CN204090275U - A kind of pcb board - Google Patents
A kind of pcb board Download PDFInfo
- Publication number
- CN204090275U CN204090275U CN201420413453.2U CN201420413453U CN204090275U CN 204090275 U CN204090275 U CN 204090275U CN 201420413453 U CN201420413453 U CN 201420413453U CN 204090275 U CN204090275 U CN 204090275U
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- CN
- China
- Prior art keywords
- conductive layer
- circuit conductive
- pcb board
- layer
- insulating barrier
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- Expired - Lifetime
Links
- 230000004888 barrier function Effects 0.000 claims abstract description 34
- 229910000838 Al alloy Inorganic materials 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 241000276425 Xiphophorus maculatus Species 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000739 chaotic effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The utility model relates to a kind of pcb board, comprise main circuit conductive layer (1) fixing in order from top to bottom, first insulating barrier (2), auxiliary circuit conductive layer (4), second insulating barrier (5) and heat dissipating layer (3), wherein, main circuit conductive layer (1) is identical with the topology layout of auxiliary circuit conductive layer (4), and main circuit conductive layer (1) each locations of structures and the upper and lower one_to_one corresponding of auxiliary circuit conductive layer (4) each locations of structures, in main circuit conductive layer (1), each cabling is connected at Nodes with corresponding cabling in auxiliary circuit conductive layer (4), node comprises external circuit tie point and electronic component pin access point.The pcb board of the utility model design, for the layer of structure of existing pcb board, by the mode of extension circuit conductive layer, make the pcb board of this design can achieve twin-channel working method, effectively overcome the shortcoming in existing pcb board, ensure that service behaviour and the operating efficiency of pcb board.
Description
Technical field
The utility model relates to a kind of pcb board.
Background technology
Pcb board and printed circuit board, also known as printed circuit board (PCB), printed substrate, be called for short wiring board, take insulation board as base material, be cut into certain size, at least with a conductive pattern on it, and cloth porose (as component hole, fastener hole, plated-through hole etc.), be used for replacing the chassis of device electronic devices and components in the past, and realize being interconnected between electronic devices and components.Because this plate adopts electron printing to make, therefore be called as " printing " circuit board; Single sided board, double sided board, four laminates, six laminates and other multilayer circuit board can be divided into according to the wiring board number of plies.Due to printed circuit board (PCB) not general end product, therefore slightly chaotic in the definition of title, such as: the motherboard of PC, be called mainboard, and directly can not be called circuit board, although it is not there is the existence of circuit board in motherboard, identical, relevant but not talkative identical both therefore during assessment industry.Again for example: because there is integrated circuit part to load on circuit boards, thus news media claim it to be IC plate, but it is not also equal to printed circuit board (PCB) in fact; The printed circuit board (PCB) that we usually say refers to the circuit board of bare board-namely do not go up components and parts.Existing pcb board is all positioned at the top one deck of pcb board for the circuit conductive layer of layout circuit, due to long use, not only air can cause oxidation to this circuit conductive layer, and dust can impact the electric conductivity of circuit conductive layer equally, will have influence on the service behaviour of PCB like this.
Utility model content
For above-mentioned technical problem, technical problem to be solved in the utility model is to provide a kind of based on existing pcb board design philosophy, adopts binary channels working method, effectively can ensure the pcb board of service behaviour.
The utility model is in order to solve the problems of the technologies described above by the following technical solutions: the utility model devises a kind of pcb board, comprise main circuit conductive layer, first insulating barrier and heat dissipating layer, also comprise auxiliary circuit conductive layer and the second insulating barrier, wherein, main circuit conductive layer, first insulating barrier, auxiliary circuit conductive layer, second insulating barrier and heat dissipating layer from top to bottom order are fixing, main circuit conductive layer is identical with the topology layout of auxiliary circuit conductive layer, and each locations of structures of main circuit conductive layer and the upper and lower one_to_one corresponding of each locations of structures of auxiliary circuit conductive layer, in main circuit conductive layer, each cabling is connected at Nodes with corresponding cabling in auxiliary circuit conductive layer, node comprises external circuit tie point and electronic component pin access point.
As a kind of optimal technical scheme of the present utility model: also comprise the 3rd insulating barrier being arranged on described auxiliary circuit conductive coating structure gap place.
As a kind of optimal technical scheme of the present utility model: described heat dissipating layer is carbon-coating, described carbon-coating is by the compressing platy structure of material with carbon element.
As a kind of optimal technical scheme of the present utility model: also comprise aluminium alloy layer, described main circuit conductive layer, the first insulating barrier, auxiliary circuit conductive layer, the second insulating barrier, heat dissipating layer and aluminium alloy layer from top to bottom order are fixing.
As a kind of optimal technical scheme of the present utility model: also comprise the engraved structure be arranged on described aluminium alloy layer, fill material with carbon element in engraved structure.
