CN204102896U - A kind of adjustable color temperature, the aobvious LED referred to - Google Patents

A kind of adjustable color temperature, the aobvious LED referred to Download PDF

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Publication number
CN204102896U
CN204102896U CN201420458338.7U CN201420458338U CN204102896U CN 204102896 U CN204102896 U CN 204102896U CN 201420458338 U CN201420458338 U CN 201420458338U CN 204102896 U CN204102896 U CN 204102896U
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China
Prior art keywords
reflector
terminal
group
blue led
conducting
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Withdrawn - After Issue
Application number
CN201420458338.7U
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Chinese (zh)
Inventor
刘明剑
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DONGGUAN OPCSO OPTOELECTRONICS TECHNOLOGY Co Ltd
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DONGGUAN OPCSO OPTOELECTRONICS TECHNOLOGY Co Ltd
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Priority to CN201420458338.7U priority Critical patent/CN204102896U/en
Application granted granted Critical
Publication of CN204102896U publication Critical patent/CN204102896U/en
Withdrawn - After Issue legal-status Critical Current
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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Abstract

The utility model discloses a kind of adjustable color temperature, the aobvious LED referred to, include insulating body, three groups of independently-powered conducting terminals, red-light LED wafer, first blue LED wafers, the fluorescent material glue-line of the second blue LED wafers and two kinds of different ratio, this insulating body is separated out two reflectors by withe, this red-light LED wafer and the first blue LED wafers are installed on wherein in a reflector, this second blue LED wafers is installed in another reflector, and in two reflectors, inject two kinds of fluorescent material glue-lines of different ratio, by this, this red-light LED wafer and the first blue LED wafers send the indefinite white light of a kind of colour temperature through the first fluorescent material glue-line mixing, this second blue LED wafers sends the indefinite white light of another kind of colour temperature through the second fluorescent material glue-line mixing, power by independently conducting end subgroup by each LED wafer, the luminosity of any regulation voltage and Current Control different chips, to adjust indefinite colour temperature, differently aobviously to refer to and mixed light that light intensity is adjustable again.

Description

A kind of adjustable color temperature, the aobvious LED referred to
Technical field
The utility model relates to LED art, refers in particular to a kind of adjustable color temperature, the aobvious LED referred to.
Background technology
Light-emitting diode (LED or LEDS) is the solid state device of luminous energy by electric energy conversion, and long service life, color rendering index are high, energy-conserving and environment-protective, brightness are high, be widely used, and every country all vigorously advocates development LED industry.Scientific and technological progress has in recent years made LED packaged lamp cup have more small size, complex structure, photochromic diversified popular trend.Existing LED encapsulates Lamp cup and generally adopts the structure encapsulating single LEDs wafer in a Lamp cup, and that is done by Lamp cup is darker, and in Lamp cup, fill glue with fixed L ED wafer, the problem existing for LED lamp of this structure is that Lamp cup volume is large, affect its serviceability, the diffusivity of light is also poor, and what is more important Lamp cup can only do single white light, photochromic single, can not meet the user demand of some special occasions.
Utility model content
In view of this, the utility model is for the disappearance of prior art existence, its main purpose is to provide a kind of adjustable color temperature, the aobvious LED referred to, it has two reflectors, LED wafer in two reflectors is different, and fluorescent material glue-line proportioning is different, and the supply power voltage of each LED wafer and electric current can free adjustment, to adjust varied different-colour, the different aobvious mixed light referred to, light mixing effect is good.
