting efficiency, there is stronger use value.Exempt from tool mounting structure described in the present embodiment and comprise four rivets, as shown in Figure 1, described rivet 3 is arranged with fixing spring 4; Described fan offers four mounting holes 5, corresponding described mounting hole is provided with mounting hole at the empty place of high density board simultaneously, the mounting hole of the mounting hole of fan with high density board is alignd, firmly cover there is the rivet of fixing spring through mounting hole, until the end bosses of rivet blocks the room of high density board, fixing spring is held in mounting hole, can realize the exempt from instrument of fan on high density board and firmly install, fast very convenient.
Meanwhile, the fan 1 of active fan assembly described in the present embodiment being provided with supply lines 6, by being connected on the power supply interface of high density board by described supply lines, powering to fan, being convenient to fan can normally work.By this active fan assembly, fan increases heating radiator, fixing spring is adopted to coordinate rivet to exempt from the technological means such as instrument installation, effectively ensure that the close contact of chip on fan and high density board, make the cooling air of fan pass through accurately and be delivered to chip, substantially increase the radiating effect of high density board.
Above-described is only embodiments more of the present utility model; not the utility model protection domain is limited; one of ordinary skill in the art should be understood that; on the basis of the technical solution of the utility model, those skilled in the art do not need to pay various amendment or distortion that creative work can make still within protection domain of the present utility model.
Claims (7)
1. one kind is efficiently reduced the active fan assembly of board chip temperature, it is characterized in that, comprise fan and heating radiator, described heating radiator is arranged on described fan front surface, fan and heating radiator form the heat radiation of active the two poles of the earth jointly, described active fan assembly also comprises exempts from tool mounting structure, this active fan assembly can be fixed on high density board by described tool mounting structure of exempting from.
2. the active fan assembly of a kind of efficient reduction board chip temperature according to claim 1, it is characterized in that, described heating radiator adopts some heat radiator, and the vertical and fan front surface of these heat radiator is arranged.
3. the active fan assembly of a kind of efficient reduction board chip temperature according to claim 2, it is characterized in that, several heat radiator described are arranged in parallel.
4. the active fan assembly of a kind of efficient reduction board chip temperature according to claim 3, is characterized in that, described in exempt from tool mounting structure and comprise several rivets, rivet is arranged with fixing spring simultaneously; On described fan and high density board, correspondence offers mounting hole, and cover has the rivet of fixing spring through both corresponding mounting holes, and described fixing spring is held in mounting hole, can by fan and high-density plate clamping is close is fixed up.
5. the active fan assembly of a kind of efficient reduction board chip temperature according to claim 4, it is characterized in that, on described fan and high density board, correspondence offers four mounting holes, and corresponding described active fan assembly comprises the rivet that four are arranged with fixing spring.
6. the active fan assembly of a kind of efficient reduction board chip temperature according to claim 1, is characterized in that, described fan is provided with supply lines, powers to fan by the power supply interface that described supply lines is connected to high density board.
7. the active fan assembly of a kind of efficient reduction board chip temperature according to claim 2, is characterized in that, described heat radiator adopts aluminum material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420619832.7U CN204129639U (en) | 2014-10-24 | 2014-10-24 | A kind of active fan assembly of efficient reduction board chip temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420619832.7U CN204129639U (en) | 2014-10-24 | 2014-10-24 | A kind of active fan assembly of efficient reduction board chip temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204129639U true CN204129639U (en) | 2015-01-28 |
Family
ID=52385978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420619832.7U Expired - Fee Related CN204129639U (en) | 2014-10-24 | 2014-10-24 | A kind of active fan assembly of efficient reduction board chip temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204129639U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112965583A (en) * | 2019-12-12 | 2021-06-15 | 荣耀终端有限公司 | Electronic device |
| RU2796575C1 (en) * | 2019-12-12 | 2023-05-25 | Хонор Девайс Ко., Лтд. | Electronic device |
-
2014
- 2014-10-24 CN CN201420619832.7U patent/CN204129639U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112965583A (en) * | 2019-12-12 | 2021-06-15 | 荣耀终端有限公司 | Electronic device |
| RU2796575C1 (en) * | 2019-12-12 | 2023-05-25 | Хонор Девайс Ко., Лтд. | Electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205070653U (en) | A motor casing for manipulator | |
| CN203840687U (en) | Heat radiator, circuit board heat radiation structure, and electronic device | |
| CN204129639U (en) | A kind of active fan assembly of efficient reduction board chip temperature | |
| CN207489846U (en) | A kind of semiconductor package part | |
| CN205670907U (en) | A kind of double baseplate heat sink | |
| CN204650409U (en) | A kind of cabinet cooling device | |
| CN202443406U (en) | Computer heat radiating plate | |
| CN204945873U (en) | A kind of cloud computer mainboard of high efficiency and heat radiation | |
| CN104182014A (en) | Thermoelectric power generation computer radiator | |
| CN208127719U (en) | A kind of architectural electric distribution box | |
| CN207896007U (en) | A kind of network communication power switch with long service life | |
| CN202085436U (en) | Radiator for low-voltage reactive power compensation cabinet | |
| CN203118478U (en) | Solid state disk | |
| CN204392166U (en) | Can quick heat radiating terminal box | |
| CN204157208U (en) | A kind of high efficiency and heat radiation chip architecture | |
| CN219436800U (en) | Ventilating and heat-dissipating type generator exciter support structure | |
| CN202759722U (en) | Novel circuit heat dissipation fin | |
| CN203966047U (en) | A kind of water-cooled computer radiator | |
| CN203279411U (en) | Vehicle multimedia terminal and terminal rear panel | |
| CN201444736U (en) | Energy-saving environment-friendly heat radiating device | |
| CN203399441U (en) | Inverter casing coated with paintcoats | |
| CN209786158U (en) | High-isolation double-section high-power isolator for cluster system | |
| CN203311975U (en) | Transformer heat radiating anti-seismic device | |
| CN102622069A (en) | Computer radiating pad | |
| CN207612051U (en) | A kind of motor protection measure and control device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150128 Termination date: 20151024 |
|
| EXPY | Termination of patent right or utility model |