A kind of pcb board described in the utility model adopts above technical scheme compared with prior art, has following technique effect:
(1) pcb board of the utility model design, for the layer of structure of existing pcb board, by the mode of extension circuit conductive layer, make the pcb board of this design can achieve twin-channel working method, effectively overcome the shortcoming in existing pcb board, ensure that service behaviour and the operating efficiency of pcb board;
(2) in the pcb board that the utility model designs, for the structure gap place of auxiliary circuit conductive layer, design the 3rd insulating barrier, coordinate the first insulating barrier and the second insulating barrier, auxiliary circuit conductive layer is positioned at and surrounds among structure, effectively auxiliary circuit conductive layer is played a protective role, enable the impact effectively avoiding environment on it, further ensure the service behaviour of pcb board;
(3), in the pcb board of the utility model design, to adopt by the compressing carbon-coating of material with carbon element as heat dissipating layer, effectively can improve the radiating effect of heat dissipating layer, make the service behaviour of the pcb board of this design obtain further guarantee;
(4) in the pcb board that the utility model designs, have also been devised the aluminium alloy layer be positioned at below heat dissipating layer, the design of aluminium alloy layer, make user use screw pass pcb board fixing to it time, aluminium alloy layer can play metallic gasket effect, prevent screw from directly contacting with heat dissipating layer, protective effect is served to heat dissipating layer;
(5) in the pcb board that the utility model designs; for the aluminium alloy layer of design; design engraved structure thereon further; and material with carbon element is filled in engraved structure; make aluminium alloy layer while playing a protective role to heat dissipating layer; effectively improve the radiating effect of this pcb board further, the service behaviour of this pcb board is promoted further.
Accompanying drawing explanation
Fig. 1 is the structural representation of the pcb board of the utility model design.
Wherein, 1. main circuit conductive layer, 2. the first insulating barrier, 3. heat dissipating layer, 4. auxiliary circuit conductive layer, 5. the second insulating barrier, 6. the 3rd insulating barrier, 7. aluminium alloy layer, 8. engraved structure.
Embodiment
Below in conjunction with Figure of description, embodiment of the present utility model is described in further detail.
As shown in Figure 1, the utility model devises a kind of pcb board, comprise main circuit conductive layer 1, first insulating barrier 2 and heat dissipating layer 3, also comprise auxiliary circuit conductive layer 4 and the second insulating barrier 5, wherein, main circuit conductive layer 1, first insulating barrier 2, auxiliary circuit conductive layer 4, second insulating barrier 5 and heat dissipating layer 3 from top to bottom order are fixing, main circuit conductive layer 1 is identical with the topology layout of auxiliary circuit conductive layer 4, and each locations of structures of main circuit conductive layer 1 and the upper and lower one_to_one corresponding of each locations of structures of auxiliary circuit conductive layer 4, in main circuit conductive layer 1, each cabling is connected at Nodes with corresponding cabling in auxiliary circuit conductive layer 4, node comprises external circuit tie point and electronic component pin access point, the pcb board of the utility model design, for the layer of structure of existing pcb board, by the mode of extension circuit conductive layer, adopt main circuit conductive layer 1 and auxiliary circuit conductive layer 4, make the pcb board of this design can achieve twin-channel working method, effectively overcome the shortcoming in existing pcb board, ensure that service behaviour and the operating efficiency of pcb board.
The pcb board of the utility model design, on technical scheme basis based on above design, also do following design: also comprise the 3rd insulating barrier 6 being arranged on described auxiliary circuit conductive layer 4 structure gap place, coordinate the first insulating barrier 2 and the second insulating barrier 5, auxiliary circuit conductive layer 4 is positioned at and surrounds among structure, effectively auxiliary circuit conductive layer 4 is played a protective role, enable the impact effectively avoiding environment on it, further ensure the service behaviour of pcb board; And described heat dissipating layer 3 is carbon-coating, described carbon-coating is by the compressing platy structure of material with carbon element, effectively can improve the radiating effect of heat dissipating layer 3, makes the service behaviour of the pcb board of this design obtain further guarantee; And it is only like this, also comprise aluminium alloy layer 7, described main circuit conductive layer 1, first insulating barrier 2, auxiliary circuit conductive layer 4, second insulating barrier 5, heat dissipating layer 3 and aluminium alloy layer 7 from top to bottom order are fixing, the design of aluminium alloy layer 7, make user use screw pass pcb board fixing to it time, aluminium alloy layer 7 can play metallic gasket effect, prevents screw from directly contacting with heat dissipating layer 3, serves protective effect to heat dissipating layer 3; And for aluminium alloy layer 7; also comprise the engraved structure 8 be arranged on described aluminium alloy layer 7; material with carbon element is filled in engraved structure 8; make aluminium alloy layer 7 while playing a protective role to heat dissipating layer 3; effectively improve the radiating effect of this pcb board further, the service behaviour of this pcb board is promoted further.