For achieving the above object, the utility model adopts following technical scheme:
Adjustable color temperature, the aobvious LED referred to, comprise
One insulating body, the end face of this insulating body is recessed a cup, and the center of this cup is provided with a nontransparent withe, and with formation first reflector and the second reflector of being divided into two by cup, the volume of this first reflector is greater than the volume of the second reflector;
Three groups of conducting terminals, first group of conducting terminal, second group of conducting terminal, the 3rd group of conducting terminal respectively, each group of conducting terminal is arranged in order and one-body molded with this insulating body, wherein first, second group conducting terminal has the bottom surface of exposing the first reflector in die bond portion, and the 3rd group of conducting terminal has the bottom surface of exposing the second reflector in die bond portion;
Three LED wafer, red-light LED wafer, the first blue LED wafers and the second blue LED wafers respectively, this red-light LED wafer and the first blue LED wafers are all positioned at the first reflector and are connected to first and second groups of conducting terminals, and this second blue LED wafers is positioned at the second reflector and is connected to the 3rd group of conducting terminal;
There is the first fluorescent material glue-line and the second fluorescent material glue-line of different ratio, this the first fluorescent material glue-line injecting glue is in the first reflector, this the second fluorescent material glue-line injecting glue is in the second reflector, this red-light LED wafer and the first blue LED wafers send a kind of white light of colour temperature through the first fluorescent material glue-line mixing, and this second blue LED wafers sends the white light of another kind of colour temperature through the second fluorescent material glue-line mixing.
As a kind of preferred version, the degree of depth of described first reflector is H1, and the degree of depth of described second reflector is H2, and the height of described withe is H3, wherein, and H1=H2, H3< H1.
As a kind of preferred version, along being equipped with concave station in the rim of a cup of described first reflector and the second reflector, the top surface being parallel of first, second fluorescent material glue-line described is in the face, base of this concave station.
As a kind of preferred version, described first to the 3rd group of conducting terminal all has a positive terminal and a negative terminal, and each positive and negative electrode terminal is distributed in the relative both sides of insulating body;
Each positive and negative electrode terminal all has die bond portion and leg portion; The length in the die bond portion of the positive terminal of this first, the 3rd group of conducting terminal is greater than the length L1> L1 ' in the die bond portion of its negative terminal, L3> L3 '; The length in the die bond portion of the negative terminal of this second group of conducting terminal is greater than the length L2 ' > L2 in the die bond portion of its positive terminal, and each LED wafer is fixed in the larger die bond portion of each length.
As a kind of preferred version, described red-light LED wafer is fixed in the die bond portion of the positive terminal of first group of conducting terminal, the positive and negative electrode terminal conducting of the two ends gold thread of red-light LED wafer and first group of conducting terminal; This first blue LED wafers is fixed in the die bond portion of the negative terminal of second group of conducting terminal, the positive and negative electrode terminal conducting of the two ends gold thread of the first blue LED wafers and second group of conducting terminal; The mixed light of this red-light LED wafer and the first blue LED wafers concentrates on the center of the first reflector;
This second blue LED wafers is fixed in the die bond portion of the positive terminal of the 3rd group of conducting terminal, the positive and negative electrode terminal conducting of the two ends gold thread of the second blue LED wafers and the 3rd group of conducting terminal, the light source of the second blue LED wafers concentrates on the center of the second reflector.
As a kind of preferred version, each Leg portion often organizing conducting terminal does not stretch out insulating body both sides and the curved bottom surface being accommodated in insulating body of reflexed.
As a kind of preferred version, the profile of described insulating body is in square, and first, second reflector described is all rectangle structures, and the first reflector Aspect Ratio is W1:W1 '=1.7:1, and the second reflector Aspect Ratio is W2:W2 '=2.7:1.
As a kind of preferred version, described insulating body and withe are integral type structure.
The utility model compared with prior art has obvious advantage and beneficial effect, specifically, as shown from the above technical solution,
Insulating body arranges two reflectors mutually cut off, and red-light LED wafer and the first blue LED wafers are installed in the first reflector, in the second reflector, the second blue LED wafers are installed, and in two reflectors, inject the fluorescent material glue-line of different ratio, this red-light LED wafer and the first blue LED wafers send the indefinite white light of a kind of colour temperature through the first fluorescent material glue-line mixing, and this second blue LED wafers sends the indefinite white light of another kind of colour temperature through the second fluorescent material glue-line mixing; By withe, nationality is arranged so that two kinds of fluorescent material can be mutually isolated, thus a kind of fluorescent material can not pollute another kind of fluorescent material, and avoids photochromic cross pollution; Power by independently conducting end subgroup by each LED wafer, voltage and current free adjustment does not affect the luminosity of other wafer again, adjusting varied indefinite colour temperature, differently aobviously to refer to, mixed light that light intensity is adjustable, light mixing effect is good.
For more clearly setting forth architectural feature of the present utility model and effect, below in conjunction with accompanying drawing and specific embodiment, the utility model is described in detail.
Accompanying drawing explanation
Fig. 1 is the assembling schematic perspective view of first embodiment of the utility model, the non-sealing of the reflector in figure;
Fig. 2 is the bottom views figure of Fig. 1;
Fig. 3 is the front view of Fig. 1;
Fig. 4 is the cutaway view of first embodiment of the utility model, the non-sealing of the reflector in figure;
Fig. 5 be in Fig. 4 A to front view;
Fig. 6 is the schematic diagram after injecting fluorescent material glue-line in Fig. 5;
Fig. 7 is the assembling schematic perspective view of second embodiment of the utility model, the non-sealing of the reflector in figure.
Accompanying drawing identifier declaration:
10, insulating body 11, withe
12, the first reflector 13, second reflector
14, concave station 21, first group of conducting terminal
22, second group of conducting terminal 23, the 3rd group of conducting terminal
211,212,221,222,231,232, die bond portion
213,214,223,224,233,234, leg portion
31, red-light LED wafer 32, first blue LED wafers
33, the second blue LED wafers 41, first fluorescent material glue-line
42, the first fluorescent material glue-line.
Embodiment
Please refer to shown in Fig. 1 to Fig. 6, that show the concrete structure of first embodiment of the utility model.The LED of described adjustable color temperature is adjustable aobvious finger includes the fluorescent material glue-line 41,42 of insulating body 10, three groups of conducting terminals 21,22,23, three LED wafer 31,32,33 and two kind of different ratio.
Wherein, described insulating body 10 makes with plastic material, sees Fig. 3, and the profile of this insulating body 10 is in square.The end face of this insulating body 10 is recessed a cup, and the center of this cup is provided with a nontransparent withe 11, with formation first reflector 12 and the second reflector 13 of being divided into two by cup.Described two kinds of fluorescent material glue-lines refer to the first fluorescent material glue-line 41 and the second fluorescent material glue-line 42 of different ratio respectively, and this first fluorescent material glue-line 41 injecting glue is in the first reflector 12, and this second fluorescent material glue-line 42 injecting glue is in the second reflector 13.Nationality makes two kinds of fluorescent material glue-lines 41 of two reflectors 12,13,42 mutually isolated by the design of withe 11, can not mix, thus a kind of fluorescent material can not pollute another kind of fluorescent material.
In the present embodiment, this withe 11 is integral type structure with insulating body 10, thus can one-shot forming go out, without the need to assembling.As shown in Figure 3, this first, second reflector 12,13 is all square structures, and the first reflector 12 Aspect Ratio is W1:W1 '=1.7:1, and the second reflector 13 Aspect Ratio is W2:W2 '=2.7:1.By the volume volume of the first reflector being greater than the second reflector, make the first reflector 12 can hold two kinds of different LED wafer, and the second reflector 13 only hold a kind of LED wafer.
In the present embodiment, see Fig. 5, the degree of depth of the first reflector 12 of described insulating body 10 is H1, and the degree of depth of described second reflector 13 is H2, and the height of described withe 11 is H3, wherein, and H1=H2, H3< H1.By withe 11, two reflectors 12,13 are intercepted, two kinds of different fluorescent material glue-lines 41,42 are not mixed mutually, thus a kind of fluorescent material can not pollute another kind of fluorescent material.Again nationality by this by the height of this withe 11 arrange lower, therefore, the LED wafer in the first and second reflectors 12,13 more easily can carry out mixed light from height difference H 4 position at withe 11 top.