The pcb board of the utility model design is in the middle of actual application, this pcb board, comprise main circuit conductive layer 1 fixing in order from top to bottom, first insulating barrier 2, auxiliary circuit conductive layer 4, second insulating barrier 5, heat dissipating layer 3 and aluminium alloy layer 7, wherein, main circuit conductive layer 1 is identical with the topology layout of auxiliary circuit conductive layer 4, and each locations of structures of main circuit conductive layer 1 and the upper and lower one_to_one corresponding of each locations of structures of auxiliary circuit conductive layer 4, in main circuit conductive layer 1, each cabling is connected at Nodes with corresponding cabling in auxiliary circuit conductive layer 4, node comprises external circuit tie point and electronic component pin access point, for described auxiliary circuit conductive layer 4 structure gap place, design the 3rd insulating barrier 6, adopt carbon-coating for heat dissipating layer 3, described carbon-coating is by the compressing platy structure of material with carbon element, and for aluminium alloy layer 7, devises engraved structure 8 thereon, and fills material with carbon element in engraved structure 8, in actual application, the pin of each electronic component accesses on the pcb board of this design by mentality of designing, and be fixed by scolding tin, therefore scolding tin can seal electronic component pin access point, because cabling each in main circuit conductive layer 1 and corresponding cabling in auxiliary circuit conductive layer 4 are connected at electronic component pin access point place, therefore, the signal of electronic component can pass in main circuit conductive layer 1 with in auxiliary circuit conductive layer 4 simultaneously, equally, because cabling each in main circuit conductive layer 1 and corresponding cabling in auxiliary circuit conductive layer 4 are connected at external circuit tie point place, therefore, the signal of external circuit equally can at external circuit tie point place, pass in main circuit conductive layer 1 with in auxiliary circuit conductive layer 4 simultaneously, like this, based on the project organization that main circuit conductive layer 1 is identical with the topology layout of auxiliary circuit conductive layer 4, each signal will carry out work transmission in main circuit conductive layer 1 and auxiliary circuit conductive layer 4 simultaneously, achieve the binary channels work of this pcb board, which kind of such environmental effects no matter the main circuit conductive layer 1 be positioned at like this on pcb board surface be subject to, all can not have influence on the work of auxiliary circuit conductive layer 4, thus ensure that the service behaviour of pcb board, ensure that operating efficiency.
In sum, the pcb board of the utility model design, for the layer of structure of existing pcb board, by the mode of extension circuit conductive layer, adopt the structure of main circuit conductive layer 1 and auxiliary circuit conductive layer 4, make the pcb board of this design can achieve twin-channel working method, effectively overcome the shortcoming in existing pcb board, ensure that service behaviour and the operating efficiency of pcb board, there is huge market using value.
By reference to the accompanying drawings execution mode of the present utility model is explained in detail above, but the utility model is not limited to above-mentioned execution mode, in the ken that those of ordinary skill in the art possess, can also make a variety of changes under the prerequisite not departing from the utility model aim.
Claims (5)
1. a pcb board, comprise main circuit conductive layer (1), first insulating barrier (2) and heat dissipating layer (3), it is characterized in that: also comprise auxiliary circuit conductive layer (4) and the second insulating barrier (5), wherein, main circuit conductive layer (1), first insulating barrier (2), auxiliary circuit conductive layer (4), second insulating barrier (5) and heat dissipating layer (3) from top to bottom order are fixing, main circuit conductive layer (1) is identical with the topology layout of auxiliary circuit conductive layer (4), and main circuit conductive layer (1) each locations of structures and the upper and lower one_to_one corresponding of auxiliary circuit conductive layer (4) each locations of structures, in main circuit conductive layer (1), each cabling is connected at Nodes with corresponding cabling in auxiliary circuit conductive layer (4), node comprises external circuit tie point and electronic component pin access point.
2. a kind of pcb board according to claim 1, is characterized in that: also comprise the 3rd insulating barrier (6) being arranged on described auxiliary circuit conductive layer (4) structure gap place.
3. a kind of pcb board according to claim 1, it is characterized in that: described heat dissipating layer (3) is carbon-coating, described carbon-coating is by the compressing platy structure of material with carbon element.
4. according to a kind of pcb board described in any one in claims 1 to 3, it is characterized in that: also comprise aluminium alloy layer (7), described main circuit conductive layer (1), the first insulating barrier (2), auxiliary circuit conductive layer (4), the second insulating barrier (5), heat dissipating layer (3) and aluminium alloy layer (7) from top to bottom order are fixing.
5. a kind of pcb board according to claim 4, is characterized in that: also comprise the engraved structure (8) be arranged on described aluminium alloy layer (7), fills material with carbon element in engraved structure (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420413453.2U CN204090275U (en) | 2014-07-25 | 2014-07-25 | A kind of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420413453.2U CN204090275U (en) | 2014-07-25 | 2014-07-25 | A kind of pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204090275U true CN204090275U (en) | 2015-01-07 |
Family
ID=52182939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420413453.2U Expired - Lifetime CN204090275U (en) | 2014-07-25 | 2014-07-25 | A kind of pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204090275U (en) |
-
2014
- 2014-07-25 CN CN201420413453.2U patent/CN204090275U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 223700 East District of Siyang Economic Development Zone, Suqian City, Jiangsu Province (No. 29 Zhuhai Road) Patentee after: Jiangsu Liankang Information Co.,Ltd. Address before: 223700 No. 29, Zhuhai Road, Siyang County, Suqian City, Jiangsu Province Patentee before: JIANGSU LIANKANG ELECTRONICS Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20150107 |