In addition, along being equipped with concave station 14 in the rim of a cup of described first reflector 12 and the second reflector 13, the top surface being parallel of this first, second fluorescent material glue-line 41,42 is in the face, base of this concave station 14.Tradition can be avoided on the one hand without the reflector of concave station, and after injection fluorescent material glue-line, the week of colloid causes the surface irregularity of fluorescent material glue-line along climbing, and affects light-out effect; On the other hand, after this concave station 14 can guarantee shaping blanking, the rim of a cup of reflector 12,13 can not be unedged; The third aspect, concave station 14 also makes the area of reflector 12,13 rim of a cup increase, thus the light mixing effect of two reflectors is better.
Described three groups of conducting terminals are first group of conducting terminal, 21, second group of conducting terminal 22, the 3rd group of conducting terminal 23 respectively.Each group of conducting terminal is arranged in order and one-body molded with this insulating body 10.Described first to the 3rd group of conducting terminal 21,22,23 all has a positive terminal and a negative terminal, and each positive and negative electrode terminal is distributed in the relative both sides of insulating body 10; Each positive and negative electrode terminal all has die bond portion 211,212,221,222,231,232 and leg portion 213,214,223,224,233,234; Each Leg portion often organizing conducting terminal does not stretch out insulating body 10 both sides and the curved bottom surface being accommodated in insulating body 10 of reflexed.
Wherein first, second group conducting terminal 21,22 has die bond portion 211,212; 221,222 bottom surfaces of exposing the first reflector 12, the 3rd group of conducting terminal 23,24 has the bottom surface of exposing the second reflector 13 in die bond portion 231,232.
Described three LED wafer comprise red-light LED wafer 31, first blue LED wafers 32, second blue LED wafers 33 respectively.This red-light LED wafer 31 is fixed on the die bond portion 211 of first group of conducting terminal 21, and this first blue LED wafers 32 is fixed on the die bond portion 222 of second group of conducting terminal 22, and this second blue LED wafers 33 is fixed on the die bond portion 231 of the 3rd group of conducting terminal 23.
In addition, the length in the die bond portion 211,231 of the positive terminal of this first, the 3rd group of conducting terminal 21,23 is greater than the length L1> L1 ' in the die bond portion 212,232 of its negative terminal, L3> L3 '; The length in the die bond portion 222 of the negative terminal of this second group of conducting terminal 22 is greater than the length L2 ' > L2 in the die bond portion 221 of its positive terminal.Each LED wafer 31,32,33 is fixed in the larger die bond portion of length 211,222,231, larger area fixed L ED wafer can be had on the one hand, make each LED wafer arrange evenly on the other hand, obtain better light mixing effect.
Specifically, described red-light LED wafer 31 is fixed in the die bond portion 211 of the positive terminal of first group of conducting terminal 21, the positive and negative electrode terminal conducting of the two ends gold thread of red-light LED wafer 31 and first group of conducting terminal 21.This first blue LED wafers 32 is fixed in the die bond portion 222 of the negative terminal of second group of conducting terminal 22, the two ends gold thread of the first blue LED wafers 32 and the positive and negative electrode terminal conducting of second group of conducting terminal 22.This second blue LED wafers 33 is fixed in the die bond portion 231 of the positive terminal of the 3rd group of conducting terminal 23, the positive and negative electrode terminal conducting of the two ends gold thread of the second blue LED wafers 33 and the 3rd group of conducting terminal 23.Thus red-light LED wafer 31 and the position of the first blue LED wafers 32 in the first reflector 12 have and misplace a little, but can ensure that the mixed light after the two combination concentrates on the center of the first reflector 12.Same, this second blue LED wafers 33 also concentrates on the center of the second reflector 13.
Provide power supply by four groups of separate conducting end subgroups 21,22,23 respectively by these three LED wafer 31,32,33, therefore electric current and the voltage of often organizing conducting terminal 21,22,23 can according to each self-adjustings of needs, to strengthen or to weaken light intensity, and not affecting the luminous intensity of other LED wafer, modulability is very strong.Coordinate the LED wafer 31,32,33 of different color and the fluorescent material glue-line 41,42 of different ratio, the mixed light in varied different-colour, different aobvious finger, different light extraction efficiency, different luminous flux, not homochromy district can be adjusted, user can freely regulate tone the most suitable according to different environment, mood, implements very simple.
As shown in Figure 7, which show the concrete structure of second embodiment of the utility model.This second embodiment is substantially identical with the first embodiment, and difference is the concave station 14 eliminating insulating body 10, because the structure of other each parts of this second embodiment is identical with the first embodiment with usage, does not repeat them here.
In sum, design focal point of the present utility model is, insulating body 10 arranges two reflectors mutually cut off, and red-light LED wafer 31 and the first blue LED wafers 32 are installed in the first reflector 12, in the second reflector 13, second blue LED wafers is installed, and at two reflectors 12, the fluorescent material glue-line 41 of different ratio is injected in 13, 42, this red-light LED wafer 31 and the first blue LED wafers 32 send the indefinite white light of a kind of colour temperature through the first fluorescent material glue-line 41 mixing, this second blue LED wafers 33 sends the indefinite white light of another kind of colour temperature through the second fluorescent material glue-line 42 mixing, by withe 11, nationality is arranged so that two kinds of fluorescent material 41,42 can be mutually isolated, thus a kind of fluorescent material can not pollute another kind of fluorescent material, photochromic can not cross pollution, power by independently conducting end subgroup 21,22,23 by each LED wafer 31,32,33 again, voltage and current free adjustment does not affect the luminosity of other wafer, with the mixed light adjusting varied indefinite colour temperature, difference shows finger, light intensity is adjustable, light mixing effect is good.
The above, it is only preferred embodiment of the present utility model, not technical scope of the present utility model is imposed any restrictions, therefore every above embodiment is done according to technical spirit of the present utility model any trickle amendment, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.

Claims (8)

1. adjustable color temperature, the aobvious LED referred to, is characterized in that: comprise
One insulating body, the end face of this insulating body is recessed a cup, and the center of this cup is provided with a nontransparent withe, and with formation first reflector and the second reflector of being divided into two by cup, the volume of this first reflector is greater than the volume of the second reflector;
Three groups of conducting terminals, first group of conducting terminal, second group of conducting terminal, the 3rd group of conducting terminal respectively, each group of conducting terminal is arranged in order and one-body molded with this insulating body, wherein first, second group conducting terminal has the bottom surface of exposing the first reflector in die bond portion, and the 3rd group of conducting terminal has the bottom surface of exposing the second reflector in die bond portion;
Three LED wafer, red-light LED wafer, the first blue LED wafers and the second blue LED wafers respectively, this red-light LED wafer and the first blue LED wafers are all positioned at the first reflector and are connected to first and second groups of conducting terminals, and this second blue LED wafers is positioned at the second reflector and is connected to the 3rd group of conducting terminal;
There is the first fluorescent material glue-line and the second fluorescent material glue-line of different ratio, this the first fluorescent material glue-line injecting glue is in the first reflector, this the second fluorescent material glue-line injecting glue is in the second reflector, this red-light LED wafer and the first blue LED wafers send a kind of white light of colour temperature through the first fluorescent material glue-line mixing, and this second blue LED wafers sends the white light of another kind of colour temperature through the second fluorescent material glue-line mixing.
2. a kind of adjustable color temperature according to claim 1, the aobvious LED referred to, it is characterized in that: the degree of depth of described first reflector is H1, the degree of depth of described second reflector is H2, the height of described withe is H3, wherein, H1=H2, H3< H1.
3. a kind of adjustable color temperature according to claim 1, the aobvious LED referred to, is characterized in that: along being equipped with concave station in the rim of a cup of described first reflector and the second reflector, the top surface being parallel of first, second fluorescent material glue-line described is in the face, base of this concave station.
4. a kind of adjustable color temperature according to claim 1, the aobvious LED referred to, is characterized in that: described first to the 3rd group of conducting terminal all has a positive terminal and a negative terminal, and each positive and negative electrode terminal is distributed in the relative both sides of insulating body;
Each positive and negative electrode terminal all has die bond portion and leg portion; The length in the die bond portion of the positive terminal of this first, the 3rd group of conducting terminal is greater than the length L1> L1 ' in the die bond portion of its negative terminal, L3> L3 '; The length in the die bond portion of the negative terminal of this second group of conducting terminal is greater than the length L2 ' > L2 in the die bond portion of its positive terminal, and each LED wafer is fixed in the larger die bond portion of each length.
5. a kind of adjustable color temperature according to claim 4, the aobvious LED referred to, is characterized in that:
Described red-light LED wafer is fixed in the die bond portion of the positive terminal of first group of conducting terminal, the positive and negative electrode terminal conducting of the two ends gold thread of red-light LED wafer and first group of conducting terminal; This first blue LED wafers is fixed in the die bond portion of the negative terminal of second group of conducting terminal, the positive and negative electrode terminal conducting of the two ends gold thread of the first blue LED wafers and second group of conducting terminal; The mixed light of this red-light LED wafer and the first blue LED wafers concentrates on the center of the first reflector;
This second blue LED wafers is fixed in the die bond portion of the positive terminal of the 3rd group of conducting terminal, the positive and negative electrode terminal conducting of the two ends gold thread of the second blue LED wafers and the 3rd group of conducting terminal, the light source of the second blue LED wafers concentrates on the center of the second reflector.
6. a kind of adjustable color temperature according to claim 4, the aobvious LED referred to, is characterized in that: each Leg portion often organizing conducting terminal does not stretch out insulating body both sides and the curved bottom surface being accommodated in insulating body of reflexed.
7. a kind of adjustable color temperature according to claim 1, the aobvious LED referred to, it is characterized in that: the profile of described insulating body is in square, first, second reflector described is all rectangle structures, first reflector Aspect Ratio is W1:W1 '=1.7:1, and the second reflector Aspect Ratio is W2:W2 '=2.7:1.
8. a kind of adjustable color temperature according to claim 1, the aobvious LED referred to, is characterized in that: described insulating body and withe are integral type structure.
CN201420458338.7U 2014-08-14 2014-08-14 A kind of adjustable color temperature, the aobvious LED referred to Withdrawn - After Issue CN204102896U (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104183583A (en) * 2014-08-14 2014-12-03 东莞市欧思科光电科技有限公司 LED lamp allowing color temperatures and color indexes to be adjusted
CN108389856A (en) * 2018-01-22 2018-08-10 东莞中之光电股份有限公司 A kind of color temperature-tunable LED packagings
CN110190171A (en) * 2019-04-27 2019-08-30 深圳市长方集团股份有限公司 A kind of ten footlights source of SMD-RGBWY polychrome
CN112289910A (en) * 2020-10-19 2021-01-29 刘成禹 LED electrodeless color temperature modulation light source and manufacturing process thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104183583A (en) * 2014-08-14 2014-12-03 东莞市欧思科光电科技有限公司 LED lamp allowing color temperatures and color indexes to be adjusted
CN104183583B (en) * 2014-08-14 2017-08-11 东莞市欧思科光电科技有限公司 A kind of adjustable color temperature, the aobvious LED referred to
CN108389856A (en) * 2018-01-22 2018-08-10 东莞中之光电股份有限公司 A kind of color temperature-tunable LED packagings
CN110190171A (en) * 2019-04-27 2019-08-30 深圳市长方集团股份有限公司 A kind of ten footlights source of SMD-RGBWY polychrome
CN112289910A (en) * 2020-10-19 2021-01-29 刘成禹 LED electrodeless color temperature modulation light source and manufacturing process thereof
CN112289910B (en) * 2020-10-19 2021-06-25 刘成禹 LED stepless color temperature regulation light source and manufacturing process thereof

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